CN102281724B - Method for machining double-sided windowed plug hole - Google Patents
Method for machining double-sided windowed plug hole Download PDFInfo
- Publication number
- CN102281724B CN102281724B CN 201110248035 CN201110248035A CN102281724B CN 102281724 B CN102281724 B CN 102281724B CN 201110248035 CN201110248035 CN 201110248035 CN 201110248035 A CN201110248035 A CN 201110248035A CN 102281724 B CN102281724 B CN 102281724B
- Authority
- CN
- China
- Prior art keywords
- hole
- welding resistance
- egative film
- printing ink
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The invention discloses a method for machining a double-sided windowed plug hole. The method comprises the following steps of: when solder mask ink is printed on a component side (CS) of a printed circuit board (PCB) substrate, plugging the solder mask ink in a hole by a plugging and printing combined manner, wherein the plugged depth of the hole is smaller than the depth of the hole; covering the CS with a CS solder mask film, covering a solder side (SS) with an exposure hole film and exposing the CS and the SS, wherein a shading sheet is arranged at position, corresponding to the hole, on the CS solder mask film, and a light penetration point is arranged at the position, corresponding to the hole, on the exposure hole film; printing the solder mask ink on the SS and pre-drying the SS for solder mask; after the SS solder mask film is covered on the SS, exposing the SS, wherein a shading sheet is arranged at position, corresponding to the hole, on the SS solder mask film; and performing developing and solder mask on the PCB substrate, and drying. The embodiment of the invention can solve the problems of penetration of the white light from the hole, oil spilling in developing process and oil spilling after drying.
Description
Technical field
The present invention relates to printed circuit board (PCB) (PCB) manufacturing process technology field, relate in particular to a kind of processing method of double-sided windowed plug hole.
Background technology
When making printed circuit board (PCB), in order to reach the purpose that stops welding stream tin, often be designed with onboard consent; And consider for heat radiation, usually be designed with copper face, thereby form double-sided windowed plug hole.
At present, the method of making double-sided windowed plug hole is as follows: hole on the PCB substrate, after filling with welding resistance printing ink in the hole and forming consent, aim at respectively the position of consent on the component side of substrate and solder side, add the diaphanous spot less than consent aperture, the part welding resistance in consent is exposed, solidify, through follow-up development, the welding resistance printing ink in the hole is developed a part, thereby forms double-sided windowed plug hole.
There is following shortcoming in existing double-sided windowed plug hole processing method: because the diaphanous spot that adds is less than consent aperture, in the hole, some welding resistance is unexposed, and through developing, in the hole, welding resistance is rushed out, and forms the development oil spilling.And after follow-up welding resistance in the baking process, in the hole, residual development liquid medicine and welding resistance solvent due to expanded by heating, can eject the welding resistance in the hole baking oil spilling after forming; And when pcb board is thinner, in development, the problem of the saturating white light of consent appears easily afterwards.
Summary of the invention
The embodiment of the present invention proposes a kind of processing method of double-sided windowed plug hole, can solve the problem of the saturating white light of consent, development oil spilling and rear baking oil spilling.
The processing method of the double-sided windowed plug hole that the embodiment of the present invention provides comprises:
S1, provide a PCB substrate, this substrate is provided with the hole for the treatment of consent; Component side and the solder side of substrate run through in described hole;
The mode of S2, the company's of employing plug band seal in seal welding resistance printing ink, is filled in welding resistance printing ink toward the top end opening in hole on component side, and preliminary drying component side welding resistance; Described welding resistance printing ink enter hole depth less than the degree of depth in hole;
S3, be covered with CS face welding resistance egative film at component side, be covered with at solder side the hole egative film that exposes to the sun, component side and solder side are exposed; On described CS face welding resistance egative film, the position in corresponding aperture has anti-dazzling screen, and on the described hole egative film that exposes to the sun, the position in corresponding aperture has diaphanous spot; Anti-dazzling screen on described CS face welding resistance egative film is circular anti-dazzling screen, and its diameter is greater than the aperture of consent; Diaphanous spot on the described hole egative film that exposes to the sun is circular diaphanous spot, and its diameter is greater than the aperture of consent;
S4, on solder side seal welding resistance printing ink, and preliminary drying solder side welding resistance;
S5, after solder side is covered with SS face welding resistance egative film, solder side is exposed; On described SS face welding resistance egative film, the position in corresponding aperture has anti-dazzling screen; Anti-dazzling screen on described SS face welding resistance egative film is circular anti-dazzling screen, and its diameter is greater than the aperture of consent;
S6, develop and welding resistance after baking process, stay welding resistance in described hole; Described welding resistance is solidificated in the middle part in described hole, is close to hole wall.
Wherein, described welding resistance printing ink is added with diluent.
In a preferred implementation, the squeegee pressure that connects plug band seal in described step S2 is 6Kg, and print speed printing speed is 6m/s.
The degree of depth in described hole is H; In described step S2, the hole depth that enters of described welding resistance printing ink is x; Wherein, 0.3H≤x≤0.7H.
The processing method of the double-sided windowed plug hole that the embodiment of the present invention provides, the mode that adopt to connect plug band seal is filled in welding resistance printing ink toward an end opening in hole, this welding resistance printing ink enter hole depth less than the degree of depth in hole; Add diaphanous spot at the other end opening in hole, the welding resistance printing ink of the phototropic face in the hole is exposed, solidify; Through follow-up development, only stay the welding resistance that a circle solidifies in the hole, thereby form double-sided windowed plug hole.The embodiment of the present invention the oil spilling problem can not occur when developing, and because a circle welding resistance that stays in the development metapore is close to hole wall, the phenomenon of the saturating white light of consent can not occur; In addition, because the welding resistance printing ink that stays in the hole is less, the also oil spilling problem with regard to not occurring drying by the fire after welding resistance, thus can shorten the drying-plate time of drying by the fire after welding resistance.
Description of drawings
Fig. 1 is the schematic flow sheet of an embodiment of the processing method of double-sided windowed plug hole provided by the invention;
Fig. 2 is the schematic diagram of step 1 of the processing method of double-sided windowed plug hole provided by the invention;
Fig. 3 is the schematic diagram of step 2 of the processing method of double-sided windowed plug hole provided by the invention;
Fig. 4 is the schematic diagram of step 4 of the processing method of double-sided windowed plug hole provided by the invention;
Fig. 5 is the schematic diagram of step 5 of the processing method of double-sided windowed plug hole provided by the invention;
Fig. 6 is the schematic diagram of step 7 of the processing method of double-sided windowed plug hole provided by the invention;
Fig. 7 is the schematic diagram of step 8 of the processing method of double-sided windowed plug hole provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Referring to Fig. 1, be the schematic flow sheet of an embodiment of the processing method of double-sided windowed plug hole provided by the invention, the method comprises the following steps:
S1, provide a PCB substrate, this substrate is provided with the hole for the treatment of consent; Component side (being called for short the CS face) and the solder side (being called for short the SS face) of substrate run through in described hole;
The mode of S2, the company's of employing plug band seal in seal welding resistance printing ink, is filled in welding resistance printing ink toward the top end opening in hole on component side, and preliminary drying component side welding resistance; Described welding resistance printing ink enter hole depth less than the degree of depth in hole;
S3, be covered with CS face welding resistance egative film at component side, be covered with at solder side the hole egative film that exposes to the sun, component side and solder side are exposed; On described CS face welding resistance egative film, the position in corresponding aperture has anti-dazzling screen, and on the described hole egative film that exposes to the sun, the position in corresponding aperture has diaphanous spot;
S4, on solder side seal welding resistance printing ink, and preliminary drying solder side welding resistance;
S5, after solder side is covered with SS face welding resistance egative film, solder side is exposed; On described SS face welding resistance egative film, the position in corresponding aperture has anti-dazzling screen;
S6, develop and welding resistance after baking process.
Wherein, described welding resistance printing ink is added with diluent.Diluent is a kind of for dilution welding resistance printing ink, reduces the organic solvent of its viscosity.Different welding resistance printing ink is because its formula components, content are different, and its viscosity also is not quite similar, and the dilution dosage of required interpolation is also different, and for example: sun PSR-2000 KX700G printing ink, the addition of its diluent is in the 40ml/Kg left and right.
In preferred an enforcement, the squeegee pressure that connects plug band seal in step S2 is 6Kg, and print speed printing speed is 6m/s.The degree of depth of supposing hole on substrate is H, and the hole depth that enters of welding resistance printing ink is x in step S2, has: 0.3H≤x≤0.7H.
And the anti-dazzling screen on CS face welding resistance egative film is circular anti-dazzling screen, and its diameter is greater than the aperture of consent; The diaphanous spot that exposes to the sun on the egative film of hole is circular diaphanous spot, and its diameter is greater than the aperture of consent; Anti-dazzling screen on SS face welding resistance egative film is circular anti-dazzling screen, and its diameter is greater than the aperture of consent.
Need to prove, when specifically implementing, can also the company of employing the mode of plug band seal, fill in the welding resistance printing ink of desired depth in from an end of solder side toward the hole; Then add diaphanous spot in when exposure, then from an end of component side, the welding resistance of the phototropic face in the hole is exposed.
Below in conjunction with Fig. 2～Fig. 7, the processing method of double-sided windowed plug hole provided by the invention is described in detail.
Step 1: nog plate
After charging, the PCB substrate is carried out nog plate process, substrate is cut into suitable size.
As shown in Figure 2, the end face of substrate 1 is component side 10, and the bottom surface is solder side 20.Wherein, component side 10 is provided with CS upper thread road, establishes SS upper thread road on solder side 20, and the inside of substrate 1 is provided with internal layer circuit 2.
Step 2: seal CS face welding resistance
The mode of the company's of employing plug band seal in seal welding resistance printing ink, is filled in welding resistance printing ink toward the top end opening in hole 3 on component side 10.
As shown in Figure 3, CS face welding resistance 11 is imprinted on component side 10, and the hole depth x that enters of welding resistance printing ink is 1/2 of hole depth H, and namely welding resistance printing ink is full of the space of hole 3 the first half, and the space non-filler of hole 3 the latter halfs.
The present embodiment adopts the mode of adding diluent, and dilution welding resistance printing ink makes its reduced viscosity.During the plug band India side formula seal CS of the company of employing face welding resistance, (for example, making squeegee pressure is 6Kg by controlling printing parameter, making print speed printing speed is 6m/s), make welding resistance printing ink hand-hole, the surface tension that has due to welding resistance printing ink itself again simultaneously can not make again welding resistance printing ink flow to the SS face along hole wall.
The present embodiment only with x=H/2 as preferred embodiment describing, when specifically implementing, x can also get the numerical value such as H/3,2H/3,2H/5,3H/5,4H/5.
Step 3: preliminary drying CS face welding resistance
Welding resistance to the CS face is toasted processing.
Step 4 a: contraposition, exposure
As shown in Figure 4, be covered with CS face welding resistance egative film 12 on component side 10, be covered with at solder side 20 the hole egative film 22 that exposes to the sun, then component side and solder side are exposed.
Wherein, on CS face welding resistance egative film 12, the position in corresponding aperture has circular anti-dazzling screen, and the diameter of this anti-dazzling screen is greater than the consent diameter.Be that a-quadrant shown in Figure 4 is shaded effect, the welding resistance at CS face mouth place is not exposed, and in follow-up developing process, this part welding resistance can be shown.
Exposing to the sun, the position in corresponding aperture has circular diaphanous spot on hole egative film 22, and the diameter of this diaphanous spot is greater than the consent diameter.Be that B shown in Figure 4 zone is diaphanous spot, during exposure, ultraviolet light shine inside inlet hole by diaphanous spot, and the part welding resistance of the phototropic face in the hole is exposed.The welding resistance that is C shown in Figure 4 zone is exposed, and solidifies, and in follow-up developing process, can not be developed.
Optionally, according to the needs of client's practical application, can also on CS face welding resistance egative film 12, diaphanous spot be set, thereby stay the welding resistance point on the CS of pcb board face.For example, as shown in Figure 4, be provided with diaphanous spot 101 and diaphanous spot 102 on CS face welding resistance egative film 12, the welding resistance on this diaphanous spot can stay after development.
Step 5: seal SS face welding resistance
Seal welding resistance printing ink on solder side 20, as shown in Figure 5, SS face welding resistance 21 overlays on component side 10.
Step 6: preliminary drying CS face, SS face welding resistance
Welding resistance to CS face, SS face is toasted processing.
Step 7: secondary contraposition, exposure
As shown in Figure 6, be covered with SS face welding resistance egative film 23 at solder side 20, then solder side exposes.
Wherein, on SS face welding resistance egative film 23, the position in corresponding aperture has circular anti-dazzling screen, and the diameter of this anti-dazzling screen is greater than the consent diameter.Be that D shown in Figure 6 zone is shaded effect, the welding resistance at SS face mouth place is not exposed, and in follow-up developing process, this part welding resistance can be shown.
Optionally, according to the needs of client's practical application, can also on SS face welding resistance egative film 23, diaphanous spot be set, thereby stay the welding resistance point on the SS of pcb board face.For example, as shown in Figure 6, be provided with diaphanous spot 201 and diaphanous spot 202 on SS face welding resistance egative film 23, the welding resistance on this diaphanous spot can stay after development.
Owing to component side being exposed in step 4, so this step 7 is only exposed to solder side.
Step 8: develop
As shown in Figure 7, after carrying out development treatment, only stay the welding resistance 113 that is cured when exposing to the sun the hole in step 4 in the hole.Welding resistance 113 is solidificated in the middle part in hole, is close to hole wall, therefore the phenomenon of the saturating white light of consent can not occur; And, because the welding resistance printing ink that stays in the hole is less, the oil spilling problem can be do not occurred in the baking process after follow-up welding resistance yet, thereby the drying-plate time of drying by the fire after welding resistance can be shortened.
In addition, as shown in Figure 7, corresponding to diaphanous spot 101 and the diaphanous spot 102 of Fig. 4, component side stays welding resistance 111 and welding resistance 112 after developing.Corresponding to diaphanous spot 201 and the diaphanous spot 202 of Fig. 6, solder side stays welding resistance 211 and welding resistance 212 after developing.
Step 9: dry by the fire after welding resistance
Pcb board is carried out after baking is processed after welding resistance, and the double-sided windowed plug hole work flow is completed in discharging.
The processing method of the double-sided windowed plug hole that the embodiment of the present invention provides, the mode that adopt to connect plug band seal is filled in welding resistance printing ink toward an end opening in hole, this welding resistance printing ink enter hole depth less than the degree of depth in hole; Add diaphanous spot at the other end opening in hole, the welding resistance printing ink of the phototropic face in the hole is exposed, solidify; Through follow-up development, only stay the welding resistance that a circle solidifies in the hole, thereby form double-sided windowed plug hole.The embodiment of the present invention the oil spilling problem can not occur when developing, and because a circle welding resistance that stays in the development metapore is close to hole wall, the phenomenon of the saturating white light of consent can not occur; In addition, because the welding resistance printing ink that stays in the hole is less, the also oil spilling problem with regard to not occurring drying by the fire after welding resistance, thus can shorten the drying-plate time of drying by the fire after welding resistance.
The above is the preferred embodiment of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (3)
1. the processing method of a double-sided windowed plug hole, is characterized in that, comprising:
S1, provide a PCB substrate, this substrate is provided with the hole for the treatment of consent; Component side and the solder side of substrate run through in described hole;
The mode of S2, the company's of employing plug band seal in seal welding resistance printing ink, is filled in welding resistance printing ink toward the top end opening in hole on component side, and preliminary drying component side welding resistance; Described welding resistance printing ink enter hole depth less than the degree of depth in hole; The degree of depth in described hole is H; The hole depth that enters of described welding resistance printing ink is x; 0.3H≤x≤0.7H;
S3, be covered with CS face welding resistance egative film at component side, be covered with at solder side the hole egative film that exposes to the sun, component side and solder side are exposed; On described CS face welding resistance egative film, the position in corresponding aperture has anti-dazzling screen, and on the described hole egative film that exposes to the sun, the position in corresponding aperture has diaphanous spot; Anti-dazzling screen on described CS face welding resistance egative film is circular anti-dazzling screen, and its diameter is greater than the aperture of consent; Diaphanous spot on the described hole egative film that exposes to the sun is circular diaphanous spot, and its diameter is greater than the aperture of consent;
S4, on solder side seal welding resistance printing ink, and preliminary drying solder side welding resistance;
S5, after solder side is covered with SS face welding resistance egative film, solder side is exposed; On described SS face welding resistance egative film, the position in corresponding aperture has anti-dazzling screen; Anti-dazzling screen on described SS face welding resistance egative film is circular anti-dazzling screen, and its diameter is greater than the aperture of consent;
S6, develop and welding resistance after baking process, stay welding resistance in described hole; Described welding resistance is solidificated in the middle part in described hole, is close to hole wall.
2. the processing method of double-sided windowed plug hole as claimed in claim 1, is characterized in that, described welding resistance printing ink is added with diluent.
3. the processing method of double-sided windowed plug hole as claimed in claim 2, is characterized in that, in described step S2, the squeegee pressure that connects plug band seal is 6Kg, and print speed printing speed is 6m/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110248035 CN102281724B (en) | 2011-08-26 | 2011-08-26 | Method for machining double-sided windowed plug hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110248035 CN102281724B (en) | 2011-08-26 | 2011-08-26 | Method for machining double-sided windowed plug hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102281724A CN102281724A (en) | 2011-12-14 |
| CN102281724B true CN102281724B (en) | 2013-05-22 |
Family
ID=45106806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110248035 Expired - Fee Related CN102281724B (en) | 2011-08-26 | 2011-08-26 | Method for machining double-sided windowed plug hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102281724B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106413264A (en) * | 2016-11-14 | 2017-02-15 | 江门崇达电路技术有限公司 | Manufacturing method of PCB of solder resist ink plug hole |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102413645B (en) * | 2011-10-31 | 2014-02-19 | 深圳市景旺电子股份有限公司 | Manufacturing method of PCB (printed circuit board) semi-plugged hole |
| CN104185373B (en) * | 2013-05-27 | 2017-02-15 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board negative film |
| CN103415164B (en) * | 2013-08-30 | 2016-04-27 | 武汉七零九印制板科技有限公司 | A kind of pcb board aperture is greater than the method for 1.0mm via hole ink plugging |
| CN104640376A (en) * | 2013-11-13 | 2015-05-20 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board plug hole forming method |
| CN107046774A (en) * | 2017-03-07 | 2017-08-15 | 惠州中京电子科技有限公司 | A kind of method of the anti-welding bleeds of improvement PCB |
| CN109257886A (en) * | 2018-10-23 | 2019-01-22 | 景旺电子科技(龙川)有限公司 | A kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods |
| CN112770497A (en) * | 2019-10-21 | 2021-05-07 | 南通深南电路有限公司 | Resin hole plugging method of circuit board and circuit board |
| CN113613385B (en) * | 2021-08-02 | 2022-08-12 | 金禄电子科技股份有限公司 | Multilayer circuit board and preparation method thereof |
| CN113840466A (en) * | 2021-09-23 | 2021-12-24 | 江门崇达电路技术有限公司 | LED lamp panel and manufacturing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT398876B (en) * | 1991-10-31 | 1995-02-27 | Philips Nv | TWO OR MULTILAYER PCB |
| JP2550899B2 (en) * | 1993-12-13 | 1996-11-06 | 日本電気株式会社 | Method for manufacturing printed wiring board |
| KR20090110596A (en) * | 2008-04-18 | 2009-10-22 | 삼성전기주식회사 | Printed circuit board and method for manufacturing the same |
| CN100556249C (en) * | 2008-07-30 | 2009-10-28 | 惠州中京电子科技有限公司 | Jack process of printed circuit board |
-
2011
- 2011-08-26 CN CN 201110248035 patent/CN102281724B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106413264A (en) * | 2016-11-14 | 2017-02-15 | 江门崇达电路技术有限公司 | Manufacturing method of PCB of solder resist ink plug hole |
| CN106413264B (en) * | 2016-11-14 | 2018-11-06 | 江门崇达电路技术有限公司 | A kind of production method of the PCB of solder mask consent |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102281724A (en) | 2011-12-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102281724B (en) | Method for machining double-sided windowed plug hole | |
| CN102170758B (en) | Circuit board double window resistance welding hole filling processing method and resistance welding exposure film | |
| CN102802357A (en) | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage | |
| CN101668390B (en) | Production technology of PCB (Printed Circuit Board) solder mask | |
| CN105101661A (en) | Manufacturing method of printed circuit board ink plug hole | |
| CN105208791B (en) | A kind of production method of printed circuit board character | |
| CN105142345B (en) | A kind of production method of plate face out-of-flatness pcb board | |
| CN103200777A (en) | Manufacture method of thick copper plate fine solder resist bridge | |
| CN106413264A (en) | Manufacturing method of PCB of solder resist ink plug hole | |
| CN103220888A (en) | Printed circuit board silk screen hole plugging method | |
| CN104640376A (en) | Circuit board plug hole forming method | |
| CN102917549B (en) | The processing method of circuit board soldermask bridge | |
| CN103153003B (en) | Making method for semi-stop hole tin immersion board | |
| CN104853529A (en) | Circuit board positive resistance welding plate edge manufacturing method | |
| CN106341944A (en) | Rigid-flex PCB capable of protecting inner-layer pads and manufacturing method of rigid-flex PCB | |
| CN105338744A (en) | Manufacturing method for PCB with double-sided oil-coating via hole and tin spraying surface treatment | |
| CN105451437B (en) | A kind of manufacturing method and printed circuit board of printed circuit board welding resistance consent structure | |
| CN104883818A (en) | Printed circuit board contraposition method | |
| TWI574592B (en) | Circuit board and method for fabricating circuit board | |
| CN110392491A (en) | A kind of PCB solder-resisting manufacturing methods preventing residual ink in blind hole | |
| CN103153004A (en) | Manufacturing method for printed circuit board (PCB) solder mask through hole | |
| CN204576453U (en) | Panel construction | |
| CN209460571U (en) | For boring the exposure film of the above welding resistance single layer opening of nozzle aperture 0.8mm | |
| CN205179186U (en) | Camera module and circuit board thereof | |
| CN202231956U (en) | Structure for improving appearance of soldering pad to limit solder paste diffusion |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130522 Termination date: 20200826 |