CN103957667A - Solder-mask and character printing manufacturing method for printed circuit board - Google Patents
Solder-mask and character printing manufacturing method for printed circuit board Download PDFInfo
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- CN103957667A CN103957667A CN201410182847.6A CN201410182847A CN103957667A CN 103957667 A CN103957667 A CN 103957667A CN 201410182847 A CN201410182847 A CN 201410182847A CN 103957667 A CN103957667 A CN 103957667A
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Abstract
The invention relates to a solder-mask and character printing manufacturing method for a printed circuit board. The method comprises the following steps of solder-mask pre-treatment, solder-mask printing, solder-mask exposure, solder-mask development, solder-mask outgoing quality control, first-surface character printing, second-surface character printing, combination curing and outgoing quality control. According to the method, three times of curing in the prior art are combined into one time of curing after the character printing process, the procedure is effectively shortened, production efficiency is improved, and cost is lowered.
Description
Technical field
The present invention relates to the manufacture method of printed substrate, specifically the anti-welding manufacture method with text printout of a kind of printed substrate.
Background technology
The manufacture craft of printed substrate (PCB) comprises anti-welding operation and text printout operation.The object of anti-welding operation is on conducting wire, to form welding resisting layer, for the protection of conducting wire and external insulation, produces short circuit while preventing soldering of electronic components; The object of text printout operation is at wiring board surface printing word marking, for indicating the effect of wiring board each several part.
In existing technique, in anti-welding operation, be provided with anti-welding baking, in text printout operation, be provided with twice baking, altogether need three bakings.There is following problem in this technique: 1, power consumption is high, and cost is high; 2, long flow path causes human cost higher, and the production time is long, and production efficiency is low; 3, long flow path, manual operation is loaded down with trivial details, and labour intensity is large, and easily scratches printed substrate.
Summary of the invention
The present invention is directed to that above-mentioned cost is high, production efficiency is low and the problem of long flow path, provide a kind of new printed substrate the anti-welding manufacture method with text printout, the method cost is low, production efficiency is high, flow process is short.
According to technical scheme of the present invention: the anti-welding manufacture method with text printout of a kind of printed substrate, comprises the following steps:
The first step, anti-pre-welding treatment, carry out roughening treatment by the copper face on printed substrate, increases the adhesion of copper face and anti-solder ink;
Second step, anti-welding printing stamp one deck ink on printed substrate, and pre-baked;
The 3rd step, anti-welding exposure, by printed wire board to explosure;
The 4th step, welding masking developing, by not having the ink at optically focused place to develop to fall, expose the pad of needs;
The 5th step, anti-welding OQC, printed substrate is shipment after the assay was approved;
The 6th step, text printout first surface, word in the first surface printing of printed substrate;
Second of the 7th step, text printout, word in second printing of printed substrate;
The 8th step, merge baking, by the first low-temperature bake of printed substrate high-temperature baking again;
The 9th step, OQC, after the assay was approved shipment.
Further, in second step, pre-baked temperature is 70-80 ℃, and the pre-baked time is 10-20 minute.
Further, in the 7th step, during second of text printout, on screen printer table top, adopt four copper-clad plates to surround the square frame consistent with circuit board technique to be printed limit, 3 and above positioning pin are installed in copper-clad plate, in the frame surrounding in copper-clad plate, every 10-15cm, be provided with the fastener contour with copper-clad plate, scraper becomes 70-80 degree angle, scraper pressure 6-7.5KG/cm with half tone
2print.
Further, in the 7th step, adopt flashboard rack mode to place wiring board, avoid word to wipe flower, unintelligible.
Further, in the 8th step, the temperature of low-temperature bake is 70-90 ℃, and baking time is 1-2H; The temperature of high-temperature baking is 150-160 ℃, and baking time is 1-2H.
Further, printed wire plate thickness is not less than 0.5mm.
Technique effect of the present invention is: the present invention, by three bakings in existing technique are merged into the once baking after text printout operation, has shortened flow process effectively, has improved production efficiency, has reduced cost.
Accompanying drawing explanation
Fig. 1 is flow chart of the present invention.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
As shown in Figure 1, the present invention is the anti-welding manufacture method with text printout of a kind of printed substrate, comprises the following steps:
The first step, anti-pre-welding treatment, carry out roughening treatment by the copper face on printed substrate, increases the adhesion of copper face and anti-solder ink.
Second step, anti-welding printing stamp one deck ink on printed substrate, and pre-baked; Pre-baked temperature is 70-80 ℃, and the pre-baked time is 10-20 minute.
The 3rd step, anti-welding exposure, by printed wire board to explosure.
The 4th step, welding masking developing, by not having the ink at optically focused place to develop to fall, expose the pad of needs.
The 5th step, anti-welding OQC, printed substrate is shipment after the assay was approved.
The 6th step, text printout first surface, word in the first surface printing of printed substrate.
Second of the 7th step, text printout, word in second printing of printed substrate.
For avoiding silk-screen off normal problem, during second of text printout, on screen printer table top, adopt four copper-clad plates to surround the square frame consistent with circuit board technique to be printed limit, 3 and above positioning pin are installed in copper-clad plate, prevent that plate from moving.
Printed wire plate thickness is not less than 0.5mm, in the frame that copper-clad plate surrounds, every 10-15cm, is provided with the fastener contour with copper-clad plate, and fastener plays the effect of supporting printing wiring board.Scraper becomes 70-80 degree angle, scraper pressure 6-7.5KG/cm with half tone
2print.
Adopt flashboard rack mode to place wiring board, avoid between plank, plate face and the friction of other objects, collision, avoid word to wipe spending, unintelligible.
The 8th step, merge baking, by the first low-temperature bake of printed substrate high-temperature baking again; The temperature of low-temperature bake is 70-90 ℃, and baking time is 1-2H; The temperature of high-temperature baking is 150-160 ℃, and baking time is 1-2H.
The 9th step, OQC, after the assay was approved shipment.
The present invention is by merging the baking in the baking in the anti-welding operation in existing technique and text printout operation, and carry out after being placed on text printout operation, thereby effectively shortened flow process, shortened Production Time, improved production efficiency, reduce manpower expense, reduced and scraped the probability of scrapping of wounding, saved baking cost simultaneously.
The present invention has been carried out to the enough detailed description with certain particularity above.Under those of ordinary skill in field should be appreciated that, the description in embodiment is only exemplary, under the prerequisite that does not depart from true spirit of the present invention and scope, make change and all should belong to protection scope of the present invention.The present invention's scope required for protection is to be limited by described claims, rather than the foregoing description in embodiment limits.
Claims (6)
1. the anti-welding manufacture method with text printout of printed substrate, is characterized in that, comprises the following steps:
The first step, anti-pre-welding treatment, carry out roughening treatment by the copper face on printed substrate, increases the adhesion of copper face and anti-solder ink;
Second step, anti-welding printing stamp one deck ink on printed substrate, and pre-baked;
The 3rd step, anti-welding exposure, by printed wire board to explosure;
The 4th step, welding masking developing, by not having the ink at optically focused place to develop to fall, expose the pad of needs;
The 5th step, anti-welding OQC, printed substrate is shipment after the assay was approved;
The 6th step, text printout first surface, word in the first surface printing of printed substrate;
Second of the 7th step, text printout, word in second printing of printed substrate;
The 8th step, merge baking, by the first low-temperature bake of printed substrate high-temperature baking again;
The 9th step, OQC, after the assay was approved shipment.
2. the manufacture method of and text printout anti-welding according to printed substrate claimed in claim 1, is characterized in that: in second step, pre-baked temperature is 70-80 ℃, and the pre-baked time is 10-20 minute.
3. the manufacture method of and text printout anti-welding according to printed substrate claimed in claim 1, it is characterized in that: in the 7th step, during second of text printout, on screen printer table top, adopt four copper-clad plates to surround the square frame consistent with circuit board technique to be printed limit, 3 and above positioning pin are installed in copper-clad plate, in the frame surrounding in copper-clad plate, every 10-15cm, be provided with the fastener contour with copper-clad plate, scraper becomes 70-80 degree angle, scraper pressure 6-7.5KG/cm with half tone
2print.
4. the manufacture method of and text printout anti-welding according to printed substrate claimed in claim 1, is characterized in that: in the 7th step, adopt flashboard rack mode to place wiring board, avoid word to wipe flower, unintelligible.
5. the manufacture method of and text printout anti-welding according to printed substrate claimed in claim 1, is characterized in that: in the 8th step, the temperature of low-temperature bake is 70-90 ℃, and baking time is 1-2H; The temperature of high-temperature baking is 150-160 ℃, and baking time is 1-2H.
6. the manufacture method of and text printout anti-welding according to printed substrate claimed in claim 1, is characterized in that: printed wire plate thickness is not less than 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410182847.6A CN103957667B (en) | 2014-04-30 | 2014-04-30 | The anti-welding manufacture method with text printout of printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410182847.6A CN103957667B (en) | 2014-04-30 | 2014-04-30 | The anti-welding manufacture method with text printout of printed substrate |
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| Publication Number | Publication Date |
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| CN103957667A true CN103957667A (en) | 2014-07-30 |
| CN103957667B CN103957667B (en) | 2016-10-05 |
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| CN201410182847.6A Active CN103957667B (en) | 2014-04-30 | 2014-04-30 | The anti-welding manufacture method with text printout of printed substrate |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104085213A (en) * | 2014-06-12 | 2014-10-08 | 胜宏科技（惠州）股份有限公司 | Text printing method for double-face circuit board |
| CN104401142A (en) * | 2014-12-05 | 2015-03-11 | 深圳市博敏电子有限公司 | Circuit board character printing method |
| CN104582280A (en) * | 2014-12-19 | 2015-04-29 | 胜华电子（惠阳）有限公司 | PTFE-based PCB manufacturing technique |
| CN105744730A (en) * | 2016-04-27 | 2016-07-06 | 广东欧珀移动通信有限公司 | PCB panel and processing method thereof |
| CN105792503A (en) * | 2015-01-09 | 2016-07-20 | 三菱电机株式会社 | Electronic board unit |
| CN105916312A (en) * | 2016-05-27 | 2016-08-31 | 建业科技电子（惠州）有限公司 | Blue glue production process for printed circuit boards |
| CN106961804A (en) * | 2017-05-05 | 2017-07-18 | 柏承科技(昆山)股份有限公司 | PCB word techniques |
| CN109121298A (en) * | 2018-08-15 | 2019-01-01 | 昱鑫科技(苏州)有限公司 | printed circuit board green oil character manufacturing method |
| CN110239206A (en) * | 2019-06-14 | 2019-09-17 | 广州兴森快捷电路科技有限公司 | PCB character silk-screen production system and method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109168270A (en) * | 2018-09-19 | 2019-01-08 | 柏承科技(昆山)股份有限公司 | The anti-welding text technique of energy conservation |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724818B (en) * | 2012-06-29 | 2015-03-11 | 奥士康精密电路（惠州）有限公司 | Solder mask green ink plugging method |
| CN102802357B (en) * | 2012-08-10 | 2015-01-07 | 东莞市五株电子科技有限公司 | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage |
| CN103660652B (en) * | 2012-09-04 | 2016-04-06 | 深南电路有限公司 | For the silk-screen printing technique of printed circuit board (PCB) |
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2014
- 2014-04-30 CN CN201410182847.6A patent/CN103957667B/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104085213A (en) * | 2014-06-12 | 2014-10-08 | 胜宏科技（惠州）股份有限公司 | Text printing method for double-face circuit board |
| CN104401142A (en) * | 2014-12-05 | 2015-03-11 | 深圳市博敏电子有限公司 | Circuit board character printing method |
| CN104401142B (en) * | 2014-12-05 | 2018-06-26 | 深圳市博敏电子有限公司 | A kind of wiring board text printout method |
| CN104582280A (en) * | 2014-12-19 | 2015-04-29 | 胜华电子（惠阳）有限公司 | PTFE-based PCB manufacturing technique |
| CN105792503A (en) * | 2015-01-09 | 2016-07-20 | 三菱电机株式会社 | Electronic board unit |
| CN105792503B (en) * | 2015-01-09 | 2019-06-07 | 三菱电机株式会社 | Electric substrate unit |
| CN105744730A (en) * | 2016-04-27 | 2016-07-06 | 广东欧珀移动通信有限公司 | PCB panel and processing method thereof |
| CN105916312A (en) * | 2016-05-27 | 2016-08-31 | 建业科技电子（惠州）有限公司 | Blue glue production process for printed circuit boards |
| CN106961804A (en) * | 2017-05-05 | 2017-07-18 | 柏承科技(昆山)股份有限公司 | PCB word techniques |
| CN109121298A (en) * | 2018-08-15 | 2019-01-01 | 昱鑫科技(苏州)有限公司 | printed circuit board green oil character manufacturing method |
| CN110239206A (en) * | 2019-06-14 | 2019-09-17 | 广州兴森快捷电路科技有限公司 | PCB character silk-screen production system and method |
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| Publication number | Publication date |
|---|---|
| CN103957667B (en) | 2016-10-05 |
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