CN105210460B - The manufacturing method of circuit board - Google Patents
The manufacturing method of circuit board Download PDFInfo
- Publication number
- CN105210460B CN105210460B CN201480029187.6A CN201480029187A CN105210460B CN 105210460 B CN105210460 B CN 105210460B CN 201480029187 A CN201480029187 A CN 201480029187A CN 105210460 B CN105210460 B CN 105210460B
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- China
- Prior art keywords
- solder mask
- face
- thickness
- connection
- connection pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
A kind of manufacturing method of circuit board is, characterized by comprising: the process that (A) forms the different solder mask of thickness on the two sides of circuit substrate；(C1) solder mask in thickness first face thinner than the solder mask in the second face is directed to the process being exposed in the process (B) as rear process by the part other than the region of filming；(C2) process that the part other than the region as the middle development of the process of rear process (D) is exposed for the solder mask in the second face；(B) make thickness below process of the solder mask filming in the first face of non-exposed portion until becoming connecting pad using filming treatment fluid；(C3) process that the region part after the filming in process (B) is exposed for the solder mask in the first face；And the process that (D) removes the solder mask of the non-exposed portion in the second face using developer solution.
Description
Technical field
The present invention relates to the manufacturing methods of circuit board, be related in more detail have for connect semiconductor chip, other
The circuit board of multiple connection pads of electronic components such as printed wiring board manufacturing method.
Background technique
Circuit board inside various electric equipments has circuit substrate in its single face or two sides, and the circuit substrate has
The conductor wiring of insulating layer and the surface for being formed in insulating layer.In addition, in the surface of circuit substrate of circuit board, in order to make solder
It is not attached to the conductor wiring for not needing welding, forms solder mask in unwelded part whole surface.Solder mask realization is led
Body wiring oxidation prevent, be electrically insulated and the protection from external environment as effect.
In addition, in the case where being mounted with the electronic components such as semiconductor chip on circuit board, on the surface of circuit board
It is formed with many connection pads for connecting with electronic components such as semiconductor chip, other printed wiring boards.Connect pad
By making the whole or part of the conductor wiring of surface of circuit substrate expose production from solder mask.In recent years, which welds
The densification of disk develops, and the mutual spacing of connection pad of configuration narrows, for example, there is 50 μm of thin spaces below.
As the method for loading electronic component in the connection pad configured to high-density, exists and utilize flip-chip connection
Method.Flip-chip connection is to instigate a part and electronics of the electronic component being arranged on circuit board connection connection pad
The configuration of the electrode terminal of component is corresponding and exposes and make the exposed division and electronics of electronic component connection connection pad
The electrode terminal of component is opposite and is electrically connected via soldering projection.
Exist in connection pad: being partially removed in solder mask and exposes the whole or part for connecting bond pad surface
SMD(Solder Mask Defined, solder mask limit) it constructs and is partially removed in solder mask and keeps connection pad complete
The NSMD(Non Solder Mask Defined of exposing, non-solder mask limit) construction.
Figure 1A is the summary section for showing an example of the circuit board with SMD construction.It is set on 8 surface of insulating layer
1 surface of circuit substrate for being equipped with the connection pad 3 of conductor wiring 7 and a part as conductor wiring is formed with solder mask 2.It closes
In connection pad 3, near its circumference is coated by solder mask 2.Accordingly, there exist be difficult to cause the company due to caused by mechanical shock
Connect pad 3 peeling, from connection pad 3 lead-out wiring in neck broken string the advantage that.Its reverse side is, in order to reliable
Ground fixes the electrical connection of the electrode terminal and corresponding connection pad 3 of electronic component and is necessary to ensure that and is formed in connection pad
Amount of solder required for the joint portion of 3 exposed surface, 3 enlargement of connection pad, accordingly, it is difficult to cope with along with electronic component
The requirement of the densification of the connection pad 3 of miniaturization and high performance.
Figure 1B is the summary section for showing an example of the circuit board with NSMD construction.On 8 surface of insulating layer
1 surface of circuit substrate for being provided with the connection pad 3 of conductor wiring 7 and a part as conductor wiring forms solder mask 2.?
Multiple connection pads 3 are configured in the same opening of solder mask 2, these connection pads 3 expose from solder mask 2.It is constructed in NSMD
In, about connection pad 3, around near solder mask 2 be completely removed, connection pad 3 side fully expose.Cause
This, even small connection pad 3, can also ensure that the adhesive strength of connection pad 3 and solder compared with SMD construction.Its
Reverse side is that the side of connection pad 3 is fully exposed, and there is the adhesive strength drop between connection pad 3 and insulating layer 8 as a result,
A possibility that low.In addition, in the connection pad 3 configured with thin space, exist due to the non-electrolytic ni au plating in rear process and
In the solder outflow between connecting pad 3 there is a situation where short circuit, when wanting that soldering projection is arranged on connecting pad 3 after melting
To adjacent connection pad 3, there is a situation where short circuits between connecting pad 3.
In order to solve the problems, such as the adhesive strength between connection pad and insulating layer, following method is proposed: by swashing
The opening portion of light irradiation and 0 ~ 15 μm of depth or so of a part formation in the solder mask for being set to surface of circuit substrate, as a result,
The printed wiring board for the construction that there is a part of connection pad side to expose from solder mask is manufactured (for example, referring to patent document
1).Using printed wiring board obtained from the method as documented by patent document 1, as a result, with make to be present under solder mask
The printed wiring board that the connection pad in portion fully exposes compares, and can be improved bonding strong between connection pad and insulating layer
Degree.
In addition, proposing following method to solve the problems, such as the short circuit in the connection pad 3 configured with thin space:
Manufacture the circuit board that solder mask 2 is filled between adjacent connection pad 3 (for example, referring to patent document 2).According to patent text
The method for offering 2 is capable of forming the solder mask as shown in Figure 2 for being filled with solder mask 2 between connecting pad 3 and being filled
The thickness NSMD construction below of 2 thickness position connection pad 3.Specifically, solder mask 2 is formed on circuit substrate 1, to making to hinder
The thickness thin film of layer 2 is exposed until becoming connecting the part other than the thickness region below of pad 3, later, benefit
The filming treatment fluid of alkaline aqueous solution is used as to make 2 filming of solder mask of non-exposed portion connect pad 3 until becoming
Below thickness.The portion with the thickness part below comprising connecting pad 3 and the thickness more than connection pad 3 is formed as a result,
The solder mask 2 of the multi-stage configuration divided can be manufactured as the circuit board that the conductor wiring of a part of connection pad 3 exposes.
In general, overleaf forming many external connection connections to high-density in the circuit board of device electronic component
Pad.External connection connects pad and exposes system from solder mask also by a part of the conductor wiring at the circuit substrate back side
Make.Keep the conductor wiring of the external electric substrates such as exposed division and the motherboard of external connection connection pad opposite, it is convex via welding
Block and be electrically connected.
In the case where the two sides of circuit substrate forms solder mask, the thickness of the solder mask on pad is connected according to comprising even
It connects the density of the surrounding conductor wiring of pad and changes.For example, being led in the case where the density of conductor wiring is small
The quantitative change of the solder mask of gap filling between body wiring is more, and the thickness of the solder mask on connection pad has the tendency that thinning.It is another
Aspect, in the case where the density of conductor wiring is big, the quantitative change of the solder mask of the gap filling between conductor wiring is few, connection weldering
The thickness of solder mask on disk has the tendency that thickeing.
In the case where loading the circuit board of electronic component by flip-chip connection, exist and the electricity comprising surface
The density of the subassembly connection surrounding conductor wiring of connection pad is compared to the connection pad of the external connection comprising the back side
Surrounding conductor wiring the big situation of density.Accordingly, there exist solder mask of the external connection at the back side on connection pad
Thickness specific surface electronic component connection with connection pad on solder mask thickness thickness situation.It is handled using filming
Liquid makes solder mask filming to make to connect in the method that pad exposes, and in the case where desired two sides simultaneously filming, exists
Lead to the problem of the case where following such.
Firstly, 2 filming of solder mask that will make surface until become electronic component connection with connection pad 3 thickness with
Under situation as benchmark in the case where, the solder mask 2 at the back side also simultaneously by filming amount identical with surface, still, the back side
2 specific surface of solder mask solder mask 2 it is thick, accordingly, there exist following situations: solder mask 2 remains in the outside at the back side as residue
Connection is generated on connection pad 4 since the bad such problems (Fig. 3) that is electrically insulated occurs for the residue.
On the contrary, in 2 filming of solder mask that will make the back side below the thickness for becoming external connection connection pad 4
The case where as benchmark in the case where, the solder mask 2 on surface also simultaneously by filming amount identical with the back side, still, the back side
The solder mask 2 of 2 specific surface of solder mask is thick, and accordingly, there exist following situations: generating the electronic component connection connection pad on surface
The thickness for the solder mask 2 filled between 3 is thinner than desired thickness and adjacent electronic component occurs and connects with short between connection pad 3
Road such problems.
However, being carried out on circuit substrate to electronic component in the printed wiring board of flip-chip connection, in order to ensure electricity
The connection reliability of subassembly and circuit substrate fills electronic component and circuit substrate by underfill (sealing resin)
Gap enhanced.In order to ensure increasing effect, it is necessary to fill full amount in the gap of electronic component and circuit substrate
Underfill.However, the case where carrying out the chip of falling stake connection using the printed wiring board obtained using patent document 1
Under, when being filled with sufficient underfill in order to ensure reinforcing effect, there are underfill from electronic component and electricity
The case where gap of base board overflows to surrounding and causes bad influence to electricity work.Therefore, in order to prevent underfill to week
It encloses spilling, proposes the printed wiring board with dam construction (for example, referring to patent document 3 ~ 5).
In patent document 3, it discloses following method: foring solder mask on the circuit substrate with conductor circuit
Later, Partial exposure is carried out, development treatment is carried out to unexposed portion later, formed makes to connect pad top from solder mask as a result,
The opening portion partly exposed then carries out secondary Partial exposure, is exposed later using abatement processes to secondary part
The unexposed portion of light carries out filming, forms dam shape.Opening portion using the solder mask of this method is SMD construction, therefore,
It is difficult to be securely fixed the electrical connection of the electrode terminal of electronic component and corresponding connection pad, there is connection pad and weldering
The insufficient situation of the electrical connection of pellet.In addition, carried out using the formation that the dam of this method constructs by abatement processes, because
This, solder mask is by rough surface, the strength reduction of solder mask as a result, and the reliable of printed wiring board cannot be fully ensured by existing
The case where property.
In patent document 4, it discloses following method: foring solder mask on the circuit substrate with conductor circuit
Later, Partial exposure is carried out, development treatment is carried out to unexposed portion later, formed keeps connection pad complete from solder mask as a result,
The opening portion that ground exposes then after foring secondary solder resist, carries out bigger than the partial exposure area of first time by 1
Secondary Partial exposure that the unexposed portion of circle occurs, later develops to unexposed portion, forms dam shape as a result,.
Opening portion using the solder mask of this method is NSMD construction, and about connection pad, the solder mask of near its circumference is by fully
It removes, the side for connecting pad is fully exposed, and what the adhesive strength between presence connection pad and insulating layer reduced as a result, can
It can property.
In patent document 5, it discloses following method: foring solder mask on the circuit substrate with conductor circuit
Later, Partial exposure process is carried out, filming is carried out to the solder mask in unexposed portion later, is formed be open in solder mask as a result,
Portion and dam shape.Opening portion using the solder mask of this method is SMD construction, and about connection pad, near its circumference is by hindering
Layer is coated, accordingly, it is difficult to it is securely fixed the electrical connection of the electrode terminal and corresponding connection pad of electronic component,
There is a situation where to connect pad and the electrical connection of solder ball is insufficient.
Existing technical literature
Patent document
Patent document 1: No. 3346263 bulletins of Japanese Patent；
Patent document 2: No. 2012/043201 book of International Publication No.；
Patent document 3: Japanese Unexamined Patent Publication 2012-238668 bulletin；
Patent document 4: Japanese Unexamined Patent Publication 05-226505 bulletin；
Patent document 5: Japanese Unexamined Patent Publication 2011-77191 bulletin.
Summary of the invention
Subject to be solved by the invention
The issue of the present invention is to provide a kind of manufacturing method of circuit board, the circuit board has and has on two sides
The circuit substrate of insulating layer and the connection pad on the surface for being formed in insulating layer has solder mask on the two sides of circuit substrate, even
The a part for connecing pad is exposed from solder mask, and the manufacturing method of the circuit board is revealed on the two sides of circuit board from solder mask
Electric short circuit is not present between connection pad out, does not remain the residue of solder mask on the connection pad of exposing.In addition, of the invention
Other projects are to provide a kind of manufacturing method of printed wiring board, and the manufacturing method of the printed wiring board can be connected
It connects pad and works with insulating layer with electricity caused by connecting the adhesive strength height of pad and solder, being flowed out as underfill
The high printed wiring board of bad, solder mask intensity.
Solution for solving the problem
It is that the present inventors is discussed with keen determination in order to solve the above problems as a result, have found can be by following hairs
It is bright to solve the above subject.
(1) a kind of manufacturing method of circuit board, the circuit board is with having insulating layer and in insulating layer on two sides
The circuit substrate of connection pad that is formed of surface and one of pad is connected with solder mask on the two sides of circuit substrate
To divide and exposes from solder mask, the manufacturing method is characterized in that, include:
(A) process for forming the different solder mask of thickness on the two sides of circuit substrate, the circuit substrate have on two sides
The connection pad of insulating layer and the surface for being formed in insulating layer；
(C1) solder mask in thickness first face thinner than the solder mask in the second face is directed to in the process (B) as rear process
The process that part other than the middle region by filming is exposed；
(C2) solder mask in the second face is directed to the part other than developed region in as the process of rear process (D)
The process being exposed；
(B) the solder mask filming of non-exposed portion is made to connect pad until becoming using filming treatment fluid in the first face
Expose the process of a part of connection pad below thickness；
(C3) process that the region part after the filming in process (B) is exposed for the solder mask in the first face；
And
(D) process of the solder mask of the non-exposed portion in the second face is removed using developer solution.
(2) a kind of manufacturing method of circuit board, the circuit board is with having insulating layer and in insulating layer on two sides
The circuit substrate of connection pad that is formed of surface and one of pad is connected with solder mask on the two sides of circuit substrate
To divide and exposes from solder mask, the manufacturing method is characterized in that, include:
(A) process for forming the different solder mask of thickness on the two sides of circuit substrate, the circuit substrate have on two sides
The connection pad of insulating layer and the surface for being formed in insulating layer；
(C1) solder mask in thickness first face thinner than the solder mask in the second face is directed to in the process as rear process
(B1) process being exposed in by the part other than the region of filming；
(C2) solder mask in the second face is directed to the part other than developed region in as the process of rear process (D)
The process being exposed；
(B1) utilize filming treatment fluid in the range of connecting pad and not exposing to the welding resistance of non-exposed portion in the first face
The process that layer carries out filming；
(C4) for the first face solder mask in as the process of rear process (B2) by the region of filming other than
The process that part is exposed；
(B2) the solder mask filming of non-exposed portion is made to connect pad until becoming using filming treatment fluid in the first face
Thickness below come expose connection pad a part process；
(C5) process that the region part after the filming in process (B2) is exposed for the solder mask in the first face；
And
(D) process of the solder mask of the non-exposed portion in the second face is removed using developer solution.
(3) a kind of manufacturing method of circuit board, the circuit board is with having insulating layer and in insulating layer on two sides
The circuit substrate of connection pad that is formed of surface and one of pad is connected with solder mask on the two sides of circuit substrate
To divide and exposes from solder mask, the manufacturing method is characterized in that, include:
(A1) process for forming the first different solder mask of thickness on the two sides of circuit substrate, the circuit substrate is on two sides
Connection pad with insulating layer He the surface for being formed in insulating layer；
(C1) first solder mask in thickness first face thinner than first solder mask in the second face is directed to as rear process
Process (B) in the process that is exposed by the part other than the region of filming；
(C2) for the second face the first solder mask to developed region in as the process of rear process (D1) other than
The process that is exposed of part；
(B) make the first solder mask filming of non-exposed portion until becoming connection weldering using filming treatment fluid in the first face
Expose the process of a part of connection pad below the thickness of disk；
(C3) work that the region part after the filming in process (B) is exposed for first solder mask in the first face
Sequence；
(A2) the second solder mask is formed on first solder mask in the first face of the circuit substrate for being accomplished to (C3) process
Process；
(C6) for the first face the second solder mask to developed region in as the process of rear process (D1) other than
The process that is exposed of part；And
(D1) the second solder mask of the non-exposed portion in the first face and the non-exposed portion in the second face are removed using developer solution
The process of first solder mask.
(4) a kind of manufacturing method of circuit board, the circuit board is with having insulating layer and in insulating layer on two sides
The circuit substrate of connection pad that is formed of surface and one of pad is connected with solder mask on the two sides of circuit substrate
To divide and exposes from solder mask, the manufacturing method is characterized in that, include:
(A1) process for forming the first different solder mask of thickness on the two sides of circuit substrate, the circuit substrate is on two sides
Connection pad with insulating layer He the surface for being formed in insulating layer；
(C1) first solder mask in thickness first face thinner than first solder mask in the second face is directed to as rear process
Process (B) in the process that is exposed by the part other than the region of filming；
(C2) for the second face the first solder mask to developed region in as the process of rear process (D) other than
The process that part is exposed；
(B) make the first solder mask filming of non-exposed portion until becoming connection weldering using filming treatment fluid in the first face
Expose the process of a part of connection pad below the thickness of disk；
(C3) work that the region part after the filming in process (B) is exposed for first solder mask in the first face
Sequence；
(D) process of the first solder mask of the non-exposed portion in the second face is removed using developer solution；
(A2) work of the second solder mask is formed on first solder mask in the first face of the circuit substrate for being accomplished to (D) process
Sequence；
(C6) for the first face the second solder mask to developed region in as the process of rear process (D2) other than
The process that is exposed of part；And
(D2) process of the second solder mask of the non-exposed portion in the first face is removed using developer solution.
(5) a kind of manufacturing method of circuit board, the circuit board is with having insulating layer and in insulating layer on two sides
The circuit substrate of connection pad that is formed of surface and one of pad is connected with solder mask on the two sides of circuit substrate
To divide and exposes from solder mask, the manufacturing method is characterized in that, include:
(A1) process for forming the first different solder mask of thickness on the two sides of circuit substrate, the circuit substrate is on two sides
Connection pad with insulating layer He the surface for being formed in insulating layer；
(C2) for the second face the first solder mask to developed region in as the process of rear process (D1) other than
The process that is exposed of part；
(B) make the first solder mask filming of non-exposed portion until becoming connection weldering using filming treatment fluid in the first face
Expose the process of a part of connection pad below the thickness of disk；
(C3) work that the region part after the filming in process (B) is exposed for first solder mask in the first face
Sequence；
(A2) the second solder mask is formed on first solder mask in the first face of the circuit substrate for being accomplished to (C3) process
Process；
(C6) for the first face the second solder mask in the process (B3) as rear process by the region of filming with
The process that outer part is exposed；
(B3) utilize filming treatment fluid in the range of connecting pad and not exposing to the second of non-exposed portion in the first face
The process of solder mask progress filming；
(C7) for the first face the second solder mask to developed region in as the process of rear process (D1) other than
The process that is exposed of part；And
(D1) the second solder mask of the non-exposed portion in the first face and the non-exposed portion in the second face are removed using developer solution
The process of first solder mask.
(6) according to the manufacturing method of described in any item circuit boards of above-mentioned (1) ~ (4), wherein process (C1) it
Preceding progress process (C2).
(7) according to the manufacturing method of described in any item circuit boards of above-mentioned (1) ~ (4), wherein while carrying out process
(C1) and process (C2).
(8) according to the manufacturing method of described in any item circuit boards of above-mentioned (1), (3), (4), wherein process (C3)
In exposure carried out by non-contact Exposure mode under an oxygen atmosphere.
(9) manufacturing method of the circuit board according to above-mentioned (5), wherein the exposure in process (C3) and process (C7)
Light is carried out by non-contact Exposure mode under an oxygen atmosphere.
(10) manufacturing method of the circuit board according to above-mentioned (2), wherein the exposure in process (C4) and process (C5)
Light is carried out by non-contact Exposure mode under an oxygen atmosphere.
(11) according to the manufacturing method of described in any item circuit boards of above-mentioned (1), (3), (4), (8), wherein process
(C3) light exposure in is 1 times or more 5 times or less of the light exposure in process (C1).
(12) manufacturing method of the circuit board according to above-mentioned (5) or (9), wherein process (C3) and process (C7)
In light exposure be 1 times or more 5 times or less of light exposure in process (C6).
(13) manufacturing method of the circuit board according to above-mentioned (2) or (10), wherein process (C4) and process (C5)
In light exposure be 1 times or more 5 times or less of light exposure in process (C1).
(14) according to the manufacturing method of described in any item circuit boards of above-mentioned (1), (3), (4), (8), (11),
In, the filming processing of the solder mask in process (B) is carried out with making the mode in filming process face.
(15) according to the manufacturing method of described in any item circuit boards of above-mentioned (5), (9), (12), wherein process (B)
It handles with the filming of the solder mask in process (B3) and is carried out with making the mode in filming process face.
(16) according to the manufacturing method of described in any item circuit boards of above-mentioned (2), (10), (13), wherein process
(B1) the filming processing of the solder mask and in process (B2) is carried out with making the mode in filming process face.
Invention effect
In accordance with the invention it is possible to provide a kind of manufacturing method of circuit board, the circuit board has and has on two sides
The circuit substrate of insulating layer and the connection pad on the surface for being formed in insulating layer has solder mask on the two sides of circuit substrate, even
The a part for connecing pad is exposed from solder mask, and the manufacturing method of the circuit board is revealed on the two sides of circuit board from solder mask
Electric short circuit is not present between connection pad out, in addition, not remaining the residue of solder mask on the connection pad of exposing.In addition, root
According to the present invention, it is capable of providing the manufacturing method of printed wiring board, the manufacturing method of the printed wiring board can obtain connection weldering
Disk is worked not with insulating layer with electricity caused by connecting the adhesive strength height of pad and solder, being flowed out as underfill
The high printed wiring board of good, solder mask intensity.
Detailed description of the invention
Fig. 1 is the summary section for showing an example of circuit board.
Fig. 2 is the summary section for showing an example of circuit board.
Fig. 3 is the summary section for showing an example of circuit board.
Fig. 4-1 and Fig. 4-2 is the section process chart for showing an example of manufacturing method for circuit board of the invention.
Fig. 5-1, Fig. 5-2 and Fig. 5-3 are the section works for showing an example of manufacturing method for circuit board of the invention
Sequence figure.
Fig. 6-1, Fig. 6-2 and Fig. 6-3 are the section works for showing an example of manufacturing method for circuit board of the invention
Sequence figure.
Fig. 7-1, Fig. 7-2 and Fig. 7-3 are the section works for showing an example of manufacturing method for circuit board of the invention
Sequence figure.
Fig. 8-1, Fig. 8-2 and Fig. 8-3 are the section works for showing an example of manufacturing method for circuit board of the invention
Sequence figure.
Fig. 9 is the summary section for showing the example that can utilize circuit board produced by the present invention.
Figure 10 is the summary section for showing the example that can utilize circuit board produced by the present invention.
Figure 11 is the summary section for showing the example that can utilize circuit board produced by the present invention.
Figure 12 is the summary section for showing the example that can utilize circuit board produced by the present invention.
Figure 13 is the summary section for showing an example of Mulitilayer circuit board.
Specific embodiment
Hereinafter, being described in detail to the manufacturing method of circuit board of the invention.
Fig. 4-1 and Fig. 4-2 is the section process chart for showing an example of manufacturing method (1) for circuit board.Prepare
Two sides has insulating layer 8 and is formed in the circuit substrate of the conductor wiring 7 on the surface of insulating layer 8.A part of conductor wiring 7 is
Connect pad 3 and 4.In process (A), welding resistance (solder is formed in a manner of covering whole surface on the two sides of circuit substrate 1
Resist) layer 2.The formation of the solder mask 2 in the first face and the second face can be two sides it is also possible to be single side single side, but
It is that need to be set according to the thickness for being formed by solder mask will not heating condition as excessive heat-cure.On two sides
Solder mask 2 thickness it is different, thin one of thickness is " the first face ", and thick one of thickness is " the second face ".On two sides with phase
In the case that same condition forms solder mask 2, the thickness of solder mask 2 is according to the conductor cloth for connecting pad 3 and 4 comprising each face
The density of line 7 and change.In Fig. 4-1, the density of the second face conductor wiring 7 compared with the first face of upside of downside is more
Greatly, the thickness of the solder mask 2 on the conductor wiring 7 in the second face is thicker than the thickness of the solder mask 2 on the conductor wiring 7 in the first face.
Further more, there is the external connection comprising the back side with its week of connection pad 4 in the case where loading the circuit board of electronic component
The density of the conductor wiring 7 enclosed connect the close of the surrounding conductor wiring 7 for using connection pad 3 with the electronic component comprising surface
Degree compares larger situation, and surface is the first face, and the back side is the second face.
In process (C1), for the solder mask 2 in the first face, in the process (B) as rear process by filming
Part other than region is exposed.In process (C2), for the solder mask 2 in the second face, in the process as rear process
(D) part in other than developed region is exposed.In the part of solder mask 2 being exposed, solder resist carries out photic
Polymerization has patience for filming process and developing procedure.
In process (B), in the first face, it is straight that filming is carried out using solder mask 2 of the filming treatment fluid to non-exposed portion
Expose a part for connecting pad 3 below to the thickness for becoming connecting pad 3.Loading the circuit board of electronic component
In the case of, it is connected as electronic component with connection pad 3 using the connection pad 3 exposed in the process (B).In process
(B) in, the solder mask 2 of the non-exposed portion in the second face is also simultaneously by filming, still, with the resistance on the connection pad 3 in the first face
Layer 2 is compared, and the solder mask 2 on the connection pad 4 in the second face is thicker, therefore, remains solder mask 2 on connection pad 4
Residue.
In process (C3), for the solder mask 2 in the first face, the region part after the filming in process (B) is carried out
Exposure.In the part of solder mask 2 being exposed, solder resist carries out photo polymerization, has patience for developing procedure.
In process (D), in the second face, the solder mask 2 of non-exposed portion is removed using developer solution, makes to connect pad 4
A part is exposed.The residue of the solder mask 2 remained on connection pad 4 is removed by process (D).In the cloth for loading electronic component
In the case where line substrate, using the connection pad 4 exposed in the process (D) as external connection connection pad 4.?
In solder mask 2 on one side, quilt in the process (C3) that the region part in process (B) after filming carries out before process (D)
Exposure has the patience for developing procedure, therefore, will not developed liquid removing.
In the manufacturing method (1) of circuit board, it is arbitrary shape, energy that the exposure area of process (C1) can be made, which to change,
The circuit board of section shape for example shown in Fig. 9 is enough made by the change of exposure area.In a of Fig. 9, in the first face
Connection pad 3 between be formed with the protrusion of solder mask 2.In the b of Fig. 9, in the first face, the connection exposed from solder mask 2 is welded
It disk 3 and is alternately arranged by the conductor wiring 7 that solder mask 2 coats.
Fig. 5-1, Fig. 5-2 and Fig. 5-3 are the section process charts for showing an example of manufacturing method (2) for circuit board.
It is not all following aspect with the manufacturing method (1) of circuit board: in the first face, additional solder mask 2 again and again respectively
Exposure process and filming process.Electronic component is loaded into circuit board connecting by flip-chip (flip chip)
In the case of, there is following situation: since the difference of electronic component and the thermal expansion coefficient of circuit board is answered when applying thermal shock
Power concentrates on interconnecting piece and causes the deformation of interconnecting piece, destroys.Stress is concentrated to interconnecting piece and improves connection reliably in order to prevent
Property, usually using the resin combination of referred to as underfill (underfill) come encapsulated electronic components and circuit board it
Between.By the manufacturing method (2) of circuit board, it is capable of forming the solder mask of the second configuration with dam construction, the dam
Construction is the construction for blocking the underfill filled between electronic component and circuit board.
In process (A), solder mask 2 is formed in a manner of covering whole surface on the two sides of circuit substrate 1.In process
(C1) in, for the solder mask 2 in the first face, in the process (B1) as rear process by the part other than the region of filming
It is exposed.In process (C2), for the solder mask 2 in the second face, to developed area in the process (D) as rear process
Part other than domain is exposed.
In process (B1), in the first face, using filming treatment fluid to non-exposure in the range of connecting pad 3 and not exposing
The solder mask 2 in light portion carries out filming.In process (B1), the solder mask 2 of the non-exposed portion in the second face is also simultaneously by filming.
In process (C4), for the solder mask 2 in the first face, to the area of the filming in the process (B2) as rear process
Part other than domain is exposed.
In process (B2), in the first face, it is straight that filming is carried out using solder mask 2 of the filming treatment fluid to non-exposed portion
Expose a part for connecting pad 3 below to the thickness for becoming connecting pad 3.Loading the circuit board of electronic component
In the case of, it is connected as electronic component with connection pad 3 using the connection pad 3 exposed in the process (B2).In process
(B2) in, the solder mask 2 of the non-exposed portion in the second face is also simultaneously by filming, still, with the resistance on the connection pad 3 in the first face
Layer 2 is compared, and the solder mask 2 on the connection pad 4 in the second face is thicker, therefore, remains solder mask 2 on connection pad 4
Residue.
In process (C5), for the solder mask 2 in the first face, the region part after the filming in process (B2) is carried out
Exposure.
In process (D), in the second face, the solder mask 2 of non-exposed portion is removed using developer solution, makes to connect pad 4
A part is exposed.The residue of the solder mask 2 remained on connection pad 4 is removed by process (D).In the cloth for loading electronic component
In the case where line substrate, using the connection pad 4 exposed in the process (D) as external connection connection pad 4.
In the manufacturing method (2) of circuit board, it is arbitrary shape, energy that the exposure area of process (C4) can be made, which to change,
The circuit board of section shape for example shown in Fig. 10 is enough made by the change of exposure area.In the c of Figure 10, first
The protrusion of solder mask 2 is formed between the connection pad 3 in face.In the d of Figure 10, in the first face, from the connection of the exposing of solder mask 2
It pad 3 and is alternately arranged by the conductor wiring 7 that solder mask 2 coats.
Fig. 6-1, Fig. 6-2 and Fig. 6-3 are the section process charts for showing an example of manufacturing method (3) for circuit board.
Be not all following aspect with the manufacturing method (2) of circuit board: the solder mask in the first face is hindered by the first solder mask 2-1 and second
Layer 2-2 is constituted.In the manufacturing method (3) of circuit board, in the thickness of the first solder mask 2-1 of the non-exposed portion to the first face
Until degree carries out filming below the thickness for becoming connecting pad 3, the second resistance is formed on the surface of the first solder mask 2-1
Layer 2-2 carries out development treatment to the second solder mask 2-2 of non-exposed portion after exposition.As a result, with used wiring base
The case where manufacturing method (2) of plate, is identical, is capable of forming the solder mask of the second configuration with dam construction, the dam construction
It is the construction for blocking the underfill filled between electronic component and circuit board.
In process (A1), the first different solder mask 2-1 of thickness is formed in the first face and the second face of circuit substrate 1.
The formation of the first solder mask 2-1 in the first face and the second face can be two sides it is also possible to be single side single side, still, need
To be set according to the thickness for being formed by solder mask will not heating condition as excessive heat-cure.
In process (C1), for the first solder mask 2- in thickness first face thinner than the first solder mask 2-1 in the second face
1, it is exposed in the process (B) as rear process by the part other than the region of filming.In process (C2), for
The first solder mask 2-1 in the second face exposes the part other than developed region in as the process of rear process (D1)
Light.
In process (B), in the first face, carried out using first solder mask 2-1 of the filming treatment fluid to non-exposed portion thin
Membranization exposes a part for connecting pad 3 below the thickness for becoming connecting pad 3.In process (B), the second face
First solder mask 2-1 of non-exposed portion is also simultaneously by filming.But the first solder mask connected on pad 3 with the first face
2-1 is compared, and the first solder mask 2-1 on the connection pad 4 in the second face is thicker, therefore, remains the first resistance on connection pad 4
The residue of layer 2-1.
In process (C3), for the first solder mask 2-1 in the first face, to the region portion after the filming in process (B)
Divide and is exposed.
In process (A2), formed on the first solder mask 2-1 in the first face of the circuit substrate for being accomplished to process (C3)
Second solder mask 2-2.At this point, being adjusted to the heating condition of the second solder mask 2-2 in first face that is applied to, the of the second face
The non-exposed portion of one solder mask 2-1 will not excessive heat-cure.
In process (C6), for the second solder mask 2-2 in the first face, shown in the process (D1) as rear process
Part other than the region of shadow is exposed.
In process (D1), the second solder mask 2-2 and the second face of the non-exposed portion in the first face are removed using developer solution
Non-exposed portion the first solder mask 2-1, make connect pad 3 and 4 a part expose.Remain in company by process (D1) removing
Connect the residue of the first solder mask 2-1 on pad 4.In the case where loading the circuit board of electronic component, using in the process
(D1) the connection pad 3 exposed in connects as electronic component with pad 3 is connected, and is connected using connection pad 4 as outside
It connects with connection pad 4.
Fig. 7-1, Fig. 7-2 and Fig. 7-3 are the section process charts for showing an example of manufacturing method (4) for circuit board.
It is not all following aspect with the manufacturing method (3) of circuit board: before the second solder mask 2-2 for forming the first face, utilizes
Developer solution removes the first solder mask 2-1 in the second face.The first resistance of the non-exposed portion in the second face is removed first with developer solution
Layer 2-1 does not need with while heating the non-exposed portion in the second face as a result, when forming the second solder mask 2-2 in the first face
First solder mask 2-1 adjusts heating condition without the mode of excessive heat-cure.In the manufacturing method (4) of circuit board,
The case where with the manufacturing method (2) for having used circuit board and (3), is identical, is capable of forming the second configuration with dam construction
Solder mask, the dam construction are the constructions for blocking the underfill filled between electronic component and circuit board.
In process (A1), the first different solder mask 2-1 of thickness is formed in the first face and the second face of circuit substrate 1.
In process (C1), for the first solder mask 2-1 in thickness first face thinner than the first solder mask 2-1 in the second face, to making
To be exposed in the process (B) of rear process by the part other than the region of filming.In process (C2), for the second face
First solder mask 2-1 is exposed the part other than developed region in as the process of rear process (D).
In process (B), in the first face, carried out using first solder mask 2-1 of the filming treatment fluid to non-exposed portion thin
Membranization exposes a part for connecting pad 3 below the thickness for becoming connecting pad 3.In process (B), the second face
First solder mask 2-1 of non-exposed portion is also simultaneously by filming.But the first solder mask connected on pad 3 with the first face
2-1 is compared, and the first solder mask 2-1 on the connection pad 4 in the second face is thicker, therefore, remains the first resistance on connection pad 4
Layer 2-1.
In process (C3), for the first solder mask 2-1 in the first face, to the region portion after the filming in process (B)
Divide and is exposed.
In process (D), the first solder mask 2-1 of the non-exposed portion in the second face is removed using developer solution, welds connection
A part of disk 4 is exposed.The residue of the first solder mask 2-1 remained on connection pad 4 is removed by process (D).It is filling
In the case where the circuit board for carrying electronic component, using the connection pad 4 exposed in the process (D) as external connection use
Connect pad 4.
In process (A2), is formed on the first solder mask 2-1 in the first face of the circuit substrate for being accomplished to process (D)
Two solder mask 2-2.
In process (C6), for the second solder mask 2-2 in the first face, shown in the process (D2) as rear process
Part other than the region of shadow is exposed.
In process (D2), the second solder mask 2-2 of the non-exposed portion in the first face is removed using developer solution, welds connection
A part of disk 3 is exposed.In the case where loading the circuit board of electronic component, the connection exposed in the process (D2) is used
Pad 3 connects as electronic component with connection pad 3.
In the manufacturing method (3) of circuit board and (4), it is arbitrary shape that the exposure area of process (C1) can be made, which to change,
Shape can make the circuit board of section shape shown in such as Figure 11 by the change of exposure area.In the e of Figure 11,
The protrusion of the first solder mask 2-1 is formed between the connection pad 3 in the first face.In the f of Figure 11, from the first solder mask 2-1
The connection pad 3 of exposing and by the first solder mask 2-1 coat conductor wiring 7 be alternately arranged.
Fig. 8-1, Fig. 8-2 and Fig. 8-3 are the section process charts for showing an example of manufacturing method (5) for circuit board.
In the manufacturing method (5) of circuit board, in the first face, before being exposed to the first solder mask 2-1, to the first solder mask
The thickness of 2-1 carries out filming processing below the thickness for becoming connecting pad 3.Later, on the surface of the first solder mask 2-1
The second solder mask 2-2 of upper formation carries out filming processing to the second solder mask 2-2 of non-exposed portion after exposition, later,
It is exposed again, development treatment is carried out to the second solder mask 2-2 of remaining non-exposed portion.In the manufacturing method of circuit board
(5) in, with manufacturing method (2) ~ (4) for having used circuit board the case where is identical, is capable of forming the second level with dam construction
The solder mask of construction, the dam construction is for blocking the underfill filled between electronic component and circuit board
Construction.
In process (A1), the first different solder mask 2-1 of thickness is formed in the first face and the second face of circuit substrate 1.
In process (C2), for the first solder mask 2-1 in the second face, to developed region in the process (D1) as rear process
Part in addition is exposed.
In process (B), in the first face, carried out using first solder mask 2-1 of the filming treatment fluid to non-exposed portion thin
Membranization exposes a part of whole connection pads 3 below the thickness for becoming connecting pad 3.In process (B), the
First solder mask 2-1 of the non-exposed portion in two faces is also simultaneously by filming.But first connected on pad 3 with the first face
Solder mask 2-1 is compared, and the first solder mask 2-1 on the connection pad 4 in the second face is thicker, therefore, is remained on connection pad 4
The residue of first solder mask 2-1.
In process (C3), for the first solder mask 2-1 in the first face, to the region portion after the filming in process (B)
Divide and is exposed.
In process (A2), formed on the first solder mask 2-1 in the first face of the circuit substrate for being accomplished to process (C3)
Second solder mask 2-2.
In process (C6), for the second solder mask 2-2 in the first face, to thin in the process (B3) as rear process
Part other than the region of membranization is exposed.
In process (B3), in the first face, using filming treatment fluid to non-exposure in the range of connecting pad 3 and not exposing
The second solder mask 2-2 in light portion carries out filming.In process (B3), the first solder mask 2-1 of the non-exposed portion in the second face
Simultaneously by filming.But exist the case where remaining the residue of the first solder mask 2-1 on connecting pad 4.
In process (C7), for the second solder mask 2-2 in the first face, shown in the process (D1) as rear process
Part other than the region of shadow is exposed.
In process (D1), the second solder mask 2-2 and the second face of the non-exposed portion in the first face are removed using developer solution
Non-exposed portion the first solder mask 2-1, make connect pad 3 a part expose again, while make connect pad 4 a part
Expose.The residue of the first solder mask 2-1 remained on connection pad 4 is removed by process (D1).Loading electronic component
Circuit board in the case where, connected as electronic component with connection using the connection pad 3 exposed in the process (D1)
Pad 3, using connection pad 4 as external connection connection pad 4.
In the manufacturing method (5) of circuit board, it is arbitrary shape, energy that the exposure area of process (C7) can be made, which to change,
The circuit board of section shape shown in such as Figure 12 is enough made by the change of exposure area.In the g of Figure 12, first
The protrusion of the second solder mask 2-2 is formed between the connection pad 3 in face.In the h of Figure 12, expose from the first solder mask 2-1
It connects pad 3 and is alternately arranged by the first solder mask 2-1 and the second solder mask 2-2 conductor wiring 7 coated.
Circuit substrate 1 of the invention has the connection pad 3 and 4 on insulating layer 8 and the surface for being formed in insulating layer 8.?
The surface of insulating layer 8 is formed with conductor wiring 7, and connection pad 3 and 4 is a part of conductor wiring 7.Circuit board of the invention
There is solder mask 2 on the two sides of circuit substrate 1, a part for connecting pad 3 and 4 is exposed from solder mask 2.Loading electronic component
Circuit board in the case where, surface have electronic component connection with connection pad 3, overleaf have external connection connect
Pad 4.The electronic component connection connection pad 3 on surface is engaged with electronic component, by the connection weldering of the external connection at the back side
Disk 4 is engaged with the conductor wiring of external electric substrate.
Such as insulating layer, the conductor of assembly (build-up) are alternately laminated in the insulating substrate for being equipped with conductor wiring
Wiring is to make circuit substrate of the invention.Figure 13 A, B are to show to be alternately laminated in the insulating substrate for being equipped with conductor wiring
The insulating layer of assembly, conductor wiring are come the summary section of an example of the circuit substrate made.As showing this hair
Fig. 4 ~ 8 of the section process chart of one example of the manufacturing method of bright circuit board, as show can using the present invention system
In Fig. 9 ~ 12 of the summary section of one example of the circuit board made, describes with a layer insulating 8 and there is shape
At the circuit substrate 1 of the conductor wiring 7 on the two sides of insulating layer 8, still, as the manufacturing method in circuit board of the invention
Used in circuit substrate 1, comprising as Figure 13 A, B the insulating substrate for being equipped with conductor wiring be alternately laminated assembly use
Insulating layer, conductor wiring come make and two sides have insulating layer 8 and be formed in insulating layer 8 surface conductor wiring 7
Circuit substrate 1.As insulating substrate, such as can enumerate by making the heat cures such as bismaleimide-triazine resin, epoxy resin
Property resin is impregnated in the resin substrate of the compositions such as the electrically insulating material of glass cloth (glass cloth).As the exhausted of assembly
Edge layer, such as the electrically insulating material for making heat-curing resin be impregnated in glass cloth in the same manner as insulating substrate can be enumerated, make dioxy
The inorganic fillers such as SiClx are dispersed in the electrically insulating material etc. of the heat-curing resins such as epoxy resin.Conductor wiring is for example by disappearing
(subtractive) method, half addition (semi-additive) method, addition (additive) method etc. is gone to be formed.In elimination approach
In, for example, forming resist layer after layers of copper is formed on the insulating layer, implement exposure, development, etching, degumming (resist
Stripping), conductor wiring is formed.In semi-additive process, cathode copper is arranged by the plating of non-electrolytic copper on the surface of insulating layer
The foundation metal layer of plating.Then, the plating resist layer with opening corresponding with conductor wiring is formed, exposing is plated in by cathode copper
Foundation metal layer surface formed electrolytic copper plating layer.Later, plating resist layer is removed, is removed using etching (flash etching) is dodged
The foundation metal layer exposed is gone, forms conductor wiring as a result,.
In the case where loading the circuit board of electronic component, the connection pad on the surface of circuit board is to be used for and electronics
The connecting pad of component connection.Electronic component is electrically connected via soldering projection with the connection pad, as a result, circuit board into
The installation of row flip-chip.In order to improve the close property with solder mask, can also rough surface processing be carried out to connection bond pad surface,
Also it is able to carry out coupling agent treatment.The connection pad at the back side of circuit board is the connecting pad for external connection.Via
Soldering projection and be electrically connected the conductor wiring of electric substrate outside the connection pad and motherboard (motherboard) etc., exist as a result,
Motherboard carries out flip-chip installation.
As solder resist of the invention, it is able to use the solder resist of alkali-developable.In addition, being 1 fluidity, 2 fluidities, any
Liquid resist be ok, be also possible to dry film shape resist.Solder resist is for example containing alkali soluble resins, simple function acrylic acid
Monomer, polyfunctional acrylic monomer, photoinitiator, epoxy resin, inorganic filler etc. form.
As alkali soluble resins, the alkali soluble resins of the characteristic with photo-curable and Thermocurable both sides, example can be enumerated
Such as, it can enumerate to making acrylic acid be additional to phenol aldehyde type epoxy resin and 2 grades of hydroxyl of the resin after epoxy acrylic esterification is attached
The resin of acid adding acid anhydride.As polyfunctional acrylic monomer, such as trihydroxymethyl propane triacrylate (Trimethylol can be enumerated
Propane Triacrylate), two-pentaerythrites, six acrylate (Di-pentaerythritol Hexaacrylate),
Pentaerythritol triacrylate (Pentaerythritol Triacrylate) etc..As photoinitiator, 2- methyl-can be enumerated
1-(4- methylphenyl-sulfanyl) -2- morpholine propane -1- ketone (2-Methyl-1-(4-Methylthiophenyl) -2-
Morpholinopropan-1-one) etc..Epoxy resin is used as curing agent.And the carboxylic acid reaction with alkali soluble resins into
Row crosslinking, seeks the raising of heat resistance, the characteristic of resistance to chemical reagents, and still, carboxylic acid and epoxy are reacted at normal temperature,
Therefore, storage stability is poor, alkali-developable solder resist be usually taken using preceding mixing 2 fluidities mode the case where compared with
It is more.As inorganic filler, for example, talcum, tripoli (silica), barium sulfate, titanium oxide, zinc oxide etc. can be enumerated.
Solder mask is formed in a manner of covering whole surface on the two sides of circuit substrate.In the formation of solder mask, for example,
As long as liquid resist is then able to use silk screen print method, rolling method, spray-on process, infusion process, showering (curtain coat)
Method, stick coating method, air knife method, hot melt, gravure coating method, hairbrush coating process, flexographic printing process.In addition, as long as film-form is anti-
Agent is lost, then using lamination (laminate) method, vacuum layer platen press.
By the solder mask 2 of process (A) formation in the manufacturing method (1) of circuit board and (2) and by being routed base
The first solder mask 2-1 that process (A1) in manufacturing method (3) ~ (5) of plate is formed thickness in the two sides of circuit substrate is different,
The thin side of thickness is " the first face ", and a side of thickness thickness is " the second face ".When the two sides of circuit substrate forms solder mask, lead to
Often identical condition is set on two sides.This is derived from solder resist with Thermocurable.In the case where liquid resist, applying
It needs to carry out the heat drying of desolventizing afterwards, therefore, when coating amount is in each surface difference, drying must be changed on each surface
Condition, at that time will not condition as excessive heat-cure however, it is necessary to set.In addition, in the feelings of dry film shape resist
It under condition, needs to heat in lamination, therefore, when using thickness according to the different dry film shape resist in each surface, on each surface
Heating condition when lamination must be changed, it at that time will not condition as excessive heat-cure however, it is necessary to set.It is not
Change like this in thickness, the heat drying condition of solder mask on each surface etc. but makes type, the thickness in the solder mask on two sides
Degree, heat drying condition etc. are that the same terms more can make flow chart simple, are preferred.
In the case where the two sides of circuit substrate forms solder mask with the same terms, the thickness of solder mask is according to comprising each
The density of the surrounding conductor wiring of the connection pad in face changes.For example, in the circuit board for being mounted with electronic component
In, external connection overleaf connects the case where pad is arranged in face formation, connect with the electronic component comprising surface
It is compared with the density of the surrounding conductor wiring of connection pad, the external connection comprising the back side is surrounding with connection pad
The density of conductor wiring becomes larger.As a result, the thickness specific surface of solder mask of the external connection at the back side on connection pad
Electronic component connection is thick with the thickness of the solder mask on connection pad.In this case, surface is the first face, and the back side is second
Face.
It is the resistance comprising making non-exposed portion using filming treatment fluid to the process that solder mask of the invention carries out filming
The micellization that layer ingredient micella (micelle) is changed handles (filming processing), removes liquid removing micella followed by micella
The process that micella removes processing.In turn, it also may include by washing to the filming treatment fluid for not removing most micella, remaining
The drying process of washing process, removing washing water that liquid is rinsed is removed with micella.
Filming processing (micellization processing) be utilize filming treatment fluid micellization non-exposed portion welding resistance composition of layer simultaneously
And make micella processing undissolved for filming treatment fluid.
In filming treatment fluid of the invention, it is able to use alkaline aqueous solution.As can be used as filming treatment fluid
Alkaline aqueous solution, can enumerate: alkali silicate (Alkali Metal Silicate), alkali metal hydroxide (Alkali
Metal Hydroxide), alkali metal phosphate (Alkali Metal Phosphate), alkali carbonate (Alkali
Metal Carbonate), ammonium phosphate, the inorganic alkaline compounds such as ammonium carbonate aqueous solution；Monoethanolamine, diethanol amine,
Triethanolamine, methylamine, dimethylamine, ethamine, diethylamine, triethylamine, cyclohexylamine, tetramethylammonium hydroxide
(Tetramethylammonium Hydroxide, TMAH), tetraethylammonium hydroxide, trimethyl -2- hydroxyethylammoniumhydroxide hydroxide (gallbladder
Alkali, Choline) etc. organic basic compounds aqueous solution.As alkali metal, lithium, sodium, potassium etc. can be enumerated.Above-mentioned inorganic alkaline
Compound and organic basic compound can also be used alone, and can also combine multiple use.Inorganic base can also be combined
Property compound and organic basic compound come using.
In addition, in order to make welding resistance layer surface more uniformly filming, can also be added in filming treatment fluid sulfate,
Sulphite.As sulfate or sulphite, the alkali metal sulfates such as lithium, sodium or potassium or sulphite, magnesium, calcium etc. can be enumerated
Alkaline-earth metal sulfate or sulphite.
It, among those, particularly, can be excellent in order to more uniformly filming surface as filming treatment fluid
Choosing uses the inorganic base comprising selecting from alkali carbonate, alkali metal phosphate, alkali metal hydroxide, alkali silicate
Property compound and from TMAH(tetramethylammonium hydroxide), among the organic basic compound that selects of choline at least any one simultaneously
And the amount of the inorganic alkaline compound and organic basic compound is the filming treatment fluid of 3 ~ 25 mass %.Less than 3 matter
When measuring %, there is a situation where to be easy to happen unevenness in the processing of filming.In addition, easily causing nothing when more than 25 mass %
The precipitation of machine alkali compounds and there is a situation where that stability at any time, the workability of liquid are bad.Alkali compounds contains
Measure more preferable 5 ~ 20 mass %, further preferred 7 ~ 15 mass %.The pH of filming treatment fluid is preferably 10 or more.Moreover it is possible to
Enough it is properly added surfactant, defoaming agent, solvent etc..
In the filming of solder mask, it cannot ignore and be filled out insoluble in the inorganic of filming treatment fluid included in solder mask
Fill the presence of agent.The size of inorganic filler is according to its type, still, have from referred to as nano-filled dose of submicron order to
Big is the size distribution of some tens of pm to a certain degree, is existed in layer with the amount of 30 ~ 70 mass %.Filming is in alkali
Property compound penetration in solder mask after process removed by the micellization and micella of welding resistance composition of layer to carry out, still, by
In the presence of insoluble inorganic filler, there is the infiltration for inhibiting the phenomenon that alkali compounds and filming slows.
Infiltration for the alkali compounds as caused by such inorganic filler hinders, and the pH of filming treatment fluid is excellent
It is selected as 12.5 or more, further preferably 13.0 or more.The pH of filming treatment fluid is higher, welding resistance when alkali compounds permeates
The expansion of layer is bigger, it is difficult to be influenced by obstruction is permeated as caused by inorganic filler.
In the present invention, in the case where exposing a part of connection pad in the first face using filming, the dew
Connection pad out can be used as electronic component connection connection pad.In general, connection bond pad surface utilizes it by rough surface
Anchoring effect improves the close property of connection pad and solder mask, throughout maintaining high insulating reliability for a long time.Previous
During soldering-resistant pattern is formed, when removing solder mask to make to connect bond pad surface exposing, usually by the superior low concentration of dispersibility
Aqueous sodium carbonate be used as developer solution, be nearly free from the residue of solder mask in connection bond pad surface.But when using low dense
When filming of the aqueous sodium carbonate of degree to carry out solder mask, be unable in face equably to carry out filming and in generating surface not
?.
About the temperature of filming treatment fluid, preferably 15 ~ 35 DEG C, and then preferably 20 ~ 30 DEG C.When the temperature is too low,
There is a situation where it is slack-off to the seepage velocity of the alkali compounds of solder mask, when needing long for the desired thickness of filming
Between.On the other hand, when the temperature is excessively high, there are following situations: simultaneously carrying out micella by the micellization with welding resistance composition of layer
Therefore removing process, is not preferred to be easy to happen film thickness unevenness in face.
Using filming treatment fluid filming processing in, be able to use impregnation, stir process, spraying treatment,
The methods of brush (brushing), scrape (scraping), however, it is preferred to impregnation.About the processing other than impregnation
Solder mask table is attached in filming and there is the bubble for being easy to happen bubble and the generation in filming treatment fluid in method
Face and film thickness becomes non-uniform situation.Using spraying treatment etc., preferably make spraying pressure as small as possible, so that not
Gassing.
After using the processing of the filming of filming treatment fluid, removing relative to the thawless resistance of filming treatment fluid
In the micella removing processing of the micella of layer ingredient, liquid is removed by spraying micella to dissolve removing micella at one stroke.
Liquid is removed as micella, is able to use tap water, industrial water, pure water etc..In addition, by that will include from alkali metal
PH5 ~ 10 of at least any one among inorganic alkaline compound that carbonate, alkali metal phosphate, alkali silicate select
Aqueous solution be used as micella remove liquid, to be easy to make the thawless welding resistance composition of layer in filming treatment fluid to disperse again.
In the case where micella removes the pH of liquid less than 5, becomes insoluble mud there are the aggregation of welding resistance composition of layer and be attached to thin
A possibility that welding resistance layer surface after membranization.On the other hand, in the case where the pH that micella removes liquid is more than 10, exist while promoting
Micellization and micella into welding resistance composition of layer remove process and are easy in face film thickness occurs uneven.In addition, micella removes
Liquid is gone to be able to use sulfuric acid, phosphoric acid, hydrochloric acid etc. to adjust pH.
Spraying condition in micella removing processing is illustrated.Spraying condition (temperature, time, spraying pressure) cooperation
The solution rate of the solder mask of filming processing carrys out appropriate adjustment.Specifically, about treatment temperature, preferably 10 ~ 50 DEG C, more preferably
22~50℃.When the temperature of aqueous solution is less than 10 DEG C, exist cause solder mask to be divided into dissolution it is bad and after rough surface
Connect the case where bond pad surface is easy the residue of residual solder mask.On the other hand, when more than 50 DEG C, exist due to aqueous solution
The problem of temperature management evaporate, continuously run, device design on restriction occur rather than preferably.In addition, spray
It is preferred that mist pressure, which preferably uses 0.01 ~ 0.5MPa, more preferably 0.1 ~ 0.3MPa,.The supply stream of liquid is removed about micella
Amount, the preferably every 1cm of solder mask2For 0.030 ~ 1.0L/min, more preferable 0.050 ~ 1.0L/min, further preferred 0.10 ~ 1.0L/
min.When supply flow rate is the range, ingredient will not be dissolved in the solder mask remained on surface after filming, it can be big in face
Cause equably removes micella.In the every 1cm of solder mask2Supply flow rate less than 0.030L/min when, exist residual solder mask not
The case where solvent components.On the other hand, when supply flow rate is more than 1.0L/min, there are the components such as the pump needed to supply
The case where becoming huge and needing large-scale device.In turn, in the case where being more than the supply amount of 1.0L/min, exist to welding resistance
The dissolution of composition of layer, which removes the effect provided, to be changed.
According to manufacturing method (3) ~ (5) of process (A), circuit board in the manufacturing method of circuit board (1) and (2)
In process (A1) and (A2) in be formed in the solder mask 2 in the first face, the first solder mask 2-1, the second solder mask 2-2 thickness with
And manufacturing method (1), the process (B) in (3) ~ (5), the process (B1) in the manufacturing method (2) of circuit board of circuit board
The solder mask 2, first of the non-exposed portion in the first face is hindered in process (B3) in the manufacturing method (5) of (B2), circuit board
The welding resistance around connection pad 3 of the amount to determine the exposing in the first face after layer 2-1, the second solder mask 2-2 progress filming
The solder mask 2 of a part of the thickness and dam blocked as underfill of the 2, first solder mask 2-1 of layer, the first welding resistance
The thickness of layer 2-1, the second solder mask 2-2.In addition, in the present invention, it can be in the range of 0.01 ~ 500 μm suitably freely
Adjust filming amount.From thickness solder mask 2 below, the first surface solder mask 2-1 to exposing for being thinned to connection pad
The amount of solder that the height on connection 3 surface of pad needs after is come appropriate adjustment.In addition, becoming what underfill was blocked
The solder mask 2 of a part of dam, the first solder mask 2-1, size of the thickness according to electronic component of the second solder mask 2-2, electricity
The size of the connection terminal of subassembly, the amount for the underfill filled between electronic component and circuit board carry out appropriate adjustment.
The manufacturing method (6) of circuit board carries out before process (C1) in manufacturing method (1) ~ (4) of circuit board
Process (C2).In addition, the manufacturing method (7) of circuit board carries out process simultaneously in manufacturing method (1) ~ (4) of circuit board
(C1) and process (C2).Like this, in the manufacturing method of circuit board (1) ~ (4), process (C1) and process can also be exchanged
(C2) sequence can also carry out process (C1) and process (C2) simultaneously.
In the process (C1) in the manufacturing method (1) of circuit board, for the solder mask 2 in the first face, to as rear work
By being partially selectively exposed other than the region of filming in the process (B) of sequence.In the manufacturing method (2) of circuit board
In process (C1) in, for the solder mask 2 in the first face, in the process (B1) as rear process by the region of filming with
Outer is partially selectively exposed.In the process (C1) in the manufacturing method (3) of circuit board and (4), for first
The first solder mask 2-1 in face, in the process (B) as rear process by other than the region of filming partially selectively into
Row exposure.In the process (C4) in the manufacturing method (2) of circuit board, for the solder mask 2 in the first face, to as rear work
By being partially selectively exposed other than the region of filming in the process (B2) of sequence.In the manufacturing method of circuit board
(3) in the process (C7) in the manufacturing method (5) of process (C6) and circuit board in, for the second solder mask 2- in the first face
2, to being partially selectively exposed other than developed region in as the process of rear process (D1).In circuit board
Manufacturing method (4) in process (C6) in, for the second solder mask 2-2 in the first face, in the process as rear process
(D2) being partially selectively exposed other than developed region in.Process in the manufacturing method (5) of circuit board
(C6) in, for the second solder mask 2-2 in the first face, other than in as the process of rear process (B3) by the region of filming
Part be exposed.Solder resist after exposure carries out photo polymerization, solder mask 2, the first solder mask 2-1, the second solder mask 2-2
Solidification.In Fig. 4-1 ~ Fig. 8-3, active ray 6 is exposed via photomask 5, but it is also possible in a manner of directly describing
It carries out.As Exposure mode, for example, can enumerate xenon lamp, high-pressure mercury-vapor lamp, Cooper-Hewitt lamp, extra-high-pressure mercury vapour lamp, UV fluorescence
Lamp as light source reflected image Exposure mode, used photomask abutting Exposure mode, close to mode, projection pattern, swash
Optical scanning Exposure mode etc..In the first face, " by the region of filming " is for example comprising on connection pad, between connection pad
Connect the region around pad.More specifically, being the installation region for loading electronic component and its surrounding.
In the process (C2) in the manufacturing method (1) of circuit board and (2), for the solder mask 2 in the second face, to making
For being partially selectively exposed other than region developed in the process (D) of rear process.In the manufacturer of circuit board
In process (C2) in method (4), for the first solder mask 2-1 in the second face, to developed in the process (D) as rear process
Region other than be partially selectively exposed.In the process (C2) in the manufacturing method (3) of circuit board and (5),
For the first solder mask 2-1 in the second face, the part other than developed region in as the process of rear process (D1) is selected
Selecting property it is exposed.Solder resist after exposure carries out photo polymerization, solder mask 2, the first solder mask 2-1 solidification.As exposure
Mode is able to use and the same modes such as process (C1) in the manufacturing method of above-mentioned circuit board (1).In the second face
" developed region " refers to for example comprising the region around the connection pad on connection pad, between connection pad.More specifically,
It is make to connect pad one in order to install and make to be configured to face battle array (Area array) type with the conductor wiring of external electric substrate
The circular opening portion region that part is exposed.
In the process (C3) in the manufacturing method (1) of circuit board, for the solder mask 2 in the first face, at process (B)
Region part after middle filming is exposed.In the process (C3) in manufacturing method (3) ~ (5) of circuit board, for
The first solder mask 2-1 on one side, is exposed the region part after the filming in process (B).In the manufacture of circuit board
In process (C5) in method (2), for the solder mask 2 in the first face, to the region part after the filming in process (B2) into
Row exposure.As Exposure mode, it is able to use same as process (C1) in the manufacturing method of above-mentioned circuit board (1) etc.
Mode.Work in the manufacturing method (2) of process (C3), circuit board in the manufacturing method (1) of circuit board, (3) ~ (5)
After sequence (C5), there is the process (cloth that development removes the solder mask 2 of non-exposed portion, the first solder mask 2-1, the second solder mask 2-2
The process in process (D), the production method (3) and (5) of circuit board in the manufacturing method (1), (2) and (4) of line substrate
(D1), the process (D2) in the production method (4) of circuit board), therefore, it is necessary to expose to the region for ultimately forming solder mask
Light makes solder resist photo polymerization.Preferably, it is exposed in the process (C3) in the manufacturing method of circuit board (1), (3), (4)
The part of light includes at least the region in process (B) after filming, is included in the part exposed in process (C1) and in process
(B) boundary portion in the region in after filming.Moreover it is preferred that the process (C5) in the manufacturing method (2) of circuit board
The part of middle exposure includes at least the region in process (B2) after filming, be included in the part exposed in process (C4) and
The boundary portion in the region in process (B2) after filming.
In the manufacturing method (1) of process (C1), circuit board in manufacturing method (1) ~ (4) of circuit board, (3) ~ (5)
Process (C3), circuit board manufacturing method (1) ~ (5) in process (C2), the work in the manufacturing method (2) of circuit board
Sequence (C4) and (C5), circuit board manufacturing method (3) ~ (5) in process (C6), in the manufacturing method (5) of circuit board
Light exposure in process (C7) is suitably determined according to the luminous sensitivity of solder resist.In more detail, as long as in wiring base
The manufacturing method (1) of plate, the process (B) in (3) ~ (5), the process (B1) in the manufacturing method (2) of circuit board and (B2), cloth
Filming treatment fluid used in process (B3) in the manufacturing method (5) of line substrate or circuit board manufacturing method (1),
(2), the process (D) in (4), the process (D1) in the manufacturing method (3) and (5) of circuit board, the manufacturing method of circuit board
(4) developer solution used in the process (D2) in can make solder resist photo polymerization and be cured as solder resist and not dissolve or do not expand
Degree, usually 100 ~ 600mJ/cm2。
Manufacturing method (1), (3), the process (C3) in (4), the work in the manufacturing method (2) of circuit board of circuit board
Sequence (C4) and (C5), circuit board manufacturing method (5) in process (C3) and process (C7) in exposure preferably with
Non-contact Exposure mode under oxygen environment carries out.As non-contact Exposure mode, can enumerate photomask and circuit board it
Between setting gap come by it is non-contact be exposed in a manner of, projection pattern, without using the direct description mode of photomask.?
Solder mask 2, the first solder mask 2-1, under an oxygen atmosphere non-carried out with the state of no bearing layer film on the second solder mask 2-2
Contact exposure, as a result, the surface layer of each solder mask nearby (depth be 0 ~ 0.5 μm or so) from welding resistance layer surface photo polymerization by
In oxygen influence and be obstructed, become uncured portion, that only leaves from surface layer is site curing.Therefore, pass through circuit board
The manufacture of process (D) in manufacturing method (1), process (B2) and (D), circuit board in the manufacturing method (2) of circuit board
Process (D1) in method (3), the manufacturing method of process (D) and (D2), circuit board in the manufacturing method (4) of circuit board
(5) process (D1) in removes the uncured portion near surface layer, solder mask 2, the first solder mask 2-1, the second solder mask 2-2
Surface carry out rough surface.It is connect with the electronic component on the surface in circuit board with the solder mask around connection pad
Surface is that smooth situation is compared, and the close property of situation and underfill after rough surface is more strong, as a result, can
It prevents due to thermal shock and stress concentrates on the interconnecting piece of electronic component and circuit board, connection reliability is higher.By in oxygen
Cordless exposure under environment, the surface progress rough surface of solder mask 2, the first solder mask 2-1, the second solder mask 2-2,
It is improved as a result, with the close property of underfill, obtains high connection reliability.It is excellent with the close property of underfill to improving
The surface roughness Ra of the solder mask of choosing is 0.30 μm or more 0.50 μm or less.When surface roughness Ra is more than 0.50 μm, deposit
The case where the intensity of solder resist is lower and is unable to get insulating reliability.Surface roughness Ra is that arithmetical average surface is coarse
Degree.
Manufacturing method (1), (3), the process (C3) in (4), the work in the manufacturing method (2) of circuit board of circuit board
Light exposure in sequence (C4) and (C5) is preferably 1 times or more 5 times of the light exposure in process (C1) hereinafter, further preferably
1.5 times or more 3 times or less.Similarly, the light exposure in the process (C3) and process (C7) in the manufacturing method (5) of circuit board
1 times or more 5 times of light exposure preferably in process (C6) are hereinafter, further preferably 1.5 times or more 3 times or less.In oxygen ring
In non-contact exposure under border, it is cured to light exposure required for insoluble or non-bloating degree relative to solder resist, is provided
More light exposures, thereby, it is possible to hinder to be suppressed to need minimum limit by polymerization caused by the oxygen on the surface as solder mask.It exposes
Light quantity is more, and the inhibition hindered polymerization is more effective, still, on the other hand, when light exposure is excessive, the resolution of solder resist
Not only deteriorate, but also the time for exposure is too long, therefore, not preferably.
In the manufacturing method (2) of process (B), circuit board in the manufacturing method (1) of circuit board, (3) ~ (5)
In process (B2), in the first face, solder mask 2, the first solder mask 2-1 filming of non-exposed portion are made by filming treatment fluid
Expose a part for connecting pad 3 below the thickness for becoming connecting pad 3.In the manufacturing method (2) of circuit board
In process (B1), in the process (B3) in the manufacturing method (5) of circuit board, in the first face, existed using filming treatment fluid
Connection pad 3 makes solder mask 2, the second solder mask 2-2 filming of non-exposed portion in the range of not exposing.Anti- using film-form
Erosion agent come be provided with bearing layer film in the case where, peel bearing layer film after carry out filming.
In the manufacturing method (2) of process (B), circuit board in the manufacturing method (1) of circuit board, (3) ~ (5)
In process (B2), the thickness of solder mask 2, the first solder mask 2-1 after filming carries out filming until the exposing with the first face
Connection pad 3 thickness it is identical or thinner than its.When the thickness of solder mask 2, the first solder mask 2-1 after filming is excessively thin,
There is a situation where that the electrical isolation between the connection pad 3 of exposing is insufficient and the short circuit of non-electrolytic ni au plating occurs, in connection pad
There is a situation where the short circuits due to solder between 3.Therefore, the solder mask 2 after filming, the first solder mask 2-1 thickness be preferably
More than the one third for connecting the thickness of pad 3, more preferably 2/3rds or more be good.
Process (B1) in the manufacturing method (2) of process (B), circuit board in the manufacturing method (1) of circuit board
In (B2), when the non-exposed portion to the first face solder mask 2 carry out filming when, also simultaneously the second face of filming it is non-exposed
The solder mask 2 in portion.In the process (B) in manufacturing method (3) ~ (5) of circuit board, when of the non-exposed portion to the first face
One solder mask 2-1 carry out filming when, also simultaneously the second face of filming non-exposed portion the first solder mask 2-1.In wiring base
In process (B3) in the manufacturing method (5) of plate, when the second solder mask 2-2 of the non-exposed portion to the first face carries out filming
When, also simultaneously the second face of filming non-exposed portion the first solder mask 2-1.The filming amount in the second face is according in the second face
The solder mask 2 of non-exposed portion, the heat cure state of the first solder mask 2-1 and it is different, still, on two sides with identical heating condition
In the case where forming solder mask 2, the first solder mask 2-1, in general, same amount of first face of filming and the second face at the same time
The solder mask 2 of non-exposed portion, the first solder mask 2-1.
In the manufacturing method (2) of process (B), circuit board in the manufacturing method (1) of circuit board, (3) ~ (5)
Process (B1) and (B2), circuit board manufacturing method (5) in process (B3) in, it is preferred that with the first face be up into
The processing of row filming.As the processing mode of filming processing, due to being difficult to generate bubble in filming treatment fluid, so leaching
Stain processing is effective.Just in case in the case where producing bubble in filming treatment fluid, bubble floats in filming treatment fluid
Out, solder mask 2, first surface solder mask 2-1 in lower surface (the second face) are attached to.Due to the attachment of the bubble, exist
Film thickness after the filming in two faces becomes non-uniform situation.But in the manufacturing method of the circuit board as rear process
(1), the manufacture of (2), the process (D) in (4), process (D1), circuit board in the manufacturing method (3) and (5) of circuit board
In process (D2) in method (4), the solder mask 2 of the non-exposed portion in the second face, the first developed removing of solder mask 2-1, therefore,
Final film thickness unevenness will not become problem.
In the process (D) in the manufacturing method (1) of circuit board and (2), the non-exposure in the second face is removed using development
The solder mask 2 in light portion.In the process (D) in the manufacturing method (4) of circuit board, the non-exposure in the second face is removed using development
The first solder mask 2-1 in light portion.In the process (D1) in the manufacturing method (3) of circuit board and (5), removed using development
First solder mask 2-1 of the non-exposed portion of the second solder mask 2-2 and the second face of the non-exposed portion in the first face.In circuit board
In process (D2) in manufacturing method (4), the second solder mask 2-2 of the non-exposed portion in the first face is removed using development.As
Developing method removes each welding resistance using the developer solution balanced with the solder resist used come the two sides spraying to circuit substrate
The unwanted part of layer.In developer solution, using thin alkaline aqueous solution, usually using the sodium carbonate of 0.3 ~ 3 mass %
Solution, wet chemical.
Embodiment
Hereinafter, illustrating the present invention in further detail using embodiment, still, the present invention is not limited to the implementations
Example.
Embodiment 1 ~ 6 is the example of the manufacturing method (1) of the circuit board shown in Fig. 4-1 and Fig. 4-2.
(embodiment 1)
<process (A)>
Be produced on using semi-additive process two sides be formed with conductor wiring 7 circuit substrate 1(area 170mm × 200mm,
15 μm of conductor thickness, substrate thickness 0.4mm).Electronic component connection connection pad 3 is existed that serve as in surface (the first face) side
25 μm of line width, the conductor wiring for being spaced 50 μm.Overleaf (the second face) side is formed with as external connection connection pad 4
The conductor wiring for the circular shape that 600 μm of diameter.Then, using vacuum lamination by 25 μm of thickness of solder mask film (sun ink system
Make (share) system, trade name: PFR-800 AUS410) vacuum hotpressing is connected to the two sides (laminating temperature 75 of foregoing circuit substrate 1
DEG C, pull up time 30 seconds, 10 seconds pressing times).Solder mask 2 is formd as a result,.In the solder mask 2 in the first face, from insulating layer
8 surfaces with a thickness of 30 μm, electronic component connection on connection pad 3 with a thickness of 15 μm.In the solder mask 2 in the second face,
From insulating layer 8 surface with a thickness of 38 μm, external connection on connection pad 4 with a thickness of 23 μm.In the density of conductor wiring
Smaller first face, compared with the second bigger face of the density of conductor wiring, the thickness of solder mask 2 is 8 μm thin.
<process (C1)>
For the solder mask 2 in the first face, 200 μ are left using to from the connection of multiple electronic components with the end of connection pad 3
The photomask 5 of pattern as the area illumination active ray 6 in the outside of the periphery of m, with light exposure 200mJ/cm2It has carried out tight
Patch exposure.
<process (C2)>
For the solder mask 2 in the second face, in order to be opened in external connection with the circle of 500 μm of diameter of setting on connection pad 4
Mouth area, using to circular open portion region with the photomask 5 of pattern as external exposure active ray 6, with light exposure
200mJ/cm2Carry out abutting exposure.
<process (B)>
After the bearing layer film on the solder mask 2 in the first face of having removed and the second face, by the sodium metasilicate of 10 mass %
Aqueous solution (25 DEG C of liquid temperature) is used as filming treatment fluid, is that above circuit substrate 1 is immersed in filming treatment fluid with the first face
Carry out micellization processing (filming processing) within 50 seconds.Later, the spraying glue that liquid (25 DEG C of liquid temperature) is removed using micella is carried out
Beam removing processing, washing process (25 DEG C of liquid temperature) and drying process carry out filming, Zhi Dao to average 20 μm of solder masks 2
The thickness of the solder mask 2 of non-exposed portion on one side becomes lower 5.0 μm of the surface of electronic component connection connection pad 3.It is using up
When microscope is observed, unevenness is not handled on the surface of the solder mask 2 in the first face, has been obtained in good face uniformly
Property.On the other hand, in the second face, filming, still, the gas in filming treatment fluid also are carried out to average 20 μm of solder mask 2
Bubble is attached to the solder mask 2 of the non-exposed portion in the second face, and there are in place of membrane thickness unevenness.In addition, in external connection connection weldering
Remain the residue of about 3 μm of solder mask 2 on disk 4.
<process (C3)>
For the solder mask 2 in the first face, using to the region part after the filming in process (B) and from the filming
The photomask 5 of pattern as area illumination active ray 6 of the boundary portion in region afterwards to 200 μm of outsides, by oxygen ring
Non-contact exposure under border, with light exposure 400mJ/cm2It is exposed.
<process (D)>
Develop within 30 seconds using (30 DEG C of liquid temperature, spraying pressure 0.15MPa) of aqueous sodium carbonate of 1 mass %, eliminate
The solder mask 2 of the non-exposed portion in the second face.With optical microscopy observation as a result, in the first face and the second face, in the ministry of electronics industry
Part connection connection pad 3 and the external connection residue for all not finding solder mask 2 on connection pad 4.In addition, in the first face,
It is connected in electronic component and is filled with solder mask 2 until under the surface that electronic component is connected with connection pad 3 between connection pad 3
5.5µm.Pass through the non-contact exposure under an oxygen atmosphere in process (C3), welding resistance of the electronic component connection between connection pad 3
The photo polymerization on 2 surface of layer is suppressed, as a result, the thickness of solder mask 2 reduces 0.5 μm.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm of thickness of solder mask 2, the electronic component that 15 μm of thickness connects
It connects and is exposed with connection pad 3, in the adjacent electronic component connection solder mask 2 for being filled with 9.5 μm of thickness between connection pad 3.
In addition, being formed with 38 μm of thickness, diameter 500 with a part on connection pad 4 in 15 μm of thickness of external connections in the second face
μm solder mask 2 circular open portion, external connection with connection pad 4 a part expose.
Then, the surface roughness of adjacent solder mask 2 of the electronic component connection between connection pad 3 is measured.It is using
Ultra-deep measuring shape microscope (joint-stock company's Keyemce (KEYENCE) system, production number " VK-8500 ") measures rough surface
When spending, surface roughness Ra is 0.40 μm.
Utilize ultra-deep measuring shape microscope (joint-stock company's Keyemce (KEYENCE) system, production number " VK-8500 ")
Arithmetic mean surface roughness Ra is used according to JIS B0601-1994 surface roughness-definition calculating formula.Further more, measurement
Region is 900 μm2, datum length is 40 μm.
(embodiment 2)
Work is implemented by method same as Example 1 other than the sequence for having exchanged process (C1) and process (C2)
Sequence (A) ~ process (D).With optical microscopy observation as a result, in the first face and the second face, connect in electronic component with connection
Pad 3 and the external connection residue for all not finding solder mask 2 on connection pad 4.In addition, in addition, in the first face, in the ministry of electronics industry
Part connection is filled with solder mask 2 until electronic component is connected with lower 5.5 μm of surface for connecting pad 3 between using connection pad 3.Pass through
Non-contact exposure under an oxygen atmosphere in process (C3), the light on solder mask 2 surface of the electronic component connection between connection pad 3
Polymerization is caused to be suppressed, as a result, the thickness of solder mask 2 reduces 0.5 μm.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm of thickness of solder mask 2, the electronic component that 15 μm of thickness connects
It connects and is exposed with connection pad 3, in the adjacent electronic component connection solder mask 2 for being filled with 9.5 μm of thickness between connection pad 3.
In addition, being formed with 38 μm of thickness, diameter 500 with a part on connection pad 4 in 15 μm of thickness of external connections in the second face
μm solder mask 2 circular open portion, external connection with connection pad 4 a part expose.
Then, in the surface roughness of solder mask 2 of the measurement adjacent electronic component connection between connection pad 3, table
Surface roughness Ra is 0.40 μm.
(embodiment 3)
By in addition to making the light exposure 200mJ/cm in process (C3)2Method same as Example 1 implements in addition
Process (A) ~ process (D).With optical microscopy observation as a result, in the first face and the second face, connect in electronic component with company
Pad 3 and external connection are connect with the residue for all not finding solder mask 2 on connection pad 4.In the first face, connects and use in electronic component
Filled with solder mask 2 until electronic component connects lower 6.0 μm of the surface with connection pad 3 between connection pad 3.Pass through process (C3)
In non-contact exposure under an oxygen atmosphere, electronic component connection with connection pad 3 between 2 surface of solder mask photo polymerization quilt
Inhibit, as a result, the thickness of solder mask 2 reduces 1.0 μm.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm of thickness of solder mask 2, the electronic component that 15 μm of thickness connects
It connects and is exposed with connection pad 3, in the adjacent electronic component connection solder mask 2 for being filled with 9.0 μm of thickness between connection pad 3.
In addition, being formed with 38 μm of thickness, diameter 500 with a part on connection pad 4 in 15 μm of thickness of external connections in the second face
μm solder mask 2 circular open portion, external connection with connection pad 4 a part expose.
Then, in the surface roughness of solder mask 2 of the measurement adjacent electronic component connection between connection pad 3, table
Surface roughness Ra is 0.50 μm.
(embodiment 4)
By in addition to making the light exposure 1000mJ/cm in process (C3)2Method same as Example 1 implements in addition
Process (A) ~ process (D).With optical microscopy observation as a result, in the first face and the second face, connect in electronic component with company
Pad 3 and external connection are connect with the residue for all not finding solder mask 2 on connection pad 4.In addition, in the first face, in electronic component
Connection is filled with solder mask 2 until electronic component is connected with lower 5.0 μm of surface for connecting pad 3 between using connection pad 3.It is unconfirmed
The film reduction amount of the solder mask 2 in the first face caused by being hindered as the polymerization of the oxygen in process (C3).
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm of thickness of solder mask 2, the electronic component that 15 μm of thickness connects
It connects and is exposed with connection pad 3, in the adjacent electronic component connection solder mask 2 for being filled with 10.0 μm of thickness between connection pad 3.
In addition, being formed with 38 μm of thickness, diameter 500 with a part on connection pad 4 in 15 μm of thickness of external connections in the second face
μm solder mask 2 circular open portion, external connection with connection pad 4 a part expose.
Then, in the surface roughness of solder mask 2 of the measurement adjacent electronic component connection between connection pad 3, table
Surface roughness Ra is 0.30 μm.
(embodiment 5)
By the way that in addition to using direct drawing apparatus under an oxygen atmosphere, (trade name: LI-8500, big Japanese screen manufacture public
Department's system) with light exposure 400mJ/cm2It carries out method same as Example 1 other than the exposure in process (C3) and implements process
(A) ~ process (D).With optical microscopy observation as a result, in the first face and the second face, connect in electronic component with connection weldering
Disk 3 and the external connection residue for all not finding solder mask 2 on connection pad 4.In addition, being connected in the first face in electronic component
With connection pad 3 between filled with solder mask 2 until electronic component connect with connection pad 3 lower 5.5 μm of surface.Pass through process
(C3) the non-contact exposure under an oxygen atmosphere in, electronic component connection are gathered with the photic of 2 surface of solder mask between connection pad 3
It closes and is suppressed, as a result, the thickness of solder mask 2 reduces 0.5 μm.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm of thickness of solder mask 2, the electronic component that 15 μm of thickness connects
It connects and is exposed with connection pad 3, in the adjacent electronic component connection solder mask 2 for being filled with 9.5 μm of thickness between connection pad 3.
In addition, being formed with 38 μm of thickness, diameter 500 with a part on connection pad 4 in 15 μm of thickness of external connections in the second face
μm solder mask 2 circular open portion, external connection with connection pad 4 a part expose.
Then, in the surface roughness of solder mask 2 of the measurement adjacent electronic component connection between connection pad 3, table
Surface roughness Ra is 0.40 μm.
(embodiment 6)
It is real by method same as Example 1 other than being exposed in process (C3) with abutting Exposure mode
Process (A) ~ process (D) is applied.With optical microscopy observation as a result, in the first face and the second face, connected in electronic component
With connection pad 3 and the external connection residue for all not finding solder mask 2 on connection pad 4.In addition, in the first face, in electronics
Component connection is filled with solder mask 2 until electronic component is connected with lower 5.0 μm of surface for connecting pad 3 between using connection pad 3.?
In process (C3), extraction air when sufficiently carrying out being close to exposure and is exposed under non-oxygen environment, therefore, solder mask
2 surfaces are not by rough surface, as a result, the thickness of solder mask 2 is not reduced.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm of thickness of solder mask 2, the electronic component that 15 μm of thickness connects
It connects and is exposed with connection pad 3, in the adjacent electronic component connection solder mask 2 for being filled with 10 μm of thickness between connection pad 3.This
Outside, in the second face, 38 μm of thickness, 500 μm of diameter are formed with a part on connection pad 4 in 15 μm of thickness of external connections
Solder mask 2 circular open portion, conductor pad 4 expose.
Then, in the surface roughness of solder mask 2 of the measurement adjacent electronic component connection between connection pad 3, table
Surface roughness Ra is 0.10 μm.
In embodiment 1 ~ 6, in adjacent electronic component connection with there are the solder masks of sufficient thickness between connection pad 3
2, therefore, it is reliably prevented from and causes the electric short circuit as caused by solder when installing electronic component.In addition, in external connection
With the residue that solder mask 2 is not present on connection pad 4, therefore, can be produced on when being installed on external electric substrate will not occur
The circuit board for the undesirable high reliablity that is electrically insulated.When being compared to embodiment 1 ~ 6, it connect in electronic component with connection
The surface of solder mask 2 between pad 3 is that the circuit board manufactured in smooth embodiment 6 is compared, and is manufactured in embodiment 1 ~ 5
The close property of circuit board and underfill is higher, and connection reliability is more superior.
(comparative example 1)
<process (A)>
Be produced on using semi-additive process two sides be formed with conductor wiring 7 circuit substrate 1(area 170mm × 200mm,
15 μm of conductor thickness, substrate thickness 0.4mm).The line of electronic component connection connection pad 3 is existed that serve as in surface (the first face)
25 μm of width, the conductor wiring for being spaced 50 μm.Overleaf (the second face) is formed with the diameter as external connection connection pad 4
The conductor wiring of 600 μm of circular shape.Then, using vacuum lamination, by 25 μm of thickness of solder mask film, (sun ink is manufactured
(share) system, trade name: PFR-800 AUS410) vacuum hotpressing be connected to foregoing circuit substrate 1 two sides (75 DEG C of laminating temperature,
Pull up time 30 seconds, 10 seconds pressing times).Solder mask 2 is formd as a result,.In the solder mask 2 in the first face, from 8 table of insulating layer
Face with a thickness of 30 μm, electronic component connection on connection pad 3 with a thickness of 15 μm.In the solder mask 2 in the second face, from exhausted
8 surface of edge layer with a thickness of 38 μm, external connection on connection pad 4 with a thickness of 23 μm.It is smaller in the density of conductor wiring
The first face, compared with the second bigger face of the density of conductor wiring, the thickness of solder mask 2 is 8 μm thin.
<process (C1)>
For the solder mask 2 in the first face, 200 μ are left using to from the connection of multiple electronic components with the end of connection pad 3
The photomask 5 of pattern as the area illumination active ray 6 in the outside of the periphery of m, with light exposure 200mJ/cm2It has carried out tight
Patch exposure.
<process (C2)>
For the solder mask 2 in the second face, in order to be opened in external connection with the circle of 500 μm of diameter of setting on connection pad 4
Mouth area, using to circular open portion region with the photomask 5 of pattern as external exposure active ray 6, with light exposure
200mJ/cm2Carry out abutting exposure.
<process (B)>
After the bearing layer film on the solder mask 2 in the first face of having removed and the second face, by the sodium metasilicate of 10 mass %
Aqueous solution (25 DEG C of liquid temperature) is used as filming treatment fluid, is that above circuit substrate 1 is immersed in filming treatment fluid with the first face
Carry out micellization processing (filming processing) within 50 seconds.Later, the spraying glue that liquid (25 DEG C of liquid temperature) is removed using micella is carried out
Beam removing processing, washing process (25 DEG C of liquid temperature) and drying process carry out filming, Zhi Dao to average 20 μm of solder masks 2
The thickness of the solder mask 2 of non-exposed portion on one side becomes lower 5.0 μm of the surface of electronic component connection connection pad 3.It is using up
When microscope is observed, unevenness is not handled on the surface of the solder mask 2 in the first face, has been obtained in good face uniformly
Property.On the other hand, the solder mask 2 in the second face also carries out average 20 μm of filmings, still, the bubble attachment in filming treatment fluid
In the solder mask 2 of the non-exposed portion in the second face, there are in place of membrane thickness unevenness.In addition, residual on pad 4 with connecting in external connection
There are the residues of about 3 μm of solder mask 2.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm of thickness of solder mask 2, the electronic component that 15 μm of thickness connects
It connects and is exposed with connection pad 3, in the adjacent electronic component connection solder mask 2 for being filled with 10.0 μm of thickness between connection pad 3.
In addition, being formed with 38 μm of thickness, diameter 500 with a part on connection pad 4 in 15 μm of thickness of external connections in the second face
μm the circular open portion of solder mask 2 still remain 3 μm of thickness of solder mask 2 on external connection connection pad 4
Residue.
When installing electronic component, in adjacent electronic component connection with there are the resistances of sufficient thickness between connection pad 3
Layer 2 is reliably prevented from the electric short circuit as caused by solder, still, when being installed on external electric substrate, due in outside
The residue with remaining solder mask 2 on connection pad 4 is connected, it is bad that electrical isolation has occurred in soldering projection connection.
In the surface roughness of solder mask 2 of the measurement adjacent electronic component connection between connection pad 3, rough surface
Spending Ra is 0.03 μm.It with connecting in electronic component with the surface of the solder mask 2 between connection pad 3 is made in smooth comparative example 1
The circuit board made is compared, and the close property of the circuit board and underfill that manufacture in embodiment 1 ~ 5 is higher, and connection is reliable
Property is more superior.
Embodiment 7 ~ 11 is the example of the manufacturing method (2) of the circuit board shown in Fig. 5-1, Fig. 5-2 and Fig. 5-3.
(embodiment 7)
<process (A)>
Be produced on using semi-additive process two sides be formed with conductor wiring 7 circuit substrate 1(area 170mm × 200mm,
15 μm of conductor thickness, substrate thickness 0.4mm).The line of electronic component connection connection pad 3 is existed that serve as in surface (the first face)
25 μm of width, the conductor wiring for being spaced 50 μm.Overleaf (the second face) is formed with the diameter as external connection connection pad 4
The conductor wiring of 600 μm of circular shape.Then, using vacuum lamination, by 25 μm of thickness of solder mask film, (sun ink is manufactured
(share) system, trade name: PFR-800 AUS410) vacuum hotpressing be connected to foregoing circuit substrate 1 two sides (75 DEG C of laminating temperature,
Pull up time 30 seconds, 10 seconds pressing times).Solder mask 2 is formd as a result,.In the solder mask 2 in the first face, from 8 table of insulating layer
Face with a thickness of 30 μm, electronic component connection on connection pad 3 with a thickness of 15 μm.In the solder mask 2 in the second face, from exhausted
8 surface of edge layer with a thickness of 38 μm, external connection on connection pad 4 with a thickness of 23 μm.It is smaller in the density of conductor wiring
The first face, compared with the second bigger face of the density of conductor wiring, the thickness of solder mask 2 is 8 μm thin.
<process (C1)>
For the solder mask 2 in the first face, 400 μ are left using to from the connection of multiple electronic components with the end of connection pad 3
The photomask 5 of pattern as the area illumination active ray 6 in the outside of the periphery of m, with light exposure 200mJ/cm2It has carried out tight
Patch exposure.
<process (C2)>
For the solder mask 2 in the second face, in order to be opened in external connection with the circle of 500 μm of diameter of setting on connection pad 4
Mouth area, using to circular open portion region with the photomask 5 of pattern as external exposure active ray 6, with light exposure
200mJ/cm2Carry out abutting exposure.
<process (B1)>
After the bearing layer film on the solder mask 2 in the first face of having removed and the second face, by the sodium metasilicate of 10 mass %
Aqueous solution (25 DEG C of liquid temperature) is used as filming treatment fluid, is that above circuit substrate 1 is immersed in filming treatment fluid with the first face
Carry out micellization processing (filming processing) within 25 seconds.Later, the spraying glue that liquid (25 DEG C of liquid temperature) is removed using micella is carried out
Beam removing processing, washing process (25 DEG C of liquid temperature) and drying process carry out filming, Zhi Dao to average 10 μm of solder masks 2
The thickness of the solder mask 2 of non-exposed portion on one side becomes lower 5.0 μm of the surface of electronic component connection connection pad 3.It is using up
When microscope is observed, unevenness is not handled on the surface of the solder mask 2 in the first face, has been obtained in good face uniformly
Property.On the other hand, in the second face, filming, still, the gas in filming treatment fluid also are carried out to average 10 μm of solder mask 2
Bubble is attached to the solder mask 2 of the non-exposed portion in the second face, and there are in place of membrane thickness unevenness.In addition, in external connection connection weldering
Remain the residue of about 13 μm of solder mask 2 on disk 4.
<process (C4)>
For the solder mask 2 in the first face, 200 μ are left using to from the connection of multiple electronic components with the end of connection pad 3
The photomask 5 of pattern as the area illumination active ray 6 in the outside of the periphery of m passes through non-contact exposure under an oxygen atmosphere
Light, with light exposure 400mJ/cm2It is exposed.
<process (B2)>
The sodium metasilicate aqueous solution (25 DEG C of liquid temperature) of 10 mass % is used as filming treatment fluid, being with the first face above will be electric
Base board 1 is immersed in filming treatment fluid 25 seconds to carry out micellization processing (filming processing).Later, it carries out utilizing micella
Spraying micella removing processing, washing process (25 DEG C of liquid temperature) and the drying process for removing liquid (25 DEG C of liquid temperature), to 10 μm average
Solder mask 2 carry out filming, until the thickness of the solder mask 2 of the non-exposed portion in the first face become electronic component connection with connection
Lower 5.0 μm of the surface of pad 3.When being observed with optical microscopy, do not handled not on the surface of the solder mask 2 in the first face
, good inner evenness has been obtained.By the non-contact exposure under an oxygen atmosphere in process (C4), from self-configuring
The resistance in the region of 200 μm of the outer periphery for thoughtfully leaving 400 μm is left in electronic component connection on one side with the end of connection pad 3
The photo polymerization on 2 surface of layer is suppressed, as a result, the thickness of solder mask 2 reduces 0.5 μm.On the other hand, second face
Solder mask 2 also carries out average 10 μm of filmings, and still, the bubble in filming treatment fluid is attached to the non-exposed portion in the second face
Solder mask 2, there are in place of membrane thickness unevenness.In addition, remaining the residual of about 3 μm of solder mask 2 in external connection connection pad 4
Slag.
<process (C5)>
For the solder mask 2 in the first face, using to the region part after the filming in process (B2) and from the film
The photomask 5 of pattern as area illumination active ray 6 of the boundary portion in the region after change to 200 μm of outsides, by oxygen
Non-contact exposure under environment, with light exposure 400mJ/cm2It is exposed.
<process (D)>
Develop within 30 seconds using (30 DEG C of liquid temperature, spraying pressure 0.15MPa) of aqueous sodium carbonate of 1 mass %, eliminate
The solder mask 2 of the non-exposed portion in the second face.With optical microscopy observation as a result, in the first face and the second face, in the ministry of electronics industry
Part connection connection pad 3 and the external connection residue for all not finding solder mask 2 on connection pad 4.In addition, in the first face,
It is connected in electronic component and is filled with solder mask 2 until under the surface that electronic component is connected with connection pad 3 between connection pad 3
5.5µm.By the non-contact exposure under an oxygen atmosphere in process (C4) and (C5), in the first face, by process (C1)
The photo polymerization for being close to 2 surface of solder mask other than region of the exposure to irradiate active ray 6 is suppressed, as a result, welding resistance
The thickness of layer 2 reduces 0.5 μm.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm and 19.5 μm of thickness of solder mask 2, forms and be equivalent to
10.5 μm of thickness of underfill of its step difference, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection connection
Pad 3 exposes, in the adjacent electronic component connection solder mask 2 for being filled with 9.5 μm of thickness between connection pad 3.In addition,
Two faces are formed with the welding resistance of 38 μm of thickness, 500 μm of diameter in 15 μm of thickness of external connections with a part on connection pad 4
The circular open portion of layer 2, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The rough surface of 200 μm of periphery and 19.5 μm of thickness of the solder mask 2 from the region between the periphery that the end leaves 400 μm
When spending, surface roughness Ra is 0.40 μm.In addition, the electronic component connection solder mask 2 connection pad 3 between adjacent in measurement
Surface roughness when, surface roughness Ra be 0.40 μm.
(embodiment 8)
Work is implemented by method same as Example 7 other than the sequence for having exchanged process (C1) and process (C2)
Sequence (A) ~ process (D).With optical microscopy observation as a result, in the first face and the second face, connect in electronic component with connection
Pad 3 and the external connection residue for all not finding solder mask 2 on connection pad 4.In addition, filled with solder mask 2 until configuration
5.5 μm under the surface of the electronic component connection connection pad 3 in the first face.By in process (C4) and (C5) in oxygen environment
Under non-contact exposure pass through the resistance other than region of the abutting exposure to irradiate active ray 6 in process (C1) in the first face
The photo polymerization on 2 surface of layer is suppressed, as a result, the thickness of solder mask 2 reduces 0.5 μm.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure, then, heat cure is handled during being implemented 60 minutes with 150 DEG C, has obtained circuit board.The knot observed with optical microscopy
Fruit is, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm and 19.5 μm of thickness of solder mask 2, forms quite
It is blocked in 10.5 μm of thickness of underfill of its step difference and uses dam.In addition, 15 μm of thickness of electronic component connection company
The exposing of pad 3 is connect, in the adjacent electronic component connection solder mask 2 for being filled with 9.5 μm of thickness between connection pad 3.In addition,
Second face is formed with the resistance of 38 μm of thickness, 500 μm of diameter in 15 μm of thickness of external connections with a part on connection pad 4
The circular open portion of layer 2, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The rough surface of 200 μm of periphery and 19.5 μm of thickness of the solder mask 2 from the region between the periphery that the end leaves 400 μm
When spending, surface roughness Ra is 0.40 μm.In addition, the electronic component connection solder mask 2 connection pad 3 between adjacent in measurement
Surface roughness when, surface roughness Ra be 0.40 μm.
(embodiment 9)
By in addition to making the light exposure 200mJ/cm in process (C4) and (C5)2Method same as Example 7 in addition
Implement process (A) ~ process (D).With optical microscopy observation as a result, in the first face and the second face, connect in electronic component
It connects with connection pad 3 and the external connection residue for all not finding solder mask 2 on connection pad 4.In addition, it is filled with solder mask 2,
Until 6.0 μm under the surface for the electronic component connection connection pad 3 configured in the first face.By in process (C4) and (C5)
Non-contact exposure under an oxygen atmosphere irradiates the region of active ray 6 by the abutting exposure in process (C1) in the first face
The photo polymerization on 2 surface of solder mask in addition is suppressed, as a result, the thickness of solder mask 2 reduces 1.0 μm.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm and 19 μm of thickness of solder mask 2, forms and be equivalent to it
11 μm of thickness of underfill of step difference, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection connection pad 3
Expose, in the adjacent electronic component connection solder mask 2 for being filled with 9.0 μm of thickness between connection pad 3.In addition, in the second face,
The solder mask 2 of 38 μm of thickness, 500 μm of diameter is formed with a part on connection pad 4 in 15 μm of thickness of external connections
Circular open portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface roughness of 200 μm of periphery and 19 μm of thickness of the solder mask 2 from the region between the periphery that the end leaves 400 μm
When, surface roughness Ra is 0.50 μm.In addition, the electronic component connection solder mask 2 connection pad 3 between adjacent in measurement
When surface roughness, surface roughness Ra is 0.50 μm.
(embodiment 10)
By in addition to making the light exposure 1000mJ/cm in process (C4) and (C5)2Method same as Example 6 in addition
Implement process (A) ~ process (D).With optical microscopy observation as a result, in the first face and the second face, connect in electronic component
It connects with connection pad 3 and the external connection residue for all not finding solder mask 2 on connection pad 4.In addition, it is filled with solder mask 2,
Until being confirmed by process (C4) and process 5.0 μm under the surface for the electronic component connection connection pad 3 configured in the first face
(C5) the film reduction amount of the solder mask 2 in the first face caused by the polymerization of the oxygen in hinders.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm and 20 μm of thickness of solder mask 2, forms and be equivalent to it
10 μm of thickness of underfill of step difference, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection connection pad 3
Expose, in the adjacent electronic component connection solder mask 2 for being filled with 10.0 μm of thickness between connection pad 3.In addition, second
Face is formed with the solder mask 2 of 38 μm of thickness, 500 μm of diameter in 15 μm of thickness of external connections with a part on connection pad 4
Circular open portion, external connection with connection pad 4 a part expose.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface roughness of 200 μm of periphery and 20 μm of thickness of the solder mask 2 from the region between the periphery that the end leaves 400 μm
When, surface roughness Ra is 0.30 μm.In addition, the electronic component connection solder mask 2 connection pad 3 between adjacent in measurement
When surface roughness, surface roughness Ra is 0.30 μm.
(embodiment 11)
By same as Example 7 other than being exposed in process (C4) and (C5) with abutting Exposure mode
Method implements process (A) ~ process (D).With optical microscopy observation as a result, in the first face and the second face, in the ministry of electronics industry
Part connection connection pad 3 and the external connection residue for all not finding solder mask 2 on connection pad 4.In addition, in the first face,
It is connected in electronic component and is filled with solder mask 2 between connection pad 3, until under the surface that electronic component is connected with connection pad 3
5.0µm.In process (C4) and (C5), extraction air when sufficiently carrying out being close to exposure and is exposed under non-oxygen environment
Light, therefore, 2 surface of solder mask is not by rough surface, as a result, the thickness of solder mask 2 is not reduced.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm and 20 μm of thickness of solder mask 2, forms and be equivalent to it
10 μm of thickness of underfill of step difference, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection connection pad 3
Expose, in the adjacent electronic component connection solder mask 2 for being filled with 10.0 μm of thickness between connection pad 3.In addition, second
Face is formed with the solder mask 2 of 38 μm of thickness, 500 μm of diameter in 15 μm of thickness of external connections with a part on connection pad 4
Circular open portion, external connection with connection pad 4 a part expose.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface roughness of 200 μm of periphery and 20 μm of thickness of the solder mask 2 from the region between the periphery that the end leaves 400 μm
When, surface roughness Ra is 0.10 μm.In addition, the electronic component connection solder mask 2 connection pad 3 between adjacent in measurement
When surface roughness, surface roughness Ra is 0.10 μm.
In embodiment 7 ~ 11, in adjacent electronic component connection with there are the welding resistances of sufficient thickness between connection pad 3
Layer 2, therefore, is reliably prevented from and causes the electric short circuit as caused by solder when installing electronic component.It is used in external connection
The residue that solder mask 2 is not present on pad 4 is connected, therefore, can be produced on will not occur electricity when being installed on external electric substrate
The circuit board of the high reliablity of defective insulation.When being compared to embodiment 7 ~ 11, it connect in electronic component with connection
The surface of solder mask 2 between pad 3 is that the circuit board manufactured in smooth embodiment 11 is compared, and is manufactured in embodiment 7 ~ 10
Circuit board and underfill close property it is higher, connection reliability is more superior.
(comparative example 2)
<process (A)>
Be produced on using semi-additive process two sides be formed with conductor wiring 7 circuit substrate 1(area 170mm × 200mm,
15 μm of conductor thickness, substrate thickness 0.4mm).The line of electronic component connection connection pad 3 is existed that serve as in surface (the first face)
25 μm of width, the conductor wiring for being spaced 50 μm.Overleaf (the second face) is formed with the diameter as external connection connection pad 4
The conductor wiring of 600 μm of circular shape.Then, using vacuum lamination, by 25 μm of thickness of solder mask film, (sun ink is manufactured
(share) system, trade name: PFR-800 AUS410) vacuum hotpressing be connected to foregoing circuit substrate 1 two sides (75 DEG C of laminating temperature,
Pull up time 30 seconds, 10 seconds pressing times).Solder mask 2 is formd as a result,.In the solder mask 2 in the first face, from 8 table of insulating layer
Face with a thickness of 30 μm, electronic component connection on connection pad 3 with a thickness of 15 μm.In the solder mask 2 in the second face, from exhausted
8 surface of edge layer with a thickness of 38 μm, external connection on connection pad 4 with a thickness of 23 μm.It is smaller in the density of conductor wiring
The first face in, compared with the second bigger face of the density of conductor wiring, the thickness of solder mask 2 is 8 μm thin.
<process (C1)>
For the solder mask 2 in the first face, 200 μ are left using to from the connection of multiple electronic components with the end of connection pad 3
The photomask 5 of pattern as the area illumination active ray 6 in the outside of the periphery of m, with light exposure 200mJ/cm2It has carried out tight
Patch exposure.
<process (C2)>
For the solder mask 2 in the second face, in order to be opened in external connection with the circle of 500 μm of diameter of setting on connection pad 4
Mouth area, using to circular open portion region with the photomask 5 of pattern as external exposure active ray 6, with light exposure
200mJ/cm2Carry out abutting exposure.
<process (B1)>
After the bearing layer film on the solder mask 2 in the first face of having removed and the second face, by the sodium metasilicate of 10 mass %
Aqueous solution (25 DEG C of liquid temperature) is used as filming treatment fluid, is that above circuit substrate 1 is immersed in filming treatment fluid with the first face
Carry out micellization processing (filming processing) within 25 seconds.Later, the spraying glue that liquid (25 DEG C of liquid temperature) is removed using micella is carried out
Beam removing processing, washing process (25 DEG C of liquid temperature) and drying process carry out filming, Zhi Dao to average 10 μm of solder masks 2
The thickness of the solder mask 2 of non-exposed portion on one side becomes lower 5.0 μm of the surface of electronic component connection connection pad 3.It is using up
When microscope is observed, unevenness is not handled on the surface of the solder mask 2 in the first face, has been obtained in good face uniformly
Property.On the other hand, the solder mask 2 in the second face also carries out average 10 μm of filmings, still, the bubble attachment in filming treatment fluid
In the solder mask 2 of the non-exposed portion in the second face, there are in place of membrane thickness unevenness.In addition, residual on pad 4 with connecting in external connection
There are the residues of about 13 μm of solder mask 2.
<process (C4)>
For the solder mask 2 in the first face, 200 μ are left using to from the connection of multiple electronic components with the end of connection pad 3
The periphery of m and photomask 5 from pattern as the area illumination active ray 6 between the periphery that the end leaves 400 μm lead to
Non-contact exposure under an oxygen atmosphere is crossed, with light exposure 400mJ/cm2It is exposed.
<process (B2)>
The sodium metasilicate aqueous solution (25 DEG C of liquid temperature) of 10 mass % is used as filming treatment fluid, being with the first face above will be electric
Base board 1 is immersed in filming treatment fluid 25 seconds to carry out micellization processing (filming processing).Later, it carries out utilizing micella
Spraying micella removing processing, washing process (25 DEG C of liquid temperature) and the drying process for removing liquid (25 DEG C of liquid temperature), to 10 μm average
Solder mask 2 carry out filming, until the thickness of the solder mask 2 of the non-exposed portion in the first face become electronic component connection with connection
Lower 5.0 μm of the surface of pad 3.When being observed with optical microscopy, do not handled not on the surface of the solder mask 2 in the first face
, good inner evenness has been obtained.By the non-contact exposure under an oxygen atmosphere in process (C4), from self-configuring
The resistance in the region of 200 μm of the outer periphery for thoughtfully leaving 400 μm is left in electronic component connection on one side with the end of connection pad 3
The photo polymerization on 2 surface of layer is suppressed, as a result, the thickness of solder mask 2 reduces 0.5 μm.On the other hand, second face
Solder mask 2 also carries out average 10 μm of filmings, and still, the bubble in filming treatment fluid is attached to the non-exposed portion in the second face
Solder mask 2, there are in place of membrane thickness unevenness.In addition, remaining the residual of about 3 μm of solder mask 2 in external connection connection pad 4
Slag.
Then, in order to solidify the solder mask 2 in the first face and the second face, with light exposure 1000mJ/cm2Carry out whole surface
Exposure is then handled with 150 DEG C of execution heat cures in 60 minutes, has obtained circuit board.The result observed with optical microscopy
It is that, in the first face, the conductor wiring 7 that 15 μm of thickness is coated by 30 μm and 19.5 μm of thickness of solder mask 2, forms and be equivalent to
10.5 μm of thickness of underfill of its step difference, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection connection
Pad 3 exposes, in the adjacent electronic component connection solder mask 2 for being filled with 9.5 μm of thickness between connection pad 3.In addition,
Two faces are formed with the welding resistance of 38 μm of thickness, 500 μm of diameter in 15 μm of thickness of external connections with a part on connection pad 4
The circular open portion of layer 2 still remains the residue of 3 μm of solder mask 2 in external connection connection pad 4.
When installing electronic component, in adjacent electronic component connection with there are the resistances of sufficient thickness between connection pad 3
Layer 2 is reliably prevented from the electric short circuit as caused by solder, still, when being installed on external electric substrate, due in outside
The residue with remaining solder mask 2 on connection pad 4 is connected, it is bad that electrical isolation has occurred in soldering projection connection.
In the surface roughness of solder mask 2 of the measurement adjacent electronic component connection between connection pad 3, rough surface
Spending Ra is 0.03 μm.It with connecting in electronic component with the surface of the solder mask 2 between connection pad 3 is made in smooth comparative example 2
The circuit board made is compared, and the close property of the circuit board and underfill that manufacture in embodiment 7 ~ 11 is higher, and connection can
It is more superior by property.
Embodiment 12 ~ 16 is the example of the manufacturing method (3) of the circuit board shown in Fig. 6-1, Fig. 6-2 and Fig. 6-3.
(embodiment 12)
<process (A1)>
Be produced on using semi-additive process two sides be formed with conductor wiring 7 circuit substrate 1(area 170mm × 200mm,
15 μm of conductor thickness, substrate thickness 0.4mm).The line of electronic component connection connection pad 3 is existed that serve as in surface (the first face)
25 μm of width, the conductor wiring for being spaced 50 μm.Overleaf (the second face) is formed with the diameter as external connection connection pad 4
The conductor wiring of 600 μm of circular shape.Then, using vacuum lamination, by 15 μm of thickness of solder mask film, (sun ink is manufactured
(share) system, trade name: PFR-800 AUS410) vacuum hotpressing is connected to the surface of foregoing circuit substrate 1, by 25 μm of resistance of thickness
Welding film (sun ink manufactures (share) system, trade name: PFR-800 AUS410) vacuum hotpressing is connected to foregoing circuit substrate 1
The back side (75 DEG C of laminating temperature, pull up time 30 seconds, 10 seconds pressing times).The first solder mask 2-1 is formd as a result,.First
The first solder mask 2-1 in face, from 8 surface of insulating layer with a thickness of 20 μm, electronic component connection on connection pad 3 with a thickness of
5µm.The first solder mask 2-1 in the second face, from 8 surface of insulating layer with a thickness of 38 μm, external connection is on connection pad 4
With a thickness of 23 μm.
<process (C1)>
For the first solder mask 2-1 in the first face, using to from multiple electronic components connect with the end of connection pad 3 from
The photomask 5 of pattern as the area illumination active ray 6 in the outside of 200 μm of periphery is opened, with light exposure 200mJ/cm2Into
Abutting of having gone exposes.
<process (C2)>
For the first solder mask 2-1 in the second face, in order in external connection 500 μm of diameter of setting on connection pad 4
Circular open portion region, using to circular open portion region with the photomask 5 of pattern as external exposure active ray 6, to expose
Light quantity 200mJ/cm2Carry out abutting exposure.
<process (B)>
After the bearing layer film on the first solder mask 2-1 in the first face of having removed and the second face, by the inclined of 10 mass %
Sodium silicate aqueous solution (25 DEG C of liquid temperature) is used as filming treatment fluid, is that above circuit substrate 1 is immersed at filming with the first face
Micellization processing (filming processing) is carried out within 25 seconds in reason liquid.Later, the spray that liquid (25 DEG C of liquid temperature) is removed using micella is carried out
Micella removing processing, washing process (25 DEG C of liquid temperature) and the drying process of mist carry out average 10 μm of the first solder mask 2-1 thin
Membranization, until the thickness of the first solder mask 2-1 of the non-exposed portion in the first face becomes the table of electronic component connection connection pad 3
Lower 5.0 μm of face.When being observed with optical microscopy, unevenness is not handled on the surface of the first solder mask 2-1 in the first face,
Good inner evenness is obtained.On the other hand, the first solder mask 2-1 in the second face has also carried out average 10 μm of filmings,
But the bubble in filming treatment fluid is attached to the first solder mask 2-1 of the non-exposed portion in the second face, there are membrane thickness unevenness
Place.In addition, remaining the residue of about 13 μm of the first solder mask 2-1 in external connection connection pad 4.
<process (C3)>
For the first solder mask 2-1 in the first face, using to the area illumination active ray after the filming in process (B)
The photomask 5 of pattern as 6, by non-contact exposure under an oxygen atmosphere, with light exposure 400mJ/cm2It is exposed.
<process (A2)>
Using vacuum lamination, by 15 μm of thickness of solder mask film, (sun ink manufactures (share) system, trade name: PFR-800
AUS410) vacuum hotpressing is connected on the first solder mask 2-1 in the first face for being accomplished to the circuit substrate 1 of process (C3) (lamination temperature
75 DEG C of degree, pull up time 30 seconds, 10 seconds pressing times).The second solder mask 2-2 in the first face is formd as a result,.In the first face
Second solder mask 2-2, from 8 surface of insulating layer with a thickness of 30 μm.
<process (C6)>
For the second solder mask 2-2 in the first face, left using to from electronic component connection with the end of connection pad 3
The photomask 5 of pattern as the area illumination active ray 6 in the outside of 400 μm of periphery, with light exposure 200mJ/cm2It carries out
It is close to exposure.
<process (D1)>
Develop within 30 seconds using (30 DEG C of liquid temperature, spraying pressure 0.15MPa) of aqueous sodium carbonate of 1 mass %, eliminate
First solder mask 2-1 of the non-exposed portion of the second solder mask 2-2 and the second face of the non-exposed portion in the first face.Bottom is formed as a result,
Portion's filling glue is blocked with dam, also, from the electricity of the first solder mask 2-1 covered by the second solder mask 2-2 the state exposed
Subassembly connection is exposed again with connection pad 3 and surrounding first solder mask 2-1.The result observed with optical microscopy
It is, in the first face and the second face, all not found in electronic component connection connection pad 3 and external connection on connection pad 4
The residue of first solder mask 2-1 and the second solder mask 2-2.In addition, the first solder mask 2-1 is filled with, until configuring in the first face
Electronic component connection with connection pad 3 lower 5.5 μm of surface.Pass through the non-contact exposure under an oxygen atmosphere in process (C3)
Light, the electronic component connection configured in the first face are pressed down with the photo polymerization on the first surface solder mask 2-1 between connection pad 3
System, as a result, the thickness of the first solder mask 2-1 in the first face reduces 0.5 μm.
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 9.5 μm of thickness are filled between connection pad 3.In addition, in the second face, at 15 μm of thickness
External connection with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the first solder mask 2-1 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.05 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.40 μm.
(embodiment 13)
It is implemented by method identical with embodiment 12 other than the sequence for having exchanged process (C1) and process (C2)
Process (A1) ~ process (D1).With optical microscopy observation as a result, in the first face and the second face, connects and use in electronic component
Connection pad 3 and the external connection residue for all not finding the first solder mask 2-1 and the second solder mask 2-2 on connection pad 4.This
Outside, it is filled with the first solder mask 2-1, until 5.5 μ under the surface for the electronic component connection connection pad 3 configured in the first face
m.By the non-contact exposure under an oxygen atmosphere in process (C3), the electronic component connection configured in the first face, which is used, connects pad
The photo polymerization on the first surface solder mask 2-1 between 3 is suppressed, as a result, the thickness of the first solder mask 2-1 reduces 0.5 μ
m。
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 9.5 μm of thickness are filled between connection pad 3.In addition, in the second face, at 15 μm of thickness
External connection with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the first solder mask 2-1 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.05 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.40 μm.
(embodiment 14)
By in addition to making the light exposure 200mJ/cm in process (C3)2Method identical with embodiment 12 implements in addition
Process (A1) ~ process (D1).With optical microscopy observation as a result, in the first face and the second face, connects and use in electronic component
Connection pad 3 and the external connection residue for all not finding the first solder mask 2-1 and the second solder mask 2-2 on connection pad 4.This
Outside, it is filled with the first solder mask 2-1, until 6.0 μ under the surface for the electronic component connection connection pad 3 configured in the first face
m.By the non-contact exposure under an oxygen atmosphere in process (C3), the electronic component connection configured in the first face, which is used, connects pad
The photo polymerization on the first surface solder mask 2-1 between 3 is suppressed, as a result, the thickness of the first solder mask 2-1 reduces 1.0 μ
m。
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 9.0 μm of thickness are filled between connection pad 3.In addition, in the second face, at 15 μm of thickness
External connection with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the first solder mask 2-1 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.05 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.50 μm.
(embodiment 15)
By in addition to making the light exposure 1000mJ/cm in process (C3)2Method identical with embodiment 12 is implemented in addition
Process (A1) ~ process (D1).With optical microscopy observation as a result, in the first face and the second face, connected in electronic component
With connection pad 3 and the external connection residue for all not finding the first solder mask 2-1 and the second solder mask 2-2 on connection pad 4.
In addition, the first solder mask 2-1 is filled with, until 5.0 under the surface for the electronic component connection connection pad 3 configured in the first face
μm, the film reduction amount of the first solder mask 2-1 in the first face caused by being hindered as the polymerization of the oxygen in process (C3) is confirmed.
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 10.0 μm of thickness are filled between connection pad 3.In addition, in the second face, at 15 μm of thickness
External connection with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the first solder mask 2-1 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.05 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.30 μm.
(embodiment 16)
Pass through method identical with embodiment 12 other than being exposed in process (C3) with abutting Exposure mode
Implement process (A1) ~ process (D1).With optical microscopy observation as a result, in the first face and the second face, in electronic component
It connects with connection pad 3 and external connection on connection pad 4 and does not all find the first solder mask 2-1's and the second solder mask 2-2
Residue.In addition, the first solder mask 2-1 is filled with, until the surface for the electronic component connection connection pad 3 configured in the first face
Lower 5.0 μm.In process (C3), extraction air when sufficiently carrying out being close to exposure and is exposed under non-oxygen environment,
Therefore, the first surface solder mask 2-1 is not by rough surface, as a result, the thickness of the first solder mask 2-1 is not reduced.
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 10.0 μm of thickness are filled between connection pad 3.In addition, in the second face, in thickness 15
μm external connection with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Shape opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the first solder mask 2-1 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.05 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.10 μm.
In embodiment 12 ~ 16, in adjacent electronic component connection with there are the first of sufficient thickness between connection pad 3
Therefore solder mask 2-1 is reliably prevented from and causes the electric short circuit as caused by solder when installing electronic component.In outside
Therefore connection can be produced on when being installed on external electric substrate with the residue that the first solder mask 2-1 is not present on connection pad 4
The circuit board for the undesirable high reliablity that will not be electrically insulated.When being compared to embodiment 12 ~ 16, and in the ministry of electronics industry
Part connection is that the circuit board manufactured in smooth embodiment 16 is compared with the surface of the first solder mask 2-1 between connection pad 3,
The close property of the circuit board and underfill that manufacture in embodiment 12 ~ 15 is higher, and connection reliability is more superior.
Embodiment 17 ~ 21 is the example of the manufacturing method (4) of the circuit board shown in Fig. 7-1, Fig. 7-2 and Fig. 7-3.
(embodiment 17)
<process (A1)>
Be produced on using semi-additive process two sides be formed with conductor wiring 7 circuit substrate 1(area 170mm × 200mm,
15 μm of conductor thickness, substrate thickness 0.4mm).The line of electronic component connection connection pad 3 is existed that serve as in surface (the first face)
25 μm of width, the conductor wiring for being spaced 50 μm.Overleaf (the second face) is formed with the diameter as external connection connection pad 4
The conductor wiring of 600 μm of circular shape.Then, using vacuum lamination, by 15 μm of thickness of solder mask film, (sun ink is manufactured
(share) system, trade name: PFR-800 AUS410) vacuum hotpressing is connected to the surface of foregoing circuit substrate 1, by 25 μm of resistance of thickness
Welding film (sun ink manufactures (share) system, trade name: PFR-800 AUS410) vacuum hotpressing is connected to foregoing circuit substrate 1
The back side (75 DEG C of laminating temperature, pull up time 30 seconds, 10 seconds pressing times).The first solder mask 2-1 is formd as a result,.First
In the first solder mask 2-1 in face, from 8 surface of insulating layer with a thickness of 20 μm, electronic component is connected with the thickness on connection pad 3
It is 5 μm.In the first solder mask 2-1 in the second face, from 8 surface of insulating layer with a thickness of 38 μm, external connection, which is used, connects pad 4
On with a thickness of 23 μm.
<process (C1)>
For the first solder mask 2-1 in the first face, using to from multiple electronic components connect with the end of connection pad 3 from
The photomask 5 of pattern as the area illumination active ray 6 in the outside of 200 μm of periphery is opened, with light exposure 200mJ/cm2Into
Abutting of having gone exposes.
<process (C2)>
For the first solder mask 2-1 in the second face, in order in external connection 500 μm of diameter of setting on connection pad 4
Circular open portion region, using to circular open portion region with the photomask 5 of pattern as external exposure active ray 6, to expose
Light quantity 200mJ/cm2Carry out abutting exposure.
<process (B)>
After the bearing layer film on the first solder mask 2-1 in the first face of having removed and the second face, by the inclined of 10 mass %
Sodium silicate aqueous solution (25 DEG C of liquid temperature) is used as filming treatment fluid, is that above circuit substrate 1 is immersed at filming with the first face
Micellization processing (filming processing) is carried out within 25 seconds in reason liquid.Later, the spray that liquid (25 DEG C of liquid temperature) is removed using micella is carried out
Micella removing processing, washing process (25 DEG C of liquid temperature) and the drying process of mist carry out average 10 μm of the first solder mask 2-1 thin
Membranization, until the thickness of the first solder mask 2-1 of the non-exposed portion in the first face becomes the table of electronic component connection connection pad 3
Lower 5.0 μm of face.When being observed with optical microscopy, unevenness is not handled on the surface of the first solder mask 2-1 in the first face,
Good inner evenness is obtained.On the other hand, the first solder mask 2-1 in the second face has also carried out average 10 μm of filmings,
But the bubble in filming treatment fluid is attached to the first solder mask 2-1 of the non-exposed portion in the second face, there are membrane thickness unevenness
Place.In addition, remaining the residue of about 13 μm of the first solder mask 2-1 in external connection connection pad 4.
<process (C3)>
For the first solder mask 2-1 in the first face, using to the area illumination active ray after the filming in process (B)
The photomask 5 of pattern as 6, by non-contact exposure under an oxygen atmosphere, with light exposure 400mJ/cm2It is exposed.
<process (D)>
Develop within 30 seconds using (30 DEG C of liquid temperature, spraying pressure 0.15MPa) of aqueous sodium carbonate of 1 mass %, eliminate
First solder mask 2-1 of the non-exposed portion in the second face.
<process (A2)>
Using vacuum lamination, by 15 μm of thickness of solder mask film, (sun ink manufactures (share) and makes, trade name: PFR-800
AUS410) vacuum hotpressing is connected to (laminating temperature on the first solder mask 2-1 in the first face for being accomplished to the circuit substrate 1 of process (D)
75 DEG C, pull up time 30 seconds, 10 seconds pressing times).The second solder mask 2-2 in the first face is formd as a result,.The of the first face
Two solder mask 2-2, from 8 surface of insulating layer with a thickness of 30 μm.
<process (C6)>
For the second solder mask 2-2 in the first face, left using to from electronic component connection with the end of connection pad 3
The photomask 5 of pattern as the area illumination active ray 6 in the outside of 400 μm of periphery, with light exposure 200mJ/cm2It carries out
It is close to exposure.
<process (D2)>
Develop within 30 seconds using (30 DEG C of liquid temperature, spraying pressure 0.15MPa) of aqueous sodium carbonate of 1 mass %, eliminate
Second solder mask 2-2 of the non-exposed portion in the first face.It forms underfill as a result, to block with dam, also, from by the second resistance
The electronic component connection connection pad 3 for the state that the first solder mask 2-1 that layer 2-2 is covered exposes and surrounding the
One solder mask 2-1 exposes again.With optical microscopy observation as a result, in the first face and the second face, connected in electronic component
With connection pad 3 and the external connection residue for all not finding the first solder mask 2-1 and the second solder mask 2-2 on connection pad 4.
In addition, the first solder mask 2-1 is filled with, until 5.5 under the surface for the electronic component connection connection pad 3 configured in the first face
µm.By the non-contact exposure under an oxygen atmosphere in process (C3), the electronic component connection configured in the first face is welded with connection
The photo polymerization on the first surface solder mask 2-1 between disk 3 is suppressed, as a result, the thickness of the first solder mask 2-1 in the first face
Reduce 0.5 μm.
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 9.5 μm of thickness are filled between connection pad 3.In addition, in the second face, in 15 μ of thickness
The external connection of m with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the first solder mask 2-1 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.05 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.40 μm.
(embodiment 18)
It is implemented by method identical with embodiment 17 other than the sequence for having exchanged process (C1) and process (C2)
Process (A1) ~ process (D2).With optical microscopy observation as a result, in the first face and the second face, connects and use in electronic component
Connection pad 3 and the external connection residue for all not finding the first solder mask 2-1 and the second solder mask 2-2 on connection pad 4.This
Outside, it is filled with the first solder mask 2-1, until 5.5 μ under the surface for the electronic component connection connection pad 3 configured in the first face
m.By the non-contact exposure under an oxygen atmosphere in process (C3), the electronic component connection configured in the first face, which is used, connects pad
The photo polymerization on the first surface solder mask 2-1 between 3 is suppressed, as a result, the thickness of the first solder mask 2-1 reduces 0.5 μ
m。
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 9.5 μm of thickness are filled between connection pad 3.In addition, in the second face, in 15 μ of thickness
The external connection of m with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the first solder mask 2-1 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.05 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.40 μm.
(embodiment 19)
By in addition to making the light exposure 200mJ/cm in process (C3)2Method identical with embodiment 17 implements in addition
Process (A1) ~ process (D2).With optical microscopy observation as a result, in the first face and the second face, connects and use in electronic component
Connection pad 3 and the external connection residue for all not finding the first solder mask 2-1 and the second solder mask 2-2 on connection pad 4.This
Outside, it is filled with the first solder mask 2-1, until 6.0 μ under the surface for the electronic component connection connection pad 3 configured in the first face
m.By the non-contact exposure under an oxygen atmosphere in process (C3), the electronic component connection configured in the first face, which is used, connects pad
The photo polymerization on the first surface solder mask 2-1 between 3 is suppressed, as a result, the thickness of the first solder mask 2-1 reduces 1.0 μ
m。
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 9.0 μm of thickness are filled between connection pad 3.In addition, in the second face, at 15 μm of thickness
External connection with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the first solder mask 2-1 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.05 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.50 μm.
(embodiment 20)
By in addition to making the light exposure 1000mJ/cm in process (C3)2Method identical with embodiment 17 in addition is implemented
Process (A1) ~ process (D2).With optical microscopy observation as a result, in the first face and the second face, connected in electronic component
With connection pad 3 and the external connection residue for all not finding the first solder mask 2-1 and the second solder mask 2-2 on connection pad 4.
In addition, the first solder mask 2-1 is filled with, until 5.0 under the surface for the electronic component connection connection pad 3 configured in the first face
μm, the film reduction amount of the first solder mask 2-1 in the first face caused by being hindered as the polymerization of the oxygen in process (C3) is confirmed.
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 10.0 μm of thickness are filled between connection pad 3.In addition, in the second face, in thickness 15
μm external connection with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Shape opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the first solder mask 2-1 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.05 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.30 μm.
(embodiment 21)
Pass through method identical with embodiment 17 other than being exposed in process (C3) with abutting Exposure mode
Implement process (A1) ~ process (D2).With optical microscopy observation as a result, in the first face and the second face, in electronic component
It connects with connection pad 3 and external connection on connection pad 4 and does not all find the first solder mask 2-1's and the second solder mask 2-2
Residue.In addition, the first solder mask 2-1 is filled with, until the surface for the electronic component connection connection pad 3 configured in the first face
Lower 5.0 μm.In process (C3), extraction air when sufficiently carrying out being close to exposure and is exposed under non-oxygen environment,
Therefore, the first surface solder mask 2-1 is not by rough surface, as a result, the thickness of the first solder mask 2-1 is not reduced.
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 10.0 μm of thickness are filled between connection pad 3.In addition, in the second face, in thickness 15
μm external connection with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Shape opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the first solder mask 2-1 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.05 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.10 μm.
In embodiment 17 ~ 21, in adjacent electronic component connection with there are the first of sufficient thickness between connection pad 3
Therefore solder mask 2-1 is reliably prevented from and causes the electric short circuit as caused by solder when installing electronic component.In outside
Therefore connection can be produced on when being installed on external electric substrate with the residue that the first solder mask 2-1 is not present on connection pad 4
The circuit board for the undesirable high reliablity that will not be electrically insulated.When being compared to embodiment 17 ~ 21, and in the ministry of electronics industry
Part connection is that the circuit board manufactured in smooth embodiment 21 is compared with the surface of the first solder mask 2-1 between connection pad 3,
The close property of the circuit board and underfill that manufacture in embodiment 17 ~ 20 is higher, and connection reliability is more superior.
Embodiment 22 ~ 25 is the example of the manufacturing method (5) of the circuit board shown in Fig. 8-1, Fig. 8-2 and Fig. 8-3.
(embodiment 22)
<process (A1)>
Be produced on using semi-additive process two sides be formed with conductor wiring 7 circuit substrate 1(area 170mm × 200mm,
15 μm of conductor thickness, substrate thickness 0.4mm).The line of electronic component connection connection pad 3 is existed that serve as in surface (the first face)
25 μm of width, the conductor wiring for being spaced 50 μm.Overleaf (the second face) is formed with the diameter as external connection connection pad 4
The conductor wiring of 600 μm of circular shape.Then, using vacuum lamination, by 15 μm of thickness of solder mask film, (sun ink is manufactured
(share) system, trade name: PFR-800 AUS410) vacuum hotpressing is connected to the surface of foregoing circuit substrate 1, by 25 μm of resistance of thickness
Welding film (sun ink manufactures (share) system, trade name: PFR-800 AUS410) vacuum hotpressing is connected to foregoing circuit substrate 1
The back side (75 DEG C of laminating temperature, pull up time 30 seconds, 10 seconds pressing times).The first solder mask 2-1 is formd as a result,.First
In the first solder mask 2-1 in face, from 8 surface of insulating layer with a thickness of 20 μm, electronic component is connected with the thickness on connection pad 3
It is 5 μm.In the first solder mask 2-1 in the second face, from 8 surface of insulating layer with a thickness of 38 μm, external connection, which is used, connects pad 4
On with a thickness of 23 μm.
<process (C2)>
For the first solder mask 2-1 in the second face, in order in external connection 500 μm of diameter of setting on connection pad 4
Circular open portion region, using to circular open portion region with the photomask 5 of pattern as external exposure active ray 6, to expose
Light quantity 200mJ/cm2Carry out abutting exposure.
<process (B)>
After the bearing layer film on the first solder mask 2-1 in the first face of having removed and the second face, by the inclined of 10 mass %
Sodium silicate aqueous solution (25 DEG C of liquid temperature) is used as filming treatment fluid, is that above circuit substrate 1 is immersed at filming with the first face
Micellization processing (filming processing) is carried out within 25 seconds in reason liquid.Later, the spray that liquid (25 DEG C of liquid temperature) is removed using micella is carried out
Micella removing processing, washing process (25 DEG C of liquid temperature) and the drying process of mist carry out average 10 μm of the first solder mask 2-1 thin
Membranization, until the thickness of the first solder mask 2-1 of the non-exposed portion in the first face becomes the table of electronic component connection connection pad 3
Lower 5.0 μm of face.When being observed with optical microscopy, unevenness is not handled on the surface of the first solder mask 2-1 in the first face,
Good inner evenness is obtained.On the other hand, the first solder mask 2-1 in the second face has also carried out average 10 μm of filmings,
But the bubble in filming treatment fluid is attached to the first solder mask 2-1 of the non-exposed portion in the second face, there are membrane thickness unevenness
Place.In addition, remaining the residue of about 13 μm of the first solder mask 2-1 in external connection connection pad 4.
<process (C3)>
For the first solder mask 2-1 in the first face, using to the area illumination active ray after the filming in process (B)
The photomask 5 of pattern as 6, by non-contact exposure under an oxygen atmosphere, with light exposure 400mJ/cm2It is exposed.
<process (A2)>
Using vacuum lamination, by 20 μm of thickness of solder mask film, (sun ink manufactures (share) and makes, trade name: PFR-800
AUS410) vacuum hotpressing is connected to (laminating temperature on the first solder mask 2-1 in the first face for being accomplished to the circuit substrate 1 of process (C)
75 DEG C, pull up time 30 seconds, 10 seconds pressing times).The second solder mask 2-2 in the first face is formd as a result,.The of the first face
Two solder mask 2-2, from 8 surface of insulating layer with a thickness of 30 μm.
<process (C6)>
For the second solder mask 2-2 in the first face, left using to from electronic component connection with the end of connection pad 3
The photomask 5 of pattern as the area illumination active ray 6 in the outside of 400 μm of periphery, with light exposure 200mJ/cm2It carries out
It is close to exposure.
<process (B3)>
After the bearing layer film on the second solder mask 2-2 in the first face of having removed, by the sodium metasilicate water of 10 mass %
Solution (25 DEG C of liquid temperature) is used as filming treatment fluid, is that above circuit substrate 1 is immersed in 25 in filming treatment fluid with the first face
Second carries out micellization processing (filming processing).Later, the spraying micella that liquid (25 DEG C of liquid temperature) is removed using micella is carried out
Removing processing, washing process (25 DEG C of liquid temperature) and drying process carry out filming to average 10 μm of the second solder mask 2-2, directly
Thickness to the second solder mask 2-2 of the non-exposed portion in the first face becomes electronic component connection with 5.0 under the surface for connecting pad 3
µm.When being observed with optical microscopy, unevenness is not handled on the surface of the second solder mask 2-2 in the first face, is obtained
Good inner evenness.On the other hand, the first solder mask 2-1 in the second face has also carried out average 10 μm of filmings, still, thin
Bubble in membranization treatment fluid is attached to the first solder mask 2-1 of the non-exposed portion in the second face, and there are in place of membrane thickness unevenness.This
Outside, the residue of about 3 μm of the first solder mask 2-1 is remained in external connection connection pad 4.
<process (C7)>
For the second solder mask 2-2 in the first face, left using to from electronic component connection with the end of connection pad 3
The photomask 5 of pattern as the area illumination active ray 6 in the outside of 200 μm of periphery is connect by under an oxygen atmosphere non-
Touching exposure, with light exposure 400mJ/cm2It is exposed.
<process (D1)>
Develop within 30 seconds using (30 DEG C of liquid temperature, spraying pressure 0.15MPa) of aqueous sodium carbonate of 1 mass %, eliminate
First solder mask 2-1 of the non-exposed portion of the second solder mask 2-2 and the second face of the non-exposed portion in the first face.Bottom is formed as a result,
Portion's filling glue is blocked with dam, also, from the electricity of the first solder mask 2-1 covered by the second solder mask 2-2 the state exposed
Subassembly connection is exposed again with connection pad 3 and surrounding first solder mask 2-1.The result observed with optical microscopy
It is, in the first face and the second face, all not found in electronic component connection connection pad 3 and external connection on connection pad 4
The residue of first solder mask 2-1 and the second solder mask 2-2.In addition, the first solder mask 2-1 is filled with, until configuring in the first face
Electronic component connection with connection pad 3 lower 5.5 μm of surface.Pass through the non-contact exposure under an oxygen atmosphere in process (C3)
Light, the electronic component connection configured in the first face are pressed down with the photo polymerization on the first surface solder mask 2-1 between connection pad 3
System, as a result, the thickness of the first solder mask 2-1 in the first face reduces 0.5 μm.In addition, passing through the oxygen environment in process (C7)
Under non-contact exposure, in from configuration the first face multiple electronic components connection with connect pad 3 end leave 200 μm
Periphery and 20 μm of thickness of the second surface solder mask 2-2 from the region between the periphery that the end leaves 400 μm it is photic
Polymerization is suppressed, as a result, the thickness of 20 μm of thickness of the second solder mask 2-2 reduces 0.5 μm.
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 19.5 μm of the second solder mask 2-2 is coated, form be equivalent to its step difference 10.5 μm of thickness of underfill it is stifled
Firmly use dam.In addition, 15 μm of thickness of electronic component connection uses connection pad 3 to expose, in adjacent electronic component connection company
It connects and is filled with 9.5 μm of thickness of the first solder mask 2-1 between pad 3.In addition, in the second face, in 15 μm of external connection of thickness
With a part on connection pad 4 be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circular open portion, it is external
Connection is exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The table of 200 μm of periphery and 19.5 μm of thickness of the second solder mask 2-2 from the region between the periphery that the end leaves 400 μm
When surface roughness, surface roughness Ra is 0.40 μm.In addition, in the adjacent electronic component connection of measurement between connection pad 3
When the surface roughness of the first solder mask 2-1, surface roughness Ra is 0.40 μm.
(embodiment 23)
By in addition to making the light exposure 200mJ/cm in process (C3) and (C7)2Method identical with embodiment 22 in addition
Implement process (A1) ~ process (D1).With optical microscopy observation as a result, in the first face and the second face, in electronic component
It connects with connection pad 3 and external connection on connection pad 4 and does not all find the first solder mask 2-1's and the second solder mask 2-2
Residue.In addition, the first solder mask 2-1 is filled with, until the surface for the electronic component connection connection pad 3 configured in the first face
Lower 6.0 μm.By the non-contact exposure under an oxygen atmosphere in process (C3), the electronic component connection configured in the first face, which is used, to be connected
The photo polymerization for connecing the first surface solder mask 2-1 between pad 3 is suppressed, as a result, the thickness of the first solder mask 2-1 is reduced
1.0 μm.In addition, by the non-contact exposure under an oxygen atmosphere in process (C7), in from configuration in the multiple of the first face
Electronic component connection with the end for connecting pad 3 leaves 200 μm of periphery and from the area between the periphery that the end leaves 400 μm
The photo polymerization on the second surface solder mask 2-2 of 20 μm of thickness of domain is suppressed, as a result, 20 μm of thickness of the second solder mask
The thickness of 2-2 reduces 1.0 μm.
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 19 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 11 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 9.0 μm of thickness are filled between connection pad 3.In addition, in the second face, in 15 μ of thickness
The external connection of m with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 19 μm of thickness of the second solder mask 2-2 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.50 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.50 μm.
(embodiment 24)
By in addition to making the light exposure 1000mJ/cm in process (C3) and (C7)2Side identical with embodiment 22 in addition
Method implements process (A1) ~ process (D1).With optical microscopy observation as a result, in the first face and the second face, in the ministry of electronics industry
Part connects with connection pad 3 and external connection on connection pad 4 and does not all find the first solder mask 2-1 and the second solder mask 2-2
Residue.In addition, the first solder mask 2-1 is filled with, until the table for the electronic component connection connection pad 3 configured in the first face
Lower 5.0 μm of face, be confirmed as the oxygen in process (C3) and (C7) polymerization hinder caused by the first face the first solder mask 2-1 with
The film reduction amount of the second solder mask 2-2 in the first face.
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 10.0 μm of thickness are filled between connection pad 3.In addition, in the second face, in thickness 15
μm external connection with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Shape opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the second solder mask 2-2 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.30 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.30 μm.
(embodiment 25)
By identical as embodiment 22 other than being exposed in process (C3) and (C7) with abutting Exposure mode
Method implement process (A1) ~ process (D1).With optical microscopy observation as a result, in the first face and the second face, in electricity
Subassembly connects with connection pad 3 and external connection on connection pad 4 and does not all find the first solder mask 2-1 and the second solder mask
The residue of 2-2.In addition, the first solder mask 2-1 is filled with, until the electronic component connection connection pad 3 configured in the first face
Lower 5.0 μm of surface.In process (C3) and (C7), by sufficiently carry out be close to exposure when extraction air and in non-oxygen environment
Under be exposed, therefore, the first solder mask 2-1 and the second surface solder mask 2-2 be not by rough surface, as a result, the first face
The first solder mask 2-1 and the thickness of the second solder mask 2-2 in the first face do not reduce.
Then, in order to make the first solder mask 2-1 and the second solder mask 2-2 and first solder mask in the second face in the first face
2-1 solidification, with light exposure 1000mJ/cm2Whole surface exposure is carried out, then, is handled with 150 DEG C of execution heat cures in 60 minutes,
Circuit board is obtained.With optical microscopy observation as a result, in the first face, the conductor wiring 7 that 15 μm of thickness is by 30 μ of thickness
M and 20 μm of the first solder mask 2-1 and the second solder mask 2-2 is coated, and is formd and is equivalent to 10 μm of thickness of its step difference
Underfill, which is blocked, uses dam.In addition, 15 μm of thickness of electronic component connection is exposed with connection pad 3, in adjacent electronics
Component connection the first solder mask 2-1 that 10 μm of thickness are filled between connection pad 3.In addition, in the second face, at 15 μm of thickness
External connection with connection pad 4 on a part be formed with 38 μm of thickness, 500 μm of diameter the first solder mask 2-1 circle
Opening portion, external connection are exposed with a part of connection pad 4.
Then, it is left in multiple electronic components connection from configuration in the first face with the end of connection pad 3 in measurement
The surface of 200 μm of periphery and 20 μm of thickness of the second solder mask 2-2 from the region between the periphery that the end leaves 400 μm
When roughness, surface roughness Ra is 0.10 μm.In addition, in the adjacent electronic component connection of measurement with the between connection pad 3
When the surface roughness of one solder mask 2-1, surface roughness Ra is 0.10 μm.
In embodiment 22 ~ 25, in adjacent electronic component connection with there are the first of sufficient thickness between connection pad 3
Therefore solder mask 2-1 is reliably prevented from and causes the electric short circuit as caused by solder when installing electronic component.In outside
Therefore connection can be produced on when being installed on external electric substrate with the residue that the first solder mask 2-1 is not present on connection pad 4
The circuit board for the undesirable high reliablity that will not be electrically insulated.When being compared to embodiment 22 ~ 25, and in the ministry of electronics industry
First solder mask 2-1 of the part connection between connection pad 3 is connected with electronic component with the second solder mask 2- around connection pad 3
2 surface is that the circuit board manufactured in smooth embodiment 25 is compared, the circuit board manufactured in embodiment 22 ~ 24 and bottom
The close property that glue is filled in portion is higher, and connection reliability is more superior.
As in above description, about the circuit board manufactured using embodiment 1 ~ 6, the electronic component in the first face connects
It connects and is exposed with a part of connection pad 3 from solder mask 2.Using the circuit board to carry out flip-chip connection the case where
Under, in being configured with circuit board of the electronic component connection with connection pad 3 to high-density, connects and use in adjacent electronic component
There is also the solder masks 2 of sufficient thickness between connection pad 3, therefore, are reliably prevented from and cause when installing electronic component
The electric short circuit as caused by solder.In addition, insulating layer 8 connect adhesive strength and the ministry of electronics industry with connection pad 3 with electronic component
Part connection is become larger with connection pad 3 and the adhesive strength of solder, obtains high connection reliability.In turn, using in oxygen environment
Under non-contact Exposure mode come in the case where carrying out the exposure in process (C3), around electronic component connection connection pad 3
Solder mask 2 the abundant rough surface in surface, it is therefore, good with the close property of underfill, obtain high connection reliability.This
Outside, the residue of solder mask 2 is also not present on the surface of the external connection connection pad 4 in the second face, it is therefore, outer being installed on
When portion's substrate, obtain to occur the undesirable high connection reliability of electrical isolation in welded connecting.
As in above description, about the circuit board manufactured using embodiment 7 ~ 25, electronic component connection company
It connects a part of pad 3 to expose from the first solder mask 2-1 of solder mask 2(), in turn, there is the solder mask 2(the using second configuration
One solder mask 2-1 and the second solder mask 2-2) underfill that is formed blocks and uses dam.It is carried out using the circuit board
In the case that flip-chip connects, it can prevent the underfill filled between electronic component and circuit board from overflowing around
Bad influence is caused to reliability of electrical connection out.In addition, in the cloth for being configured with electronic component connection connection pad 3 to high-density
In line substrate, in adjacent electronic component connection with there are the first solder masks of solder mask 2(of sufficient thickness between connection pad 3
2-1), therefore, it is reliably prevented from and causes the electric short circuit as caused by solder when installing electronic component.Insulating layer 8 and electricity
The adhesive strength of subassembly connection connection pad 3 and electronic component connection are become larger with connection pad 3 and the adhesive strength of solder,
Obtain high connection reliability.In turn, in the manufacture for carrying out circuit board using non-contact Exposure mode under an oxygen atmosphere
The process (C4) of method (2) and (C5), the manufacturing method (3) of circuit board, (4), the process (C3) of (5), the system of circuit board
In the case where making the exposure in the process (C7) of method (5), electronic component connection with connection pad 3 between, around solder mask 2
(the first solder mask 2-1, the second solder mask 2-2) abundant rough surface in surface, it is therefore, good with the close property of underfill, it obtains
To high connection reliability.In addition, on the surface of the external connection connection pad 4 in the second face, also there is no solder mask 2(the
One solder mask 2-1) residue, therefore, when being installed on external substrate, the electrical isolation for obtaining will not occurring in being welded to connect is bad
High connection reliability.
Industrial availability
The manufacturing method of circuit board of the invention for example can be applied to manufacture have for connect semiconductor chip, its
The purposes of the circuit board of multiple connection pads of the electronic component of his printed wiring board.
The explanation of appended drawing reference
1 circuit substrate
2 solder masks
The first solder mask of 2-1
The second solder mask of 2-2
The 3 electronic components connection connection pad for connecting pad, the first face
The 4 external connections connection pad for connecting pad, the second face
5 photomasks
6 active rays
7 conductor wirings
8 insulating layers.
Claims (7)
1. a kind of manufacturing method of circuit board, the circuit board is with having insulating layer on two sides and on the surface of insulating layer
The circuit substrate of the connection pad of formation and there is solder mask on the two sides of circuit substrate and connect a part of pad from resistance
Layer exposes, and the manufacturing method is characterized in that, includes:
The process that A forms the different solder mask of thickness on the two sides of circuit substrate, the circuit substrate have insulating layer on two sides
With the connection pad on the surface for being formed in insulating layer；
C1 for thickness first face thinner than the solder mask in the second face solder mask in the process B as rear process by film
The process that part other than the region of change is exposed；
C2 is exposed the part other than developed region in the step D as rear process for the solder mask in the second face
Process；
B the first face using filming treatment fluid make the solder mask filming of non-exposed portion until become connect pad thickness with
Get off and expose a part of the connection pad formed in the first face, also, the solder mask of the non-exposed portion in the second face is also while quilt
Filming and remain on the connection pad in second face that is formed in solder mask residue process；
The process that C3 is exposed the region part after the filming in process B for the solder mask in the first face；And
D removes the residue process of the solder mask of the non-exposed portion in the second face using developer solution.
2. the manufacturing method of circuit board according to claim 1, wherein the exposure in process C3 is by under an oxygen atmosphere
Non-contact Exposure mode carry out.
3. the manufacturing method of circuit board according to claim 1 or 2, wherein the light exposure in process C3 is process C1
In 1 times or more 5 times or less of light exposure.
4. the manufacturing method of circuit board according to claim 1 or 2, wherein at the filming of the solder mask in process B
Reason is carried out with making the mode on the first face.
5. the manufacturing method of circuit board according to claim 3, wherein the filming of the solder mask in process B is handled
It is carried out with making the mode on the first face.
6. the manufacturing method of circuit board according to claim 1, wherein carry out process C2 before process C1.
7. the manufacturing method of circuit board according to claim 1, wherein while carrying out process C1 and process C2.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711303988.9A CN107979919B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
| CN201711303986.XA CN107969076B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
| CN201711304405.4A CN107969077B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
Applications Claiming Priority (21)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013107932 | 2013-05-22 | ||
| JP2013-107932 | 2013-05-22 | ||
| JP2013-125178 | 2013-06-14 | ||
| JP2013125178 | 2013-06-14 | ||
| JP2013-131839 | 2013-06-24 | ||
| JP2013131839 | 2013-06-24 | ||
| JP2013139706 | 2013-07-03 | ||
| JP2013-139706 | 2013-07-03 | ||
| JP2013-142482 | 2013-07-08 | ||
| JP2013142482 | 2013-07-08 | ||
| JP2013-147430 | 2013-07-16 | ||
| JP2013147430 | 2013-07-16 | ||
| JP2013-150825 | 2013-07-19 | ||
| JP2013-150824 | 2013-07-19 | ||
| JP2013150825 | 2013-07-19 | ||
| JP2013150824 | 2013-07-19 | ||
| JP2014-086392 | 2014-04-18 | ||
| JP2014086392 | 2014-04-18 | ||
| JP2014-090220 | 2014-04-24 | ||
| JP2014090220 | 2014-04-24 | ||
| PCT/JP2014/062928 WO2014188945A1 (en) | 2013-05-22 | 2014-05-15 | Manufacturing method for wiring board |
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| CN201711303988.9A Division CN107979919B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
| CN201711303986.XA Division CN107969076B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
| CN201711304405.4A Division CN107969077B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
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| Publication Number | Publication Date |
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| CN105210460A CN105210460A (en) | 2015-12-30 |
| CN105210460B true CN105210460B (en) | 2019-01-11 |
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| CN201711304405.4A Active CN107969077B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
| CN201480029187.6A Active CN105210460B (en) | 2013-05-22 | 2014-05-15 | The manufacturing method of circuit board |
| CN201711303988.9A Active CN107979919B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
| CN201711303986.XA Active CN107969076B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
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| CN201711304405.4A Active CN107969077B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
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| CN201711303988.9A Active CN107979919B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
| CN201711303986.XA Active CN107969076B (en) | 2013-05-22 | 2014-05-15 | Method for manufacturing wiring substrate |
Country Status (5)
| Country | Link |
|---|---|
| JP (3) | JP6224520B2 (en) |
| KR (1) | KR102076479B1 (en) |
| CN (4) | CN107969077B (en) |
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| WO (1) | WO2014188945A1 (en) |
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| JP6075643B2 (en) * | 2013-11-28 | 2017-02-08 | 京セラ株式会社 | Wiring board manufacturing method |
| KR200491846Y1 (en) | 2014-12-10 | 2020-06-17 | 미쓰비시 세이시 가부시키가이샤 | Apparatus for thin filming resist layer |
| TWI675256B (en) * | 2015-03-13 | 2019-10-21 | 日商三菱製紙股份有限公司 | Process for forming solder resist patterns |
| KR20210115188A (en) | 2020-03-12 | 2021-09-27 | 엘지이노텍 주식회사 | Printed circuit board and mehod of manufacturing thereof |
| KR20210131149A (en) * | 2020-04-23 | 2021-11-02 | 엘지이노텍 주식회사 | Printed circuit board and mehod of manufacturing thereof |
| KR20210154454A (en) * | 2020-06-12 | 2021-12-21 | 엘지이노텍 주식회사 | Printed circuit board and mehod of manufacturing thereof |
| KR20210154450A (en) * | 2020-06-12 | 2021-12-21 | 엘지이노텍 주식회사 | Printed circuit board and mehod of manufacturing thereof |
| US11551939B2 (en) | 2020-09-02 | 2023-01-10 | Qualcomm Incorporated | Substrate comprising interconnects embedded in a solder resist layer |
| CN116941334A (en) * | 2021-04-26 | 2023-10-24 | Lg 伊诺特有限公司 | Circuit board |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107979919A (en) | 2018-05-01 |
| KR102076479B1 (en) | 2020-02-12 |
| CN107969076A (en) | 2018-04-27 |
| JP2017183744A (en) | 2017-10-05 |
| JP2018139318A (en) | 2018-09-06 |
| JP2015216332A (en) | 2015-12-03 |
| WO2014188945A1 (en) | 2014-11-27 |
| CN107979919B (en) | 2020-07-10 |
| JP6224520B2 (en) | 2017-11-01 |
| CN105210460A (en) | 2015-12-30 |
| TWI625996B (en) | 2018-06-01 |
| JP6514807B2 (en) | 2019-05-15 |
| JP6416323B2 (en) | 2018-10-31 |
| CN107969077A (en) | 2018-04-27 |
| CN107969077B (en) | 2020-02-18 |
| TW201509256A (en) | 2015-03-01 |
| CN107969076B (en) | 2020-04-28 |
| KR20160013007A (en) | 2016-02-03 |
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