CN109257886A - A kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods - Google Patents
A kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods Download PDFInfo
- Publication number
- CN109257886A CN109257886A CN201811237975.0A CN201811237975A CN109257886A CN 109257886 A CN109257886 A CN 109257886A CN 201811237975 A CN201811237975 A CN 201811237975A CN 109257886 A CN109257886 A CN 109257886A
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- face
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods, it is related to wiring board manufacture technology field, this method is specifically in the rigid-flex combined board for needing double-sided resistance welding, and successively including process: pre-treatment → the first face stamp-pad ink → first time preliminary drying → first face exposes the → the second face and exposes hole → first time development → precuring → the second face stamp-pad ink → second of preliminary drying → the second face exposure → second development → solidification.Rigid-flexible combination multi-layer board solder-resisting manufacturing methods disclosed by the invention, cancel traditional consent twice, reverse side is added after face stamp-pad ink exposure and exposes hole technique, when exposing the first face welding resistance, ink in another face is exposed with the exposure hole film simultaneously, makes the second face welding resistance again after precuring of developing.Process after optimization increases reverse side and exposes hole, can once fix ink in hole, and when reverse side stamp-pad ink greatly reduces the bad generation probability such as false dew copper and heap oil, while keeping hole edge ink more neat, significantly promotes product quality.
Description
Technical field
The present invention relates to wiring board manufacture technology fields, refer in particular to a kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods.
Background technique
In the prior art, with the continuous development of electronic technology, general rigid printed board has been unable to satisfy electronic product
The requirement of " light, thin, short, small ", and frivolous, flexible flexible printed board meets such technical need just, especially just
Flex combined board (also referred to as Rigid Flex), the support performance of existing rigid printed board also possess the bendability characteristics of flex plate, right
In saving interiors of products space, finished-product volume is reduced, enhances product performance and is very helpful.
Currently, applying the surface protecting material in rigid-flex combined board main for PI Cover Layer (cover film) and oil
Ink (play prevent constitute circuit part conductor metal material be directly exposed in air through oxidation or it is rotten due to humidity
Erosion and device play welding resistance when welding).PI Cover Layer (cover film) is mainly used in soft board region and plays welding resistance and guarantor
Shield effect, application time is longer, and technology maturation；Ink since characteristic and use scope are different, be generally divided into soft board ink and
The welding resistance technique of hardboard ink, conventional PCB hardboard ink is also more mature, but prints in the hardboard region ink of multilayered rigidity and flexibility board
It paints, it usually needs use soft board ink, production procedure is cumbersome, and manufacture difficulty is big, and yields is lower.Soft board is frequently with tradition
Technique is raw are as follows: and pre-treatment → consent (the first face) → preliminary drying → stamp-pad ink (the first face) → preliminary drying → exposure → development → precuring →
Consent (the second face) → preliminary drying → stamp-pad ink (the second face) → preliminary drying → exposure → development → solidification.
Summary of the invention
The technical problems to be solved by the present invention are: welding resistance uses soft board oil for the rigid-flex combined board for needing double-sided resistance welding
Ink, according to existing welding resistance process, stamp-pad ink has the undesirable generation such as permeability and dew copper often, and soft board is frequently with conventionally produced
It easily leads to local ink uneven (bad order) and color difference is obvious, process is cumbersome, while also failing to be fully solved plate face heap oil
And false dew copper phenomenon.
In order to solve the above-mentioned technical problem, the invention discloses a kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods, specially
It is directed to the rigid-flex combined board for needing double-sided resistance welding, successively includes process: pre-treatment → the first face stamp-pad ink → first time preliminary drying → the
The → the second face of exposure exposes hole → first time development → precuring → the second face stamp-pad ink → second of preliminary drying → the second face exposure on one side
→ second development → solidification.
Further, when the first face stamp-pad ink, pad upper jig in multi-layer board bottom, the jig using 1.5mm~
2.5mm thickness F R4 is made, and does abdicating through hole in corresponding welding resistance lead to the hole site, the upper abdicating through hole aperture FR4 is relative to resistance
Weld the unilateral increasing 0.2mm~0.3mm of through-hole aperture.
Further, when the first face stamp-pad ink, mesh 43T~51T halftone is selected, by head silk printer, semi-automatic
Or automatic screen-printing machine printing surface oil.
Further, in the first time soft-bake step, baking is dried in opposite oil, and baking temperature is 75 DEG C ± 5 DEG C,
Baking time is 25min~35min.
Further, it when second face exposes hole, is exposed using the set PIN contraposition of the hole film is exposed, and the hard of welding resistance need to done
Plate region, on the corresponding position of through-hole, the unilateral increasing 0.075mm~0.1mm of through-hole aperture does catch point and exposes the hole film.
Further, in the pre-cure step, baking is dried to ink, baking temperature is 75 DEG C ± 5 DEG C, is dried
The roasting time is 3min~5min.
Further, in the second face stamp-pad ink step, select mesh 77T~100T halftone, by head silk printer,
Semi-automatic or automatic screen-printing machine printing surface oil.
Further, after the stamp-pad ink of second face, 10min-30min is stood.
Further, in second of soft-bake step, baking is dried in opposite oil, and baking temperature is 75 DEG C ± 5 DEG C,
Time is 10min~30min.
Further, in the curing schedule, solidification temperature is 150 DEG C ± 5 DEG C, and curing time is 50min~70min,
High-temperature baking is carried out to promote the physical and chemical properties of ink to ink.
In traditional two-sided " consent " technique of rigid-flexible combination multi-layer board, ink is constantly in interim filling effect in hole,
The main bad generation for playing the false dew copper of prevention, development process can clean ink in hole, lead to the second face easy permeability when printing
To the completed side, plate face and table top are polluted；Consent easily leads to ink accumulation simultaneously, causes ink relatively uneven and color difference
It is more apparent.And rigid-flexible combination multi-layer board solder-resisting manufacturing methods disclosed by the invention, cancel traditional consent twice, in a face stamp-pad ink
Reverse side is added after exposure and exposes hole technique, exposes ink in another face when exposing the first face welding resistance, while with the hole film is exposed,
The second face welding resistance is made again after development precuring.Process after optimization increases reverse side and exposes hole, can once fix ink in hole,
The bad generation probability such as false dew copper and heap oil is greatly reduced when reverse side stamp-pad ink, while keeping hole edge ink more neat, significantly
Promote product quality.
Detailed description of the invention
Concrete scheme of the invention is described in detail with reference to the accompanying drawing
Fig. 1 is the first face stamp-pad ink schematic diagram；
Fig. 2 is that the exposure of the first face and the second face expose hole schematic diagram；
Fig. 3 is development schematic diagram corresponding with Fig. 2；
Fig. 4 is the second face stamp-pad ink schematic diagram.
In figure, 1- ink, 2- Rigid Flex, 21- through-hole, 3- jig, the 4- film.
Specific embodiment
In order to describe the technical content, the structural feature, the achieved object and the effect of this invention in detail, below in conjunction with embodiment
And attached drawing is cooperated to be explained in detail.
A kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods are disclosed in one embodiment, specifically for two-sided in needing
The rigid-flex combined board of welding resistance successively includes process: pre-treatment → the first face stamp-pad ink → first time preliminary drying → the first face exposure → the
Two faces expose hole → first time development → precuring → the second face stamp-pad ink → second of preliminary drying → the second face exposure → second development
→ solidification.
Pre-treatment such as can clean plate face by way of liquid medicine chemical cleaning or physical grinding, do for subsequent printing ink
It is good to prepare.
First face (front) stamp-pad ink increases pad special fixture, silk-screen halftone in conjunction with Fig. 1 under Rigid Flex when passing through stamp-pad ink
Ink for screen printing, ink can be flowed into along the through-hole of Rigid Flex when brush is oily, through-hole be filled up, fraction ink can be seeped to reverse side
(the second face) plate face.And the jig is made of 1.5mm~2.5mm thickness F R4, the preferably FR4 of 2.0mm thickness into
Row production.Abdicating through hole or windowing are done in corresponding welding resistance lead to the hole site, the upper abdicating through hole aperture FR4 is relative to welding resistance through-hole
The unilateral increasing 0.2mm~0.3mm in aperture.In this way, the space of through-hole is stepped down when by making stamp-pad ink, ink is adequately filled out
In full through-hole, it is bad to be effectively improved dew copper.In addition, when the first face stamp-pad ink, the preferred halftone of mesh 43T~51T passes through hand
Dynamic screen printer, semi-automatic or automatic screen-printing machine printing surface oil.
First time preliminary drying, opposite oil are dried baking, and baking temperature is 75 DEG C ± 5 DEG C, baking time be 25min~
35min。
The exposure of first face and the second face expose hole, and in conjunction with Fig. 2, manually or machine aligns by the film, special lamp tube is to ink
Area is exposed, and the region ink by irradiation has the performance of resistance to weak base, and the ink that it is extra that weak base develops obtains design ink
Region.In addition, when second face exposes hole, using exposing the set PIN contraposition exposure of the hole film, and in the hardboard region that need to do welding resistance,
On the corresponding position of through-hole, the unilateral increasing 0.075mm~0.1mm of through-hole aperture does catch point and exposes the hole film.
Develop for the first time, first time development is carried out to Rigid Flex, and form ink distribution situation as shown in Figure 3.
And ink is since through overexposure, developer solution will not be reacted in through-hole, ink can remain in the metapore that develops, and reach
The effect of consent, and reverse side (the second face) hole edge ink is more regular.
In the pre-cure step baking is dried to ink, baking temperature is 75 DEG C ± 5 DEG C, baking in precuring
Time is 3min~5min.
Second face stamp-pad ink, as shown in figure 3, the second face (reverse side) to Rigid Flex carries out stamp-pad ink processing.Second face print
In oily step, the halftone of mesh 77T~100T is selected, head silk printer, semi-automatic or automatic screen-printing machine printing surface are passed through
Oil.And due to having filled up ink in through-hole, when reverse side stamp-pad ink, can not need to produce using special fixture, and not have false dew
The bad situation of copper and heap oil generates.After the stamp-pad ink of second face, preferably standing 10min-30min.
Second of preliminary drying, in second of soft-bake step, baking is dried in opposite oil, and baking temperature is 75 DEG C ± 5 DEG C, when
Between be 10min~30min.
Second face exposure, exposure reverse side (the second face) face oil, by the film manually or machine align, special lamp tube is to ink
Area is exposed, and the region ink by irradiation has the performance of resistance to weak base, and the ink that it is extra that weak base develops obtains design ink
Region.
Second development: develop using weakly alkaline solution to the second face ink after exposed, it is extra to remove
Ink layer.
Solidification, in curing schedule, solidification temperature is 150 DEG C ± 5 DEG C, and curing time is 50min~70min, to ink into
Row high-temperature baking is to promote the physical and chemical properties of ink.
In conclusion rigid-flexible combination multi-layer board solder-resisting manufacturing methods disclosed by the invention, eliminate traditional consent twice,
Reverse side is added after face stamp-pad ink exposure and exposes hole technique, when expose the first face welding resistance, while with the exposure hole film by another face
Interior ink exposure, makes the second face welding resistance after precuring of developing again.Process after optimization increases reverse side and exposes hole, can once will be in hole
Ink is fixed, and when reverse side stamp-pad ink greatly reduces the bad generation probability such as false dew copper and heap oil, while making hole edge ink more
Neatly, product quality is significantly promoted.
It should be noted that herein, up, down, left, right, before and after only represents its relative position without indicating its absolute position
It sets.And the above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, it is all to be said using the present invention
Equivalent structure or equivalent flow shift made by bright book and accompanying drawing content is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (10)
1. a kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods, which is characterized in that successively include process: pre-treatment → the first face print
Oil → first time preliminary drying → first face exposes the → the second face and exposes hole → first time development → precuring → second face stamp-pad ink → the second
Secondary preliminary drying → the second face exposure → second development → solidification.
2. rigid-flexible combination multi-layer board solder-resisting manufacturing methods as described in claim 1, it is characterised in that: first face stamp-pad ink
When, upper jig is padded in multi-layer board bottom, the jig is made of 1.5mm~2.5mm thickness F R4, in corresponding welding resistance
Lead to the hole site does abdicating through hole, and the upper abdicating through hole aperture FR4 is relative to the unilateral increasing 0.2mm~0.3mm of welding resistance through-hole aperture.
3. rigid-flexible combination multi-layer board solder-resisting manufacturing methods as claimed in claim 2, it is characterised in that: first face stamp-pad ink
When, mesh 43T~51T halftone is selected, head silk printer, semi-automatic or automatic screen-printing machine printing surface oil are passed through.
4. rigid-flexible combination multi-layer board solder-resisting manufacturing methods as described in claim 1, it is characterised in that: the first time preliminary drying step
In rapid, baking is dried in opposite oil, and baking temperature is 75 DEG C ± 5 DEG C, and baking time is 25min~35min.
5. rigid-flexible combination multi-layer board solder-resisting manufacturing methods as described in claim 1, it is characterised in that: second face exposes hole
When, it is exposed using the set PIN contraposition of the hole film is exposed, and on the hardboard region that need to do welding resistance, the corresponding position of through-hole, through-hole aperture
Unilateral increasing 0.075mm~0.1mm does catch point and exposes the hole film.
6. rigid-flexible combination multi-layer board solder-resisting manufacturing methods as described in claim 1, it is characterised in that: in the pre-cure step
In, baking is dried to ink, baking temperature is 75 DEG C ± 5 DEG C, and baking time is 3min~5min.
7. rigid-flexible combination multi-layer board solder-resisting manufacturing methods as described in claim 1, it is characterised in that: second face stamp-pad ink step
In rapid, the halftone of mesh 77T~100T is selected, passes through head silk printer, semi-automatic or automatic screen-printing machine printing surface oil.
8. rigid-flexible combination multi-layer board solder-resisting manufacturing methods as described in claim 1, it is characterised in that: second face stamp-pad ink
Afterwards, 10min-30min is stood.
9. rigid-flexible combination multi-layer board solder-resisting manufacturing methods as described in claim 1, it is characterised in that: second of preliminary drying step
In rapid, baking is dried in opposite oil, and baking temperature is 75 DEG C ± 5 DEG C, and the time is 10min~30min.
10. rigid-flexible combination multi-layer board solder-resisting manufacturing methods as described in claim 1, it is characterised in that: in the curing schedule,
Solidification temperature is 150 DEG C ± 5 DEG C, and curing time is 50min~70min, carries out high-temperature baking to ink to promote the object of ink
Reason and chemical property.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811237975.0A CN109257886A (en) | 2018-10-23 | 2018-10-23 | A kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811237975.0A CN109257886A (en) | 2018-10-23 | 2018-10-23 | A kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods |
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| CN201811237975.0A Pending CN109257886A (en) | 2018-10-23 | 2018-10-23 | A kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072339A (en) * | 2019-05-31 | 2019-07-30 | 高德（无锡）电子有限公司 | The design method of welding resistance consent under two kinds of PCB single side different ink type ink |
| CN110798980A (en) * | 2019-10-12 | 2020-02-14 | 西安金百泽电路科技有限公司 | Method for improving oil leakage and ink inlet hole |
| CN112672531A (en) * | 2020-11-30 | 2021-04-16 | 江门荣信电路板有限公司 | Double-sided processing method of PCB single-sided substrate |
| CN112770497A (en) * | 2019-10-21 | 2021-05-07 | 南通深南电路有限公司 | Resin hole plugging method of circuit board and circuit board |
| CN113490339A (en) * | 2021-08-04 | 2021-10-08 | 东莞市若美电子科技有限公司 | Control method for canceling low-temperature sectional baking in post-curing of welding-proof hole plugging product |
| CN113840466A (en) * | 2021-09-23 | 2021-12-24 | 江门崇达电路技术有限公司 | LED lamp panel and manufacturing method thereof |
| CN113973438A (en) * | 2020-07-22 | 2022-01-25 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN114501833A (en) * | 2020-10-23 | 2022-05-13 | 深南电路股份有限公司 | Method for processing solder mask on circuit board |
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| CN110072339A (en) * | 2019-05-31 | 2019-07-30 | 高德（无锡）电子有限公司 | The design method of welding resistance consent under two kinds of PCB single side different ink type ink |
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| CN112770497A (en) * | 2019-10-21 | 2021-05-07 | 南通深南电路有限公司 | Resin hole plugging method of circuit board and circuit board |
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| CN114501833B (en) * | 2020-10-23 | 2024-05-14 | 深南电路股份有限公司 | Processing method of solder mask layer on circuit board |
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| CN113490339A (en) * | 2021-08-04 | 2021-10-08 | 东莞市若美电子科技有限公司 | Control method for canceling low-temperature sectional baking in post-curing of welding-proof hole plugging product |
| CN113840466A (en) * | 2021-09-23 | 2021-12-24 | 江门崇达电路技术有限公司 | LED lamp panel and manufacturing method thereof |
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Application publication date: 20190122 |