CN110856370A - Resistance welding pretreatment method for 5G high-frequency circuit board - Google Patents
Resistance welding pretreatment method for 5G high-frequency circuit board Download PDFInfo
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- CN110856370A CN110856370A CN201911214078.2A CN201911214078A CN110856370A CN 110856370 A CN110856370 A CN 110856370A CN 201911214078 A CN201911214078 A CN 201911214078A CN 110856370 A CN110856370 A CN 110856370A
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- circuit board
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- board substrate
- substrate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1168—Graft-polymerization
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Abstract
The invention discloses a resistance welding pretreatment method for a 5G high-frequency circuit board, which specifically comprises the following steps: s1, pretreatment of the circuit board base material: the invention discloses a method for cleaning a substrate, which comprises the steps of placing the substrate on a plate grinding machine for plate grinding treatment, and cleaning the surface of the substrate twice by using pure water after the plate grinding treatment of the substrate is finished. According to the pretreatment method for the solder mask of the 5G high-frequency circuit board, the substrate is arranged on the board grinding machine for board grinding treatment, the surface of the substrate is cleaned twice by pure water after the board grinding treatment is completed on the substrate, impurities on the surface of the substrate are washed clean, then the circuit board substrate is dried by strong wind, the grinding mark is controlled to be 10-15mm, the linear speed of a brushing board is 10.8m/s, the brushing roller adopts a large dragging shaft, the contact surface is increased, the phenomenon of ink bubbles of the circuit board substrate in the process of ink jet printing can be effectively avoided, the surface oxidation of the circuit board substrate before solder mask is effectively avoided, and the pretreatment effect is good.
Description
Technical Field
The invention relates to the technical field of resistance welding pretreatment of high-frequency circuit boards, in particular to a resistance welding pretreatment method of a 5G high-frequency circuit board.
Background
The prior high-frequency circuit board solder mask method comprises the following pretreatment steps: the pretreatment of the PTFE plate adopts a chemical cleaning mode of micro-etching or super-roughening; the ceramic plate can adopt two operation modes of mechanical grinding and brushing and chemical cleaning, the chemical cleaning mode is preferentially selected, the mechanical grinding and brushing can be adopted under the special condition that the chemical cleaning cannot be carried out, but the grinding mark is controlled within 0.6-1.0mm, and the phenomenon that the flatness of a copper surface is influenced due to too many times of plate passing is avoided.
The 5G high-frequency PTFE substrate has chemical inertness and low surface energy and is difficult to be adhered with other materials, wherein the surface of the PTFE substrate is discolored by a sodium etching agent, which is caused by the removal of fluorine atoms on the surface, the pretreatment procedures of the prior PTFE circuit board in the printing process are usually pretreatment, corona treatment, printing treatment, exposure development treatment and baking treatment, when the high-frequency circuit board substrate pretreatment is carried out, the adhesion force of the surface of the high-frequency circuit board substrate is poor, so that the bonding force between the high-frequency circuit board substrate and silk-screen printing ink is poor, and the problem of oil throwing is easy to occur, and the surface of the circuit board substrate is oxidized due to unclean treatment and the influence of supercooling, overheating or humidity before the high-frequency circuit board substrate ink printing is carried out, so that the ink cannot be effectively printed on the high-frequency circuit board substrate, and the ink bubble phenomenon is easy, the processing efficiency of the high-frequency circuit board is reduced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for the resistance welding pretreatment of a 5G high-frequency circuit board, which solves the problems that the binding force between a base material of the high-frequency circuit board and silk-screen printing ink is poor, oil throwing is easy to occur, and the phenomenon of ink bubbles on the base material of the high-frequency circuit board is easy to occur, so that the treatment efficiency of the high-frequency circuit board is reduced.
In order to achieve the purpose, the invention is realized by the following technical scheme: a resistance welding pretreatment method for a 5G high-frequency circuit board specifically comprises the following steps:
s1, pretreatment of the circuit board base material: placing the base material on a plate grinding machine for plate grinding treatment, cleaning the surface of the base material twice by using pure water after the plate grinding treatment is completed on the base material, washing impurities on the surface of the base material, then carrying out strong wind air drying on the circuit board base material, and placing the air-dried circuit board base material in a purifying box for further treatment;
s2, surface treatment of the circuit board substrate: taking out the circuit board substrate in the purifying box, placing the circuit board substrate in a laser radiation processing box for laser radiation processing, wherein the laser radiation time is 45min, and the circuit board substrate is rotated at low speed and uniform speed in the laser radiation processing box or subjected to corona processing of high-frequency alternating voltage;
s3, ink jet printing of the circuit board base material: in the process of carrying out laser radiation treatment on the circuit board substrate, blending the concentration of the printing ink, strictly adding the diluent according to the standard requirement of adding the diluent into the printing ink, taking the circuit board substrate out of a laser radiation treatment box after the laser radiation treatment of the circuit board substrate is finished, carrying out ink printing, and carrying out spray printing on the diluted printing ink on an area to be printed;
s4, exposure and development of the circuit board base material: carrying out exposure and development treatment on the ink layer on the circuit board substrate, wherein the energy level of green oil exposure is 9-11 grids, and the energy level of black oil exposure is 11-12 grids;
s5, baking treatment of the circuit board substrate: and carrying out UV pre-curing treatment on the ink sprayed and printed on the circuit board substrate, then carrying out laser trimming on the circuit board substrate by using a laser cutting machine, and carrying out thermosetting treatment on the circuit board substrate subjected to laser trimming.
Preferably, in the step S1, the grinding mark is controlled to be 10-15mm, wherein the linear speed of the brush plate is 10.8m/S, and the large dragging shaft is adopted for the brush roller, so as to increase the contact surface.
Preferably, in step S1, the strong wind drying employs a low-temperature strong wind knife to cut the liquid, thereby effectively preventing the oxidation of the board surface.
Preferably, in step S2, when the circuit board substrate is subjected to the laser irradiation treatment, the circuit board substrate is placed in a polymerizable monomer, and the radiation of Co-60 is performed to chemically graft-polymerize the monomer on the surface thereof, thereby forming the graft polymer layer.
Preferably, in step S2, the corona treatment step is to perform corona treatment on the copper foil surface on one side of the circuit board substrate, turn over the circuit board substrate, and perform corona treatment on the copper foil surface on the other side of the circuit board substrate, so as to change the surface energy of the circuit board substrate, and make the circuit board substrate easily adhere to the solder resist ink.
Preferably, in step S3, the dilution ratio of the ink is 70 ml/kg, the thickness of the ink is 5 μm to 100 μm, and when the ink jet printing is performed, the first side of the circuit board is firstly jet printed, then the circuit board is turned over, and finally the second side of the circuit board is jet printed.
Preferably, in step S4, when the exposure alignment is completed, the alignment of each circuit board substrate is checked by using a magnifying glass of 10 times or more, and the exposure energy is set to 11 to 13 glad films.
Preferably, in step S5, the UV pre-curing process primarily cures the ink sprayed on the circuit board, the thermal curing process completely cures the ink sprayed on the circuit board, a stable cross-linked structure is formed on the surface, and the circuit board substrate after the thermal curing process is placed on a special cooling plate before the solder-welding of the circuit board substrate.
The invention provides a solder mask pretreatment method for a 5G high-frequency circuit board. Compared with the prior art, the method has the following beneficial effects:
(1) the 5G high-frequency circuit board resistance welding pretreatment method comprises the steps of arranging a base material on a plate grinding machine for plate grinding treatment, cleaning the surface of the base material twice by using pure water after the base material is subjected to plate grinding treatment, washing impurities on the surface of the base material, then carrying out strong wind air drying on the circuit board base material, and controlling the grinding mark to be 10-15mm, wherein the linear speed of a brushing plate is 10.8m/s, a large dragging shaft is adopted by a brushing roller, the contact surface is enlarged, the phenomenon of ink bubbles generated in the process of carrying out ink jet printing on the circuit board base material can be effectively avoided, the surface oxidation of the circuit board base material before resistance welding can be effectively avoided, and the pretreatment effect is better;
(2) the pretreatment method for the solder resist of the 5G high-frequency circuit board comprises the steps of taking out a circuit board substrate in a purifying box, placing the circuit board substrate in a laser radiation processing box for laser radiation treatment, wherein the laser radiation time is 45min, rotating the circuit board substrate in the laser radiation processing box at a low speed and at a uniform speed, or carrying out corona treatment on the circuit board substrate at a high-frequency alternating-current voltage, placing the circuit board substrate in a polymerizable monomer during the laser radiation treatment of the circuit board substrate, radiating the polymerizable monomer by Co-60 to enable the monomer to generate chemical graft polymerization on the surface of the polymerizable monomer to form a graft polymer layer, carrying out corona treatment on one copper foil surface of the circuit board substrate, turning over the circuit board substrate, carrying out corona treatment on the other copper foil surface of the circuit board substrate, changing the surface energy of the circuit board substrate, and enabling the circuit board substrate to be easily bonded with, by carrying out laser radiation treatment or corona treatment on the surface of the circuit board substrate, the adhesion between the surface of the circuit board substrate and the printing ink can be effectively improved, and the problem of oil throwing is avoided;
(3) according to the method for the pretreatment of the 5G high-frequency circuit board before solder mask, the concentration of ink is blended in the process of carrying out laser radiation treatment on a circuit board substrate, the diluent is added according to the standard requirement of adding the diluent in the ink strictly, after the laser radiation treatment of the circuit board substrate is finished, the circuit board substrate is taken out from a laser radiation treatment box for ink printing, the diluted ink is sprayed and printed on an area to be printed, the dilution ratio of the ink is 70 ml/kg, in addition, the thickness of the ink is 5 mu m-100 mu m, the steps of firstly spraying and printing the first surface of the circuit board, then turning over the circuit board and finally spraying and printing the second surface of the circuit board are carried out during the ink spraying and printing, and the concentration of the ink can enable the ink on the surface of the circuit board substrate to reach the qualified standard, so that the inside;
(4) the 5G high-frequency circuit board resistance welding pretreatment method comprises the steps of carrying out UV pre-curing treatment on ink printed on a circuit board substrate, then carrying out laser trimming on the circuit board substrate by using a laser cutting machine, carrying out thermosetting treatment on the circuit board substrate subjected to laser trimming, carrying out primary curing on the ink printed on the circuit board by the UV pre-curing treatment, carrying out thorough curing on the ink printed on the circuit board by the thermosetting treatment, forming a stable cross-linking structure on the surface, placing the circuit board substrate subjected to thermosetting treatment on a special cooling plate before carrying out resistance welding on the circuit board substrate, effectively improving the ink baking effect on the circuit board, and enabling the surface adhesion effect of the ink on the circuit board substrate to be better.
Drawings
FIG. 1 is a flow chart of the steps of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a technical solution: a resistance welding pretreatment method for a 5G high-frequency circuit board specifically comprises the following steps:
s1, pretreatment of the circuit board base material: placing the base material on a plate grinding machine for plate grinding treatment, cleaning the surface of the base material twice by using pure water after the plate grinding treatment is completed on the base material, washing impurities on the surface of the base material, then carrying out strong wind air drying on the circuit board base material, and placing the air-dried circuit board base material in a purifying box for further treatment;
s2, surface treatment of the circuit board substrate: taking out the circuit board substrate in the purifying box, placing the circuit board substrate in a laser radiation processing box for laser radiation processing, wherein the laser radiation time is 45min, and the circuit board substrate is rotated at low speed and uniform speed in the laser radiation processing box or subjected to corona processing of high-frequency alternating voltage;
s3, ink jet printing of the circuit board base material: in the process of carrying out laser radiation treatment on the circuit board substrate, blending the concentration of the printing ink, strictly adding the diluent according to the standard requirement of adding the diluent into the printing ink, taking the circuit board substrate out of a laser radiation treatment box after the laser radiation treatment of the circuit board substrate is finished, carrying out ink printing, and carrying out spray printing on the diluted printing ink on an area to be printed;
s4, exposure and development of the circuit board base material: carrying out exposure and development treatment on the ink layer on the circuit board substrate, wherein the energy level of green oil exposure is 9-11 grids, and the energy level of black oil exposure is 11-12 grids;
s5, baking treatment of the circuit board substrate: and carrying out UV pre-curing treatment on the ink sprayed and printed on the circuit board substrate, then carrying out laser trimming on the circuit board substrate by using a laser cutting machine, and carrying out thermosetting treatment on the circuit board substrate subjected to laser trimming.
In the invention, in step S1, the grinding mark is controlled to be 10-15mm, wherein the linear speed of the brush plate is 10.8m/S, and the brush roller adopts a large dragging shaft to enlarge the contact surface.
In the invention, in step S1, the strong wind drying adopts low-temperature strong wind knife cutting liquid, thereby effectively preventing the board surface from being oxidized.
In the present invention, in step S2, when the circuit board substrate is subjected to the laser irradiation treatment, the circuit board substrate is placed in a polymerizable monomer, and is irradiated with Co-60 to cause chemical graft polymerization of the monomer on the surface thereof, thereby forming a graft polymer layer.
In step S2, the corona treatment step first performs corona treatment on the copper foil surface on one side of the circuit board substrate, and then performs corona treatment on the copper foil surface on the other side of the circuit board substrate after turning the circuit board substrate, so as to change the surface energy of the circuit board substrate and make the circuit board substrate easy to bond with solder resist ink.
In the invention, in step S3, the ink dilution ratio is 70 ml/kg, the thickness of the ink is 5 μm to 100 μm, and the ink jet printing is performed by firstly jet printing the first surface of the circuit board, then turning over the circuit board, and finally jet printing the second surface of the circuit board.
In the present invention, in step S4, when the exposure alignment is completed, the alignment of each circuit board substrate is checked with a magnifying glass of 10 times or more, and the exposure energy is set to 11 to 13 pieces of the cover film.
In the present invention, in step S5, the UV pre-curing process is to primarily cure the ink sprayed on the circuit board, the temperature of the UV pre-curing process is 80-100 ℃, the thermal curing process is to completely cure the ink sprayed on the circuit board, a stable cross-linked structure is formed on the surface, the temperature of the thermal curing process is 145-155 ℃, the circuit board substrate after the thermal curing process is placed on a dedicated cooling plate before the solder mask of the circuit board substrate, and the contents not described in detail in this specification belong to the prior art known to those skilled in the art.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A resistance welding pretreatment method for a 5G high-frequency circuit board is characterized by comprising the following steps: the method specifically comprises the following steps:
s1, pretreatment of the circuit board base material: placing the base material on a plate grinding machine for plate grinding treatment, cleaning the surface of the base material twice by using pure water after the plate grinding treatment is completed on the base material, washing impurities on the surface of the base material, then carrying out strong wind air drying on the circuit board base material, and placing the air-dried circuit board base material in a purifying box for further treatment;
s2, surface treatment of the circuit board substrate: taking out the circuit board substrate in the purifying box, placing the circuit board substrate in a laser radiation processing box for laser radiation processing, wherein the laser radiation time is 45min, and the circuit board substrate is rotated at low speed and uniform speed in the laser radiation processing box or subjected to corona processing of high-frequency alternating voltage;
s3, ink jet printing of the circuit board base material: in the process of carrying out laser radiation treatment on the circuit board substrate, blending the concentration of the printing ink, strictly adding the diluent according to the standard requirement of adding the diluent into the printing ink, taking the circuit board substrate out of a laser radiation treatment box after the laser radiation treatment of the circuit board substrate is finished, carrying out ink printing, and carrying out spray printing on the diluted printing ink on an area to be printed;
s4, exposure and development of the circuit board base material: carrying out exposure and development treatment on the ink layer on the circuit board substrate, wherein the energy level of green oil exposure is 9-11 grids, and the energy level of black oil exposure is 11-12 grids;
s5, baking treatment of the circuit board substrate: and carrying out UV pre-curing treatment on the ink sprayed and printed on the circuit board substrate, then carrying out laser trimming on the circuit board substrate by using a laser cutting machine, and carrying out thermosetting treatment on the circuit board substrate subjected to laser trimming.
2. The method for the pre-welding treatment of the 5G high-frequency circuit board as claimed in claim 1, wherein the method comprises the following steps: in the step S1, the grinding mark is controlled to be 10-15mm, wherein the linear speed of the brush plate is 10.8m/S, and the brush roller adopts a large dragging shaft to increase the contact surface.
3. The method for the pre-welding treatment of the 5G high-frequency circuit board as claimed in claim 1, wherein the method comprises the following steps: in the step S1, the strong wind air-drying adopts low-temperature strong wind knife to cut the liquid, thereby effectively preventing the board surface from being oxidized.
4. The method for the pre-welding treatment of the 5G high-frequency circuit board as claimed in claim 1, wherein the method comprises the following steps: in the step S2, when the circuit board substrate is subjected to the laser radiation treatment, the circuit board substrate is placed in a polymerizable monomer, and is irradiated by Co-60, so that the monomer is chemically graft-polymerized on the surface thereof, thereby forming a graft polymer layer.
5. The method for the pre-welding treatment of the 5G high-frequency circuit board as claimed in claim 1, wherein the method comprises the following steps: in the step S2, the corona treatment step first performs corona treatment on the copper foil surface on one side of the circuit board substrate, and then performs corona treatment on the copper foil surface on the other side of the circuit board substrate after turning the circuit board substrate, so as to change the surface energy of the circuit board substrate, and make the circuit board substrate easily adhere to the solder resist ink.
6. The method for the pre-welding treatment of the 5G high-frequency circuit board as claimed in claim 1, wherein the method comprises the following steps: in the step S3, the ink dilution ratio is 70 ml/kg, the thickness of the ink is 5 μm to 100 μm, and when the ink jet printing is performed, the first surface of the circuit board is firstly jet printed, then the circuit board is turned over, and finally the second surface of the circuit board is jet printed.
7. The method for the pre-welding treatment of the 5G high-frequency circuit board as claimed in claim 1, wherein the method comprises the following steps: in step S4, when the exposure alignment is completed, the alignment of each circuit board substrate is checked by using a magnifying glass of 10 times or more, and the exposure energy is set to 11 to 13 grids of the cover film.
8. The method for the pre-welding treatment of the 5G high-frequency circuit board as claimed in claim 1, wherein the method comprises the following steps: in the step S5, the UV pre-curing process primarily cures the ink sprayed on the circuit board, the thermal curing process completely cures the ink sprayed on the circuit board, a stable cross-linked structure is formed on the surface, and the circuit board substrate after the thermal curing process is placed on a special cooling plate before the solder resist of the circuit board substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911214078.2A CN110856370A (en) | 2019-12-02 | 2019-12-02 | Resistance welding pretreatment method for 5G high-frequency circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911214078.2A CN110856370A (en) | 2019-12-02 | 2019-12-02 | Resistance welding pretreatment method for 5G high-frequency circuit board |
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| CN112074089A (en) * | 2020-08-31 | 2020-12-11 | 珠海智锐科技有限公司 | Method for manufacturing bonding pad |
| CN112533360A (en) * | 2020-12-07 | 2021-03-19 | 惠州市特创电子科技股份有限公司 | Hot-press bonding method of high-frequency circuit board and processing method of circuit board |
| CN112770507A (en) * | 2020-12-10 | 2021-05-07 | 惠州市特创电子科技股份有限公司 | Corona resistance welding circuit board and preparation method thereof |
| CN113225939A (en) * | 2021-04-16 | 2021-08-06 | 深圳正峰印刷有限公司 | Flexible circuit preparation method and flexible circuit |
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Application publication date: 20200228 |