CN106255333A - A kind ofization gold adds the hybrid process technique of gold finger plate - Google Patents
A kind ofization gold adds the hybrid process technique of gold finger plate Download PDFInfo
- Publication number
- CN106255333A CN106255333A CN201610685529.0A CN201610685529A CN106255333A CN 106255333 A CN106255333 A CN 106255333A CN 201610685529 A CN201610685529 A CN 201610685529A CN 106255333 A CN106255333 A CN 106255333A
- Authority
- CN
- China
- Prior art keywords
- gold
- process technique
- hybrid process
- finger plate
- adds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind ofization gold and add the hybrid process technique of gold finger plate, described hybrid process technique includes: 1) changes gold and processes；2) tape；3) brush board；4) electrogilding；5) washing；6) dry.This invention simplifies nickel-gold electroplating process, chemical surface directly carries out gold-plated process, reduce nickel plating technology, ensure that product generation plating point also will not produce impact to changing gold surface, open defect will not be produced, improve the qualification rate of product, decrease the wasting of resources that nickel plating technology causes and the process of the pollutant that nickel plating technology is brought simultaneously, reduce cost.
Description
Technical field
The present invention relates to the processing technique of pcb board, be specifically related to a kind ofization gold and add the hybrid process technique of gold finger plate.
Background technology
In the fabrication processing of printed circuit board, the solderability on the final surface of product processes, the dress to final products
Joining and use plays most important effect, wherein surface processes following several ways: hot air leveling, organic protective agent, chemistry
Nickel gold, electronickelling gold etc..Chemical nickel and gold processes and is intended to meet the requirement of surface encapsulation, and its flow process is: welding resistance → oil removing → washing
→ microetch → washing → preimpregnation → activation → washing → heavy nickel → washing → change gold → reclaim → washing → dry；Electrogilding finger
Being intended to meet the wear-resisting and requirement of plug, its flow process is: welding resistance → brush board → tape → activate → nickel plating → washing → plating is thick
Gold → reclaim → washing → dry；Two kinds of surfaces process and can not pollute processed gold surface, and existing method is by two streams
Journey merges into selective immersion process: the blue glue of welding resistance → patch or print select carburetion ink → change nickel gold → remove blue glue or select carburetion ink → patch
Adhesive tape → brushing → electronickelling gold.This flow process problem points is the temperature 45 C of electronickelling, 15--20 minute time, electrogilding 40
DEG C, 5 minutes time, this technique can cause plating to pollute and change golden gold through long-time immersion plating during electronickelling
Face, occur about 15% bad.
Summary of the invention
The technical problem to be solved is: provide the hybrid process technique that a kind ofization gold adds gold finger plate, improves
The qualification rate of product, save resource, reduced cost.
In order to reach above-mentioned technique effect, the technical solution used in the present invention is:
A kind ofization gold adds the hybrid process technique of gold finger plate, and described hybrid process technique comprises the following steps that:
1) change gold to process；
2) tape；
3) brush board；
4) electrogilding；
5) washing；
6) dry.
Further, described step 1) change gold process and include following operation: welding resistance, oil removing, washing, microetch, washing, pre-
Soak, activate, wash, heavy nickel, wash, change gold, reclaim, wash, dry.
Further, described step 2) tape and include pressing the product posting adhesive tape through secondary film laminator
Film, film laminator temperature controls at 65-70 DEG C.
Further, described step 3) brush board in for the polish-brush mesh numerical control system of brush board more than 1000 mesh.
Compared with prior art, the invention has the beneficial effects as follows: the present invention, according to electrogilding feature and requirement, simplifies plating
Nickel gold process, directly carries out gold-plated process on chemical surface, reduces nickel plating technology, it is ensured that product generation plating point also will not
Produce impact to changing gold surface, open defect will not be produced, improve the qualification rate of product, decrease the money of nickel plating technology simultaneously
Waste and the Pollutant Treatment that nickel plating technology is brought in source, reduce cost.
Detailed description of the invention
Hereinafter the preferred embodiments of the present invention are illustrated, it will be appreciated that preferred embodiment described herein is only used
In the description and interpretation present invention.
A kind ofization gold adds the hybrid process technique of gold finger plate, first processes circuit boardization gold, this step co-occurrence
There is technology, i.e. welding resistance → oil removing → washing → microetch → washing → preimpregnation → activation → washing → heavy nickel → washing → change gold → return
Receive → washing → dry.Then the circuit board dried is taped, will post the product of adhesive tape through secondary film laminator
Carrying out press mold, film laminator temperature controls at 65-70 DEG C, and this operation ensure that adhesive tape close adhesion, in plate face, reduces gold cylinder medicine
The infiltration of water, prevents plating from wasting gold salt.The polish-brush utilizing more than 1000 mesh followed by carries out brush board operation, is careful not to brush wound
Welding resistance.Then re-plating gold, then high-pressure washing, finally dry.
The present invention, according to electrogilding feature and requirement, simplifies nickel-gold electroplating process, directly plates on chemical surface
Gold processes, and reduces nickel plating technology, even if occurring plating point also will not produce impact to changing gold surface, has simply thickeied golden thickness, no
Open defect can be produced, improve the qualification rate of product, decrease the wasting of resources that nickel plating technology causes and to bringing simultaneously
Pollutant Treatment, reduce cost.Ensure that adhesive tape close adhesion, in plate face, reduces oozing of gold cylinder liquid medicine by secondary press mold
Thoroughly, prevent plating from wasting gold salt.The polish-brush brush board using more than 1000 mesh make re-plating gold before circuit board surface to be plated
Brushing obtains cleaner, it is to avoid false plating layering, improves the adhesion of plating layer gold.
The present invention is not limited to above-mentioned specific embodiment, for the person of ordinary skill of the art from above-mentioned structure
Think of sets out, and without performing creative labour, done all conversion, within all falling within protection scope of the present invention.
Claims (4)
1. change gold and add the hybrid process technique of gold finger plate for one kind, it is characterised in that described hybrid process technique includes following work
Skill step:
1) change gold to process；
2) tape；
3) brush board；
4) electrogilding；
5) washing；
6) dry.
A kind ofization gold the most according to claim 1 adds the hybrid process technique of gold finger plate, it is characterised in that described step
1) change gold processes and includes following operation: welding resistance, oil removing, washing, microetch, washes, presoak, activate, wash, heavy nickel, wash, change
Gold, reclaim, wash, dry.
A kind ofization gold the most according to claim 1 adds the hybrid process technique of gold finger plate, it is characterised in that described step
2) tape includes through secondary film laminator, the product posting adhesive tape is carried out press mold, and film laminator temperature controls at 65-70
℃。
A kind ofization gold the most according to claim 1 adds the hybrid process technique of gold finger plate, it is characterised in that described step
3) brush board is used for the polish-brush mesh numerical control system of brush board more than 1000 mesh.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610685529.0A CN106255333A (en) | 2016-08-18 | 2016-08-18 | A kind ofization gold adds the hybrid process technique of gold finger plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610685529.0A CN106255333A (en) | 2016-08-18 | 2016-08-18 | A kind ofization gold adds the hybrid process technique of gold finger plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106255333A true CN106255333A (en) | 2016-12-21 |
Family
ID=57593211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610685529.0A Pending CN106255333A (en) | 2016-08-18 | 2016-08-18 | A kind ofization gold adds the hybrid process technique of gold finger plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106255333A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108401381A (en) * | 2018-02-27 | 2018-08-14 | 深圳崇达多层线路板有限公司 | A kind of production method of disconnecting golden finger class printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101631427B (en) * | 2008-07-14 | 2011-07-27 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN102752964A (en) * | 2012-07-17 | 2012-10-24 | 景旺电子（深圳）有限公司 | Selective PCB (Printed Circuit Board) gold-electroplated manufacturing procedure and anti-plating layer therein |
| CN102638945B (en) * | 2012-03-21 | 2014-09-03 | 深圳崇达多层线路板有限公司 | Method for producing goldfinger via twice electroplating |
-
2016
- 2016-08-18 CN CN201610685529.0A patent/CN106255333A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101631427B (en) * | 2008-07-14 | 2011-07-27 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN102638945B (en) * | 2012-03-21 | 2014-09-03 | 深圳崇达多层线路板有限公司 | Method for producing goldfinger via twice electroplating |
| CN102752964A (en) * | 2012-07-17 | 2012-10-24 | 景旺电子（深圳）有限公司 | Selective PCB (Printed Circuit Board) gold-electroplated manufacturing procedure and anti-plating layer therein |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108401381A (en) * | 2018-02-27 | 2018-08-14 | 深圳崇达多层线路板有限公司 | A kind of production method of disconnecting golden finger class printed circuit board |
| CN108401381B (en) * | 2018-02-27 | 2020-10-16 | 深圳崇达多层线路板有限公司 | Method for manufacturing disconnected gold finger type printed circuit board |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161221 |