CN105142345B - A kind of production method of plate face out-of-flatness pcb board - Google Patents
A kind of production method of plate face out-of-flatness pcb board Download PDFInfo
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- CN105142345B CN105142345B CN201510469804.0A CN201510469804A CN105142345B CN 105142345 B CN105142345 B CN 105142345B CN 201510469804 A CN201510469804 A CN 201510469804A CN 105142345 B CN105142345 B CN 105142345B
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- pcb board
- film
- wet film
- plate face
- flatness
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention discloses a kind of production method of plate face out-of-flatness pcb board, including step：A, wet film is uniformly coated on the pcb board made to electric plating of whole board, is filled the pit on pcb board and dent；B, carrying out baking to the pcb board for coating wet film dries wet film；C, using laminator on wet film one layer of dry film of hot pressing；D, pcb board is stood into a period of time, then using the ultraviolet light of exposure machine wet film and dry film is made to generate polymerisation, so as to by pattern transfer to pcb board；E, the pcb board after exposing stands a period of time, then falls the dry film for not being exposed polymerization and wet film development using alkaline development liquid medicine, the dry film for having exposed polymerization and wet film is made to stay in plate face to form circuit.There is the problem of notch, open circuit after solving the etching of plate face out-of-flatness pcb board in the present invention.The method of the present invention, which is promoted, makes yield.
Description
Technical field
The present invention relates to PCB production fields more particularly to a kind of production methods of plate face out-of-flatness pcb board.
Background technology
Dry film is a kind of photosensitive resist layer, and after ultraviolet light is subject to irradiate, photosensitive part generates what polymerisation was stablized
Pcb board face is attached to, not photosensitive part is rinsed out by liquid medicine, forms the resist layer for stopping plating and etching.
Normally pcb board face should be smooth, but some plate faces, because when preceding process makes, carry, operate, pressing,
Even plating all may cause plate face to have the problem of pit dent.When the PCB for having serious pit dent pastes resist layer dry film, meeting
Appearance is pasted not tightly, occurs rejection film after development, and then circuit, hole, PAD and copper face notch occur after being etched at pit dent, open
The phenomenon that road.
When making the PCB of precise circuit, since fine and closely woven circuit can not be repaired, so the open circuit that pit dent problem generates
It will cause very high scrappage, seriously affect the quality control of PCB manufacturers and productivity effect problem.
Therefore, the prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned deficiencies of the prior art, it is an object of the invention to provide a kind of making of plate face out-of-flatness pcb board
Method, it is intended to which the problems such as notch and open circuit occurs in the PCB for solving plate face out-of-flatness.
Technical scheme is as follows：
A kind of production method of plate face out-of-flatness pcb board, wherein, including step：
A, wet film is uniformly coated on the pcb board made to electric plating of whole board, is filled the pit on pcb board and dent；
B, carrying out baking to the pcb board for coating wet film dries wet film；
C, using laminator on wet film one layer of dry film of hot pressing；
D, pcb board is stood into a period of time, then using the ultraviolet light of exposure machine wet film and dry film is made to generate polymerization instead
Should, so as to by pattern transfer to pcb board；
E, the pcb board after exposing stands a period of time, then will not be exposed the dry film of polymerization using alkaline development liquid medicine
And wet film development is fallen, and the dry film for having exposed polymerization and wet film is made to stay in plate face to form circuit.
The production method of the plate face out-of-flatness pcb board, wherein, it is further included after the step E：
F, copper facing, tin processing are carried out to pcb board.
The production method of the plate face out-of-flatness pcb board, wherein, it is further included after the step F：
G, the useless copper under dry film and wet film is etched away using alkali etching liquid medicine, then returns tin.
The production method of the plate face out-of-flatness pcb board, wherein, in the step B, baking time 10min.
The production method of the plate face out-of-flatness pcb board, wherein, in the step D, time of repose 15min.
The production method of the plate face out-of-flatness pcb board, wherein, in the step E, time of repose 15min.
Advantageous effect：The present invention covers non-conduction hole, solves plate face out-of-flatness by filling the pit dent of pcb board
There is rejection film when pasting resist layer dry film in pcb board after development, then circuit, hole, PAD and copper face occur after pit etching
The problem of notch, open circuit.The present invention method be suitable for all thickness pit dent copper face or base material and in
Between have a naked sky, the concave pcb board of core plate is promoted and makes yield.
Description of the drawings
Fig. 1 is a kind of flow chart of the production method preferred embodiment of plate face out-of-flatness pcb board of the present invention.
Structure diagram when Fig. 2 to Fig. 4 is using production method different conditions of the present invention.
Specific embodiment
The present invention provides a kind of production method of plate face out-of-flatness pcb board, to make the purpose of the present invention, technical solution and effect
Fruit is clearer, clear and definite, and the present invention is described in more detail below.It should be appreciated that specific embodiment described herein is only
Only to explain the present invention, it is not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is a kind of flow chart of the production method preferred embodiment of plate face out-of-flatness pcb board of the present invention,
Wherein, including step：
S1, wet film is uniformly coated on the pcb board made to electric plating of whole board, is filled the pit on pcb board and dent；
S2, to coat wet film pcb board carry out baking dry wet film；
S3, using laminator on wet film one layer of dry film of hot pressing；
S4, pcb board is stood into a period of time, then using the ultraviolet light of exposure machine wet film and dry film is made to generate polymerization instead
Should, so as to by pattern transfer to pcb board；
Pcb board after S5, exposure stands a period of time, then will not be exposed the dry film of polymerization using alkaline development liquid medicine
And wet film development is fallen, and the dry film for having exposed polymerization and wet film is made to stay in plate face to form circuit.
The characteristics of present invention is first with wet film good fluidity will fill at pit dent, then one layer of cover on wet film
Dry film carrys out masking hole.Then uv-exposure thus by pattern transfer to pcb board, finally develops, the present invention can fill pit
Dent, and non-conduction hole can be covered, it is that line pattern makes difficulty when there is pit dent in a kind of extraordinary solution pcb board face
Method can effectively solve the problems, such as that plate face has the not tight caused open lines of pit dent printed line road pad pasting patch, it is good to promote making
Rate.
Specifically, first sawing sheet, baking sheet are carried out by the dimensions of engineering design；By ready substrate, according to normal stream
Journey is made to electric plating of whole board；As shown in Fig. 2, first in pcb board（Including base material 100 and copper face 200）Upper uniformly coating wet film 300,
Wet film 300 is applied specifically on the copper face 200 with pit dent, coating machine can be used and carry out surface coating, wet film 300
Thickness control is, for example, 10 μm at 5-15 μm or so, ensures that pit dent is filled.
The main component of wet film is：70 parts of acrylic acid unsaturated polyester (UP)s, 12 parts of dimethoxybenzoins, 3 parts of titanium dioxides, 2 parts
Talcum powder, 2.5 parts of lithopone, 9 parts of hydroxypropyl methyl celluloses, 7 parts of methyl acrylates, 9 parts of polyacrylate, 12 parts of phthalein green grass or young crops
Green, 18 parts of benzil dimethyl contracting copper.
Then carrying out baking to the pcb board for coating wet film 300 dries wet film 300, and baking temperature can be 150 degree, dries
Roasting 10min makes its drying.
As shown in figure 3, recycle laminator one layer of dry film 400 of hot pressing on wet film（Photosensitive dry film）, it is not required with covering
The hole of conducting；The thickness of dry film is preferably 30 ~ 40 μm, such as 35 μm.
Dry film is divided into three layers from top to bottom：Polyester film, photoresist layer, polyethylene film.
Then the pcb board for pressing dry film is stood into a period of time, specific time of repose can be 15min, can be in room
Temperature is lower to be stood, such as 25 degree.
Recycling the ultraviolet light of exposure machine makes wet film and dry film generate polymerisation, so as to by pattern transfer to pcb board；
Polymerisation is generated at light transmission to be attached in plate face, it is unpolymerized at shading.
As shown in figure 4, after the pcb board after exposure stands 15min, the dry of polymerization will not be exposed using alkaline development liquid medicine
Film and wet film development are fallen, and have exposed the dry film of polymerization and wet film then stays in plate face to form circuit；Alkaline development liquid medicine is matched somebody with somebody
Side can be：Warm water（35 degree）750ml, Mitouer 3.5g, anhydrous also sodium sulphate 45g, hydroquinone 12g, natrium carbonicum calcinatum
45g, potassium bromide 2g, add cold water to 1000ml.Spray pressure during development is 2.5kg/cm2。
At the pit dent of pcb board, because there is two layers of resist layer of dry film and wet film, when development, can adjust photographic parameter or aobvious
Shadow twice, but pays attention to preventing cooked situation from occurring simultaneously.
The pcb board identified above having no problem is subjected to copper facing and tin plating processing, makes to thicken at the circuit copper face of exposed copper
Copper and plating last layer resist layer tin；
Then the useless copper under dry film and wet film is etched away using alkali etching liquid medicine, then returns tin, that is, complete PCB
Graphic making, form line pattern.Etch temperature is 40 ~ 50 DEG C, such as 45 DEG C, when the temperature is excessively high, etch-rate increase,
But NH3Volatile quantity also greatly increase, cause to pollute environment, and chemical constituent is out of proportion.Cu in alkali etching liquid medicine2+'s
Concentration is 150g/L, preferably 510g/L, and concentration is too low, and etching period is long, and excessive concentration, solution is unstable, and it is heavy easily to generate
It forms sediment, currently preferred concentration etch-rate is high and solution-stabilized.NH4For the content of Cl in 150g/l, concentration is too low, etching speed
Rate declines, so that losing etch capabilities, too high levels can cause resist layer to be etched.Between pH is 8.0 ~ 8.8, preferably
It is unfavorable to metal resist layer during 8.5, pH decline, and ammoniacal copper complex ion cannot be complexed into copper completely, form sludge, pH mistakes
Height, then ammonia supersaturation, discharges into the atmosphere, causes environmental pollution.
In conclusion the pit dent of the invention by filling pcb board, covers non-conduction hole, solves plate face out-of-flatness
There is rejection film when pasting resist layer dry film in pcb board after development, then circuit, hole, PAD and copper face occur after pit etching
The problem of notch, open circuit.The present invention method be suitable for all thickness pit dent copper face or base material and in
Between have a naked sky, the concave pcb board of core plate is promoted and makes yield.
It should be appreciated that the application of the present invention is not limited to the above, it for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (6)
1. a kind of production method of plate face out-of-flatness pcb board, which is characterized in that including step：
A, wet film is uniformly coated on the pcb board made to electric plating of whole board, is filled the pit on pcb board and dent；
B, carrying out baking to the pcb board for coating wet film dries wet film；
C, using laminator on wet film one layer of dry film of hot pressing；
D, pcb board is stood into a period of time, then using the ultraviolet light of exposure machine wet film and dry film is made to generate polymerisation, from
And by pattern transfer to pcb board；
E, the pcb board after exposing stands a period of time, then will not be exposed the dry film of polymerization and wet using alkaline development liquid medicine
Film development falls, and the dry film for having exposed polymerization and wet film is made to stay in plate face to form circuit;
In the step A, coating wet film in surface is carried out to the pcb board using coating machine, the wet-film thickness is 10 μm；
In the step E, when the utilization alkaline development liquid medicine develops, development number is twice;
The main component of wet film is：70 parts of acrylic acid unsaturated polyester (UP)s, 12 parts of dimethoxybenzoins, 3 parts of titanium dioxides, 2 parts of talcums
Powder, 2.5 parts of lithopone, 9 parts of hydroxypropyl methyl celluloses, 7 parts of methyl acrylates, 9 parts of polyacrylate, 12 parts of dark greens, 18
Part benzil dimethyl contracting copper;
The dry film is divided into three layers from top to bottom：Polyester layer, photoresist layer, polyethylene film, the thickness of dry film is 35 μm.
2. the production method of plate face out-of-flatness pcb board according to claim 1, which is characterized in that after the step E also
Including：
F, copper facing, tin processing are carried out to pcb board.
3. the production method of plate face out-of-flatness pcb board according to claim 2, which is characterized in that after the step F also
Including：
G, the useless copper under dry film and wet film is etched away using alkali etching liquid medicine, then returns tin.
4. the production method of plate face out-of-flatness pcb board according to claim 1, which is characterized in that in the step B, dry
The roasting time is 10min.
5. the production method of plate face out-of-flatness pcb board according to claim 1, which is characterized in that quiet in the step D
The time is put as 15min.
6. the production method of plate face out-of-flatness pcb board according to claim 1, which is characterized in that quiet in the step E
The time is put as 15min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510469804.0A CN105142345B (en) | 2015-08-04 | 2015-08-04 | A kind of production method of plate face out-of-flatness pcb board |
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| CN201510469804.0A CN105142345B (en) | 2015-08-04 | 2015-08-04 | A kind of production method of plate face out-of-flatness pcb board |
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| CN105142345A CN105142345A (en) | 2015-12-09 |
| CN105142345B true CN105142345B (en) | 2018-05-22 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106304666A (en) * | 2016-08-31 | 2017-01-04 | 奥士康精密电路（惠州）有限公司 | A kind of high density HF link plate producing process of anti-open lines |
| CN108398859A (en) * | 2018-05-04 | 2018-08-14 | 中国振华集团云科电子有限公司 | A kind of dry film developing method |
| CN110248486A (en) * | 2019-04-29 | 2019-09-17 | 惠州中京电子科技有限公司 | A kind of reworking method that etching semi-finished product plate hole is broken |
| CN110446361A (en) * | 2019-07-24 | 2019-11-12 | 广合科技（广州）有限公司 | A kind of matrix LED car light circuit board and production method |
| CN110505749B (en) * | 2019-08-01 | 2021-07-27 | 隽美经纬电路有限公司 | Structure for improving poor open circuit gap of FPC with Air-gap |
| CN110519934A (en) * | 2019-09-02 | 2019-11-29 | 成都明天高新产业有限责任公司 | A kind of method of the thick gold of circuit board electroplating |
| CN115135024A (en) * | 2022-08-31 | 2022-09-30 | 东莞市湃泊科技有限公司 | Method and system for improving graphic quality of PCB and application thereof |
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| CN102958282A (en) * | 2011-08-16 | 2013-03-06 | 悦虎电路(苏州)有限公司 | Circuit manufacturing method utilizing wet films and dry films for circuit boards |
| CN103338595A (en) * | 2013-07-09 | 2013-10-02 | 皆利士多层线路版(中山)有限公司 | Heavy-copper step circuit board and preparation method thereof |
| CN103987202A (en) * | 2014-05-20 | 2014-08-13 | 深圳市景旺电子股份有限公司 | PCB manufacturing method for controlling local bronze thickness and PCB |
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2015
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102958282A (en) * | 2011-08-16 | 2013-03-06 | 悦虎电路(苏州)有限公司 | Circuit manufacturing method utilizing wet films and dry films for circuit boards |
| CN103338595A (en) * | 2013-07-09 | 2013-10-02 | 皆利士多层线路版(中山)有限公司 | Heavy-copper step circuit board and preparation method thereof |
| CN103987202A (en) * | 2014-05-20 | 2014-08-13 | 深圳市景旺电子股份有限公司 | PCB manufacturing method for controlling local bronze thickness and PCB |
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| CN105142345A (en) | 2015-12-09 |
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