CN102802357B - Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage - Google Patents
Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage Download PDFInfo
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- CN102802357B CN102802357B CN201210285545.2A CN201210285545A CN102802357B CN 102802357 B CN102802357 B CN 102802357B CN 201210285545 A CN201210285545 A CN 201210285545A CN 102802357 B CN102802357 B CN 102802357B
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Abstract
The invention provides a method for preventing a solder mask of a singleside-windowed PCB (Printed Circuit Board) from oil leakage. The method comprises the following steps of: board grinding, oil preparing, hole plugging, screen printing, pre-baking, aligning, exposure, developing and segmented solidifying, wherein a film corresponding to a singleside plug-hole windowed position on the PCB is provided with film baffle points, the single side of printing ink in holes is prevented from being photosensed during exposure, the board is descended when passing through a developer during developing, and green oil which is not photosensed is completely removed through flushing. The method disclosed by the invention can be used for preventing the printing ink in the holes of the PCB from permeating to a bonding pad of a windowed face, and while no pseudo welding formed when the electronic device and the PCB are welded is guaranteed, the interconnection between an electronic device and the bonding pad of the PCB is prevented from being influenced.
Description
Technical field
The present invention relates to a kind of manufacture method of pcb board, particularly relate to a kind of one side of avoiding and to window the method for the anti-welding bleed of pcb board.
Background technology
Along with popularizing of wiring BGA, make the requirement of industry to wiring board higher, if green oil fill-up hole is on pad or when fill-up hole is less than 3mil from pad, because solder mask is heated to completely crued material again after light semi-solid preparation, because green oil is resin system during hot curing, clog that ink in hole is as easy as rolling off a log in the curing process windows bit stream out from one side, infect on BGA pad, this result is also referred to as bleed, and bleed can cause the quality abnormal of PCB and components and parts failure welding.
Summary of the invention
The present invention relates to a kind of manufacture method of pcb board, particularly relate to a kind of one side of avoiding and to window the method for the anti-welding bleed of pcb board.
The invention provides a kind of one side of avoiding to window the method for the anti-welding bleed of pcb board, said method comprising the steps of:
Nog plate, carries out surface treatment to pcb board, removes surface oxidation, increases plate surface roughness;
Opening oil, prepare photosensitive-ink, by photosensitive-ink and curing agent Homogeneous phase mixing, eliminating because stirring the bubble produced simultaneously;
Consent, clogs in the fill-up hole on pcb board by photosensitive-ink;
Silk screen printing, is printed on component side or the solder side of pcb board by screen printing mode by photosensitive-ink;
Pre-baked, the pcb board after silk screen printing is toasted;
Contraposition and exposure, carry out contraposition and the one side film of windowing respectively to the pcb board after baking and establish the exposure of gear point, exposure energy is between 9.5-10.5 level;
Development, windows to face down to the pcb board one side after exposure and develops;
Rear roasting baking sheet, carries out stage curing to the pcb board after development;
Wherein, described pcb board comprises pad and to window fill-up hole, described in fill-up hole of windowing be arranged on described pad; Further, the fill-up hole of described pcb board face correspondence of windowing is provided with first film, and described first film is designed with window PAD and with the window fill-up hole of the described pcb board corresponding gear point corresponding with the pad on described pcb board; And the non-face correspondence of windowing of the fill-up hole of described pcb board is provided with second film, described second film is designed with the PAD that windows equally, and described second film position corresponding with the fill-up hole of windowing of described pcb board is not designed and kept off some positions.
In a preferred embodiment of the present invention, described pcb board comprises all types of material substrates.
In a preferred embodiment of the present invention, in development step, one side windows face when developing to transferring plate, and developing powder is 4.5-5.0m/min, and in development, pressure is 2.5kg/m
2, development presses down as 2kg/m
2, washing pressure is 3.5kg/m
2.
In a preferred embodiment of the present invention, the baking time of pre-baked step is 45min, and pre-baked temperature is 75 DEG C.
In a preferred embodiment of the present invention, rear baking sheet is stage curing, and cure parameter is 70 DEG C ± 5 DEG C × 60min → 100 DEG C ± 5 DEG C × 30min → 120 DEG C ± 5 DEG C × 30min → 150 DEG C ± 5 DEG C × 60min.
In a preferred embodiment of the present invention, screen printing step photosensitive-ink used is that connection causes photosensitive-ink R-500 D-300 G927.
In a preferred embodiment of the present invention, during development, corresponding pcb board is windowed face, crosses developing machine downwards, to ensure in hole by the development of photosensitive photosensitive-ink not completely.
Compared to prior art, method of the present invention one side can be avoided to window pcb board in the curing process rabbet ink window bit stream out from one side, photosensitive-ink can not be caused to infect on pad, avoid the quality abnormal of PCB and components and parts failure welding.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the step that uses required in describing embodiment and accompanying drawing are briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is that one side of avoiding of the present invention is windowed the step schematic diagram of method one preferred embodiment of the anti-welding bleed of pcb board.
Fig. 2 is that one side of avoiding of the present invention is windowed the using state schematic diagram of method of the anti-welding bleed of pcb board.
Fig. 3 be of the present invention avoid one side window the anti-welding bleed of pcb board method in use do not establish gear point film schematic diagram.
Fig. 4 be of the present invention avoid one side window the anti-welding bleed of pcb board method in pcb board schematic diagram.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the invention discloses a kind of one side of avoiding and to window the method for the anti-welding bleed of pcb board, said method comprising the steps of:
Nog plate, carries out surface treatment to pcb board, removes surface oxidation, increases plate surface roughness;
Opening oil, prepare photosensitive-ink, by photosensitive-ink and curing agent Homogeneous phase mixing, eliminating because stirring the bubble produced simultaneously;
Consent, clogs in the fill-up hole on pcb board by photosensitive-ink;
Silk screen printing, is printed on component side or the solder side of pcb board by screen printing mode by photosensitive-ink;
Pre-baked, prebake conditions is carried out to the pcb board after silk screen printing;
Contraposition and exposure, to baking after pcb board window the position film establish gear point exposure, exposure energy is between 9.5-10.5 level;
Development, windows to face down to the pcb board one side after exposure and develops;
Rear roasting baking sheet, carries out stage curing to the pcb board after development.
Please continue to refer to Fig. 2, Fig. 3 and Fig. 4, described pcb board 5 comprises pad 10 and neighbouring fill-up hole 11 of windowing, described in window fill-up hole 11 on pad 10 or its spacing≤3mil.Described pcb board 5 tetra-pack is containing the registration holes 7 corresponding with the film 1 and the film 4.
The fill-up hole of described pcb board 5 is windowed and the film 1 corresponding to face is designed with gear point 3 corresponding to fill-up hole 11 of windowing with pcb board, and the spacing≤3mil of the PAD 2 that windows on gear point 3 films, the PAD 2 on the film 1 is corresponding with the pad 10 on pcb board.The described film 1 tetra-pack is containing the registration holes 6 corresponding with pcb board 5 and the film 4.
On the film 4 that the non-face of windowing of fill-up hole 11 on described pcb board 5 is corresponding, be designed with the PAD 9 that windows, not designing with pcb board fill-up hole 11 correspondence position near the PAD 9 that windows keeps off some positions.The described film 4 tetra-pack is containing the registration holes 7 corresponding with pcb board 5 and the film 1.
During use, only the film 1, pcb board and the film 4 need be aimed at according to each self-corresponding corner location hole 6,7,8, put into exposure machine exposure, when developing machine is put in development afterwards, pcb board 5 one side is windowed and be face toward lower direction and put plate.
Compared to prior art, the beneficial effect of the method for the anti-welding bleed of pcb board of avoiding of the present invention is:
1, avoid the ink in pcb board hole to be dipped in the curing process on the pad in the face of windowing, raising pcb board welds reliability with BGA's.
2, while ensureing that electronic devices and components weld with PCB and can not form rosin joint, that guarantees between components and parts and board pads is interconnected unaffected.
3, employ new technological process, do not need industry generally to use development after walk to return exposure process, time and the cost of whole method can be saved;
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. avoid one side to window the method for the anti-welding bleed of pcb board, it is characterized in that, said method comprising the steps of:
Nog plate, carries out surface treatment to pcb board, removes surface oxidation, increases plate surface roughness;
Opening oil, prepare photosensitive-ink, by photosensitive-ink and curing agent Homogeneous phase mixing, eliminating because stirring the bubble produced simultaneously;
Consent, clogs in the fill-up hole on pcb board by photosensitive-ink;
Silk screen printing, is printed on component side or the solder side of pcb board by screen printing mode by photosensitive-ink;
Pre-baked, prebake conditions is carried out to the pcb board after silk screen printing;
Contraposition and exposure, carry out contraposition respectively to the pcb board after baking and the exposure of gear point established by the opening one side window position film, and exposure energy is between 9.5-10.5 level;
Development, windows to face down to the pcb board one side after exposure and develops;
Rear roasting baking sheet, carries out stage curing to the pcb board after development;
Wherein, described pcb board comprises pad and to window fill-up hole, described in fill-up hole of windowing be arranged on described pad; Further, the fill-up hole of described pcb board face correspondence of windowing is provided with first film, and described first film is designed with window PAD and with the window fill-up hole of the described pcb board corresponding gear point corresponding with the pad on described pcb board; And the non-face correspondence of windowing of the fill-up hole of described pcb board is provided with second film, described second film is designed with the PAD that windows equally, and described second film position corresponding with the fill-up hole of windowing of described pcb board is not designed and kept off some positions.
2. method according to claim 1, is characterized in that, in development step, to transferring plate when development is put in one side window face, developing powder is 4.5-5.0m/min, and in development, pressure is 2.5kg/m
2, development presses down as 2kg/m
2, washing pressure is 3.5kg/m
2.
3. method according to claim 1, is characterized in that, the baking time of pre-baked step is 45min, and pre-baked temperature is 75 DEG C.
4. method according to claim 1, is characterized in that, rear baking sheet is stage curing, cure parameter is 70 DEG C ± 5 DEG C × 60min → 100 DEG C ± 5 DEG C × 30min → 120 DEG C ± 5 DEG C × and 30min → 150 DEG C ± 5 DEG C × 60min.
5. method according to claim 1, is characterized in that, screen printing step photosensitive-ink used is that connection causes photosensitive-ink R-500D-300G927.
6. method according to claim 1, is characterized in that, during development, corresponding pcb board is windowed face, crosses developing machine downwards, to ensure in hole by the development of photosensitive photosensitive-ink not completely.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210285545.2A CN102802357B (en) | 2012-08-10 | 2012-08-10 | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210285545.2A CN102802357B (en) | 2012-08-10 | 2012-08-10 | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage |
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| CN102802357A CN102802357A (en) | 2012-11-28 |
| CN102802357B true CN102802357B (en) | 2015-01-07 |
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| CN201210285545.2A Active CN102802357B (en) | 2012-08-10 | 2012-08-10 | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage |
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| CN103025063A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Circuit board machining process capable of preventing oil overflowing |
| CN103025065B (en) * | 2012-12-11 | 2015-09-02 | 胜宏科技（惠州）股份有限公司 | A kind of method of circuit board pressing filler |
| CN103687334A (en) * | 2013-12-02 | 2014-03-26 | 深圳市景旺电子股份有限公司 | Method for solving problem of oil bleeding of anti-welding plug hole in single-side windowed PCB (printed circuit board) |
| CN103607858B (en) * | 2013-12-03 | 2017-02-22 | 奥士康科技（益阳）有限公司 | Anti-welding processing method of PCB via hole with open window formed in single face |
| CN103957667B (en) * | 2014-04-30 | 2016-10-05 | 江苏博敏电子有限公司 | The anti-welding manufacture method with text printout of printed substrate |
| CN104320928B (en) * | 2014-10-13 | 2017-05-10 | 广东依顿电子科技股份有限公司 | Hole plugging method of different resistance welding colors of circuit board |
| CN104411107A (en) * | 2014-11-05 | 2015-03-11 | 深圳恒宝士线路板有限公司 | PCB electrogilding technology |
| CN105163507A (en) * | 2015-08-11 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Method for improving carbon oil yield |
| CN106546640A (en) * | 2015-09-16 | 2017-03-29 | 刘珊珊 | A kind of carrier for biosensor and preparation method thereof and application |
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| CN105916306A (en) * | 2016-05-19 | 2016-08-31 | 湖北龙腾电子科技有限公司 | PCB jack panel segmented panel baking method |
| CN106658990A (en) * | 2016-11-13 | 2017-05-10 | 惠州市大亚湾科翔科技电路板有限公司 | Method preventing printing ink from remaining on pad in hole of one-side windowed plughole panel of PCB |
| CN106852010A (en) * | 2017-02-16 | 2017-06-13 | 江苏博敏电子有限公司 | A kind of anti-welding making method of half bore printed substrate |
| CN108668440B (en) * | 2017-03-29 | 2021-02-26 | 博敏电子股份有限公司 | Reworking method for poor solder mask plug hole of finished circuit board |
| CN107124826B (en) * | 2017-06-20 | 2019-08-23 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN107148159A (en) * | 2017-07-20 | 2017-09-08 | 深圳中富电路有限公司 | The method for manufacturing printed substrate |
| CN107683023A (en) * | 2017-09-19 | 2018-02-09 | 珠海精毅电路有限公司 | The method of aperture bleed when preventing high-temperature baking after printed substrate via hole consent |
| CN107889362A (en) * | 2017-11-16 | 2018-04-06 | 清远市富盈电子有限公司 | A kind of PCB solder masks jack panel high-temperature baking manufacture craft |
| CN109287076A (en) * | 2018-11-14 | 2019-01-29 | 大连崇达电路有限公司 | The method of the single side opening bleed of aperture 0.8mm or more is prevented in welding resistance technique |
| CN109298595A (en) * | 2018-11-14 | 2019-02-01 | 大连崇达电路有限公司 | For boring the exposure film of the above welding resistance single layer opening of nozzle aperture 0.8mm |
| CN109379852A (en) * | 2018-11-21 | 2019-02-22 | 奥士康精密电路（惠州）有限公司 | A method of preventing anti-welding single side windowing pcb board aperture bleed |
| CN111385979A (en) * | 2018-12-28 | 2020-07-07 | 惠东县建祥电子科技有限公司 | Method for improving solder mask oil leakage of PCB |
| CN111511114A (en) * | 2019-01-31 | 2020-08-07 | 惠东县建祥电子科技有限公司 | Method for improving SMDPAD on solder resist oil bleeding of PCB |
| CN113966101B (en) * | 2021-12-21 | 2022-03-18 | 广东科翔电子科技股份有限公司 | Small pad windowing manufacturing method of high-precision Mini-LED PCB |
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| JP5106726B2 (en) * | 2001-08-10 | 2012-12-26 | イビデン株式会社 | Wiring board manufacturing method |
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