CN107567203A - A kind of method of spray printing anti-solder ink - Google Patents
A kind of method of spray printing anti-solder ink Download PDFInfo
- Publication number
- CN107567203A CN107567203A CN201711010677.3A CN201711010677A CN107567203A CN 107567203 A CN107567203 A CN 107567203A CN 201711010677 A CN201711010677 A CN 201711010677A CN 107567203 A CN107567203 A CN 107567203A
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- Prior art keywords
- sprayed
- ink
- wiring board
- spraying
- solder
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Abstract
The invention discloses a kind of method for spraying anti-solder ink, methods described includes：Obtain ink spray parameters；According to the ink spray parameters, the anti-solder ink of spraying preset thickness on wiring board to be sprayed；Obtain drying process parameter；According to the drying process parameter, processing is dried to the wiring board for having sprayed the anti-solder ink.By according to computer program, obtaining corresponding ink spray parameters, spraying the anti-solder ink of preset thickness on wiring board to be sprayed by Computer Control Unit control ink-spraying-head.Compared to screen printing process more of the prior art, high degree improves anti-solder ink spray efficiency, and technique is simple.
Description
Technical field
The present invention relates to ink jet-printing technology field, more specifically, more particularly to a kind of spray printing anti-solder ink
Method.
Background technology
With the continuous development of scientific technology, electronic product is widely used to daily life, work and work
In industry, brought great convenience for the life of people.
In the prior art, the mode to wiring board printing-ink is carried out using the mode of wire mark, in the situation of thickness print
When lower, it is also necessary to carry out secondary wire mark, and need manually to be completed.
The mode of the wire mark, efficiency is low and technique is cumbersome.
The content of the invention
To solve the above problems, the invention provides a kind of method for spraying anti-solder ink, efficiency high, technique are simple.
To achieve the above object, the present invention provides following technical scheme：
A kind of method for spraying anti-solder ink, methods described include：
Obtain ink spray parameters；
According to the ink spray parameters, the anti-solder ink of spraying preset thickness on wiring board to be sprayed；
Obtain drying process parameter；
According to the drying process parameter, processing is dried to the wiring board for having sprayed the anti-solder ink.
Preferably, in the above-mentioned methods, it is described according to the ink spray parameters, sprayed on wiring board to be sprayed default
The anti-solder ink of thickness, including：
The fixed wiring board to be sprayed of level, and the first surface of the wiring board to be sprayed is faced ink-spraying-head；
According to the ink spray parameters, the anti-solder ink of the preset thickness is sprayed in the first surface；
The wiring board to be sprayed is overturn, and the second surface of the wiring board to be sprayed is sprayed in face of ink；
According to the ink spray parameters, the anti-solder ink of the preset thickness is sprayed in the second surface.
Preferably, in the above-mentioned methods, methods described also includes：
After the anti-solder ink of the preset thickness is completed in the first surface spraying of the wiring board to be sprayed, using 75
DEG C -85 DEG C of temperature carries out pre-dried, continues 15min-25min；
After the anti-solder ink of the preset thickness is completed in the second surface spraying of the wiring board to be sprayed, using 75
DEG C -85 DEG C of temperature carries out pre-dried, continues 15min-25min.
Preferably, in the above-mentioned methods, it is described according to the ink spray parameters, sprayed on wiring board to be sprayed default
The anti-solder ink of thickness, including：
The wiring board to be sprayed is fixed vertically, and makes the first surface and second surface difference of the spraying wiring board
In face of ink-spraying-head；
According to the ink spray parameters, the default thickness is sprayed simultaneously in the first surface and the second surface
The anti-solder ink of degree.
Preferably, in the above-mentioned methods, methods described also includes：
After the first surface and second surface of the wiring board to be sprayed complete the anti-solder ink of the preset thickness,
Predrying place is carried out to the first surface and second surface of the wiring board to be sprayed simultaneously using 75 DEG C -85 DEG C of temperature
Reason, continue 15min-25min.
Preferably, in the above-mentioned methods, methods described also includes：
When treat spraying wiring board on spray preset thickness anti-solder ink after the completion of, be exposed processing.
Preferably, in the above-mentioned methods, methods described also includes：
After the completion of spraying wiring board exposure-processed is treated, development treatment is carried out.
Preferably, in the above-mentioned methods, the scope of the preset thickness is 10um-30um.
Preferably, in the above-mentioned methods, the drying process parameter includes：Drying temperature scope is 145 DEG C -155 DEG C, is done
Dry duration ranges are 55min-65min.
By foregoing description, a kind of method for spraying anti-solder ink provided by the invention includes：Obtain ink spraying
Parameter；According to the ink spray parameters, the anti-solder ink of spraying preset thickness on wiring board to be sprayed；Obtain drying process
Parameter；According to the drying process parameter, processing is dried to the wiring board for having sprayed the anti-solder ink.
By according to computer program, obtaining corresponding ink spray parameters, ink being controlled by Computer Control Unit
Shower nozzle sprays the anti-solder ink of preset thickness on wiring board to be sprayed.Compared to screen printing process more of the prior art, very big journey
Degree improves anti-solder ink spray efficiency, and technique is simple.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is a kind of schematic flow sheet of method for spraying anti-solder ink provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
In order to facilitate the understanding of the purposes, features and advantages of the present invention, it is below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is further detailed explanation.
With reference to figure 1, Fig. 1 is a kind of schematic flow sheet of method for spraying anti-solder ink provided in an embodiment of the present invention.
Methods described includes：
S101：Obtain ink spray parameters.
Specifically, corresponding ink spray parameters are inputted into ink spray equipment, controlled and carried out by computer
Ink sprays.
S102：According to the ink spray parameters, the anti-solder ink of spraying preset thickness on wiring board to be sprayed.
Specifically, before anti-solder ink is sprayed, it is to be sprayed to its using process meanses such as grinding, roughening, nog plate, sandblastings
Wiring board carries out surface pretreatment, removes oxide on surface, increases PCB surface roughness, and it is attached to strengthen PCB surface ink
Put forth effort.
S103：Obtain drying process parameter.
Specifically, it is 145 DEG C -155 DEG C that the drying process parameter, which includes drying temperature scope, duration ranges are dried
For 55min-65min.For example, using 150 DEG C of drying temperature, 60min is dried.
S104：According to the drying process parameter, processing is dried to the wiring board for having sprayed the anti-solder ink.
Specifically, the epoxy resin on the wiring board of the complete anti-solder ink of spraying is set thoroughly to harden.
Further, it is described according to the ink spray parameters, the anti-welding of preset thickness is sprayed on wiring board to be sprayed
Ink, including：
The fixed wiring board to be sprayed of level, and the first surface of the wiring board to be sprayed is faced ink-spraying-head.
According to the ink spray parameters, the anti-solder ink of the preset thickness is sprayed in the first surface.
The wiring board to be sprayed is overturn, and the second surface of the wiring board to be sprayed is sprayed in face of ink.
According to the ink spray parameters, the anti-solder ink of the preset thickness is sprayed in the second surface.
That is, the first surface for treating spraying wiring board first is sprayed, then treat the first of spraying wiring board
Surface is sprayed, and is divided into the completion of two steps.
Further, when the anti-solder ink of the preset thickness is completed in the first surface spraying of the wiring board to be sprayed
Afterwards, pre-dried is carried out using 75 DEG C -85 DEG C of temperature, continues 15min-25min.
After the anti-solder ink of the preset thickness is completed in the second surface spraying of the wiring board to be sprayed, using 75
DEG C -85 DEG C of temperature carries out pre-dried, continues 15min-25min.
That is, after anti-solder ink is completed in the first surface spraying for treating spraying wiring board, pre-dried is carried out,
For driving the solvent in anti-solder ink away, make anti-solder ink partially hardened, prevent the sticky end piece in subsequent step.Similarly, when right
After anti-solder ink is completed in the second surface spraying of wiring board to be sprayed, pre-dried is also carried out, for driving away in anti-solder ink
Solvent, make anti-solder ink partially hardened, prevent the sticky end piece in subsequent step.
Further, it is described according to the ink spray parameters, the anti-welding of preset thickness is sprayed on wiring board to be sprayed
Ink, including：
The wiring board to be sprayed is fixed vertically, and makes the first surface and second surface difference of the spraying wiring board
In face of ink-spraying-head.
According to the ink spray parameters, the default thickness is sprayed simultaneously in the first surface and the second surface
The anti-solder ink of degree.
That is, first surface and second surface while the spraying for carrying out anti-solder ink of spraying wiring board are treated,
Further increase spray efficiency.
Further, when the first surface and second surface of the wiring board to be sprayed complete the anti-of the preset thickness
After solder paste ink, the first surface and second surface of the wiring board to be sprayed are carried out simultaneously using 75 DEG C -85 DEG C of temperature
Pre-dried, continue 15min-25min.
That is, after the first surface and second surface spraying for the treatment of spraying wiring board complete anti-solder ink, enter
Row pre-dried, for driving the solvent in anti-solder ink away, make anti-solder ink partially hardened, prevent the sticky end in subsequent step
Piece.
Further, method provided in an embodiment of the present invention also includes：When treating preset thickness is sprayed on spraying wiring board
Anti-solder ink after the completion of, be exposed processing.
Specifically, by being exposed processing, image transfer is realized, using photoinduction mode, exposure light source is passed through into system
The film of product anti-solder ink shape, is irradiated on light-sensitive surface, is allowed to photosensitive.The light-sensitive surface being mapped to by light forms protective layer, not by
The light-sensitive surface that light is mapped to does not have diaphragm then.
Further, method provided in an embodiment of the present invention also includes：After the completion of spraying wiring board exposure-processed is treated,
Carry out development treatment.
Specifically, will not washed away using imaging liquid by the photonasty oil film that light is mapped to, the copper face handled with exposing surface can
Choosing, development point control is between 50%-70%.
Further, in the embodiment of the present invention, the scope of the preset thickness is 10um-30um, including endpoint value.
It follows that a kind of method for spraying anti-solder ink provided by the invention, by according to computer program, obtaining phase
The ink spray parameters answered, ink-spraying-head is controlled to spray preset thickness on wiring board to be sprayed by Computer Control Unit
Anti-solder ink.Compared to screen printing process more of the prior art, high degree improves anti-solder ink spray efficiency, and technique letter
It is single.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (9)
- A kind of 1. method for spraying anti-solder ink, it is characterised in that methods described includes：Obtain ink spray parameters；According to the ink spray parameters, the anti-solder ink of spraying preset thickness on wiring board to be sprayed；Obtain drying process parameter；According to the drying process parameter, processing is dried to the wiring board for having sprayed the anti-solder ink.
- 2. according to the method for claim 1, it is characterised in that it is described according to the ink spray parameters, in line to be sprayed The anti-solder ink of preset thickness is sprayed on the plate of road, including：The fixed wiring board to be sprayed of level, and the first surface of the wiring board to be sprayed is faced ink-spraying-head；According to the ink spray parameters, the anti-solder ink of the preset thickness is sprayed in the first surface；The wiring board to be sprayed is overturn, and the second surface of the wiring board to be sprayed is sprayed in face of ink；According to the ink spray parameters, the anti-solder ink of the preset thickness is sprayed in the second surface.
- 3. according to the method for claim 2, it is characterised in that methods described also includes：After the anti-solder ink of the preset thickness is completed in the first surface spraying of the wiring board to be sprayed, using 75 DEG C -85 DEG C temperature carry out pre-dried, continue 15min-25min；After the anti-solder ink of the preset thickness is completed in the second surface spraying of the wiring board to be sprayed, using 75 DEG C -85 DEG C temperature carry out pre-dried, continue 15min-25min.
- 4. according to the method for claim 1, it is characterised in that it is described according to the ink spray parameters, in line to be sprayed The anti-solder ink of preset thickness is sprayed on the plate of road, including：The wiring board to be sprayed is fixed vertically, and the first surface of the spraying wiring board and second surface is faced respectively Ink-spraying-head；According to the ink spray parameters, the preset thickness is sprayed simultaneously in the first surface and the second surface Anti-solder ink.
- 5. according to the method for claim 4, it is characterised in that methods described also includes：After the first surface and second surface of the wiring board to be sprayed complete the anti-solder ink of the preset thickness, use 75 DEG C -85 DEG C of temperature carries out pre-dried to the first surface and second surface of the wiring board to be sprayed simultaneously, holds Continuous 15min-25min.
- 6. according to the method for claim 1, it is characterised in that methods described also includes：When treat spraying wiring board on spray preset thickness anti-solder ink after the completion of, be exposed processing.
- 7. according to the method for claim 6, it is characterised in that methods described also includes：After the completion of spraying wiring board exposure-processed is treated, development treatment is carried out.
- 8. according to the method for claim 1, it is characterised in that the scope of the preset thickness is 10um-30um.
- 9. according to the method for claim 1, it is characterised in that the drying process parameter includes：Drying temperature scope is 145 DEG C -155 DEG C, it is 55min-65min to dry duration ranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711010677.3A CN107567203A (en) | 2017-10-25 | 2017-10-25 | A kind of method of spray printing anti-solder ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711010677.3A CN107567203A (en) | 2017-10-25 | 2017-10-25 | A kind of method of spray printing anti-solder ink |
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| Publication Number | Publication Date |
|---|---|
| CN107567203A true CN107567203A (en) | 2018-01-09 |
Family
ID=60987311
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711010677.3A Pending CN107567203A (en) | 2017-10-25 | 2017-10-25 | A kind of method of spray printing anti-solder ink |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109878222A (en) * | 2019-04-02 | 2019-06-14 | 广州益峰尖纸制品有限公司 | A kind of PCB ink curing device and its working method |
| CN110831341A (en) * | 2019-11-15 | 2020-02-21 | 江苏上达电子有限公司 | Novel ink coating method for printed circuit board |
| CN111770642A (en) * | 2020-06-11 | 2020-10-13 | 珠海斗门超毅实业有限公司 | Application method of bonding agent in surface treatment of circuit board and circuit board |
| CN112087883A (en) * | 2019-06-12 | 2020-12-15 | 群翊工业股份有限公司 | Substrate surface feeding method and substrate surface feeding equipment |
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| CN105101660A (en) * | 2014-05-09 | 2015-11-25 | 深圳崇达多层线路板有限公司 | Large-size backboard solder mask manufacturing method |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070104878A1 (en) * | 2001-11-02 | 2007-05-10 | Cabot Corporation | Precursor compositions for the deposition of passive electronic features |
| JP2013022847A (en) * | 2011-07-21 | 2013-02-04 | Ricoh Co Ltd | Liquid drop ejection head and image forming apparatus |
| CN103200782A (en) * | 2013-04-18 | 2013-07-10 | 汕头超声印制板（二厂）有限公司 | Manufacturing method of full-inkjet printed-circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109878222A (en) * | 2019-04-02 | 2019-06-14 | 广州益峰尖纸制品有限公司 | A kind of PCB ink curing device and its working method |
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| CN112087883A (en) * | 2019-06-12 | 2020-12-15 | 群翊工业股份有限公司 | Substrate surface feeding method and substrate surface feeding equipment |
| CN110831341A (en) * | 2019-11-15 | 2020-02-21 | 江苏上达电子有限公司 | Novel ink coating method for printed circuit board |
| CN111770642A (en) * | 2020-06-11 | 2020-10-13 | 珠海斗门超毅实业有限公司 | Application method of bonding agent in surface treatment of circuit board and circuit board |
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Application publication date: 20180109 |