CN107623998A - A kind of pcb board method for plugging of anti-foaming - Google Patents
A kind of pcb board method for plugging of anti-foaming Download PDFInfo
- Publication number
- CN107623998A CN107623998A CN201711044211.5A CN201711044211A CN107623998A CN 107623998 A CN107623998 A CN 107623998A CN 201711044211 A CN201711044211 A CN 201711044211A CN 107623998 A CN107623998 A CN 107623998A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- micro
- nog plate
- osp
- plugging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Abstract
Present invention system provides a kind of pcb board method for plugging of anti-foaming, comprises the following steps：Prepare pcb board；Make silk-screen half tone；Consent；Baking：Pcb board is toasted, baking temperature is 100~120 DEG C, and baking time is 50~60min；Nog plate：Nog plate is carried out to all consent faces of pcb board, nog plate speed is 1.8~2.0m/min, and nog plate pressure is 2.8~3.0kg/cm2；Clean nog plate bits；OSP is processed：PCB is put into the groove equipped with micro-corrosion liquid, micro-corrosion liquid is hydrogen peroxide solution, and hydrogen peroxide concentration is 40~80g/L；Clean micro-corrosion liquid.The present invention can effectively slow down the reaction that anti-solder ink is occurred with OSP micro-corrosion liquids, and the contact area of ink and OSP micro-corrosion liquids can be reduced, in addition, setting rational OSP parameters, the OSP micro-corrosion liquids of cleaning residual in time, it can further reduce the probability of ink foaming.
Description
Technical field
The present invention relates to pcb board consent field, a kind of pcb board method for plugging of anti-foaming is specifically disclosed.
Background technology
PCB (Printed Circuit Board, i.e. printed circuit board (PCB)) at least has a conductive pattern, and cloth thereon
There is hole slot to realize the interconnection between electronic component, the basis of almost all electronic products.If it is, in general, that
There is electronic component in some equipment, then they are integrated on the pcb board of different sizes.Except the various members of fixation
Outside device, the main function of pcb board is to provide the connection circuit between every component.Conducting metal substrate is multi-layer PCB board
Basis, make each layer circuit respectively in the both sides of conducting metal substrate and form multi-layer PCB board.
Need to carry out OSP processing after the consent processing of traditional PCB plate, OSP is the compound RoHS of pcb board copper foil surface processing
A kind of desired technique is instructed, Chinese translation is that organic guarantor welds film, also known as copper-protection agent, and briefly, OSP is exactly in the naked of cleaning
On copper surface, one layer of organic coating is grown in the method for chemistry.In the prior art, OSP processing is carried out after to pcb board consent to hold
The ink for being easily caused consent is bubbled, and can influence consent effect, and rabbet ink is also resulted in when serious and is come off, and ink rises and steeped oneself-meeting
Influence pcb board and be unable to reach due performance, or even be also possible to cause pcb board to be scrapped.
The content of the invention
Based on this, it is necessary to for prior art problem, there is provided a kind of pcb board method for plugging of anti-foaming, can be effective
The probability of pcb board foaming is reduced, and then ensures the performance of pcb board.
To solve prior art problem, the present invention discloses a kind of pcb board method for plugging of anti-foaming, comprised the following steps：
A, pcb board is prepared：A pcb board is provided, pcb board is provided with the filling perforation of ink to be filled in；
B, silk-screen half tone is made：According to the design requirement of pcb board, by the film, silk-screen half tone is made in exposure imaging on grenadine；
C, consent：Silk-screen half tone alignment pcb board is placed, anti-solder ink is filled into filling perforation by silk-screen half tone；
D, toast：Pcb board is toasted, baking temperature is 100~120 DEG C, and baking time is 50~60min；
E, nog plate：Nog plate is carried out to all consent faces of pcb board, nog plate speed is 1.8~2.0m/min, and nog plate pressure is 2.8
~3.0kg/cm2；
F, nog plate bits are cleaned：Pcb board is passed sequentially through into aqueous cleaning agent and clear water cleaning, then is dried；
G, OSP is processed：PCB is put into the groove equipped with micro-corrosion liquid, micro-corrosion liquid is hydrogen peroxide solution, hydrogen peroxide concentration is 40~
80g/L；
H, micro-corrosion liquid is cleaned：Pcb board is passed sequentially through into aqueous cleaning agent and clear water cleaning, then is dried.
Further, in step D, baking temperature is 105 DEG C.
Further, in step D, baking time 50min.
Further, in step F and H, drying is hot-air seasoning.
Further, in step F and H, pcb board all also passes through deionized water rinsing after clear water cleaning, before drying.
Further, in step G, hydrogen peroxide concentration 70g/L.
Beneficial effects of the present invention are：The present invention discloses a kind of pcb board method for plugging of anti-foaming, sets rational baking
It parameter and nog plate parameter, can effectively slow down the unavoidable reaction that anti-solder ink is occurred with OSP micro-corrosion liquids, and can make
The unnecessary anti-solder ink in filling perforation edge obtains sufficient polish-brush, so as to effectively reduce the contact area of ink and OSP micro-corrosion liquids, drop
The probability of low anti-solder ink foaming, in addition, setting rational OSP parameters, can significantly reduce OSP micro-corrosion liquids to anti-welding in filling perforation
The attack of ink, the probability of anti-solder ink foaming is fully reduced, and cleaning in time is remained on pcb board after OSP processing is completed
OSP micro-corrosion liquids, can further reduce ink foaming probability.
Embodiment
For the feature of the present invention, technological means and the specific purposes reached, function can be further appreciated that, with reference to
Embodiment is described in further detail to the present invention.
The embodiment of the present invention discloses a kind of pcb board method for plugging of anti-foaming, comprises the following steps：
A, pcb board is prepared：A pcb board is provided, pcb board is provided with the filling perforation of ink to be filled in；
B, silk-screen half tone is made：According to the design requirement of pcb board, by the film, silk-screen half tone is made in exposure imaging on grenadine；
C, consent：Silk-screen half tone alignment pcb board is placed, anti-solder ink is filled into filling perforation by silk-screen half tone；
D, toast：Pcb board is toasted, solidifies anti-solder ink, baking temperature be 100~120 DEG C, baking time be 50~
60min, it can effectively slow down the unavoidable reaction that anti-solder ink is occurred with OSP micro-corrosion liquids, so as to reduce anti-solder ink
There is the probability bubbled；
E, nog plate：Nog plate is carried out to all consent faces of pcb board, the face where filling perforation mouth is consent face, and filling perforation edge is unnecessary
Anti-solder ink polish, nog plate speed is 1.8~2.0m/min, and nog plate pressure is 2.8~3.0kg/cm2, filling perforation side can be made
The unnecessary anti-solder ink of edge obtains sufficient polish-brush；
F, nog plate bits are cleaned：Pcb board is passed sequentially through into aqueous cleaning agent and clear water cleaning, removes the chip waste material of nog plate residual,
It is dried again；
G, OSP is processed：PCB is put into the groove equipped with micro-corrosion liquid, micro-corrosion liquid is hydrogen peroxide solution, hydrogen peroxide concentration is 40~
80g/L, aggressiveness of the OSP micro-corrosion liquids to anti-solder ink can be effectively reduced, i.e., can effectively weaken OSP micro-corrosion liquids and anti-solder paste
Reaction between ink；
H, micro-corrosion liquid is cleaned：Pcb board is passed sequentially through into aqueous cleaning agent and clear water cleaning, then is dried, can be removed in time
The OSP micro-corrosion liquids remained in pcb board surface, filling perforation gap, it can effectively avoid anti-solder ink that non-add occurs with OSP micro-corrosion liquids
Necessary contact during work, so as to shorten the reaction time of anti-solder ink and OSP micro-corrosion liquids.
The present invention sets rational Flue curing parameter effectively to slow down anti-solder ink and can not kept away with what OSP micro-corrosion liquids were occurred
The reaction exempted from, rational nog plate parameter is set, the anti-solder ink that filling perforation edge can be made unnecessary obtains sufficient polish-brush, so as to have
Effect reduces the contact area of ink and OSP micro-corrosion liquids, reduces the probability of anti-solder ink foaming, sets rational OSP parameters, fully
The probability of anti-solder ink foaming is reduced, and clears up the OSP micro-corrosion liquids remained on pcb board in time after OSP processing is completed, can
Further reduce the probability of ink foaming.
Based on above-described embodiment, in step D, baking temperature is 105 DEG C, baking time 50min, shortens anti-solder ink
Hardening time can further slow down the unavoidable reaction that anti-solder ink is occurred with OSP micro-corrosion liquids, improve baking temperature
It is able to ensure that the effect of anti-solder ink curing molding.
For improve clean after to the drying effect of pcb board, based on above-described embodiment, in step F and H, drying is hot blast
Drying, it is preferable that also absorbed water before hot-air seasoning by suction roll.
Further to improve the cleaning performance of pcb board, based on above-described embodiment, in step F and H, pcb board cleans in clear water
Afterwards, all also by deionized water rinsing before drying, deionized water refers to eliminate the pure water in after ionic species impurity, energy
It is enough effectively to prevent that secondary pollution occurs in cleaning process.
Based on above-described embodiment, in step G, hydrogen peroxide concentration 70g/L, the effect of OSP processing can be effectively ensured, simultaneously
Also it can prevent anti-solder ink from bubbling.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. the pcb board method for plugging of a kind of anti-foaming, it is characterised in that comprise the following steps：
A, pcb board is prepared：A pcb board is provided, pcb board is provided with the filling perforation of ink to be filled in；
B, silk-screen half tone is made：According to the design requirement of pcb board, by the film, silk-screen half tone is made in exposure imaging on grenadine；
C, consent：Silk-screen half tone alignment pcb board is placed, anti-solder ink is filled into filling perforation by silk-screen half tone；
D, toast：Pcb board is toasted, baking temperature is 100~120 DEG C, and baking time is 50~60min；
E, nog plate：Nog plate is carried out to all consent faces of pcb board, nog plate speed is 1.8~2.0m/min, and nog plate pressure is 2.8
~3.0kg/cm2；
F, nog plate bits are cleaned：Pcb board is passed sequentially through into aqueous cleaning agent and clear water cleaning, then is dried；
G, OSP is processed：PCB is put into the groove equipped with micro-corrosion liquid, micro-corrosion liquid is hydrogen peroxide solution, hydrogen peroxide concentration is 40~
80g/L；
H, micro-corrosion liquid is cleaned：Pcb board is passed sequentially through into aqueous cleaning agent and clear water cleaning, then is dried.
A kind of 2. pcb board method for plugging of anti-foaming according to claim 1, it is characterised in that in step D, baking temperature
Spend for 105 DEG C.
3. the pcb board method for plugging of a kind of anti-foaming according to claim 1, it is characterised in that in step D, during baking
Between be 50min.
4. the pcb board method for plugging of a kind of anti-foaming according to claim 1, it is characterised in that in step F and H, dry
It is hot-air seasoning.
A kind of 5. pcb board method for plugging of anti-foaming according to claim 1, it is characterised in that in step F and H, PCB
Plate all also passes through deionized water rinsing after clear water cleaning, before drying.
A kind of 6. pcb board method for plugging of anti-foaming according to claim 1, it is characterised in that in step G, hydrogen peroxide
Concentration is 70g/L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711044211.5A CN107623998A (en) | 2017-10-31 | 2017-10-31 | A kind of pcb board method for plugging of anti-foaming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711044211.5A CN107623998A (en) | 2017-10-31 | 2017-10-31 | A kind of pcb board method for plugging of anti-foaming |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107623998A true CN107623998A (en) | 2018-01-23 |
Family
ID=61093228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711044211.5A Pending CN107623998A (en) | 2017-10-31 | 2017-10-31 | A kind of pcb board method for plugging of anti-foaming |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107623998A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513461A (en) * | 2018-04-28 | 2018-09-07 | 珠海智锐科技有限公司 | A kind of FPC plates manufacture craft |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6066889A (en) * | 1998-09-22 | 2000-05-23 | International Business Machines Corporation | Methods of selectively filling apertures |
| TW201204212A (en) * | 2010-07-02 | 2012-01-16 | Boardtek Comp Suzhou Co Ltd | Method for shaping PCB with semi-hole |
| CN104202907A (en) * | 2014-07-21 | 2014-12-10 | 本立遠東有限公司 | Process for manufacturing electroless copper electroplating via hole type double-sided circuit board through UV printing method |
| CN104540320A (en) * | 2014-12-09 | 2015-04-22 | 江门崇达电路技术有限公司 | Manufacturing method for resin plug hole in PCB |
-
2017
- 2017-10-31 CN CN201711044211.5A patent/CN107623998A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6066889A (en) * | 1998-09-22 | 2000-05-23 | International Business Machines Corporation | Methods of selectively filling apertures |
| TW201204212A (en) * | 2010-07-02 | 2012-01-16 | Boardtek Comp Suzhou Co Ltd | Method for shaping PCB with semi-hole |
| CN104202907A (en) * | 2014-07-21 | 2014-12-10 | 本立遠東有限公司 | Process for manufacturing electroless copper electroplating via hole type double-sided circuit board through UV printing method |
| CN104540320A (en) * | 2014-12-09 | 2015-04-22 | 江门崇达电路技术有限公司 | Manufacturing method for resin plug hole in PCB |
Non-Patent Citations (1)
| Title |
|---|
| 吴江浩: ""印制电路板阻焊油墨塞孔对孔铜的影响"", 《印制电路信息》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513461A (en) * | 2018-04-28 | 2018-09-07 | 珠海智锐科技有限公司 | A kind of FPC plates manufacture craft |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104619122B (en) | A kind of production method of printed circuit board | |
| CN103237421B (en) | A kind of PCB segmentation golden finger preparation method | |
| CN103491710B (en) | A kind of two-sided and multilayer line board machining process | |
| CN103945648B (en) | A kind of high-frequency circuit board production technology | |
| CN102548066A (en) | PCB (Printed Circuit Board) surface treatment technology | |
| CN109195333A (en) | A kind of technology of wiring board filling holes with resin deaeration | |
| CN100562222C (en) | A kind of method of removing sensitization film in flexible printed circuit board | |
| CN103458620B (en) | Pcb board circuitous pattern development exposure method | |
| CN105813393B (en) | Selective turmeric board manufacturing method | |
| CN107623998A (en) | A kind of pcb board method for plugging of anti-foaming | |
| CN106413276A (en) | Method for re-washing solder resist plug hole | |
| CN108580407A (en) | Base material cleaning procedure before printing | |
| CN104869758A (en) | Method for making solder-resisting layer on PCB sheet | |
| CN105449036A (en) | Reworking treatment method for poor screen printing sheet | |
| CN113766747A (en) | PCB (printed Circuit Board) micro-etching process for fine circuit and circuit board | |
| CN103763865B (en) | Welding resistance ink hand-hole processing method | |
| CN109462946B (en) | PCB solder mask backwashing method | |
| CN112921330A (en) | Organic alkali film-removing liquid | |
| CN113365432B (en) | Method for improving character jet printing adhesion and printed circuit board | |
| CN106929852A (en) | A kind of pcb board surface automatic film coating technique | |
| KR20150015304A (en) | Cleaning apparatus | |
| CN107552481A (en) | A kind of silicon wafer cleaning process | |
| CN102650054A (en) | Method for removing burrs of copper-clad plate | |
| CN111328207A (en) | Roughening treatment method for resin surface of PCB (printed circuit board) substrate, application and PCB | |
| KR20130028249A (en) | Method of forming a fine pattern using multiple etching |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20200407 |
|
| AD01 | Patent right deemed abandoned |