CN106961804A - PCB word techniques - Google Patents
PCB word techniques Download PDFInfo
- Publication number
- CN106961804A CN106961804A CN201710312086.5A CN201710312086A CN106961804A CN 106961804 A CN106961804 A CN 106961804A CN 201710312086 A CN201710312086 A CN 201710312086A CN 106961804 A CN106961804 A CN 106961804A
- Authority
- CN
- China
- Prior art keywords
- baking
- faces
- pcb
- welding
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention belongs to printed circuit board (PCB) manufacturing technology field, it is related to a kind of PCB words technique, step includes welding masking developing, the printing of A faces, the baking of A faces, the printing of B faces, anti-welding baking, excision forming successively.The present invention reduces a technological process compared with prior art, reduces the production time, hands over the phase with the obvious advantage；The heat time is reduced, the consumption for the energy sources is saved, exhaust-gas treatment cost is reduced, meets low carbon development requirement；It also avoid because the failure welding that repeatedly pollution of baking plate face is caused, improves the reliability of product.
Description
Technical field
The present invention relates to printed circuit board (PCB) manufacturing technology field, the PCB word techniques of more particularly to a kind of more energy-conservation.
Background technology
Run into sometimes in the manufacture of PCB or multi-layer PCB sheet material positive and negative will mimeograph word situation.This two-sided text
The step that the technique of word is usual is welding masking developing → anti-welding baking → word A faces printing → word A faces baking → word B faces printing
→ word B faces baking → excision forming.The baking of word A faces simply allows ink glimmer to be dried, anti-when avoiding printing B face words to be stained with platform
Face, therefore baking time is shorter, word baking in B faces is then to allow A/B faces word ink to be fully cured, therefore the word energy resource consumption of B faces is big,
And baking number of times is the more, influences whether the cleannes of anti-welding weld pad, causes weld defect.So no matter this conventional method is from adding
Between man-hour, or energy cost, or even product quality is all in the absence of competitive advantage.
Therefore, it is necessary to provide a kind of new method to solve the above problems.
The content of the invention
It is a primary object of the present invention to provide a kind of PCB word techniques of more energy-conservation.
The present invention is achieved through the following technical solutions above-mentioned purpose：A kind of PCB words technique, step includes successively：
1. welding masking developing：Remove unwanted anti-solder ink at solder mask window；
2. A faces are printed：The character needed for the printing of front in pcb board；
3. A faces are toasted：Baking pcb board makes its front word ink semi-solid preparation in high temperature environments；
4. B faces are printed：Character needed for back face printing in pcb board；
5. anti-welding baking：In high temperature environments baking pcb board make thereon anti-solder ink be fully cured；
6. excision forming：Pcb board is cut into shipment chip size through forming machine.
Specifically, the temperature of the A faces baking is 70~155 DEG C, the time is 15min.
Specifically, the temperature of the anti-welding baking is 70~155 DEG C, the time is 210min.
Using above-mentioned technical proposal, the beneficial effect of technical solution of the present invention is：
1st, the present invention reduces a technological process compared with prior art, reduces the production time, hands over the phase with the obvious advantage.
2nd, the heat time is reduced, the consumption for the energy sources is saved, exhaust-gas treatment cost is reduced, meets low carbon development requirement.
3rd, avoid because the failure welding that repeatedly pollution of baking plate face is caused, improves the reliability of product.
Embodiment
The present invention is described in further detail with reference to specific embodiment.
Embodiment
A kind of PCB words technique, step includes successively：
1. welding masking developing：Remove unwanted anti-solder ink at solder mask window；
2. A faces are printed：The character needed for the printing of front in pcb board；
3. A faces are toasted：Pcb board 15min is toasted under 70~155 DEG C of hot environments, makes pcb board front word ink half solid
Change；
4. B faces are printed：Character needed for back face printing in pcb board；
5. anti-welding baking：Pcb board 210min is toasted under 70~155 DEG C of hot environments, makes the anti-solder ink on pcb board complete
All solidstate；
6. excision forming：Pcb board is cut into shipment chip size through forming machine.
Compared to prior art, this technique totally reduces the step of B faces are toasted, but is reached while anti-welding baking
The effect of B faces baking, about half an hour every suit process reduction production time, hands over the phase with the obvious advantage.Because reducing the heat time,
So saving the energy consumption needed for heating, the processing cost for the waste gas for also reducing therefore producing meets low carbon development requirement.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, not
On the premise of departing from the invention design, various modifications and improvements can be made, these belong to the protection model of the present invention
Enclose.
Claims (3)
1. a kind of PCB words technique, it is characterised in that step includes successively：
1. welding masking developing：Remove unwanted anti-solder ink at solder mask window；
2. A faces are printed：The character needed for the printing of front in pcb board；
3. A faces are toasted：Baking pcb board makes its front word ink semi-solid preparation in high temperature environments；
4. B faces are printed：Character needed for back face printing in pcb board；
5. anti-welding baking：In high temperature environments baking pcb board make thereon anti-solder ink be fully cured；
6. excision forming：Pcb board is cut into shipment chip size through forming machine.
2. PCB words technique according to claim 1, it is characterised in that：The temperature of the A faces baking is 70~155 DEG C,
Time is 15min.
3. PCB words technique according to claim 1, it is characterised in that：The temperature of the anti-welding baking is 70~155
DEG C, the time is 210min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710312086.5A CN106961804A (en) | 2017-05-05 | 2017-05-05 | PCB word techniques |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710312086.5A CN106961804A (en) | 2017-05-05 | 2017-05-05 | PCB word techniques |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106961804A true CN106961804A (en) | 2017-07-18 |
Family
ID=59481909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710312086.5A Pending CN106961804A (en) | 2017-05-05 | 2017-05-05 | PCB word techniques |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106961804A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108738242A (en) * | 2018-05-25 | 2018-11-02 | 东莞市鹏利节能设备有限公司 | A kind of PCB circuit board printing technology and its production line |
| CN109121298A (en) * | 2018-08-15 | 2019-01-01 | 昱鑫科技(苏州)有限公司 | printed circuit board green oil character manufacturing method |
| CN109168270A (en) * | 2018-09-19 | 2019-01-08 | 柏承科技(昆山)股份有限公司 | The anti-welding text technique of energy conservation |
| CN111741611A (en) * | 2020-07-27 | 2020-10-02 | 深圳市卓创通电子有限公司 | Laser solder mask processing technology of PCB |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101670718A (en) * | 2009-09-29 | 2010-03-17 | 梅州博敏电子有限公司 | Method for printing printed circuit board double sided characters |
| JP2010129835A (en) * | 2008-11-28 | 2010-06-10 | Toppan Printing Co Ltd | Multilayer printed wiring board, and manufacturing method and processing method thereof |
| CN103957667A (en) * | 2014-04-30 | 2014-07-30 | 江苏博敏电子有限公司 | Solder-mask and character printing manufacturing method for printed circuit board |
| CN105491805A (en) * | 2015-12-29 | 2016-04-13 | 江门崇达电路技术有限公司 | Method for fabricating characters on thick copper board of PCB |
-
2017
- 2017-05-05 CN CN201710312086.5A patent/CN106961804A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129835A (en) * | 2008-11-28 | 2010-06-10 | Toppan Printing Co Ltd | Multilayer printed wiring board, and manufacturing method and processing method thereof |
| CN101670718A (en) * | 2009-09-29 | 2010-03-17 | 梅州博敏电子有限公司 | Method for printing printed circuit board double sided characters |
| CN103957667A (en) * | 2014-04-30 | 2014-07-30 | 江苏博敏电子有限公司 | Solder-mask and character printing manufacturing method for printed circuit board |
| CN105491805A (en) * | 2015-12-29 | 2016-04-13 | 江门崇达电路技术有限公司 | Method for fabricating characters on thick copper board of PCB |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108738242A (en) * | 2018-05-25 | 2018-11-02 | 东莞市鹏利节能设备有限公司 | A kind of PCB circuit board printing technology and its production line |
| CN109121298A (en) * | 2018-08-15 | 2019-01-01 | 昱鑫科技(苏州)有限公司 | printed circuit board green oil character manufacturing method |
| CN109168270A (en) * | 2018-09-19 | 2019-01-08 | 柏承科技(昆山)股份有限公司 | The anti-welding text technique of energy conservation |
| CN111741611A (en) * | 2020-07-27 | 2020-10-02 | 深圳市卓创通电子有限公司 | Laser solder mask processing technology of PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170718 |