CN102625590A - Soldering-resistant processing method for circuit board - Google Patents
Soldering-resistant processing method for circuit board Download PDFInfo
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- CN102625590A CN102625590A CN2012100756749A CN201210075674A CN102625590A CN 102625590 A CN102625590 A CN 102625590A CN 2012100756749 A CN2012100756749 A CN 2012100756749A CN 201210075674 A CN201210075674 A CN 201210075674A CN 102625590 A CN102625590 A CN 102625590A
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Abstract
The invention discloses a soldering-resistant processing method for a circuit board. The method comprises the following steps of: coating soldering-resistant coatings; precuring; performing exposure; developing and curing. Before the exposure step, the method also comprises a leveling step for leveling surfaces of the precured soldering-resistant coatings. According to the technical scheme, the technical problem that ink imprints are easily generated in the conventional soldering-resistant processing can be solved.
Description
Technical field
The present invention relates to the circuit board processing technique field, be specifically related to a kind of circuit plate resistance weldering processing method.
Background technology
Welding resistance processing is the necessary flow process of circuit board manufacturing, generally after circuit etching finishes, carries out.Solder mask can play the effect of insulation resistance weldering, possesses protection simultaneously and increases effect attractive in appearance.
The welding resistance work flow comprises steps such as applying welding resistance coating, precuring, exposure, development and curing.Wherein, the step that applies resistance weldering coating has following several kinds of technology types available: the dip-coating type, and roll-on-type, curtain is coated with type, electrostatic painting type, silk screen printing type etc.
In the resistance weldering course of processing, the resistance weldering coating that is coated in circuit board surface may make the resistance weldering paint thickness of zones of different inconsistent because of skewness.Especially when adopting silk-screen printing technique, the problem that this kind resistance weldering coating skewness, variable thickness cause is more obvious.
And in follow-up steps such as exposure, the resistance weldering dope layer that skewness, variable thickness cause receives the extruding of instruments such as exposure egative film easily, to such an extent as to can form various printing ink impressions.The skewness of printing ink, variable thickness cause and in follow-up encapsulation process, cause the wafer lacerated wound easily; The printing ink impression then influences the roughness of printing ink to a certain extent, and gummosis speed does not wait when causing encapsulating.These all can increase the risk that encapsulation was lost efficacy undoubtedly, increase cost, and consider from the consumer angle, and the open defect that the printing ink impression causes also is easy to generate psychological burden.
Summary of the invention
The embodiment of the invention provides a kind of circuit plate resistance weldering processing method, is used to solve the technical problem that existing resistance weldering handling ease produces the printing ink impression.
A kind of circuit board welding resistance processing method comprises applying welding resistance coating, precuring, and exposure is developed and curing, wherein, also comprises before the said step of exposure:
The resistance weldering coating of precuring is carried out the smoothing step of surface evening.
The embodiment of the invention increases the technical scheme of smoothing step before being employed in step of exposure; Be implemented in the preceding resistance weldering coating of exposure and carry out surface evening precuring; Can before exposure, solve the problem that resistance weldering coating skewness, variable thickness cause; And then the generation that can avoid printing ink to impress, the good appearance of holding circuit plate, the risk of minimizing wafer lacerated wound.
Description of drawings
Fig. 1 is that the circuit plate resistance that the embodiment of the invention provides is welded the flow chart of processing method;
Fig. 2 is the sketch map that need carry out the circuit board of welding resistance processing among the embodiment;
Fig. 3 is the sketch map that has applied the circuit board of resistance weldering coating among the embodiment;
Fig. 4 presses the sketch map of establishing mould release membrance at resistance weldering coating surface among the embodiment;
Fig. 5 is the sketch map that among the embodiment resistance weldering coating is made public;
Fig. 6 removes mould release membrance and the sketch map of the circuit board afterwards that develops among the embodiment.
Embodiment
The embodiment of the invention provides a kind of circuit plate resistance weldering processing method, below is elaborated.
Embodiment one,
Please refer to Fig. 1, the embodiment of the invention provides a kind of circuit plate resistance weldering processing method, and this method may further comprise the steps: coating resistance weldering coating, and precuring, exposure is developed and curing.Wherein, also comprise before the step of exposure: the smoothing step of the resistance weldering coating of precuring being carried out surface evening.This method can solve the technical problem that prior art is easy to generate the printing ink impression.
Applying resistance weldering coating step, is to adopt silk screen printing, or roller coating, or dip-coating, or curtain is coated with, or mode such as electrostatic painting type, applies one deck photosensitive solder resist coating at circuit board surface.This welding resistance coating can be welding resistance printing ink specifically, comprises epoxy resin IR baking-type, UV constrictive type, liquid photosensitive type etc.Present embodiment is particularly useful for adopting the resistance weldering processing of liquid photosensitive type resistance solder paste China ink and silk-screen printing technique.
Silk-screen printing technique is meant by the web plate that has special shelves point to be provided with, by scraper welding resistance printing ink is passed through screen printing on circuit board piece.Because the performance requirement of circuit board is different, line pattern has very big-difference, for line pattern densely distributed with different zone such as copper face greatly, be easy to generate the printing ink skewness behind the silk screen frictioning, the problem that variable thickness causes.
Pre-cure step is to adopt mode such as baking that the photosensitive solder resist coating of coating is tentatively hardened, and is unlikely in follow-up steps such as exposure, to take place the phenomenon of the anti-sticking egative film that makes public.
Step of exposure is to utilize exposure machine, makes the photosensitive solder resist coating generation photopolymerization reaction of ad-hoc location.
Development step is to utilize the photoresistance weldering coating that photopolymerization reaction will not take place solution such as sodium carbonate to remove.
Through exposure and development step, realize the weldering of the resistance on egative film figure transfer to resistance weldering coating.
Curing schedule is to adopt mode such as baking that photosensitive solder resist coating is hardened fully to be fixed on the circuit board.
The smoothing step is carried out before the exposure after precuring, is used for the surface evening with the welding resistance coating of precuring, eliminates or alleviates the problem that welding resistance coating skewness, variable thickness cause.
In a kind of mode, the smoothing step comprises: the surface pressure of welding coating in the resistance of precuring is established mould release membrance.
Mould release membrance is meant that the surface has film separatory, and mould release membrance does not have viscosity with specific material after contacting under the limited condition, or slight viscosity.Generally, can plastic film be done plasma treatment, or be coated with the fluorine processing, or be coated with silicon (silicone) mould release on the top layer of film material in order to increase the off-type force of plastic film, like PET, PE, OPP, or the like; Let it can show extremely light and stable off-type force for various organic pressure sensitivity glue (like the pressure sensitivity glue of hot melt adhesive, acryl glue and rubber system).Surface pressure by at the welding resistance coating of precuring is established one deck mould release membrance, can make the more even distribution of welding resistance coating with the welding resistance coating extruding in the big zone of thickness to the thin zone of ink thickness, and thickness is consistent more.Because mould release membrance is transparent, can avoid exposure process is caused adverse effect.Therefore, can in whole exposure process, make mould release membrance remain on circuit board surface, remove again after the exposure.And because the off-type force of mould release membrance can be peeled off removal with mould release membrance easily.In this execution mode,, can preferentially select the higher mould release membrance of transparency for use in order to reduce the adverse effect of mould release membrance to exposure process.
In the another kind of mode, the smoothing step comprises: utilize metallic plate that the surface of the resistance weldering coating of precuring is pushed.
The absorption affinity of metal sheet surface is less, and resistance solder paste China ink is not easy to adhere to metal sheet surface.Therefore, also can utilize metallic plate that the surface of the welding resistance coating of precuring is pushed, the big regional welding resistance coating extruding of thickness to the thin zone of ink thickness, is made the more even distribution of welding resistance coating, thickness is consistent more.Then, remove metallic plate, carry out follow-up steps such as exposure.
In another mode, the smoothing step comprises: elder generation establishes mould release membrance in the surface pressure of the resistance weldering coating of precuring, and then utilizes metallic plate to push.This mode is the combination of above-mentioned dual mode, better effects if.
Metallic plate mentioned above specifically can be a steel plate, especially can be corrosion resistant plate.
In the alternate manner, can also adopt other any available material or instrument that the surface of the resistance weldering coating of precuring is smoothed.
To sum up; The embodiment of the invention provides a kind of circuit plate resistance weldering processing method, is employed in the technical scheme that increases the smoothing step before the step of exposure, is implemented in that the resistance weldering coating to precuring carries out surface evening before the exposure; Can before exposure, solve the problem that resistance weldering coating skewness, variable thickness cause; And then the generation that can avoid printing ink to impress, the good appearance of holding circuit plate, the risk of minimizing wafer lacerated wound.
Embodiment two,
Present embodiment is done more detailed explanation in conjunction with concrete application scenarios to the inventive method.
Suppose to hinder the circuit board of weldering processing, as shown in Figure 2.The circuit board 100 of this simplification comprises dielectric layer 101 and two line layers 102.
Apply welding resistance coating step circuit board afterwards, as shown in Figure 3, the welding resistance coating of coating is shown in label 103 among the figure.
Press the circuit board of having established mould release membrance at the welding resistance coating surface, as shown in Figure 4, establish mould release membrance 104 by pressure, the welding resistance coating in the big zone of thickness can be pushed to other zone, make the more even distribution of welding resistance coating, thickness is consistent more.
Shown in Figure 5, be that resistance weldering coating is carried out step of exposing, the radiation direction of exposure process is shown in arrow among the figure.In the exposure process, light rays shines on the welding resistance coating after by egative film and mould release membrance, makes the welding resistance coating generation photopolymerization reaction of privileged site.
Shown in Figure 6, be removed mould release membrance and develop after the sketch map of circuit board.At this moment, the resistance of circuit board surface weldering coating is flattened, and has formed resistance weldering figure.
To sum up, present embodiment combines concrete scene example accompanying drawing that circuit plate resistance weldering processing method of the present invention is further specified.
More than circuit plate resistance that the embodiment of the invention provided weldering processing method has been carried out detailed introduction, but the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof, should not be construed as limitation of the present invention.The technical staff in present technique field is in the technical scope that the present invention discloses, and the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.
Claims (5)
1. a circuit board welding resistance processing method comprises applying welding resistance coating, precuring, and exposure is developed and curing, it is characterized in that, also comprises before the said step of exposure:
The resistance weldering coating of precuring is carried out the smoothing step of surface evening.
2. method according to claim 1 is characterized in that, said smoothing step comprises:
Weld the surface pressure of coating in the resistance of precuring and establish mould release membrance.
3. method according to claim 2 is characterized in that, also comprises before the said development step:
Step with said mould release membrance removal.
4. method according to claim 1 is characterized in that, said smoothing step comprises:
Utilize metallic plate that the surface of the resistance weldering coating of precuring is pushed.
5. method according to claim 1 is characterized in that, said smoothing step comprises:
Weld the surface pressure of coating in the resistance of precuring and establish mould release membrance, and utilize metallic plate to push.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2012100756749A CN102625590A (en) | 2012-03-21 | 2012-03-21 | Soldering-resistant processing method for circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012100756749A CN102625590A (en) | 2012-03-21 | 2012-03-21 | Soldering-resistant processing method for circuit board |
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| CN102625590A true CN102625590A (en) | 2012-08-01 |
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| CN2012100756749A Pending CN102625590A (en) | 2012-03-21 | 2012-03-21 | Soldering-resistant processing method for circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541142A (en) * | 2018-06-01 | 2018-09-14 | 河源诚展科技有限公司 | A kind of PCB inner line figures shifting process |
| CN109462943A (en) * | 2018-12-14 | 2019-03-12 | 惠州市和鑫达电子科技有限公司 | A kind of pcb board production technology suitable for 3.2mm substrate |
| CN109922606A (en) * | 2019-03-15 | 2019-06-21 | 东莞塘厦裕华电路板有限公司 | A kind of production method of wiring board solder mask |
| CN110402035A (en) * | 2018-04-25 | 2019-11-01 | 鹰克实业有限公司 | The method for forming soldermask layer on circuit boards using double-formulation anti-solder ink |
| CN112721482A (en) * | 2020-12-17 | 2021-04-30 | 江西弘信柔性电子科技有限公司 | Printing process for improving thickness uniformity of solder resist ink |
| CN113163615A (en) * | 2021-02-05 | 2021-07-23 | 东莞市春瑞电子科技有限公司 | Non-photopolymerization PCB solder resist ink windowing and solder resist oil bridge process |
| CN113993294A (en) * | 2020-07-27 | 2022-01-28 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
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| CN102361543A (en) * | 2011-09-26 | 2012-02-22 | 深南电路有限公司 | Circuit board resistance welding processing method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110402035A (en) * | 2018-04-25 | 2019-11-01 | 鹰克实业有限公司 | The method for forming soldermask layer on circuit boards using double-formulation anti-solder ink |
| CN108541142A (en) * | 2018-06-01 | 2018-09-14 | 河源诚展科技有限公司 | A kind of PCB inner line figures shifting process |
| CN108541142B (en) * | 2018-06-01 | 2021-07-20 | 河源诚展科技有限公司 | PCB inner layer circuit pattern transfer process |
| CN109462943A (en) * | 2018-12-14 | 2019-03-12 | 惠州市和鑫达电子科技有限公司 | A kind of pcb board production technology suitable for 3.2mm substrate |
| CN109922606A (en) * | 2019-03-15 | 2019-06-21 | 东莞塘厦裕华电路板有限公司 | A kind of production method of wiring board solder mask |
| CN113993294A (en) * | 2020-07-27 | 2022-01-28 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN113993294B (en) * | 2020-07-27 | 2024-03-22 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN112721482A (en) * | 2020-12-17 | 2021-04-30 | 江西弘信柔性电子科技有限公司 | Printing process for improving thickness uniformity of solder resist ink |
| CN113163615A (en) * | 2021-02-05 | 2021-07-23 | 东莞市春瑞电子科技有限公司 | Non-photopolymerization PCB solder resist ink windowing and solder resist oil bridge process |
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Application publication date: 20120801 |