CN105491805B - A kind of method that character is made on PCB thickness copper coins - Google Patents
A kind of method that character is made on PCB thickness copper coins Download PDFInfo
- Publication number
- CN105491805B CN105491805B CN201511023652.8A CN201511023652A CN105491805B CN 105491805 B CN105491805 B CN 105491805B CN 201511023652 A CN201511023652 A CN 201511023652A CN 105491805 B CN105491805 B CN 105491805B
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- China
- Prior art keywords
- character
- silk
- screen
- halftone
- copper face
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
Abstract
The present invention relates to board production technical field, specially a kind of method that character is made on PCB thickness copper coins.The present invention is directed to the halftone of substrate surface and copper face by separately designing, single character portion is avoided to be located at the situation that substrate surface part is located at copper face, and the character on silk-screen substrate surface and on copper face is distinguished in two times, solve the problems, such as ink do not occur at the base material for leading to close copper face in conventional design due to copper face and big substrate surface ladder height；And by silk-screen twice, can also avoid a silk-screen pressure excessive and cause copper face suety or a silk-screen pressure it is too small and cause substrate surface lower oil the problem of；So as to make clearly character on PCB thickness copper coins, the exterior quality of product is improved.Meanwhile the present invention can ensure silk-screen quality, ensure the quality of character with the use of specific halftone and silk-screen parameter.
Description
Technical field
The present invention relates to board production technical field more particularly to a kind of methods that character is made on PCB thickness copper coins.
Background technology
According to different design requirements, the copper layer thickness (copper face thickness) of the upper outer-layer circuits of PCB will be different, some
PCB requires copper layer thickness >=70 μm of its outer-layer circuit, such PCB is known as PCB thickness copper coins.Existing PCB production procedures are general
It is to make solder mask on multiple-plate surface again after making outer-layer circuit on multilayer boards, is then made in certain region again
Character, it is as follows：Preceding process makes multi-layer board → silk-screen solder mask with outer-layer circuit → pre-baked → contraposition exposure → development
→ QC examination boards → silk-screen legend ink → curing → QC examination boards → rear process.In the production process of PCB thickness copper coins, due to copper on plate
The difference in height of face and substrate surface is larger (ladder height is big), and character, silk-screen word are made on it by existing character production method
When according with ink, the situation of ink can be susceptible to any more close to the substrate location of copper face, it is unintelligible so as to cause the character of making.
Invention content
For the prior art when making character on PCB thickness copper coins, the character close to the substrate location of copper face holds the present invention
Easily there is unsharp problem, the unsharp character production method of character on PCB thickness copper coins can be prevented by providing one kind.
To achieve the above object, the present invention uses following technical scheme.
A kind of method that character is made on PCB thickness copper coins, includes the following steps：
Silk-screen of S1：Using the first halftone, silk-screen is located at the character on substrate surface, first halftone on production plate
Including copper face area and substrate area, the substrate area corresponds to the substrate surface on production plate, and copper face area corresponds to the copper on production plate
Face is equipped with picture and text mesh on first halftone only on substrate area.
Preferably, the T numbers of first halftone are 77-100T；It is furthermore preferred that during silk-screen, frictioning hardness is 70 degree, ink
Viscosity be 225 ± 25dpas.
Preferably, the picture and text mesh of character each in the substrate area of the first halftone is arranged on to the copper face area of the second halftone
On, it is therefore an objective to character is made to be imprinted on as possible on the copper face of production plate.
S2 one-step solidifications：Baking production plate makes ink solidification of the silk-screen on production plate substrate surface.
Preferably, the temperature of one-step solidification is 155 ± 5 DEG C, time 15min.
Bis- silk-screens of S3：Using the second halftone, silk-screen is located at the character on copper face, the second halftone packet on production plate
Copper face area and substrate area are included, the substrate area corresponds to the substrate surface on production plate, and copper face area corresponds to the copper face on production plate,
Picture and text mesh is equipped on second halftone only in copper face area.
Preferably, the T numbers of second halftone are 120T；It is furthermore preferred that during silk-screen, frictioning hardness is 75 degree, ink
Viscosity is 225 ± 25dpas.
S4 secondary curings：Baking production plate makes ink solidification of the silk-screen on production plate copper face.
Preferably, the temperature of secondary curing is 155 ± 5 DEG C, time 35min.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention is directed to substrate surface and copper face by separately designing
Halftone, single character portion is avoided to be located at the situation that substrate surface part is located at copper face, and from distinguishing on silk-screen substrate surface in two times
With the character on copper face, solving in conventional design causes due to copper face and big substrate surface ladder height at the base material of copper face
There is not the problem of ink；And by silk-screen twice, can also avoid a silk-screen pressure excessive and cause copper face suety or
Silk-screen pressure is too small and substrate surface is caused not descend the problem of oily；So as to make clearly character on PCB thickness copper coins, carry
The exterior quality of high product.By the way that the picture and text mesh of character each in the substrate area of the first halftone is arranged on the second halftone as possible
Copper face area on, can make character silk-screen as possible production plate copper face on, so as to reduce silk-screen difficulty, further improve silk-screen product
Matter.Meanwhile the present invention can ensure silk-screen quality, ensure the quality of character with the use of specific halftone and silk-screen parameter.
Specific embodiment
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme of the present invention
It is described further and illustrates.
Embodiment
The present embodiment provides it is a kind of on PCB thickness copper coins make character method, mainly by silk-screen process in two times into
Row, the respectively character on the character and copper face on silk-screen substrate surface, and make to be imprinted on during any one character difference on production plate
On substrate surface and copper face, in addition by character silk-screen on the copper face of production plate.It is as follows：
(1) plate is produced
→ negative film technique makes internal layer circuit → pressing → drilling → heavy copper → complete according to the prior art, successively by sawing sheet
Plate plating → outer graphics transfer → graphic plating → takes off film, etches → take off tin → silk-screen welding resistance, and base material is fabricated to outer
Sandwich circuit and the production plate for having made solder mask.
(2) substrate surface character
Silk-screen：Using automatic screen-printing machine and T numbers, the silk-screen on production plate is located at base material for the first halftone of 100T
Character on face, the first halftone include copper face area and substrate area, and substrate area corresponds to the substrate surface on production plate, and copper face area corresponds to
Copper face on production plate；Picture and text mesh is equipped on first halftone only on substrate area, without picture and text mesh in copper face area, and as possible
The picture and text mesh of character each in the substrate area of the halftone is arranged in the copper face area of the second halftone.(in other embodiments
In, the T numbers of the first halftone can also be in the range of 77-100T, and the halftone T numbers specifically used can be by the quality of practical initial workpiece
To determine.)
During silk-screen, frictioning hardness is 70 degree, and the viscosity of ink is 225 ± 25dpas.The state modulator of automatic screen-printing machine
It is as shown in the table：
One-step solidification：Production plate is placed at 155 ± 5 DEG C and toasts 15min, makes ink of the silk-screen on production plate substrate surface
Curing, the character needed for formation on substrate surface.
(3) copper face character
Secondary silk-screen：Using automatic screen-printing machine and T numbers, the silk-screen on production plate is located at copper face for the second halftone of 120T
On character, the second halftone include copper face area and substrate area, substrate area correspond to production plate on substrate surface, copper face area corresponds to
Produce the copper face on plate；Picture and text mesh is equipped on second halftone only in copper face area, without picture and text mesh on substrate area.
Secondary curing：Production plate is placed at 155 ± 5 DEG C and toasts 35min, consolidates ink of the silk-screen on production plate copper face
Change, the character needed for formation on copper face.
During silk-screen, frictioning hardness is 75 degree, and the viscosity of ink is 225 ± 25dpas.The state modulator of automatic screen-printing machine
Also as shown above.
(4) process afterwards
In actual production, production plate on make character after also need successively by surface treatment → electrical testing → molding →
PCB thickness copper coin finished products are made in production plate by FQA → packaging.
It is described above only with embodiment come the technology contents that further illustrate the present invention, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (8)
- A kind of 1. method that character is made on PCB thickness copper coins, which is characterized in that include the following steps：Silk-screen of S1：Using the first halftone, silk-screen is located at the character on substrate surface on production plate, and first halftone includes Copper face area and substrate area, the substrate area correspond to the substrate surface on production plate, and copper face area corresponds to the copper face on production plate, institute It states and is equipped with picture and text mesh on the first halftone only on substrate area；S2 one-step solidifications：Baking production plate makes ink solidification of the silk-screen on production plate substrate surface；Bis- silk-screens of S3：Using the second halftone, silk-screen is located at the character on copper face on production plate, and second halftone includes copper Face area and substrate area, the substrate area correspond to the substrate surface on production plate, and copper face area corresponds to the copper face on production plate, described Picture and text mesh is equipped on second halftone only in copper face area；S4 secondary curings：Baking production plate makes ink solidification of the silk-screen on production plate copper face.
- 2. a kind of method that character is made on PCB thickness copper coins according to claim 1, which is characterized in that in step S1, institute The T numbers for stating the first halftone are 77-100T.
- 3. a kind of method that character is made on PCB thickness copper coins according to claim 2, which is characterized in that in step S1, silk During print, frictioning hardness is 70 degree, and the viscosity of ink is 225 ± 25dpas.
- 4. a kind of method that character is made on PCB thickness copper coins according to claim 1, which is characterized in that in step S3, institute The T numbers for stating the second halftone are 120T.
- 5. a kind of method that character is made on PCB thickness copper coins according to claim 4, which is characterized in that in step S3, silk During print, frictioning hardness is 75 degree, and the viscosity of ink is 225 ± 25dpas.
- 6. a kind of method that character is made on PCB thickness copper coins according to claim 1, which is characterized in that in step S2, one Secondary cured temperature is 155 ± 5 DEG C, time 15min.
- 7. a kind of method that character is made on PCB thickness copper coins according to claim 1, which is characterized in that in step S4, two Secondary cured temperature is 155 ± 5 DEG C, time 35min.
- 8. a kind of method that character is made on PCB thickness copper coins according to claim 1, which is characterized in that by the first halftone Substrate area in the picture and text mesh of each character be arranged in the copper face area of the second halftone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511023652.8A CN105491805B (en) | 2015-12-29 | 2015-12-29 | A kind of method that character is made on PCB thickness copper coins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511023652.8A CN105491805B (en) | 2015-12-29 | 2015-12-29 | A kind of method that character is made on PCB thickness copper coins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105491805A CN105491805A (en) | 2016-04-13 |
| CN105491805B true CN105491805B (en) | 2018-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201511023652.8A Active CN105491805B (en) | 2015-12-29 | 2015-12-29 | A kind of method that character is made on PCB thickness copper coins |
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| CN (1) | CN105491805B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106961804A (en) * | 2017-05-05 | 2017-07-18 | 柏承科技(昆山)股份有限公司 | PCB word techniques |
| CN109397910A (en) * | 2018-11-16 | 2019-03-01 | 广州兴森快捷电路科技有限公司 | A kind of PCB character production method |
| CN110802963B (en) * | 2019-11-06 | 2021-03-05 | 四会富仕电子科技股份有限公司 | Character processing method for PCB (printed circuit board) super-thick copper plate |
| CN111182738B (en) * | 2020-01-15 | 2021-01-15 | 珠海崇达电路技术有限公司 | Method for manufacturing characters on large copper surface of PCB |
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|---|---|---|---|---|
| TW201013601A (en) * | 2008-09-19 | 2010-04-01 | Univ Feng Chia | Phosphoresce color halftone printing, its fabrication and emitting light method |
| CN103152992A (en) * | 2012-12-27 | 2013-06-12 | 胜宏科技（惠州）股份有限公司 | Solder mask printing method of thick copper plate |
| CN104244575A (en) * | 2014-09-24 | 2014-12-24 | 晏石英 | Circuit board provided with multi-color solder mask layers |
| CN104608511A (en) * | 2013-11-04 | 2015-05-13 | 深圳崇达多层线路板有限公司 | Silk-screen printing method of overprinted characters |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60224574A (en) * | 1984-04-20 | 1985-11-08 | F:Kk | Printing method |
-
2015
- 2015-12-29 CN CN201511023652.8A patent/CN105491805B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201013601A (en) * | 2008-09-19 | 2010-04-01 | Univ Feng Chia | Phosphoresce color halftone printing, its fabrication and emitting light method |
| CN103152992A (en) * | 2012-12-27 | 2013-06-12 | 胜宏科技（惠州）股份有限公司 | Solder mask printing method of thick copper plate |
| CN104608511A (en) * | 2013-11-04 | 2015-05-13 | 深圳崇达多层线路板有限公司 | Silk-screen printing method of overprinted characters |
| CN104244575A (en) * | 2014-09-24 | 2014-12-24 | 晏石英 | Circuit board provided with multi-color solder mask layers |
Non-Patent Citations (1)
| Title |
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| "205.7μm底铜厚铜PCB板制作工艺开发";焦其正，曾志军;《印制电路信息》;20121231;第56页2.4阻焊制作部分 * |
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| CN105491805A (en) | 2016-04-13 |
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