CN113201412A - Semi-water-based cleaning agent for flexible circuit board and preparation method thereof - Google Patents
Semi-water-based cleaning agent for flexible circuit board and preparation method thereof Download PDFInfo
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- CN113201412A CN113201412A CN202110572699.9A CN202110572699A CN113201412A CN 113201412 A CN113201412 A CN 113201412A CN 202110572699 A CN202110572699 A CN 202110572699A CN 113201412 A CN113201412 A CN 113201412A
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- cleaning agent
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- circuit board
- flexible circuit
- water
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 49
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- -1 acetate compound Chemical class 0.000 claims abstract description 23
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 12
- 229920000570 polyether Polymers 0.000 claims abstract description 12
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 12
- 238000009736 wetting Methods 0.000 claims abstract description 12
- 230000007797 corrosion Effects 0.000 claims abstract description 11
- 238000005260 corrosion Methods 0.000 claims abstract description 11
- 239000003112 inhibitor Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims description 22
- 238000003756 stirring Methods 0.000 claims description 14
- 239000008367 deionised water Substances 0.000 claims description 9
- 229910021641 deionized water Inorganic materials 0.000 claims description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 8
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 4
- LXOFYPKXCSULTL-UHFFFAOYSA-N 2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound CC(C)CC(C)(O)C#CC(C)(O)CC(C)C LXOFYPKXCSULTL-UHFFFAOYSA-N 0.000 claims description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 2
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 claims description 2
- GVNHOISKXMSMPX-UHFFFAOYSA-N 2-[butyl(2-hydroxyethyl)amino]ethanol Chemical compound CCCCN(CCO)CCO GVNHOISKXMSMPX-UHFFFAOYSA-N 0.000 claims description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 claims description 2
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 claims description 2
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 claims description 2
- 239000012752 auxiliary agent Substances 0.000 claims description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical group CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 24
- 238000000034 method Methods 0.000 abstract description 22
- 238000005476 soldering Methods 0.000 abstract description 12
- 239000006072 paste Substances 0.000 abstract description 10
- 238000003466 welding Methods 0.000 abstract description 10
- 239000004519 grease Substances 0.000 abstract description 9
- 239000000428 dust Substances 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 3
- 230000001680 brushing effect Effects 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 230000004907 flux Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000005507 spraying Methods 0.000 abstract description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 3
- 238000004506 ultrasonic cleaning Methods 0.000 abstract description 3
- 229910052736 halogen Inorganic materials 0.000 abstract description 2
- 150000002367 halogens Chemical class 0.000 abstract description 2
- 238000002791 soaking Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 15
- 239000000126 substance Substances 0.000 description 7
- 239000012855 volatile organic compound Substances 0.000 description 7
- 238000009472 formulation Methods 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 238000003912 environmental pollution Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 238000011086 high cleaning Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000370 laser capture micro-dissection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 238000001223 reverse osmosis Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/722—Ethers of polyoxyalkylene glycols having mixed oxyalkylene groups; Polyalkoxylated fatty alcohols or polyalkoxylated alkylaryl alcohols with mixed oxyalkylele groups
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
- C11D3/2048—Dihydric alcohols branched
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2065—Polyhydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2093—Esters; Carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3707—Polyethers, e.g. polyalkyleneoxides
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Detergent Compositions (AREA)
Abstract
The invention provides a semi-water-based cleaning agent for a flexible circuit board and a preparation method thereof, wherein the semi-water-based cleaning agent comprises the following components in percentage by mass: 1-5% of block polyether, 1-5% of polyhydric alcohol, 1-5% of acetate compound, 1-5% of alcohol amine compound, 0.1-0.5% of wetting assistant, 0.1-0.5% of corrosion inhibitor and the balance of water. The cleaning agent of the technical scheme of the invention can thoroughly remove residues such as rosin, welding flux, dust, grease and the like generated on the surface of the FPC after reflow soldering; the cleaning agent has the characteristics of environmental protection, no halogen, non-flammability, strong cleaning power, easy rinsing, good material compatibility, bright welding points and the like, and is particularly suitable for cleaning the solder paste, dust and grease residues of the FPC soft board. In the use process, the cleaning agent is suitable for various cleaning processes such as manual brushing, soaking, ultrasonic cleaning, spraying and the like, is suitable for wide process window, does not need heating and normal-temperature cleaning, and is more energy-saving and environment-friendly.
Description
Technical Field
The invention belongs to the technical field of chemical cleaning agents, and particularly relates to a semi-water-based cleaning agent for a flexible circuit board and a preparation method thereof.
Background
As the design concept of electronic products gradually trends to be light, thin and small, the design of Printed Circuit Boards (PCBs) also develops toward small aperture, high density, multiple layers and thin lines. With the increasing difficulty of the integration process and the increasing temperature of the circuit board operation process, the original substrate can not cope with the increasing operation temperature, and the present novel soft board substrate without the adhesive has reached the process requirement of high density and reliability, and can meet the halogen-free requirement, and will gradually replace the present printed circuit board in the future.
The Flexible Printed Circuit (FPC) Flexible board has the characteristics of high wiring density, light weight, thin thickness, flexibility and the like, and is widely applied to electronic products such as mobile phones, notebook computers, PDAs, digital cameras, LCMs and the like. The integration level of electronic products is higher and higher, and in order to ensure the normal function and reliable performance of the products, the cleanliness of the products is required to be higher and higher. In order to eliminate the hidden reliability trouble existing after the reflow soldering of the FPC, the residual solder paste must be cleaned after the SMT reflow soldering, the bonding pad and the welding spot cannot be corroded, and the solder paste is generally qualified through the detection of a high-power microscope.
At present, most of domestic FPC (flexible printed circuit) flexible board processing manufacturers use water-based cleaning agents or organic solvent cleaning agents of imported brands for cleaning, and the cleaning agent is expensive, narrow in supply channel, high in production cost, low in cleaning efficiency, high in VOC (volatile organic compound) content, pollution to the atmospheric environment, not environment-friendly, inflammable and unsafe to use.
Disclosure of Invention
Aiming at the technical problems, the invention discloses a semi-water-based cleaning agent for a flexible circuit board and a preparation method thereof, which are more environment-friendly, have strong cleaning force, are easy to rinse and have good material compatibility, and solve a series of problems of high cleaning cost, low cleaning efficiency, atmospheric environmental pollution, flammability, explosiveness and the like of FPC (flexible printed circuit) processing enterprises.
In contrast, the technical scheme adopted by the invention is as follows:
the semi-water-based cleaning agent for the flexible circuit board is characterized in that: the composite material comprises the following components in percentage by mass: 1-5% of block polyether, 1-5% of polyhydric alcohol, 1-5% of acetate compound, 1-5% of alcohol amine compound, 0.1-0.5% of wetting assistant, 0.1-0.5% of corrosion inhibitor and the balance of water.
By adopting the technical scheme, the principles of organic matter similarity intermiscibility and acid-base neutralization are ingeniously combined, the residual grease on the FPC soft board and the organic matter residues in the soldering paste are dissolved by utilizing the polyalcohol and the acetate compounds, and then the residues are stripped and dissolved into water in a brushing, ultrasonic or spraying mode by utilizing the amphiphilic structure of the block polyether, so that the effect of removing the residues is achieved. And (3) carrying out neutralization or polycondensation reaction on residual organic acidic substances in the soldering paste by utilizing an alcohol amine compound aqueous solution to generate substances which are easy to dissolve in water, and dissolving the substances in the water or rinsing the substances by using deionized water to remove the substances. The wetting assistant has the effects of reducing the surface tension and improving the permeability of the cleaning agent. The block polyether, the polyhydric alcohol, the acetate compound, the alcohol amine compound, the wetting assistant, the corrosion inhibitor and the water are mixed according to the proportion, so that residues such as rosin, welding flux, dust, grease and the like generated on the surface of the FPC soft board after reflow soldering can be thoroughly removed.
As a further improvement of the invention, the semi-water-based cleaning agent for the flexible circuit board comprises the following components in percentage by mass: 1-3% of block polyether, 1-3% of polyhydric alcohol, 1-3% of acetate compound, 3-5% of alcohol amine compound, 0.2-0.5% of wetting assistant, 0.1-0.2% of corrosion inhibitor and the balance of water.
As a further improvement of the invention, the semi-water-based cleaning agent for the flexible circuit board comprises the following components in percentage by mass: 2-3% of block polyether, 2-3% of polyhydric alcohol, 2-3% of acetate compound, 3-5% of alcohol amine compound, 0.2-0.5% of wetting assistant, 0.1-0.2% of corrosion inhibitor and the balance of water.
As a further improvement of the invention, the block polyether comprises one or a mixture of more than two of PE6100, PE6200 and PE6400 of Pasteur Germany.
In a further improvement of the present invention, the polyhydric alcohol is one or a mixture of two or more of dipropylene glycol, glycerin, tripropylene glycol, and isohexylene glycol.
In a further improvement of the invention, the acetate compound is one or a mixture of more than two of propylene glycol methyl ether acetate, dipropyl alcohol methyl ether acetate, diethylene glycol butyl ether acetate and ethylene glycol butyl ether acetate.
As a further improvement of the invention, the alcohol amine compound is one or a mixture of more than two of 2-hydroxyethylamine, diethanolamine, triethanolamine, N-butyldiethanolamine and triisopropanolamine.
As a further improvement of the invention, the wetting auxiliary agent comprises one or a mixture of more than two of Surfynol 420, Surfynol FS-85 and Surfynol 104E.
As a further improvement of the invention, the corrosion inhibitor is one or a mixture of benzotriazole and methylbenzotriazole.
As a further improvement of the invention, the water is deionized water. Further preferably, the deionized water is prepared by an RO reverse osmosis process.
The invention also discloses a preparation method of the semi-aqueous cleaning agent for the flexible circuit board, which comprises the steps of weighing the block polyether, the polyhydric alcohol, the acetate compound, the alcohol amine compound, the wetting assistant, the corrosion inhibitor and the water according to the mass percentage, adding the weighed materials into a closed stirring tank, stirring the materials at the rotating speed of 300-500r/min by a stirrer for 60-120 minutes at normal temperature and normal pressure, and fully dissolving and uniformly mixing the materials.
The semi-aqueous cleaning agent for the FPC soft board is prepared by compounding multiple fine environment-friendly raw materials in a scientific ratio, has the characteristics of environmental protection, nonflammability, strong cleaning power, easiness in rinsing, good material compatibility, bright welding points, wide applicable cleaning process window and the like, meets the requirement of the content limit value of a volatile organic compound of the latest GB38508 and 2020 cleaning agent, is particularly suitable for cleaning the residual soldering paste of the FPC soft board, and solves a series of problems of high cleaning cost, low cleaning efficiency, atmospheric environmental pollution, flammability, explosiveness and the like of FPC processing enterprises.
Compared with the prior art, the invention has the beneficial effects that:
the cleaning agent of the technical scheme of the invention can thoroughly remove residues such as rosin, welding flux, dust, grease and the like generated on the surface of the FPC after reflow soldering; the cleaning agent has the characteristics of environmental protection, no halogen, non-flammability, strong cleaning power, easy rinsing, good material compatibility, bright welding points and the like, and is particularly suitable for cleaning the solder paste, dust and grease residues of the FPC soft board. In the use process, the cleaning agent is suitable for various cleaning processes such as manual brushing, soaking, ultrasonic cleaning, spraying and the like, is suitable for wide process window, does not need heating and normal-temperature cleaning, and is more energy-saving and environment-friendly. From the aspect of atmospheric environment protection, the cleaning agent only uses low-content organic volatile compounds as solubilizing substances, completely meets the requirement of the content limit of the volatile organic compounds of the latest GB38508-2020 cleaning agent, reduces the atmospheric environmental pollution pressure and promotes sustainable development.
Detailed Description
Preferred embodiments of the present invention are described in further detail below.
Example 1
The semi-water-based cleaning agent for the FPC soft board comprises the following components in percentage by mass:
the raw materials with the mass percentage are weighed by an electronic scale, and then are sequentially added into a stirring tank, the rotating speed of the stirring machine is 300-500r/min, and the mixture is mixed and stirred for 60-120 minutes, so that the cleaning agent in the embodiment is obtained.
Example 2
The semi-water-based cleaning agent for the FPC soft board comprises the following components in percentage by mass:
the raw materials with the mass percentage are weighed by an electronic scale, and then are sequentially added into a stirring tank, the rotating speed of the stirring machine is 300-500r/min, and the mixture is mixed and stirred for 60-120 minutes, so that the cleaning agent in the embodiment is obtained.
Example 3
The semi-water-based cleaning agent for the FPC soft board comprises the following components in percentage by mass:
the raw materials with the mass percentage are weighed by an electronic scale, and then are sequentially added into a stirring tank, the rotating speed of the stirring machine is 300-500r/min, and the mixture is mixed and stirred for 60-120 minutes, so that the cleaning agent in the embodiment is obtained.
Example 4
The semi-water-based cleaning agent for the FPC soft board comprises the following components in percentage by mass:
the raw materials with the mass percentage are weighed by an electronic scale, and then are sequentially added into a stirring tank, the rotating speed of the stirring machine is 300-500r/min, and the mixture is mixed and stirred for 60-120 minutes, so that the cleaning agent in the embodiment is obtained.
Example 5
The semi-water-based cleaning agent for the FPC soft board comprises the following components in percentage by mass:
the raw materials with the mass percentage are weighed by an electronic scale, and then are sequentially added into a stirring tank, the rotating speed of the stirring machine is 300-500r/min, and the mixture is mixed and stirred for 60-120 minutes, so that the cleaning agent in the embodiment is obtained.
Comparative example 1
The procedure is as in example 1 except that no PE6100 is included in the formulation and the balance is made up to 100% with deionized water.
Comparative example 2
The procedure is as in example 1, except that PE6100 in the formulation is replaced by the conventional surfactant AEO-3.
Comparative example 3
The procedure is as in example 1 except that the formulation does not contain propylene glycol methyl ether acetate and the balance is made up to 100% with deionized water.
Comparative example 4
The procedure is as in example 1 except that no 2-hydroxyethylamine is present in the formulation and the balance is made up to 100% with deionized water.
Comparative example 5
The procedure is as in example 1 except that the formulation does not contain Surfynol 104E and benzotriazole and the balance is made up to 100% with deionized water.
Comparative example 6
The procedure is as in example 1, except that the propylene glycol methyl ether acetate in the formulation is replaced by ethyl acetate.
Comparative example 7
The procedure is as in example 1 except that 2% glycerol is replaced with 20% absolute ethanol and the balance water.
The cleaning agent obtained in the above examples and comparative examples is used to perform a cleaning comparative test on the FPC flexible printed circuit after reflow soldering according to an ultrasonic cleaning process, and the cleaning process is as follows: cleaning tanks are respectively added with the cleaning agents of the above examples and comparative examples for cleaning for 10 minutes, then 3 rinsing tanks are respectively added with deionized water for rinsing for 3 minutes, and the cleaning tanks are dried by hot air at 90 ℃ for 30 minutes. The cleaning tank and the rinsing tank are not set to heating temperatures. The cleaning and testing results are shown in table 1:
TABLE 1 comparison of the properties of the examples and comparative examples
In the test items in Table 1, the VOC content is tested according to the content limit requirement of the volatile organic compounds of the GB 38508-. Post-weld assembly of all electronic categories must be less than 1.56 μ g NaCl Eq./cm, according to the ionic cleanliness criteria of J-STD-0012。
The results of the comparative tests show that the ionic cleanliness of the board surface after being cleaned by using the cleaning agent in the examples 1-5 is obviously superior to that of the comparative examples, the soldering paste and the grease have no residue, the welding spots are corrosive and bright, no color exists, and the marks of the marking pens can be reserved, while the comparative examples 1-7 are verified by adopting a mode of removing or replacing related components in the examples, and the comparative examples generate certain adverse effects, which cannot achieve the expected cleaning effect, and particularly show the defects that the soldering paste and the grease residue cannot be cleaned, are combustible, the welding spots are corroded, the marks of the marking pens are removed (the identification of the bad boards in the later process is influenced), and the like.
The semi-water-based cleaning agent can thoroughly remove the residual soldering paste and grease on the FPC soft board, has low VOC content, meets the requirement of GB38508 and 2020, has bright welding spots and no abnormal color, does not remove the marks of the bad board marking pen marked on the FPC soft board, effectively remains, is convenient for the bad board identification of the later stage process, and has the characteristic of non-flammability.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. The semi-water-based cleaning agent for the flexible circuit board is characterized in that: the composite material comprises the following components in percentage by mass: 1-5% of block polyether, 1-5% of polyhydric alcohol, 1-5% of acetate compound, 1-5% of alcohol amine compound, 0.1-0.5% of wetting assistant, 0.1-0.5% of corrosion inhibitor and the balance of water.
2. The semi-aqueous cleaning agent for the flexible circuit board as claimed in claim 1, wherein: the block polyether comprises one or a mixture of more than two of PE6100, PE6200 and PE6400 of Pasteur Germany.
3. The semi-aqueous cleaning agent for the flexible circuit board as claimed in claim 2, wherein: the polyalcohol is one or more of dipropylene glycol, glycerol, tripropylene glycol and isohexylene glycol.
4. The semi-aqueous cleaning agent for the flexible circuit board as claimed in claim 3, wherein: the acetate compound is one or a mixture of more than two of propylene glycol methyl ether acetate, dipropyl alcohol methyl ether acetate, diethylene glycol butyl ether acetate and ethylene glycol butyl ether acetate.
5. The semi-aqueous cleaning agent for the flexible circuit board as claimed in claim 4, wherein: the alcohol amine compound is one or a mixture of more than two of 2-hydroxyethylamine, diethanolamine, triethanolamine, N-butyldiethanolamine and triisopropanolamine.
6. The semi-aqueous cleaning agent for the flexible circuit board as claimed in claim 5, wherein: the wetting auxiliary agent comprises one or a mixture of more than two of Surfynol 420, Surfynol FS-85 and Surfynol 104E.
7. The semi-aqueous cleaning agent for the flexible circuit board as claimed in claim 6, wherein: the corrosion inhibitor is one or a mixture of benzotriazole and methylbenzotriazole.
8. The semi-aqueous cleaning agent for the flexible circuit board as claimed in claim 1, wherein: the water is deionized water.
9. The semi-aqueous cleaning agent for the flexible circuit board as claimed in any one of claims 1 to 8, wherein: the composite material comprises the following components in percentage by mass: 1-3% of block polyether, 1-3% of polyhydric alcohol, 1-3% of acetate compound, 3-5% of alcohol amine compound, 0.2-0.5% of wetting assistant, 0.1-0.2% of corrosion inhibitor and the balance of water.
10. The preparation method of the semi-aqueous cleaning agent for the flexible circuit board as claimed in any one of claims 1 to 9, characterized in that: weighing the block polyether, the polyhydric alcohol, the acetate compound, the alcohol amine compound, the wetting assistant, the corrosion inhibitor and the water according to the mass percentage, then adding the materials into a closed stirring tank, stirring the materials at the normal temperature and the normal pressure for 60 to 120 minutes at the rotating speed of the stirrer of 300-500r/min, and fully dissolving and uniformly mixing the materials.
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