TW201509256A - Process for manufacturing wiring substrate - Google Patents

Abstract

The present invention is a manufacturing method for a wiring board, which is characterized in including steps for: (A) forming solder mask layers of different thickness on both surfaces of a circuit board; (C1) for a solder mask layer of a first surface which is of thinner thickness than a solder mask layer of a second surface, exposing portions other than areas to be thinned in step (B), which is a later step; (C2) for the solder mask layer of the second surface, exposing portions other than areas to be developed in step (D), which is a later step; (B) by way of a thin-film processing solution, thinning the solder mask layer of the first surface of the non-exposed portions until reaching thicknesses that are less than or equal to connection pads; (C3) for the solder mask layer of the first surface, exposing the area-portions that have been thinned in step (B); and (D) removing, by way of a developer solution, the solder mask layers of the non-exposed portions of the second surface.

Description

Wiring substrate manufacturing method

The present invention relates to a method of manufacturing a wiring board, and more particularly to a method of manufacturing a wiring board having a plurality of connection pads for connecting electronic components such as semiconductor wafers and other printed wiring boards.

A wiring board inside each of the electric devices has a circuit board having an insulating layer and conductor wiring formed on the surface of the insulating layer on one or both surfaces thereof. Further, on the surface of the circuit board of the wiring board, in order to prevent the solder from adhering to the conductor wiring which is not required to be soldered, a solder resist layer is formed over the unwelded portion. The solder resist layer functions to prevent oxidation, electrical insulation, and external environment of the conductor wiring.

Further, when an electronic component such as a semiconductor wafer is mounted on the wiring substrate, a plurality of connection pads for connecting electronic components such as a semiconductor wafer and other printed wiring boards are formed on the surface of the wiring substrate. The connection pad is formed such that the entire or a part of the conductor wiring on the surface of the circuit board is exposed from the solder resist layer. In recent years, the connection pads have continued to be densified, and the spacing of the connected pads is becoming narrower and narrower, for example, There is also a narrow pitch of 50 μm or less.

A method of attaching an electronic component to a connection pad of a high-density arrangement has a method of using a flip chip connection. The flip-chip connection means that a part of the connection pad for the electronic component to be placed on the wiring board is exposed in accordance with the arrangement of the electrode terminals of the electronic component, and the exposed portion of the connection pad for the electronic component is connected to the electrode of the electronic component. The terminals are opposite and are electrically connected by solder bumps.

The structure of the connection pad includes an SMD (Solder Mask Defined) structure in which a part of the solder resist layer is removed to expose the entire or a part of the surface of the connection pad, and an NSMD (Non Solder Mask Defined) in which a part of the solder resist layer is removed to completely expose the connection pad. )structure.

Fig. 1A is a schematic cross-sectional view showing an example of a wiring board having an SMD structure. The surface of the circuit board 1 on which the conductor wiring 7 and the part of the conductor wiring are connected to the pad 3 is disposed on the surface of the insulating layer 8, and the solder resist layer 2 is formed. The connection pad 3 is covered by the solder resist layer 2 in the vicinity of the periphery. Therefore, there is an advantage that it is difficult to cause the connection pad 3 to peel off and the neck of the extension wire of the connection pad 3 to be broken due to mechanical impact. On the contrary, since the electrical connection between the electrode terminal of the electronic component and the connection pad 3 corresponding thereto is surely fixed, it is necessary to secure a necessary amount of soldering at the joint portion formed on the exposed surface of the connection pad 3, thereby causing an increase in the size of the connection pad 3. Therefore, it is difficult to meet the demand for higher density of the connection pad 3 in accordance with the miniaturization and high performance of the electronic component.

Fig. 1B is a schematic cross-sectional view showing an example of a wiring board having an NSMD structure. A surface of the circuit board 1 on which the conductor wiring 7 and the portion of the conductor wiring are connected to the pad 3 are disposed on the surface of the insulating layer 8, and a solder resist layer is formed. 2. In the same opening of the solder resist layer 2, a plurality of connection pads 3 are disposed, and the connection pads 3 are exposed from the solder resist layer 2. In the NSMD structure, the solder resist layer 2 in the vicinity of the periphery of the connection pad 3 is completely removed, and the side surface of the connection pad 3 is completely exposed. Therefore, compared with the SMD structure, even if the connection pad 3 is small, the bonding strength of the bonding pad 3 and the flux can be ensured. Conversely, the side surface of the bonding pad 3 is completely exposed, which may lower the bonding strength between the bonding pad 3 and the insulating layer 8. Further, when the connection pads 3 are arranged at a narrow pitch, the electroless nickel/gold plating in the post-process may be short-circuited between the connection pads 3, or may be melted if the solder bumps are provided on the connection pads 3. The flux flows to the adjacent connection pads 3, causing a short circuit between the connection pads 3.

In order to solve the problem of the adhesion strength between the connection pad and the insulating layer, a method of manufacturing a connection by forming a portion of the solder resist layer disposed on the surface of the circuit board to a depth of about 0 to 15 μm by irradiating the laser light is provided. A method of printing a wiring board having a structure in which the side of the pad portion is exposed from the solder resist layer (for example, refer to Patent Document 1). By using the printed wiring board obtained by the method described in Patent Document 1, the bonding strength between the connection pad and the insulating layer may be improved as compared with the printed wiring board in which the connection pads existing in the lower portion of the solder resist layer are completely exposed.

In addition, a method of manufacturing a wiring board in which the solder resist layer 2 is filled between adjacent connection pads 3 has been proposed in order to solve the problem of short-circuiting of the connection pads 3 in a narrow pitch (see, for example, Patent Document 2). According to the method of Patent Document 2, it is possible to form the NSMD structure in which the solder resist layer 2 is filled between the connection pads 3 as shown in FIG. 2, and the thickness of the solder resist layer 2 to be filled is equal to or less than the thickness of the connection pad 3. Specifically, formed on the circuit substrate 1 In the solder resist layer 2, after the thickness of the solder resist layer 2 is thinned to a portion other than the region below the thickness of the connection pad 3, the solution is thinned by the alkaline aqueous solution to be equal to or less than the thickness of the connection pad 3. The thin film of the solder resist layer 2 in the non-exposed portion. Thereby, the solder resist layer 2 having a multi-stage structure including a portion having a thickness equal to or less than the thickness of the connection pad 3 and a portion exceeding the thickness of the connection pad 3 is formed, and a wiring board in which a part of the conductor wiring of the connection pad 3 is exposed is manufactured.

In general, when a wiring board of an electronic component is mounted, a large number of external connection connecting pads are formed at a high density on the back surface. The external connection connecting pad can also be produced by exposing a part of the conductor wiring on the back surface of the circuit board from the solder resist layer. The exposed portion of the external connection connecting pad is opposed to the conductor wiring of the external electrical board such as the motherboard, and is electrically connected via the solder bump.

When the solder resist layer is formed on both surfaces of the circuit board, the thickness of the solder resist layer on the connection pad changes with the density of the conductor wiring around the connection pad. For example, when the conductor wiring density is small, the amount of the solder resist layer filled in the gap between the conductor wirings is large, and the thickness of the solder resist layer on the connection pad tends to be thin. On the other hand, when the conductor wiring density is large, the amount of the solder resist layer filled in the gap between the conductor wirings is small, and the thickness of the solder resist layer on the connection pad tends to be thick.

When the wiring board of the electronic component is mounted by the flip chip connection, the conductor wiring density around the external connection connection pad including the back surface may be larger than the conductor around the electronic component connection connection pad including the surface. Wiring density. Therefore, sometimes the external connection connecting pad on the back side The thickness of the solder resist layer on the surface is thicker than the thickness of the solder resist layer on the connection pad for electronic component connection on the surface. When a method of thinning the solder resist layer by using a thin film processing liquid to expose the bonding pad, when the both surfaces are simultaneously thinned, the following problems may occur.

First, when the surface solder resist layer 2 is made thinner than the thickness of the electronic component connecting connecting pad 3, the solder resist layer 2 on the back surface is simultaneously thinned in the same amount as the surface. Since the solder resist layer 2 on the back surface is thicker than the solder resist layer 2 on the surface, the residue of the solder resist layer 2 remains on the connection pad 4 for external connection on the back surface, which may cause a problem of poor electrical insulation (Fig. 3) ).

On the other hand, when the solder resist layer 2 on the back surface is made thinner than the thickness of the outer connecting connecting pad 4, the solder resist layer 2 on the surface is simultaneously thinned by the same amount as the back surface. Since the solder resist layer 2 on the back surface is thicker than the solder resist layer 2 on the surface, the thickness of the solder resist layer 2 between the bonding pads 3 for connecting electronic components on the surface is thinner than the desired thickness, and adjacent electronic components sometimes occur. A short circuit problem between the connection pads 3 for connection.

However, when a printed wiring board in which the electronic component is flip-chip bonded is mounted on a circuit board, in order to secure the connection reliability between the electronic component and the circuit board, the gap between the electronic component and the circuit board is filled with a filler (sealing resin) to reinforce. In order to ensure the reinforcing effect, it is necessary to fill a sufficient amount of the gap between the electronic component and the circuit board. However, when the flip chip connection is performed using the printed wiring board obtained in Patent Document 1, when the filling of the sufficient filling is performed to secure the reinforcing effect, the filling is performed from the electronic component and The gap of the circuit board overflows to the surroundings, which may adversely affect electrical operation. Therefore, in order to prevent the glue from overflowing to the surroundings, a printed wiring board having a bank structure has been proposed (for example, refer to Patent Documents 3 to 5).

According to the method proposed in Patent Document 3, after the solder resist layer is formed on the circuit board having the conductor circuit, partial exposure is performed, and then the unexposed portion is subjected to development processing to form an opening for exposing the upper portion of the portion of the connection pad from the solder resist layer. In the second step, a second partial exposure is performed, and thereafter, a method of forming a bank shape by performing a second partial exposure of the unexposed portion by the desmear treatment is performed. The opening of the solder resist layer by this method is difficult to securely fix the electrical connection between the electrode terminal of the electronic component and the connection pad corresponding thereto due to the SMD structure, and the electrical connection between the connection pad and the solder ball may be insufficient. Further, since the formation of the dam structure by this method is performed by the desmear treatment, the solder resist layer may be roughened to lower the strength of the solder resist layer, and the reliability of the printed wiring board may not be sufficiently ensured.

According to the method proposed in Patent Document 4, after the solder resist layer is formed on the circuit board having the conductor circuit, partial exposure is performed, and then the unexposed portion is subjected to development processing to form the connection pad completely exposed from the solder resist layer. In the opening, secondly, after the second solder mask is formed, the unexposed portion is much larger than the second partial exposure of the first partial exposure region, and thereafter, the bank shape is formed by development of the unexposed portion. The opening of the solder resist layer by this method is an NSMD structure, and the solder resist layer in the vicinity of the vicinity of the connection pad is completely removed, and the side surface of the connection pad is completely exposed, which may cause a decrease in the bonding strength between the connection pad and the insulating layer.

According to the method proposed in Patent Document 5, after a solder resist layer is formed on a circuit board having a conductor circuit, a partial exposure process is performed, and thereafter, a solder resist layer of the unexposed portion is thinned, and an opening portion is formed in the solder resist layer. And the method of the shape of the dam. The opening of the solder resist layer by this method is an SMD structure, and since the vicinity of the vicinity of the connection pad is covered by the solder resist layer, it is difficult to secure the electrical connection between the electrode terminal of the electronic component and the connection pad corresponding thereto, and sometimes There is a case where the electrical connection between the connection pad and the solder ball is insufficient.

[Patent Literature]

[Patent Document 1] Japanese Patent No. 3346263

[Patent Document 2] International Publication No. 2012/043201

[Patent Document 3] Japanese Laid-Open Patent Publication No. 2012-238668

[Patent Document 4] Japanese Laid-Open Patent Publication No. 05-226505

[Patent Document 5] Japanese Patent Laid-Open Publication No. 2011-77191

An object of the present invention is to provide a circuit board having an insulating layer on both surfaces and a bonding pad formed on the surface of the insulating layer, and both surfaces of the circuit substrate have a solder resist layer to expose a portion of the bonding pad from the solder resist layer In the method of manufacturing a wiring board, a method of manufacturing a wiring board in which no residue of the solder resist layer remains on the exposed connection pads without causing an electrical short between the connection pads exposed from the solder resist layer on both surfaces of the wiring board. Further, another object of the present invention is to provide a method of manufacturing a printed wiring board. It is possible to obtain a printed wiring board having high bonding strength between the bonding pad and the insulating layer and the bonding pad and the solder, and having no electrical breakdown due to the outflow of the adhesive, and having high strength of the solder resist layer.

The inventors of the present invention have found that the above problems can be solved by the following inventions in order to solve the above problems.

(1) A method of manufacturing a wiring board, comprising: a circuit board having an insulating layer on both surfaces and a connection pad formed on a surface of the insulating layer; and having a solder resist layer on both surfaces of the circuit board to partially form a connection pad A method of manufacturing a wiring board in which a solder resist layer is exposed, comprising: a process of forming a solder resist layer having different thicknesses on both surfaces of an electric circuit having an insulating layer and a connection pad formed on a surface of the insulating layer; A); a solder resist layer having a thickness smaller than the first surface of the solder resist layer of the second surface, a process (C1) of performing a post-process (B) exposure process on a portion other than the thinned region; The solder resist layer is subjected to a process (C2) of exposing a portion other than the developed region in the process of the post-process (D); on the first surface, the solder resist layer of the non-exposed portion is used as a bonding pad by the thin film processing liquid a process (B) for exposing one portion of the connection pad to a thickness of the thickness of the connection pad, and a process (C3) for exposing the portion of the process area (B) to the thinned portion of the process (B); And removing the non-exposed portion of the second side with a developer Welding process layer (D).

(2) A method of manufacturing a wiring board, comprising: a circuit board having an insulating layer on both surfaces and a connection pad formed on a surface of the insulating layer; and having a solder resist layer on both surfaces of the circuit board, and a part of the connection pad is A method of manufacturing a wiring board in which a solder resist layer is exposed, comprising: a process of forming a solder resist layer having different thicknesses on both surfaces of an electric circuit having an insulating layer and a connection pad formed on a surface of the insulating layer; A); for the solder resist layer having a thickness thinner than the first surface of the solder mask of the second surface, a process (C1) of performing a post-process (B1) exposure process on a portion other than the thinned region; The solder resist layer is subjected to a process (C2) for exposing a portion other than the developed region in the process of the post-process (D2); and the non-exposed portion is formed by thinning the solution on the first surface in a range where the bonding pad is not exposed; a process for thinning the solder resist layer (B1); a solder resist layer on the first side, a process (C4) for performing a post-process (B2) exposure process on a portion other than the thinned region; on the first side, The film formation treatment liquid is used to make the solder resist layer of the non-exposure portion The process of thinning the thickness of the bonding pad to expose one of the bonding pads (B2); and the process of exposing the soldering layer of the first surface to the portion of the process (B2) which is thinned (C5) And a process of removing the solder resist layer of the non-exposed portion of the second surface by the developer (D).

(3) A method of manufacturing a wiring board, comprising: a circuit board having an insulating layer on both surfaces and a connection pad formed on a surface of the insulating layer; and having a solder resist layer on both surfaces of the circuit board to partially form a connection pad A method of manufacturing a wiring board in which a solder resist layer is exposed, comprising: forming an insulating layer on both surfaces and a surface of a circuit board formed on a connection pad on a surface of the insulating layer, and forming a first solder resist layer having a thickness different from each other Process (A1); the first solder resist layer having a thickness smaller than the first surface of the first solder resist layer of the second surface is subjected to a process of post-process (B) exposure of a portion other than the thinned region (C1) The first solder resist layer on the second surface is subjected to a process (C2) of exposing a portion of the process (D1) to the portion other than the developed region in the post-process; on the first surface, the non-exposed portion is implemented as a thin film processing solution The first solder resist layer is formed into a film having a thickness equal to or less than the thickness of the bonding pad, and a part (b) of the bonding pad is exposed; and the first solder resist layer on the first surface is formed into a thin film in the process (B). Process for exposure of the regional part (C3); after completion to (C3) a second solder resist layer process (A2) is formed on the first solder resist layer on the first surface of the circuit substrate; and the second solder resist layer on the first surface is developed in the post process (D1) a process for exposing a portion outside the region (C6); and a second solder resist layer and a second portion of the non-exposed portion of the first side removed by the developer The process of the first solder mask of the non-exposed portion of the surface (D1).

(4) A method of manufacturing a wiring board, comprising: a circuit board having an insulating layer on both surfaces and a connection pad formed on a surface of the insulating layer; and having a solder resist layer on both surfaces of the circuit board, and a part of the connection pad is A method of manufacturing a wiring board in which a solder resist layer is exposed, comprising: forming an insulating layer on both surfaces and a surface of a circuit board formed on a connection pad on a surface of the insulating layer, and forming a first solder resist layer having a thickness different from each other Process (A1); the first solder resist layer having a thickness smaller than the first surface of the first solder resist layer of the second surface is subjected to a process of post-process (B) exposure of a portion other than the thinned region (C1) The first solder resist layer on the second side is subjected to a process (C2) for exposing a portion of the process other than the developed region in the post-process (D); on the first side, the film is treated with a thin film to make the non-exposure The first solder resist layer of the portion is formed by thinning the thickness of the bonding pad or less to expose one of the bonding pads (B); and the first solder resist layer of the first surface is applied to the film (B) by the film Process for exposure of the region (C3); removal with developer a process (D) of the first solder resist layer of the non-exposed portion of the second surface; a process of forming the second solder resist layer on the first solder resist layer of the first surface of the circuit substrate until the (D) process is completed (A2); for the second solder mask on the first side, implemented in the post-process (D2) a process for exposing a portion other than the developed region (C6); and a process for removing the second solder resist layer of the non-exposed portion of the first face by the developer (D2).

(5) A method of manufacturing a wiring board, comprising: a circuit board having an insulating layer on both surfaces and a connection pad formed on a surface of the insulating layer; and having a solder resist layer on both surfaces of the circuit board, and a part of the connection pad is A method of manufacturing a wiring board in which a solder resist layer is exposed, comprising: forming an insulating layer on both surfaces and a surface of a circuit board formed on a connection pad on a surface of the insulating layer, and forming a first solder resist layer having a thickness different from each other Process (A1); the first solder resist layer on the second side is subjected to a process (C2) of exposing a portion of the process (D1) to the portion other than the developed region in the post-process; on the first side, the film is treated with a thin film processing solution The first solder resist layer of the non-exposed portion is formed by thinning the thickness of the bonding pad or less to expose one of the bonding pads (B); and the first solder resist layer of the first surface is formed in the process (B) a process for exposing a portion of the thinned region (C3); a process for forming a second solder resist layer on the first solder resist layer on the first side of the circuit substrate until the (C3) process is completed (A2); The second solder mask on one side is implemented in the post-process (B3) a process for exposing a portion other than the thinned region (C6); a process for forming a thin film of the second solder resist layer in the non-exposed portion by the thin film processing liquid on the first surface in a range where the bonding pad is not exposed (B3) ; a second solder resist layer on the first surface, a process (C7) of exposing a portion of the process (D1) to the portion other than the developed region, and a second solder resist for removing the non-exposed portion of the first face by the developer The process (D1) of the first solder resist layer of the non-exposed portion of the layer and the second surface.

. (6) A method of manufacturing a wiring board according to any one of the above-mentioned items (1) to (4) of the process (C2) before the process (C1).

. (7) A method of manufacturing a wiring board according to any one of the above-mentioned items (1) to (4) of the process (C1) and the process (C2).

(8) A method of manufacturing a wiring board, which is described in any one of the above items (1), (3), and (4) by performing a process (C3) exposure by a non-contact exposure method in an oxygen atmosphere. A method of manufacturing a wiring board.

(9) A method of manufacturing a wiring board according to the above (5), which is a method of performing the process (C3) and the process (C7) by a non-contact exposure method in an oxygen atmosphere.

(10) A method of manufacturing a wiring board according to the above (2), which is a method of performing the process (C4) and the process (C5) by a non-contact exposure method in an oxygen atmosphere.

(11) The method of manufacturing the wiring board according to the above (1), (3), (4), (8) in which the exposure amount of the process (C3) is one time or more and five times or less the exposure amount of the process (C1). The method of manufacturing a wiring board according to any one of the items.

(12) The method of manufacturing the wiring board, wherein the exposure amount of the process (C3) and the process (C7) is 1 time or more and 5 times or less of the exposure amount of the process (C6), and the above (5) or (9) is described. A method of manufacturing a wiring board.

(13) The method of manufacturing the wiring board, wherein the exposure amount of the process (C4) and the process (C5) is 1 time or more and 5 times or less of the exposure amount of the process (C1), and the above (2) or (10) is described. A method of manufacturing a wiring board.

(14) The method for producing a wiring board, wherein the thinning treatment of the solder resist layer of the process (B) is performed by the thinning treatment surface (1), (3), (4), (8), A method of manufacturing a wiring board according to any one of the items 1 to 4.

(15) The method for producing a wiring board, wherein the thinning treatment of the solder resist layer of the process (B) and the process (B3) is carried out with the thinned surface facing up (5), (9), and (12) A method of manufacturing a wiring board according to any one of the preceding claims.

(16) The method for producing a wiring board, wherein the thinning treatment of the solder resist layer of the process (B1) and the process (B2) is carried out with the thinned surface facing up (2), (10), and (13) A method of manufacturing a wiring board according to any one of the preceding claims.

According to the present invention, there is provided a method of manufacturing a wiring board, comprising: a circuit board having an insulating layer on both surfaces and a connection pad formed on a surface of the insulating layer; and having a solder resist layer on both surfaces of the circuit board to connect the pad A part of the method of manufacturing the wiring board exposed from the solder resist layer does not form between the bonding pads exposed from the solder resist layer on both surfaces of the wiring board. An electrical short circuit occurs, and the residue of the solder resist layer does not remain on the exposed bonding pads. In addition, according to the present invention, it is possible to provide a method for manufacturing a printed wiring board, which can obtain high bonding strength between the bonding pad and the insulating layer and the bonding pad and the flux, and the electrical operation failure caused by the outflow of the glue is not required, and the solder resist layer has high strength. Printed circuit board.

1‧‧‧ circuit substrate

2‧‧‧ solder mask

2-1‧‧‧First solder mask

2-2‧‧‧Second solder mask

3‧‧‧Connecting pads for electronic components and connecting pads for the first side

4‧‧‧Connecting mat for external connection and connecting mat for second side

5‧‧‧Photomask

6‧‧‧Active light

7‧‧‧Conductor wiring

8‧‧‧Insulation

Fig. 1 is a schematic cross-sectional view showing an example of a wiring board.

Fig. 2 is a schematic cross-sectional view showing an example of a wiring board.

Fig. 3 is a schematic cross-sectional view showing an example of a wiring board.

Fig. 4 is a cross-sectional process view showing an example of a method of manufacturing a wiring board of the present invention.

Fig. 5 is a cross-sectional process view showing an example of a method of manufacturing a wiring board of the present invention.

Fig. 6 is a cross-sectional process view showing an example of a method of manufacturing a wiring board of the present invention.

Fig. 7 is a cross-sectional process view showing an example of a method of manufacturing a wiring board of the present invention.

Fig. 8 is a cross-sectional process view showing an example of a method of manufacturing a wiring board of the present invention.

Fig. 9 is a schematic cross-sectional view showing an example of a wiring board manufactured by the present invention.

Fig. 10 is a schematic cross-sectional view showing an example of a wiring board manufactured by the present invention. Figure.

Fig. 11 is a schematic cross-sectional view showing an example of a wiring board manufactured by the present invention.

Fig. 12 is a schematic cross-sectional view showing an example of a wiring board manufactured by the present invention.

Fig. 13 is a schematic cross-sectional view showing an example of a multilayer circuit substrate.

Hereinafter, a method of manufacturing the wiring board of the present invention will be described in detail.

FIGS. 4-1 and 4-2 are diagrams showing a method of manufacturing a wiring board (1). A circuit board having an insulating layer 8 on both surfaces and a conductor wiring 7 formed on the surface of the insulating layer 8 is prepared. One of the conductor wires 7 is connected to the pads 3 and 4. In the process (A), the solder resist layer 2 is formed on both surfaces of the circuit board 1 so as to cover the entire surface. The formation of the solder resist layer 2 on the first surface and the second surface may be performed simultaneously on both surfaces, or may be performed on a surface-by-side basis. However, it is necessary to set a heating condition that does not excessively harden the thickness of the solder resist layer to be formed. The thickness of the solder resist layer 2 on both surfaces is different, and one of the thinner sides is the "first side", and the one of the thicker ones is the "second side". When the solder resist layer 2 is formed under the same conditions on both surfaces, the thickness of the solder resist layer 2 changes in accordance with the density of the conductor wiring 7 including the connection pads 3 and 4 of the respective surfaces. In the case of FIG. 4-1, the density of the conductor wiring 7 on the second side of the lower side is larger than the first surface of the upper side, so that the thickness of the solder resist layer 2 on the conductor wiring 7 on the second side is also larger than that on the conductor wiring 7 of the first surface. Solder mask 2 thickness. In addition, when the wiring board of the electronic component is mounted, the density of the surrounding conductor wiring 7 including the external connection connecting pad 4 on the back surface may be larger than the density of the surrounding conductor wiring 7 including the electronic component connecting connecting pad 3 including the surface. Therefore, the surface is the first side and the back side is the second side.

In the process (C1), the solder resist layer 2 on the first side is exposed to a portion other than the thinned region in the process (B) of the post-process. In the process (C2), the solder resist layer 2 on the second side is exposed to a portion other than the region where the process of the post-process (D) is developed. In the exposed portion of the solder resist layer 2, the solder resist generates photopolymerization, and is resistant to the thin film formation process and the development process.

In the case of the process (B), the film formation treatment liquid is used to form a thin film of the non-exposed portion of the solder resist layer 2 to a thickness equal to or less than the thickness of the connection pad 3, and a part of the connection pad 3 is exposed. When the wiring board of the electronic component is loaded, the exposed connection pad 3 is used as the connection pad 3 for electronic component connection in the process (B). In the process (B), the thin film formation of the solder resist layer 2 of the non-exposed portion of the second surface is simultaneously performed, however, since the solder resist layer 2 on the bonding pad 4 of the second surface is on the bonding pad 3 of the first surface. The solder resist layer 2 is thicker, and the residue of the solder resist layer 2 remains on the bonding pad 4.

In the process (C3), the solder resist layer 2 on the first side is exposed to a portion of the region where the process (B) is thinned. The exposed portion of the solder resist layer 2, the solder resist generates photopolymerization, and is resistant to the development process.

In the process (D), on the second surface, the solder resist layer 2 of the non-exposed portion is removed by a developing solution to expose a part of the bonding pad 4. By process (D), the residue of the solder resist layer 2 remaining on the connection pad 4 is removed. When the wiring board of the electronic component is placed, the connection pad 4 exposed in the process (D) is used as the external connection connection pad 4. In the solder mask layer 2 on the first side, in the portion where the process (B) is thinned, the process (C3) performed before the process (D) is exposed to be resistant to the development process without being removed by the developer. .

In the method (1) of manufacturing the wiring board, the exposure region of the process (C1) can be changed to an arbitrary shape, and by changing the exposure region, for example, a wiring board having a cross-sectional shape as shown in FIG. 9 can be produced. In the case of the ninth a diagram, the convex portion of the solder resist layer 2 is formed between the connection pads 3 on the first surface. In the case of the ninth b, the conductor wiring 7 covered by the connection pad 3 and the solder resist layer 2 exposed from the solder resist layer 2 is alternately arranged on the first surface.

FIGS. 5-1, 5-2, and 5-3 are cross-sectional process diagrams of an example of a method (2) of manufacturing a wiring board. In the method (1) for manufacturing the wiring board, the exposure process and the thinning process of the solder resist layer 2 are added once on the first surface. When the electronic component is placed on the wiring board by the flip chip connection, the thermal stress is applied to the connection portion due to the difference in thermal expansion coefficient between the electronic component and the wiring substrate, and the connection portion is deformed or broken. In order to prevent stress from being concentrated on the joint portion and improve the connection reliability, generally, a resin composition called a filler is used to seal the gap between the electronic component and the wiring board. According to the method (2) for manufacturing a wiring board, it is possible to form a solder resist layer having a two-stage structure of a bank structure for filling a gel between the electronic component and the wiring board.

In the process (A), on both surfaces of the circuit substrate 1, The cover is formed in a comprehensive manner to form the solder resist layer 2. In the process (C1), the solder resist layer 2 on the first side is exposed to a portion of the post-process (B1) which is exposed outside the thinned region. In the process (C2), the solder resist layer 2 on the second side is exposed to a portion other than the region where the process of the post-process (D) is developed.

In the process (B1), the solder resist layer 2 of the non-exposed portion is thinned by the thin film processing liquid on the first surface in a range where the bonding pad 3 is not exposed. In the process (B1), the solder resist layer 2 of the non-exposed portion of the second surface is also thinned.

In the process (C4), the solder resist layer 2 on the first side is exposed to a portion other than the thinned region of the process (B2) of the post-process.

In the process (B2), the film formation treatment liquid is used to form a thin film of the non-exposed portion of the solder resist layer 2 to a thickness equal to or less than the thickness of the connection pad 3 on the first surface, and a part of the connection pad 3 is exposed. When the wiring board of the electronic component is loaded, the exposed connection pad 3 is used as the connection pad 3 for electronic component connection in the process (B2). In the process (B2), the thinning of the solder resist layer 2 of the non-exposed portion of the second surface is also performed simultaneously, because the solder resist layer 2 on the bonding pad 4 of the second surface is more resistant than the bonding pad 3 of the first surface. The solder layer 2 is thicker, and the residue of the solder resist layer 2 remains on the connection pad 4.

In the process (C5), the solder resist layer 2 on the first surface is exposed to a portion of the region where the process (B2) is thinned.

In the process (D), on the second surface, the solder resist layer 2 of the non-exposed portion is removed by a developing solution to expose a part of the bonding pad 4. By the process (D), the residue of the solder resist layer 2 remaining on the bonding pad 4 is removed. When the wiring board of the electronic component is loaded, the bonding pad which will be exposed in the process (D) 4 It is used as the external connection connection pad 4.

In the method (2) of manufacturing the wiring board, the exposure region of the process (C4) can be changed to an arbitrary shape, and by changing the exposure region, for example, a wiring board having a cross-sectional shape as shown in FIG. 10 can be produced. In the case of the 10th c, the convex portion of the solder resist layer 2 is formed between the connection pads 3 on the first surface. In the case of d in FIG. 10, on the first surface, the connection pads 3 exposed from the solder resist layer 2 and the conductor wirings 7 covered by the solder resist layer 2 are alternately arranged.

Fig. 6-1, Fig. 6-2, and Fig. 6-3 are cross-sectional process diagrams of an example of a method (3) of manufacturing a wiring board. Unlike the manufacturing method (2) of the wiring board, the solder resist layer on the first surface is composed of the first solder resist layer 2-1 and the second solder resist layer 2-2. In the method (3) of manufacturing the wiring board, the thickness of the first solder resist layer 2-1 of the non-exposed portion of the first surface is reduced to a thickness equal to or less than the thickness of the connection pad 3, and then the first solder resist layer is formed. The second solder resist layer 2-2 is formed on the surface of 2-1, and after exposure, development processing of the second solder resist layer 2-2 of the non-exposed portion is performed. As a result, in the same manner as in the case of the manufacturing method (2) using the wiring board, it is possible to form a solder resist layer having a two-stage structure of a bank structure for filling the plug between the electronic component and the wiring board.

In the process (A1), the first solder resist layer 2-1 having a different thickness is formed on the first surface and the second surface of the circuit board 1. The formation of the first solder mask layer 2-1 on the first surface and the second surface may be performed on both surfaces at the same time or in one piece, but the heat of the solder resist layer formed may be set corresponding to the thickness of the solder resist layer formed. condition.

In the process (C1), the first solder resist layer 2-1 having a first surface thinner than the first solder resist layer 2-1 of the second surface is subjected to a post-process (B) thinned region. Exposure to the outside part. In the process (C2), the first solder resist layer 2-1 on the second surface is exposed to a portion other than the region where the process (D1) of the post-process is developed.

In the case of the process (B), the first solder resist layer 2-1 of the non-exposed portion is formed into a film thickness equal to or less than the thickness of the connection pad 3 on the first surface, and a part of the connection pad 3 is exposed. . In the process (B), the first solder resist layer 2-1 of the non-exposed portion of the second surface is also thinned at the same time. However, since the first solder resist layer 2-1 on the bonding pad 4 of the second surface is thicker than the first solder resist layer 2-1 on the bonding pad 3 of the first surface, the bonding pad 4 remains on the bonding pad 4 A residue of the solder resist layer 2-1.

In the process (C3), the first solder resist layer 2-1 on the first surface is exposed to a portion of the region where the process (B) is thinned.

In the process (A2), the second solder resist layer 2-2 is formed on the first solder resist layer 2-1 on the first surface of the circuit board until the process (C3). At this time, the relevant heating conditions of the second solder resist layer 2-2 of the first surface are adjusted so that the non-exposed portion of the first solder resist layer 2-1 of the second surface is not excessively thermally hardened.

In the process (C6), the second solder resist layer 2-2 on the first surface is subjected to a post-process (D1) exposure to a portion other than the developing region.

In the process (D1), the second solder resist layer 2-2 of the non-exposed portion of the first surface and the first solder resist layer 2-1 of the non-exposed portion of the second surface are removed by the developer to bond the pad 3 and One of the 4 parts is exposed. With process (D1), The residue of the first solder resist layer 2-1 remaining on the bonding pad 4 is removed. When the wiring board of the electronic component is mounted, the connection pad 3 exposed in the process (D1) is used as the connection pad 3 for electronic component connection, and the connection pad 4 is used as the connection pad 4 for external connection.

Fig. 7-1, Fig. 7-2, and Fig. 7-3 are cross-sectional process diagrams of an example of a method (4) of manufacturing a wiring board. Unlike the manufacturing method (3) of the wiring board, the first solder resist layer 2-1 of the second surface is removed by the developer before the second solder resist layer 2-2 of the first surface is formed. First, when the first solder resist layer 2-2 of the first surface is formed by removing the first solder resist layer 2-1 of the non-exposed portion of the second surface by the developer, it is not necessary to perform the non-exposed portion of the second surface at the same time. The first solder resist layer 2-1 is heated to avoid adjustment of heating conditions for excessive thermal hardening. In the manufacturing method (4) of the wiring board, as in the case of using the manufacturing methods (2) and (3) of the wiring board, it is possible to form a bank structure having a purpose of filling the gap between the electronic component and the wiring board with a plug. The solder mask of the second section.

In the process (A1), the first solder resist layer 2-1 having a different thickness is formed on the first surface and the second surface of the circuit board 1. In the process (C1), the first solder resist layer 2-1 having a first surface thinner than the first solder resist layer 2-1 of the second surface is disposed outside the thinned region in the process (B) of the post-process Partial exposure. In the process (C2), the first solder resist layer 2-1 on the second surface is exposed to a portion other than the region where the process of the post-process (D) is developed.

In the process (B), the first solder resist layer 2-1 of the non-exposed portion is made to have a thickness equal to or less than the thickness of the connection pad 3 on the first surface. As soon as it is thinned, a part of the connection pad 3 is exposed. In the process (B), the first solder resist layer 2-1 of the non-exposed portion of the second surface is also thinned at the same time. However, since the first solder resist layer 2-1 on the bonding pad 4 of the second surface is thicker than the first solder resist layer 2-1 on the bonding pad 3 of the first surface, the first anti-resistance remains on the bonding pad 4. The residue of the solder layer 2-1.

In the process (C3), the first solder resist layer 2-1 on the first surface is exposed to a portion of the region where the process (B) is thinned.

In the process (D), the first solder resist layer 2-1 of the non-exposed portion of the second surface is removed by a developing solution to expose a part of the bonding pad 4. By the process (D), the residue of the first solder resist layer 2-1 remaining on the bonding pad 4 is removed. When the wiring board of the electronic component is placed, the connection pad 4 exposed in the process (D) is used as the external connection connection pad 4.

In the process (A2), the second solder resist layer 2-2 is formed on the first solder resist layer 2-1 on the first surface of the circuit board until the process (D) is completed.

In the process (C6), the second solder resist layer 2-2 on the first surface is subjected to a post-process (D2) exposure to a portion other than the developed region.

In the process (D2), the second solder resist layer 2-2 of the non-exposed portion of the first surface is removed by a developing solution to expose a part of the bonding pad 3. When the wiring board of the electronic component is mounted, the connection pad 3 which exposes the process (D2) is used as the connection pad 3 for electronic component connection.

In the method (3) and (4) of manufacturing the wiring board, the exposure region of the process (C1) can be changed to an arbitrary shape, and by changing the exposure region, for example, the wiring of the cross-sectional shape shown in Fig. 11 can be produced. Substrate. In the eleventh figure, the convex portion of the first solder resist layer 2-1 is formed between the connection pads 3 on the first surface. In the case of Fig. 11 f, the connection pads 3 exposed from the first solder resist layer 2-1 and the conductor wirings 7 covered by the first solder resist layer 2-1 are alternately arranged.

Figs. 8-1, 8-2, and 8-3 are cross-sectional process diagrams of an example of a method (5) of manufacturing a wiring board. In the method (5) of manufacturing the wiring board, the thickness of the first solder resist layer 2-1 is set to be equal to or less than the thickness of the connection pad 3 before the first solder resist layer 2-1 is exposed on the first surface. Thin film treatment. Thereafter, after the second solder resist layer 2-2 is formed on the surface of the first solder resist layer 2-1 and exposed, the second solder resist layer 2-2 of the non-exposed portion is subjected to thinning treatment, and thereafter, again Exposure is performed, and development processing of the second solder resist layer 2-2 of the remaining non-exposed portion is performed. In the manufacturing method (5) of the wiring board, as in the case of using the manufacturing methods (2) to (4) of the wiring board, it is possible to form a bank structure having a purpose of filling the gap between the electronic component and the wiring board with a plug. The solder mask of the second section.

In the process (A1), the first solder resist layer 2-1 having a different thickness is formed on the first surface and the second surface of the circuit board 1. In the process (C2), the first solder resist layer 2-1 on the second surface is subjected to a post-process (D1) exposure to a portion other than the developed region.

In the case of the process (B), the first solder resist layer 2-1 of the non-exposed portion is formed into a thin film at a thickness equal to or less than the thickness of the bonding pad 3 on the first surface, so that all the bonding pads 3 are formed. Part of it is exposed. In the process (B), the first solder resist layer 2-1 of the non-exposed portion of the second surface is also thinned at the same time. However, because the first solder resist layer 2 on the bonding pad 4 of the second side 1 is thicker than the first solder resist layer 2-1 on the connection pad 3 of the first surface, and the residue of the first solder resist layer 2-1 remains on the connection pad 4.

In the process (C3), the first solder resist layer 2-1 on the first surface is exposed to a portion of the region where the process (B) is thinned.

In the process (A2), the second solder resist layer 2-2 is formed on the first solder resist layer 2-1 on the first surface of the circuit board until the process (C3) is completed.

In the process (C6), the second solder resist layer 2-2 on the first surface is exposed to a portion of the post-process (B3) which is exposed outside the thinned region.

In the process (B3), on the first surface, in the range where the connection pad 3 is not exposed, the second solder resist layer 2-2 of the non-exposed portion is thinned by the thin film processing liquid. In the process (B3), the first solder resist layer 2-1 of the non-exposed portion of the second surface is also thinned at the same time. However, the residue of the first solder resist layer 2-1 may remain on the bonding pad 4.

In the process (C7), the second solder resist layer 2-2 on the first surface is subjected to a post-process (D1) exposure to a portion other than the developed region.

In the process (D1), the second solder resist layer 2-2 of the non-exposed portion of the first surface and the first solder resist layer 2-1 of the non-exposed portion of the second surface are removed by a developing solution to make a part of the bonding pad 3 It is exposed again, and at the same time, a part of the connection pad 4 is exposed. By the process (D1), the residue of the first solder resist layer 2-1 remaining on the bonding pad 4 is removed. When the wiring board of the electronic component is mounted, the connection pad 3 exposed by the process (D1) is used as the connection pad 3 for electronic component connection, and the connection pad 4 is used as the connection pad 4 for external connection. To use.

In the manufacturing method (5) of the wiring board, the exposure region of the process (C7) can be changed to an arbitrary shape, and by changing the exposure region, for example, a wiring board having a cross-sectional shape as shown in Fig. 12 can be produced. In the case of the 12th g, the convex portion of the second solder resist layer 2-2 is formed between the connection pads 3 on the first surface. In the case of the 12th h, the connection pads 3 exposed from the first solder resist layer 2-1 and the conductor wiring 7 covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 are alternately arranged. .

The circuit board 1 of the present invention has an insulating layer 8 and connection pads 3 and 4 formed on the surface of the insulating layer 8. On the surface of the insulating layer 8, a conductor wiring 7 is formed, and one of the pads 3 and 4 is connected to the conductor wiring 7. In the wiring board of the present invention, the solder resist layer 2 is provided on both surfaces of the circuit board 1, and one of the connection pads 3, 4 is exposed from the solder resist layer 2. When the wiring board of the electronic component is mounted, the electronic component connection connection pad 3 is provided on the surface, and the external connection connection pad 4 is provided in the back surface. The electronic component connecting connection pad 3 on the surface is used to bond the electronic component, and the external connection connecting pad 4 on the back surface is used to bond the conductor wiring of the external electrical substrate.

The circuit board of the present invention is produced, for example, by an insulating substrate on which conductor wirings are disposed, and an insulating layer for conductor lamination and conductor wiring. 13A and FIG. B are schematic cross-sectional views showing an example of a circuit board produced by laminating an insulating layer and a conductor wiring in an insulating substrate in which conductor wirings are arranged. 4 to 8 are cross-sectional process diagrams showing an example of a method of manufacturing a wiring board of the present invention, and FIGS. 9 to 12 of a schematic cross-sectional view of an example of a wiring board manufactured according to the present invention, showing an insulating layer having one layer. 8 and the circuit board 1 having the conductor wirings 7 formed on the both surfaces of the insulating layer 8, but the circuit board 1 used in the method of manufacturing the wiring board of the present invention is arranged as shown in Figs. 13A and B The insulating substrate having the conductor wiring is formed by alternately laminating the insulating layer for insulation and the conductor wiring, and is included in the circuit board 1 having the insulating layer 8 and the conductor wiring 7 formed on the surface of the insulating layer 8 on both surfaces. The insulating substrate is, for example, a resin substrate made of an electrical insulating material or the like which is made of a thermosetting resin such as a bismaleimide-triazole resin or an epoxy resin. The insulating layer for the build-up is, for example, an electrical insulating material in which a glass cloth is impregnated with a thermosetting resin, or an inorganic insulating material such as cerium oxide is dispersed in an electrical insulating material such as a thermosetting resin such as an epoxy resin. The conductor wiring is formed, for example, by elimination, semi-addition, addition, or the like. In the erasing method, for example, after a copper layer is formed on the insulating layer, a resist layer is formed, and exposure, development, etching, and photoresist removal are performed to form a conductor wiring. In the case of the semi-addition, an underlying metal layer for electrolytic copper plating is disposed on the surface of the insulating layer by electroless copper plating. Next, an electroplated resist layer having an opening corresponding to the conductor wiring is formed, and an electrolytic copper plating layer is formed on the surface of the underlying metal layer exposed by electrolytic copper plating. Thereafter, the plating resist is peeled off, and the exposed underlying metal layer is removed by flash etching to form a conductor wiring.

When the wiring board of the electronic component is mounted, the connection pad on the surface of the wiring board is used to connect the connection pads of the electronic component. The electronic component is electrically connected to the solder bump via the connection pad, and the coated crystal is assembled on the wiring substrate. In order to improve the adhesion of the solder resist layer, roughening treatment or coupling agent treatment may be performed on the surface of the bonding pad. The connection pad on the back of the wiring board A connection pad for external connection. The connection pad is electrically connected to the conductor wiring of the external electrical board such as the motherboard via the solder bump, and is flip-chip mounted on the motherboard.

As the solder resist of the present invention, an alkaline development type solder resist can be used. Further, either a liquid-based or two-liquid liquid solder resist may be used, or a dry film photoresist may be used. The solder resist includes, for example, an alkali-soluble resin, a monofunctional acrylic monomer, a polyfunctional acrylic monomer, a photoinitiator, an epoxy resin, an inorganic filler, and the like.

The alkali-soluble resin is, for example, an alkali-soluble resin having both photocurability and thermosetting properties, for example, a secondary hydroxy group-added acid anhydride of an epoxy acryl resin and an epoxy acryl resin. Resin. A polyfunctional acrylic monomer, for example, Trimethylol Propane Triacrylate, Di-pentaerythritol Polyacrylate, Pentaerythritol Triacrylate, or the like. Photoinitiator, for example, 2-methyl-1-(4-methylphenylthio)-2- morphine-n-propyl-1-one (2-Methyl-1-(4-Methylthiophenyl)-2 -Morpholinopropan-1-one) and so on. Epoxy resin, used as a hardener. By bridging with a carboxylic acid of an alkali-soluble resin, bridging is carried out, and the characteristics of heat resistance and chemical resistance are improved. However, since a carboxylic acid and an epoxy group react at normal temperature, storage stability is poor, and alkali development is performed. Type solder resists are generally in a two-liquid form that is mixed prior to use. Inorganic fillers, for example, talc, vermiculite, barium sulfate, titanium oxide, zinc oxide, and the like.

The solder resist layer is covered on both surfaces of the circuit board The way to form. For the formation of the solder resist layer, for example, a liquid solder resist, a screen printing method, a roll coating method, a spray method, a dipping method, a curtain coating method, a bar coating method, an air knife method, a hot melt method, and a gravure coating method can be used. Cloth method, brush coating method, and plate printing method. In addition, in the case of a film-like solder resist, a stacking method and a vacuum stacking method are used.

The solder resist layer 2 formed by the manufacturing method (1) and (2) of the wiring board, and the first method (A1) of the wiring board manufacturing method (3) to (5) The solder resist layer 2-1 has a thickness different from each other on both surfaces of the circuit board, and one of the thinner portions is the "first surface", and the thicker one is the "second surface". When a solder resist layer is formed on both surfaces of a circuit board, the same conditions are generally set for both surfaces. This is because the solder resist has thermosetting properties. In the case of a liquid solder resist, since it is necessary to perform heat drying for the purpose of solvent removal after coating, if the coating amount of each surface is different, it is necessary to change the drying conditions depending on each surface. However, it is necessary to set the drying conditions. Conditions for excessive heat hardening. In addition, in the case of dry film photoresist, since it is necessary to heat during lamination, if dry film photoresists having different thicknesses are used for each surface, it is necessary to change the heating conditions at the time of lamination according to each surface. However, at this time, it is necessary to set Conditions that will be excessively hardened. As described above, the thickness of the solder resist layer on each surface, the heating and drying conditions, and the like are not changed, and the same conditions as those of the solder resist layer on both surfaces, the thickness, and the heating and drying conditions can be used to make the work process simpler and more preferable.

When the solder resist layer is formed under the same conditions on both surfaces of the circuit board, the thickness of the solder resist layer varies depending on the density of the conductor wiring around the connection pads of the respective surfaces. For example, a wiring base for loading electronic components When the outer surface of the panel is connected to the area array by the connection pad, the density of the conductor wiring around the surface including the connection pad for the electronic component connection is included in the periphery of the back surface including the external connection connection pad. The conductor wiring density is large. As a result, the thickness of the solder resist layer on the connection pads for external connection on the back surface is thicker than the thickness of the solder resist layer on the connection pads for electronic component connection on the surface. At this time, the surface is the first side and the back side is the second side.

The process for thinning the solder resist layer of the present invention comprises a micellization treatment (thinning treatment) of micelleizing the solder resist layer of the non-exposed portion by a thin film processing liquid, and a micelle removing liquid The process of removing the micelles of the micelles is removed. Further, the method may include: washing the unremoved micelles with water, washing the remaining thin film processing liquid, and the micelle removing liquid, and drying the water washing water.

The film formation treatment (myiselation treatment) refers to a treatment in which the micelle of the solder resist layer of the non-exposed portion is subjected to micellization by the thin film treatment liquid to make the micelle insoluble in the thin film treatment liquid.

As the film forming treatment liquid of the present invention, an alkaline aqueous solution can be used. It can be used as an alkaline aqueous solution for use as a thin film treatment liquid, for example, Alkali Metal Silicate, Alkali Metal Hydroxide, Alkali Metal Phosphate, alkali metal carbonate An aqueous solution of an inorganic basic compound such as a salt (Alkali Metal Carbonate), an ammonium phosphate or an ammonium carbonate; monoethanolamine, diethanolamine, triethanolamine, methylamine, dimethylamine, ethylamine, diethylamine, triethylamine, Cyclohexylamine, Tetramethylammonium Hydroxide, TMAH, Tetraethyl Hydrogen An aqueous solution of an organic basic compound such as ammonium oxide or trimethyl-2-hydroxyethylammonium hydroxide (choline, Choline). An alkali metal such as lithium, sodium, potassium or the like. The inorganic basic compound and the organic basic compound may be used singly or in combination of plural kinds. Combinations of inorganic basic compounds with organic basic compounds can also be used.

Further, in order to make the surface of the solder resist layer more uniform, it is also possible to add a sulfate or a sulfite to the thin film processing liquid. Sulfate or sulfite, for example, an alkali metal sulfate or a sulfite of magnesium, sodium or potassium, or an alkaline earth metal sulfate or sulfite of magnesium or calcium.

a thin film treatment liquid in which an inorganic basic compound selected from alkali metal carbonates, alkali metal phosphates, alkali metal hydroxides, alkali metal silicates, and TMAH (tetramethyl group) are further contained. Any one of the organic basic compounds selected from the group consisting of ammonium hydroxide and choline, and the content of the inorganic basic compound and the organic basic compound is 3 to 25% by mass of the thin film treatment liquid because the surface can be made It is more uniform and thinner and more suitable for use. When it is less than 3% by mass, the film formation treatment may be uneven. In addition, when it exceeds 25% by mass, precipitation of an inorganic basic compound may occur easily, and the aging stability and workability of the liquid may be deteriorated. The content of the basic compound is preferably 5 to 20% by mass, more preferably 7 to 15% by mass. The pH of the film-forming treatment liquid is preferably 10 or more. Further, a surfactant, an antifoaming agent, a solvent, or the like may be added as appropriate.

When the solder resist layer is thinned, the presence of the inorganic filler which is insoluble in the thin film processing liquid contained in the solder resist layer cannot be ignored. The size of the inorganic filler varies with its type and has a supermicron called nanofiller. A certain particle size distribution up to a few tens of micrometers is present in the layer in an amount of 30 to 70% by mass. Thin film formation, after the alkaline compound is impregnated into the solder resist layer, the micelle of the solder resist layer is subjected to the micelle removal process. However, due to the presence of the insoluble inorganic filler, the impregnation of the basic compound is suppressed, and the thin film is formed. The speed is slower.

The impregnation of the basic compound by the inorganic filler is not particularly limited as long as the pH of the thin film treatment liquid is 12.5 or more, and more preferably 13.0 or more. The higher the pH of the film-forming treatment liquid, the larger the swelling of the solder resist layer when the alkaline compound is impregnated, and the less susceptible to the impregnation of the inorganic filler.

In the present invention, when a part of the connection pads of the first surface is exposed by thinning, the exposed connection pads can be used as the connection pads for electronic component connection. Usually, the surface of the connection pad is roughened, and the anchoring effect is used to improve the adhesion between the connection pad and the solder resist layer, and the high insulation reliability for a long period of time can be maintained. In the conventional solder resist pattern formation, when the solder resist layer is removed to expose the surface of the bonding pad, a low-concentration sodium carbonate aqueous solution having excellent dispersing ability is generally used as a developing solution, and a solder resist layer hardly occurs on the surface of the bonding pad. Residue. However, when the film of the solder resist layer is formed by using a low-concentration sodium carbonate aqueous solution, the in-plane uniform film formation cannot be obtained, and the in-plane unevenness occurs.

The temperature of the thin film treatment liquid is preferably 15 to 35 ° C, preferably 20 to 30 ° C. When the temperature is too low, the penetration speed of the alkaline compound to the solder resist layer may be slow, and it takes a long time to form a thin film of a desired thickness. On the other hand, if the temperature is too high, because of the micelle removal process and soldering prevention The micelleization of the layer components is carried out at the same time, and sometimes the film thickness unevenness is likely to occur in the plane, and should be avoided.

In the thin film formation treatment by the thin film treatment liquid, a method such as immersion treatment, slurry agitation treatment, spray treatment, painting, and scraping may be employed. However, the immersion treatment is preferred. In the treatment method other than the immersion treatment, bubbles are likely to be generated in the thin film-forming treatment liquid, and the generated bubbles adhere to the surface of the solder resist layer during film formation, and the film thickness may be uneven. When using a spray treatment or the like, it is preferred to minimize the spray pressure so that bubbles do not occur.

After the film formation treatment is carried out by the film formation treatment liquid, and the micelle removal treatment for removing the micelles of the solder resist component which is insoluble in the film formation treatment liquid is carried out, the micelles are dissolved and removed by the spray of the micelle removal liquid.

As the micelle removing liquid, tap water, industrial water, pure water or the like can be used. Further, an aqueous solution containing pH 5 to 10 of any one of an inorganic basic compound selected from an alkali metal carbonate, an alkali metal phosphate or an alkali metal citrate is used as a micelle removing liquid, and is easily dissolved. The solder resist component of the filming treatment liquid is redispersed. When the Ph of the micelle removing liquid is less than 5, the solder resist layer may aggregate to become insoluble sludge and adhere to the surface of the thinned solder resist layer. On the other hand, when the pH of the micelle removing liquid exceeds 10, the micelleization of the solder resist layer and the micelle removal process are promoted, and the film thickness unevenness is likely to occur in the surface. Further, the micelle removing liquid can adjust the pH by sulfuric acid, phosphoric acid, hydrochloric acid or the like.

The spray conditions for the micelle removal treatment will be described. The spray conditions (temperature, time, and spray pressure) were appropriately adjusted in accordance with the dissolution rate of the solder resist layer of the film formation treatment. Specifically, the treatment temperature is preferably 10 to 50 ° C, and more preferably 22 to 50 ° C. When the temperature of the aqueous solution is less than 10 ° C, the solder resist component may be poorly dissolved, and the residue of the solder resist layer may be easily left on the surface of the roughened joint pad. On the other hand, if it exceeds 50 ° C, the problem of temperature management of evaporation or continuous operation of the aqueous solution may occur, and the design of the apparatus is limited and should be avoided. Further, the spray pressure is preferably 0.01 to 0.5 MPa, more preferably 0.1 to 0.3 MPa. The supply flow rate of the micelle removing liquid is preferably 0.030 to 1.0 L/min per 1 cm ² of the solder resist layer, more preferably 0.050 to 1.0 L/min, and most preferably 0.10 to 1.0 L/min. When the supply flow rate is within this range, the insoluble component does not remain on the surface of the solder resist layer after the film formation, and the micelle can be removed substantially uniformly in the plane. When the supply flow rate per 1 cm ² of the solder resist layer is less than 0.030 L/min, the insoluble component of the solder resist layer may remain. On the other hand, when the supply flow rate exceeds 1.0 L/min, components such as pumps required for supply are large, and large-scale devices are sometimes required. Further, when the supply amount exceeds 1.0 L/min, the effect of dissolving and removing the solder resist layer is not changed.

The thickness of the solder resist layer 2 and the first solder resist layer 2-1 around the bonding pad 3 exposed on the first surface, and the solder resist layer 2 as the part of the dam for filling the plug, the first solder resist layer 2 -1 and the thickness of the second solder resist layer 2-2, the manufacturing method of the wiring board (1) and (2), and the manufacturing method of the wiring board (3) to (5) (A1) The thickness of the solder resist layer 2 formed on the first surface of (A2), the thickness of the first solder resist layer 2-1 and the second solder resist layer 2-2, and the method of manufacturing the wiring board (1), (3) Process (B) of ~(5), manufacturing method of wiring board (2) The solder mask 2, the first solder resist layer 2-1 and the second solder resist layer 2 of the non-exposed portion of the first surface of the process (B1) and (B2), the process (5) of the method for manufacturing the wiring substrate (B3) The amount of filming of -2 is determined. Further, in the case of the present invention, the filming amount can be appropriately adjusted in a range of 0.01 to 500 μm. The height of the solder resist layer 2 which is thinned to the thickness of the connection pad to the surface of the connection pad 3 exposed from the surface of the first solder resist layer 2-1, and thereafter, can be appropriately adjusted in accordance with the necessary solder amount. Adjustment. In addition, the thickness of the solder resist layer 2, the first solder resist layer 2-1, and the second solder resist layer 2-2, which is part of the dam for filling the plug, may correspond to the size of the electronic component and the connection of the electronic component. The size of the terminal and the amount of glue filled between the electronic component and the wiring substrate are appropriately adjusted.

In the method (6) of manufacturing the wiring board, the process (C2) is performed before the process (C1) of the method (1) to (4) of the method of manufacturing the wiring board. Further, in the method (7) of manufacturing the wiring board, the process (C1) and the process (C2) of the manufacturing methods (1) to (4) of the wiring board are simultaneously performed. As described above, in the manufacturing method (1) to (4) of the wiring board, the order of the process (C1) and the process (C2) may be replaced, or the process (C1) and the process (C2) may be simultaneously performed.

In the process (C1) of the method of manufacturing the wiring board (1), the solder resist layer 2 on the first surface is selectively exposed to a portion other than the region thinned by the process (B) of the post-process. In the process (C1) of the method for manufacturing the wiring board (2), the solder resist layer 2 on the first surface is selectively exposed to a portion other than the region thinned by the process (B1) of the post-process. Manufacturing method (3) and (4) of wiring board (C1) In the case of the first solder resist layer 2-1 on the first side, the exposure of the portion other than the thinned region of the process (B) of the post-process is selectively performed. In the process (C4) of the method for manufacturing the wiring board (2), the solder resist layer 2 on the first surface is selectively exposed to a portion other than the region thinned by the process (B2) of the post-process. In the process (C6) of the method for manufacturing the wiring substrate (3) and the process (C7) for the method of manufacturing the wiring substrate (5), the second solder resist layer 2-2 on the first surface is selectively subjected to a post process. The exposure of the portion outside the area developed by the process (D1). In the process (C6) of the method (4) of manufacturing the wiring board, the second solder resist layer 2-2 on the first surface is selectively exposed to a portion other than the region developed by the process (D2) of the post-process. In the process (C6) of the method (5) for manufacturing the wiring board, the second solder resist layer 2-2 on the first surface is exposed to a portion other than the thinned region in the post-process (B3) process. The exposed solder resist generates photopolymerization, and the solder resist layer 2, the first solder resist layer 2-1, and the second solder resist layer 2-2 are hardened. In the drawings 4-1 to 8-3, the exposure of the active light 6 is performed by the mask 5, but it can also be carried out by direct drawing. The exposure mode may be, for example, a reflection image exposure method using a xenon lamp, a high pressure mercury lamp, a low pressure mercury lamp, an ultra high pressure mercury lamp, a UV fluorescent lamp as a light source, and a contact exposure method using a reticle, a proximity method, a projection method, and a laser. Scan exposure method, etc. The "thinned region" on the first side is, for example, a peripheral region of the connection pad on the connection pad or including the connection pads. More specifically, it is a mounting area for the purpose of loading an electronic component and its surroundings.

Manufacturing method of wiring board (1) and (2) In the case of (C2), the solder resist layer 2 on the second surface is selectively exposed to a portion other than the region developed by the process (D) of the post-process. In the process (C2) of the method (4) of manufacturing the wiring board, the first solder resist layer 2-1 on the second surface is selectively exposed to a portion other than the region developed by the process (D) of the post-process. In the manufacturing method (3) of the wiring board and the process (C2) of (5), the first solder resist layer 2-1 on the second surface is selectively subjected to the process of developing the post-process (D1). Part of the exposure. The exposed solder resist generates photopolymerization, and the solder resist layer 2 and the first solder resist layer 2-1 are hardened. The exposure method can be the same as the process (C1) of the above-described method (1) of manufacturing the wiring board. The "developed region" of the second surface is, for example, a peripheral region of the connection pad on the connection pad or including the connection pads. More specifically, for the purpose of mounting the conductor wiring of the external electric board, a circular opening portion region in which a part of the connection pad of the area array type is exposed is exposed.

In the process (C3) of the method (1) of manufacturing the wiring board, the solder resist layer 2 on the first surface is exposed to a portion of the region where the process (B) is thinned. In the manufacturing method (3) to (5) of the wiring board (C3), the first solder resist layer 2-1 on the first surface is exposed to a portion of the region where the process (B) is thinned. In the process (C5) of the method (2) of manufacturing the wiring board, the solder resist layer 2 on the first surface is exposed to a portion of the region where the process (B2) is thinned. The exposure method can be the same as the process (C1) of the above-described method (1) of manufacturing the wiring board. Process for manufacturing wiring board (1), process (3) to (5) (C3), and process for manufacturing wiring board (2) (C5) After that, the solder resist layer 2 of the non-exposed portion, the first solder resist layer 2-1, and the second solder resist layer 2-2 are developed and removed (the manufacturing method (1), (2), and (of the wiring board) 4) Process (D), manufacturing method (3) of wiring board, process (D1) of (5), and process (D2) of manufacturing method (4) of wiring board, and it is necessary to implement formation of final soldering layer Exposure of the area to cause photopolymerization of the solder resist. The exposed portion of the manufacturing method (1), (3), and (4) of the wiring substrate is included in at least the portion of the process (B) which is thinned, and includes the portion exposed by the process (C1). And the boundary between the thinned areas of the process (B) is better. Further, the exposed portion of the process (C5) of the method for manufacturing the wiring substrate (2) is included at least in the region where the process (B2) is thinned, and includes the portion exposed by the process (C4) and the process (B2). The realm of the thinned area is better.

Method for manufacturing wiring board (1) to (4) (C1), method for manufacturing wiring board (1), (3) to (5), (C3), wiring board manufacturing method (1)~( 5) Process (C2), Process for Manufacturing a Wiring Substrate (2) Process (C4) and (C5), Process for Manufacturing a Wiring Substrate (3) to (5) Process (C6), and Method of Manufacturing a Wiring Substrate (5) The exposure amount of the process (C7) can be appropriately determined according to the sensitivity of the solder resist. Specifically, the manufacturing method (1) of the wiring board, the process (B) of (3) to (5), the process (B1) and (B2) of the manufacturing method (2) of the wiring board, and the manufacturing method of the wiring board (5) Process (B3), thin film processing liquid used, or manufacturing method of wiring board (1), (2), (4) process (D), wiring board manufacturing method (3) In the process (D1) of (5) and the process (D2) of the method of manufacturing the wiring board (4), the solder resist is photopolymerized as long as the solder resist is not dissolved or swollen to the developer used. And it can be hardened, usually 100~600mJ/cm ² .

Process for manufacturing wiring board (1), (3), (4), (C3), wiring board manufacturing method (2), (C4) and (C5), and wiring board manufacturing method (5) The exposure of (C3) and process (C7) is preferably carried out in a non-contact exposure mode in an oxygen atmosphere. The non-contact exposure method is, for example, a proximity method in which a gap is disposed between the photomask and the wiring substrate, and a direct contact method in which the exposure is performed in a non-contact manner, a projection method, and a direct drawing method in which the photomask is not used. In the state in which the support layer film is not provided on the solder resist layer 2, the first solder resist layer 2-1, and the second solder resist layer 2-2, non-contact exposure in an oxygen atmosphere is performed, and the vicinity of the surface layer of each solder resist layer is Photopolymerization from the surface of the solder resist layer to a depth of 0 to 0.5 μm is hindered by the influence of oxygen and becomes an uncured portion, and only the portion which leaves the surface layer is hardened. Therefore, the process (D) of the method (1) of manufacturing the wiring board, the processes (B2) and (D) of the method (2) of manufacturing the wiring board, the process (D1) of the method (3) of manufacturing the wiring board, Process (D) and (D2) of the manufacturing method (4) of the wiring board, and the process (D1) of the manufacturing method (5) of the wiring board, the uncured portion near the surface layer is removed, and the solder resist layer 2 is prevented. The surfaces of the solder layer 2-1 and the second solder resist layer 2-2 are roughened. When the surface of the solder resist layer around the connection pad for electronic component connection on the surface of the wiring board is roughened, when compared with smoothing, The adhesiveness of the glue is stronger, and as a result, the stress caused by the thermal shock can be prevented from being concentrated on the joint portion between the electronic component and the wiring board, and the connection reliability can be further improved. The surface of the solder resist layer 2, the first solder resist layer 2-1, and the second solder resist layer 2-2 is roughened by non-contact exposure in an oxygen atmosphere, thereby improving the adhesion of the filler. And get high link reliability. In order to improve the adhesion of the filler, the surface roughness Ra of the solder resist layer is preferably 0.30 μm or more and 0.50 μm or less. When the surface roughness Ra exceeds 0.50 μm, the solder resist strength is lowered, and insulation reliability may not be obtained. The surface roughness Ra is an arithmetic mean surface thickness.

The exposure amount of the manufacturing method (1), (3), (4) of the wiring substrate (C3), and the manufacturing process (C4) and (C5) of the manufacturing method of the wiring substrate, by the process (C1) The exposure amount is preferably 1 time or more and 5 times or less, and more preferably 1.5 times or more and 3 times or less. Similarly, the exposure amount of the process (C3) and the process (C7) of the method (5) for manufacturing the wiring substrate is preferably 1 time or more and 5 times or less, more preferably 1.5 times or more, of the exposure amount of the process (C6). , 3 times or less. In the non-contact exposure in an oxygen environment, by providing an exposure amount which is more than necessary for the solder resist to be dissolved or swollen, the polymerization caused by oxygen on the surface of the solder resist layer can be inhibited from being inhibited. At the smallest. The larger the amount of exposure, the more effective the suppression of polymerization hindrance. However, if the amount of exposure is too large, the resolution of the solder resist is deteriorated and the exposure time is too long, so it should be avoided.

Process for manufacturing wiring board (1), process (B) of (3) to (5), and process for manufacturing wiring board (2) (B2) At the time of the first surface, the solder resist layer 2 and the first solder resist layer 2-1 of the non-exposed portion are formed into a film thickness equal to or less than the thickness of the connection pad 3, and the bonding pad 3 is formed. Part of it is exposed. In the process (B1) of the method for manufacturing the wiring board (2) and the process (B3) of the method (5) for manufacturing the wiring board, the film is formed on the first surface in a range in which the connection pad 3 is not exposed. Thinning of the solder resist layer 2 and the second solder resist layer 2-2 in the non-exposed portion. When the support layer film is disposed using a film-like solder resist, the support layer film is peeled off and then thinned.

In the manufacturing method (1) of the wiring board, the process (B) of (3) to (5), and the process (B2) of the manufacturing method (2) of the wiring board, the solder resist layer 2 and the thinned film are formed. The thickness of the solder resist layer 2-1 is thinned as long as the thickness of the connection pad 3 exposed on the first surface is the same or thinner. If the thickness of the solder resist layer 2 and the first solder resist layer 2-1 after being thinned is too thin, the electrical insulation between the exposed connection pads 3 is insufficient, and a short circuit of electroless nickel/gold plating may occur, or Sometimes, a short circuit caused by flux occurs between the bonding pads 3. Therefore, the thickness of the solder resist layer 2 and the first solder resist layer 2-1 after the film formation is preferably one-third or more of the thickness of the bonding pad 3, and more preferably two-thirds or more.

In the process (B) of the method of manufacturing the wiring board (1) and the processes (B1) and (B2) of the method (2) of manufacturing the wiring board, the solder resist layer 2 of the non-exposed portion of the first surface is thinned. The solder resist layer 2 of the non-exposed portion of the second surface is also thinned at the same time. In the manufacturing process (3) to (5) of the wiring board, the first solder resist layer 2-1 of the non-exposed portion of the first surface is thinned, and the first portion of the non-exposed portion of the second surface is formed. Solder mask 2 1 is also thinned at the same time. In the process (B3) of the method (5) of manufacturing the wiring board, the second solder resist layer 2-2 of the non-exposed portion of the first surface is thinned, and the first solder resist layer 2 of the non-exposed portion of the second surface is formed. 1 is also thinned at the same time. The amount of film formation of the second surface differs depending on the solder resist layer 2 of the non-exposed portion of the second surface and the heat-hardened state of the first solder resist layer 2-1, however, the same heating conditions are applied to both surfaces. When the solder resist layer 2 and the first solder resist layer 2-1 are formed, generally, the solder resist layer 2 of the non-exposed portion of the first surface and the second surface and the first solder resist layer 2-1 are simultaneously The same amount of filming.

Process for manufacturing wiring board (1), process (B) of (3) to (5), process (B1) and (B2) of method for manufacturing wiring board (2), and method for manufacturing wiring board (5) In the process (B3), it is preferable to carry out the film forming treatment with the first side facing up. The treatment method of the film formation treatment is an effective method for immersion treatment in order to prevent bubbles from occurring in the film formation treatment liquid. In the case where air bubbles are generated in the thin film processing liquid, the air bubbles float in the thin film processing liquid and adhere to the surface of the lower (second surface) solder resist layer 2 and the first solder resist layer 2-1. The adhesion of the bubbles may result in a non-uniform film thickness after the second surface is thinned. However, the manufacturing method (1), (2), and (4) of the wiring substrate in the post-process, the manufacturing method (3) of the wiring board, and the process (D1) of the wiring substrate (D1), and the wiring substrate In the process (D2) of the manufacturing method (4), since the solder resist layer 2 of the non-exposed portion of the second surface and the first solder resist layer 2-1 are developed and removed, there is no problem that film thickness unevenness eventually occurs.

In the manufacturing method (1) of the wiring board and the process (D) of (2), the solder resist layer 2 of the non-exposed part of the second surface is removed by development. In the process (D) of the method (4) of manufacturing the wiring board, the first solder resist layer 2-1 of the non-exposed portion of the second surface is removed by development. In the manufacturing method (3) and (5) of the wiring board (D1), the second solder resist layer 2-2 of the non-exposed portion of the first surface and the non-exposed portion of the second surface are removed by development. A solder mask layer 2-1. In the process (D2) of the manufacturing method (4) of the wiring board, the second solder resist layer 2-2 of the non-exposed portion of the first surface is removed by development. In the developing method, the surface of the circuit board is sprayed with a developer conforming to the solder resist to be used, and unnecessary portions of the solder resist layers are removed. The developer is a thin alkaline aqueous solution, and generally, a 0.3 to 3% by mass aqueous sodium carbonate solution or an aqueous potassium carbonate solution is used.

[Examples]

Hereinafter, the present invention will be described in more detail by way of examples, however, the invention is not limited thereto.

Examples 1 to 6 are related examples of the method (1) for manufacturing the wiring board shown in Figs. 4-1 and 4-2.

(Example 1) <Process (A)>

The circuit board 1 (having an area of 170 mm × 200 mm, a conductor thickness of 15 μm, and a substrate thickness of 0.4 mm) on which conductor wirings 7 were formed on both surfaces was produced by a half addition method. On the surface (first surface) side, there is a conductor wiring having a line width of 25 μm and a spacing of 50 μm which is used as the connection pad 3 for electronic component connection. On the back side (second side) side, a connection pad 4 as an external connection is formed. A circular conductor wire having a diameter of 600 μm was used. Next, a 25 mm-thick solder mask (manufactured by TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) was vacuum-compressed using a vacuum laminator (lamination temperature: 75 ° C, suction time: 30 seconds). The pressurization time is 10 seconds) on both surfaces of the circuit board 1 described above. Thereby, the solder resist layer 2 is formed. In the solder resist layer 2 of the first surface, the thickness from the surface of the insulating layer 8 was 30 μm, and the thickness of the connection pad 3 for electronic component connection was 15 μm. In the solder resist layer 2 of the second surface, the thickness from the surface of the insulating layer 8 was 38 μm, and the thickness of the external connection connecting pad 4 was 23 μm. On the first side where the conductor wiring density is small, the thickness of the solder resist layer 2 is 8 μm thinner than the second surface having a larger conductor wiring density.

<Process (C1)>

For the solder resist layer 2 of the first surface, the photomask 5 of the pattern of the active light rays 6 is irradiated with a region in which the end portion of the connection pad 3 of the plurality of electronic component connection is 200 μm and the outer side is irradiated with an exposure amount of 200 mJ/cm. ² Implementation of contact exposure.

<Process (C2)>

In the solder resist layer 2 on the second surface, a circular opening portion having a diameter of 500 μm is disposed on the external connection connecting pad 4, and the mask 5 that irradiates the pattern of the active light 6 to the outside of the circular opening portion is exposed. Contact exposure was carried out at a quantity of 200 mJ/cm ² .

<Process (B)>

After peeling off the support layer film on the first surface and the second surface of the solder resist layer 2, using a 10% by mass aqueous sodium metasilicate solution (liquid temperature: 25 ° C) as a thin film treatment liquid, with the first side facing up, The circuit board 1 was immersed in the thin film processing liquid for 50 seconds, and subjected to micellization treatment (thinning treatment). Thereafter, a micelle removal treatment, a water washing treatment (liquid temperature: 25 ° C), and a drying treatment using a spray of a micelle removal liquid (liquid temperature: 25 ° C) were carried out to obtain a solder resist layer 2 of the non-exposed portion of the first surface. When the thickness is 5.0 μm below the surface of the connection pad 3 for electronic component connection, the solder resist layer 2 having an average thickness of 20 μm is formed into a thin film. Observation by an optical microscope revealed that the surface of the solder resist layer 2 on the first side was not unevenly treated, and good in-plane uniformity was obtained. On the other hand, on the second surface, the solder resist layer 2 having an average of 20 μm is also thinned, and the bubbles in the thin film processing liquid adhere to the solder resist layer 2 of the non-exposed portion of the second surface, and a portion having uneven film thickness appears. . Further, on the external connection connecting pad 4, a residue of the solder resist layer 2 of about 3 μm remains.

<Process (C3)>

For the solder mask layer 2 on the first surface, the photomask 5 which irradiates the active light ray 6 to the region of the region which is thinned by the process (B) and the region from the outer side of the boundary portion of the thinned region of 200 μm is exposed. Exposure was carried out by non-contact exposure in an oxygen atmosphere of 400 mJ/cm ² .

<Process (D)>

Use 1% by mass aqueous sodium carbonate solution (liquid temperature 30 ° C, spray The development was carried out for 30 seconds under a pressure of 0.15 MPa), and the solder resist layer 2 of the non-exposed portion of the second surface was removed. As a result of observing with an optical microscope, the residue of the solder resist layer 2 was not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. In the first surface, the solder resist layer 2 is filled between the electronic component connecting connecting pads 3 until the surface of the electronic component connecting connecting pad 3 is 5.5 μm lower. By the non-contact exposure in the oxygen atmosphere of the process (C3), photopolymerization of the surface of the solder resist layer 2 between the connection pads 3 for electronic component connection is suppressed, and as a result, the thickness of the solder resist layer 2 is reduced by 0.5 μm.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm is covered by the solder resist layer 2 having a thickness of 30 μm on the first surface, and the connecting pad 3 for connecting the electronic component having a thickness of 15 μm is exposed, and the connecting member for connecting adjacent electronic components is connected. Between the pads 3, a solder resist layer 2 having a thickness of 9.5 μm is filled. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the solder resist layer 2 having a thickness of 38 μm and a diameter of 500 μm, and a part of the external connection connecting pad 4 is exposed. .

Next, the surface roughness of the solder resist layer 2 between the adjacent electronic component connecting pads 3 is measured. When the surface thickness was measured using an ultra-depth shape measuring microscope (manufactured by KEYENCE CORPORATION, product number "VK-8500"), the surface roughness Ra was 0.40 μm.

The arithmetic mean surface roughness Ra of the ultra-depth shape measuring microscope (manufactured by KEYENCE CORPORATION, product number "VK-8500") was calculated using the JIS B0601-1994 surface thickness-definition. Further, the measurement area was 900 μm ² and the reference length was 40 μm.

(Example 2)

The process (A) to the process (D) were carried out in the same manner as in Example 1 except that the order of the process (C1) and the process (C2) was replaced. As a result of observing with an optical microscope, the residue of the solder resist layer 2 was not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. In the first surface, the solder resist layer 2 is filled between the electronic component connecting connecting pads 3 until the surface of the electronic component connecting connecting pad 3 is 5.5 μm lower. By the non-contact exposure in the oxygen atmosphere of the process (C3), photopolymerization of the surface of the solder resist layer 2 between the connection pads 3 for electronic component connection is suppressed, and as a result, the thickness of the solder resist layer 2 is reduced by 0.5 μm.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm is covered by the solder resist layer 2 having a thickness of 30 μm on the first surface, and the connecting pad 3 for connecting the electronic component having a thickness of 15 μm is exposed, and the connecting member for connecting adjacent electronic components is connected. Between the pads 3, a solder resist layer 2 having a thickness of 9.5 μm is filled. In the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening having a thickness of 38 μm and a diameter of 500 μm, and a part of the external connection connecting pad 4 is exposed.

Next, the surface roughness of the solder resist layer 2 between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.40 μm.

(Example 3)

The process (A) to the process (D) were carried out in the same manner as in Example 1 except that the exposure amount of the process (C3) was 200 mJ/cm ² . As a result of observing with an optical microscope, the residue of the solder resist layer 2 was not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. On the first surface, the solder resist layer 2 is filled between the electronic component connecting connecting pads 3 until the surface of the electronic component connecting connecting pad 3 is 6.0 μm below the surface. By the non-contact exposure in the oxygen atmosphere of the process (C3), photopolymerization of the surface of the solder resist layer 2 between the connection pads 3 for electronic component connection is suppressed, and as a result, the thickness of the solder resist layer 2 is reduced by 1.0 μm.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm is covered by the solder resist layer 2 having a thickness of 30 μm on the first surface, and the connecting pad 3 for connecting the electronic component having a thickness of 15 μm is exposed, and the connecting member for connecting adjacent electronic components is connected. Between the pads 3, a solder resist layer 2 having a thickness of 9.0 μm is filled. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the solder resist layer 2 having a thickness of 38 μm and a diameter of 500 μm, and a part of the external connection connecting pad 4 is exposed. .

Next, the surface roughness of the solder resist layer 2 between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.50 μm.

(Example 4)

The process (A) to the process (D) were carried out in the same manner as in Example 1 except that the exposure amount of the process (C3) was 1000 mJ/cm ² . As a result of observing with an optical microscope, the residue of the solder resist layer 2 was not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. In the first surface, the solder resist layer 2 is filled between the electronic component connecting connecting pads 3 until 5.0 μm below the surface of the electronic component connecting connecting pad 3 . It was not confirmed that the oxygen polymerization of the process (C3) hindered the film reduction of the first surface solder resist layer 2.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm is covered by the solder resist layer 2 having a thickness of 30 μm on the first surface, and the connecting pad 3 for connecting the electronic component having a thickness of 15 μm is exposed, and the connecting member for connecting adjacent electronic components is connected. Between the pads 3, a solder resist layer 2 having a thickness of 10.0 μm is filled. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the solder resist layer 2 having a thickness of 38 μm and a diameter of 500 μm, and a part of the external connection connecting pad 4 is exposed. .

Next, the surface roughness of the solder resist layer 2 between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.30 μm.

(Example 5)

Except for the exposure of the process (C3) at an exposure amount of 400 mJ/cm ² by using a direct drawing device (trade name: LI-8500, manufactured by Dainippon Screen Mfg. Co., Ltd.) in an oxygen atmosphere, and Example 1 In the same way, the process (A) ~ process (D) is implemented. As a result of observing with an optical microscope, the residue of the solder resist layer 2 was not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. In the first surface, the solder resist layer 2 is filled between the electronic component connecting connecting pads 3 until the surface of the electronic component connecting connecting pad 3 is 5.5 μm lower. By the non-contact exposure in the oxygen atmosphere of the process (C3), photopolymerization of the surface of the solder resist layer 2 between the connection pads 3 for electronic component connection is suppressed, and as a result, the thickness of the solder resist layer 2 is reduced by 0.5 μm.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm is covered by the solder resist layer 2 having a thickness of 30 μm on the first surface, and the connecting pad 3 for connecting the electronic component having a thickness of 15 μm is exposed, and the connecting member for connecting adjacent electronic components is connected. Between the pads 3, a solder resist layer 2 having a thickness of 9.5 μm is filled. In the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening having a thickness of 38 μm and a diameter of 500 μm, and a part of the external connection connecting pad 4 is exposed.

Next, the connection pad 3 for connecting adjacent electronic components is measured. The surface roughness of the solder resist layer 2 between the two was 0.50 μm.

(Example 6)

In the process (C3), the processes (A) to (D) were carried out in the same manner as in Example 1 except that the exposure was performed by a contact exposure method. As a result of observing with an optical microscope, the residue of the solder resist layer 2 was not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. In the first surface, the solder resist layer 2 is filled between the electronic component connecting connecting pads 3 until 5.0 μm below the surface of the electronic component connecting connecting pad 3 . In the process (C3), since the exposure is performed in a non-oxygen atmosphere by sufficiently performing the exhaust gas during the contact exposure, the surface of the solder resist layer 2 is not roughened, and as a result, the thickness of the solder resist layer 2 is not reduced.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm is covered by the solder resist layer 2 having a thickness of 30 μm on the first surface, and the connecting pad 3 for connecting the electronic component having a thickness of 15 μm is exposed, and the connecting member for connecting adjacent electronic components is connected. Between the pads 3, a solder resist layer 2 having a thickness of 10 μm is filled. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm was formed with a circular opening portion having a solder resist layer 2 having a thickness of 38 μm and a diameter of 500 μm, and the conductor pad 4 was exposed.

Next, the surface roughness of the solder resist layer 2 between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.10 μm.

In the first to sixth embodiments, since the solder resist layer 2 having a sufficient thickness between the adjacent electronic component connecting pads 3 is provided, it is possible to surely prevent an electrical short circuit caused by the solder when the electronic component is mounted. In addition, since the residue of the solder resist layer 2 is not present on the external connection connecting pad 4, when it is mounted on an external electric board, it is possible to manufacture a wiring board having high reliability without causing electrical insulation failure. In the case of the wiring boards manufactured in the sixth embodiment in which the surface of the solder resist layer 2 between the electronic component connecting pads 3 is smooth, the wiring boards manufactured in the first to fifth embodiments are filled with glue. It has high adhesion and excellent connection reliability.

(Comparative Example 1) <Process (A)>

The circuit board 1 (having an area of 170 mm × 200 mm, a conductor thickness of 15 μm, and a substrate thickness of 0.4 mm) on which conductor wirings 7 were formed on both surfaces was produced by a half addition method. On the surface (first surface), there is a conductor wiring having a line width of 25 μm and a spacing of 50 μm which is used as the connection pad 3 for electronic component connection. On the back surface (second surface), a circular conductor wiring having a diameter of 600 μm used as the external connection connecting mat 4 was formed. Next, a 25 mm-thick solder mask (manufactured by TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) was vacuum-compressed using a vacuum laminator (lamination temperature: 75 ° C, suction time: 30 seconds). The pressurization time is 10 seconds) on both surfaces of the circuit board 1 described above. Thereby, the solder resist layer 2 is formed. In the solder resist layer 2 of the first surface, the thickness from the surface of the insulating layer 8 was 30 μm, and the thickness of the connection pad 3 for electronic component connection was 15 μm. The second side of the solder mask 2, from The thickness of the surface of the insulating layer 8 was 38 μm, and the thickness of the external connection connecting pad 4 was 23 μm. On the first side where the conductor wiring density is small, the thickness of the solder resist layer 2 is 8 μm thinner than the second surface having a larger conductor wiring density.

<Process (C1)>

For the solder resist layer 2 of the first surface, the photomask 5 of the pattern of the active light rays 6 is irradiated with a region in which the end portion of the connection pad 3 of the plurality of electronic component connection is 200 μm and the outer side is irradiated with an exposure amount of 200 mJ/cm. ² Implementation of contact exposure.

<Process (C2)>

In the solder resist layer 2 on the second surface, a circular opening portion having a diameter of 500 μm is disposed on the external connection connecting pad 4, and the mask 5 that irradiates the pattern of the active light 6 to the outside of the circular opening portion is exposed. Contact exposure was carried out at a quantity of 200 mJ/cm ² .

<Process (B)>

After peeling off the support layer film on the first surface and the second surface of the solder resist layer 2, using a 10% by mass aqueous sodium metasilicate solution (liquid temperature: 25 ° C) as a thin film treatment liquid, with the first side facing up, The circuit board 1 was immersed in the thin film processing liquid for 50 seconds, and subjected to micellization treatment (thinning treatment). Thereafter, a micelle removal treatment, a water washing treatment (liquid temperature: 25 ° C), and a drying treatment using a spray of a micelle removal liquid (liquid temperature: 25 ° C) were carried out to obtain a solder resist layer 2 of the non-exposed portion of the first surface. The thickness becomes the connection pad 3 for electronic component connection Thin film formation of the solder resist layer 2 of an average of 20 μm was performed up to 5.0 μm below the surface. Observation by an optical microscope revealed that the surface of the solder resist layer 2 on the first side was not unevenly treated, and good in-plane uniformity was obtained. On the other hand, the solder mask 2 of the second surface is also thinned by an average of 20 μm, and the bubbles in the thin film-forming liquid adhere to the solder resist layer 2 of the non-exposed portion of the second surface, and the film thickness is uneven. . Further, on the external connection connecting pad 4, a residue of the solder resist layer 2 of about 3 μm remains.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm is covered by the solder resist layer 2 having a thickness of 30 μm on the first surface, and the connecting pad 3 for connecting the electronic component having a thickness of 15 μm is exposed, and the connecting member for connecting adjacent electronic components is connected. Between the pads 3, a solder resist layer 2 having a thickness of 10.0 μm is filled. Further, on the second surface, a circular opening portion having a solder resist layer 2 having a thickness of 38 μm and a diameter of 500 μm is formed in a part of the external connection connecting pad 4 having a thickness of 15 μm, but remains on the external connection connecting pad 4 The residue of the solder resist layer 2 having a thickness of 3 μm was used.

When the electronic component is mounted, the solder resist layer 2 having a sufficient thickness is provided between the adjacent electronic component connecting connecting pads 3, and the electrical short circuit caused by the solder can be surely prevented. However, when it is mounted on the external electrical substrate, it remains in the external connection. The residue of the solder resist layer 2 on the bonding pad 4 causes electrical insulation failure of the solder bump connection.

Determining the resistance between the connecting pads 3 for connecting adjacent electronic components When the surface of the solder layer 2 has a thickness, the surface roughness Ra is 0.03 μm. The wiring board manufactured in the first to fifth embodiments of the wiring board manufactured in the first to fifth embodiments has a high adhesiveness and excellent connection reliability, as compared with the wiring board manufactured by the comparative example 1 in which the solder resist surface between the electronic component connection connecting pads 3 is smooth.

Examples 7 to 11 are related examples of the method (2) for manufacturing the wiring board shown in Figs. 5-1, 5-2, and 5-3.

(Example 7) <Process (A)>

The circuit board 1 (having an area of 170 mm × 200 mm, a conductor thickness of 15 μm, and a substrate thickness of 0.4 mm) on which conductor wirings 7 were formed on both surfaces was produced by a half addition method. On the surface (first surface), there is a conductor wiring having a line width of 25 μm and a spacing of 50 μm which is used as the connection pad 3 for electronic component connection. On the back surface (second surface), a circular conductor wiring having a diameter of 600 μm used as the external connection connecting mat 4 was formed. Next, a 25 mm-thick solder mask (manufactured by TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) was vacuum-compressed using a vacuum laminator (lamination temperature: 75 ° C, suction time: 30 seconds). The pressurization time is 10 seconds) on both surfaces of the circuit board 1 described above. Thereby, the solder resist layer 2 is formed. In the solder resist layer 2 of the first surface, the thickness from the surface of the insulating layer 8 was 30 μm, and the thickness of the connection pad 3 for electronic component connection was 15 μm. In the solder resist layer 2 of the second surface, the thickness from the surface of the insulating layer 8 was 38 μm, and the thickness of the external connection connecting pad 4 was 23 μm. On the first side where the conductor wiring density is small, the thickness of the solder resist layer 2 is 8 μm thinner than the second surface having a larger conductor wiring density.

<Process (C1)>

For the solder mask layer 2 of the first surface, the mask 5 of the pattern of the active light rays 6 is irradiated with a region in which the end portion of the connection pad 3 of the plurality of electronic component connection is 400 μm and the outer side is irradiated with an exposure amount of 200 mJ/cm. ² Implementation of contact exposure.

<Process (C2)>

In the solder resist layer 2 on the second surface, a circular opening portion having a diameter of 500 μm is disposed on the external connection connecting pad 4, and the mask 5 that irradiates the pattern of the active light 6 to the outside of the circular opening portion is exposed. Contact exposure was carried out at a quantity of 200 mJ/cm ² .

<Process (B1)>

After peeling off the support layer film on the first surface and the second surface of the solder resist layer 2, using a 10% by mass aqueous sodium metasilicate solution (liquid temperature: 25 ° C) as a thin film treatment liquid, with the first side facing up, The circuit board 1 was immersed in the thin film processing liquid for 25 seconds, and subjected to micellization treatment (thinning treatment). Thereafter, a micelle removal treatment, a water washing treatment (liquid temperature: 25° C.), and a drying treatment using a spray of a micelle removal liquid (liquid temperature: 25° C.) are performed to the solder resist layer 2 of the non-exposed portion of the first surface. When the thickness is 5.0 μm on the surface of the connection pad 3 for electronic component connection, thinning of the solder resist layer 2 of an average of 10 μm is performed. Observation by an optical microscope revealed that the surface of the solder resist layer 2 on the first side was not unevenly treated, and good in-plane uniformity was obtained. On the other hand, the second side The solder resist layer 2 is also thinned by an average of 10 μm. However, the bubbles in the thin film-forming treatment liquid adhere to the solder resist layer 2 of the non-exposed portion of the second surface, and a portion having a non-uniform film thickness appears. Further, on the external connection connecting pad 4, a residue of the solder resist layer 2 of about 13 μm remains.

<Process (C4)>

The mask 5 of the first surface of the solder resist layer 2 is irradiated with a pattern of the active light rays 6 in a region where the end portion of the connection pad 3 for the electronic component connection is 200 μm and the outer side of the connection pad 3 is used. Exposure was carried out, and exposure was performed at an exposure amount of 400 mJ/cm ² .

<Process (B2)>

Using a 10% by mass aqueous solution of sodium metasilicate (liquid temperature: 25 ° C) as a thin film treatment liquid, the first substrate was faced upward, and the circuit board 1 was immersed in the thin film treatment liquid for 25 seconds to carry out micellization treatment (film Treatment). Thereafter, a micelle removal treatment, a water washing treatment (liquid temperature: 25 ° C), and a drying treatment using a spray of a micelle removal liquid (liquid temperature: 25 ° C) were carried out to obtain a solder resist layer 2 of the non-exposed portion of the first surface. When the thickness is 5.0 μm below the surface of the connection pad 3 for electronic component connection, the thickness of the solder resist layer 2 having an average of 10 μm is formed. Observation by an optical microscope revealed that the surface of the solder resist layer 2 on the first side was not unevenly treated, and good in-plane uniformity was obtained. By the non-contact exposure in the oxygen atmosphere of the process (C4), the surface of the solder resist layer 2 is located from the outer periphery of the end portion of the connecting portion 3 of the electronic component connecting pad 3 disposed on the first surface to the outer periphery of the distance of 400 μm. Photopolymerization As a result, the thickness of the solder resist layer 2 was reduced by 0.5 μm. On the other hand, the solder resist layer 2 of the second surface is also thinned by an average of 10 μm. However, the bubbles in the thin film processing liquid adhere to the solder resist layer 2 of the non-exposed portion of the second surface, and the film thickness is uneven. The part. Further, on the external connection connecting pad 4, a residue of the solder resist layer 2 of about 3 μm remains.

<Process (C5)>

For the solder mask 2 of the first surface, a mask 5 that irradiates the region of the region where the process (B2) is thinned and the region from the boundary portion of the thinned region to the outer side of the thinned region of 200 μm is irradiated with oxygen. The non-contact exposure in the environment was carried out at an exposure amount of 400 mJ/cm ² .

<Process (D)>

Development was carried out for 30 seconds using a 1% by mass aqueous sodium carbonate solution (liquid temperature: 30 ° C, spray pressure: 0.15 MPa) to remove the solder resist layer 2 of the non-exposed portion on the second surface. As a result of observing with an optical microscope, the residue of the solder resist layer 2 was not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. In the first surface, the solder resist layer 2 is filled between the electronic component connecting connecting pads 3 until the surface of the electronic component connecting connecting pad 3 is 5.5 μm lower. By the non-contact exposure in the oxygen environment of the processes (C4) and (C5), the photopolymerization of the surface of the solder resist layer 2 outside the region irradiated with the active light 6 by the contact exposure of the process (C1) is suppressed on the first side. As a result, the thickness of the solder resist layer 2 was reduced by 0.5 μm.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm was covered with the solder resist layer 2 having a thickness of 30 μm and 19.5 μm on the first surface, and a dam for filling the plug which had a thickness of 10.5 μm corresponding to the step was formed. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a solder resist layer 2 having a thickness of 9.5 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the solder resist layer 2 having a thickness of 38 μm and a diameter of 500 μm, and a part of the external connection connecting pad 4 is exposed. .

Then, the surface roughness of the solder resist layer 2 having a thickness of 19.5 μm which is an outer circumference of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface and a thickness of 19.5 μm from the outer periphery of the end portion of 400 μm is measured. The surface roughness Ra was 0.40 μm. Further, the surface roughness of the solder resist layer 2 between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.40 μm.

(Example 8)

The process (A) to the process (D) were carried out in the same manner as in Example 7, except that the order of the process (C1) and the process (C2) were replaced. As a result of observing with an optical microscope, the residue of the solder resist layer 2 was not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. In addition, to the electronic component connected to the first side The solder resist layer 2 is filled up to 5.5 μm below the surface of the connection pad 3. By the non-contact exposure in the oxygen environment of the processes (C4) and (C5), the photopolymerization of the surface of the solder resist layer 2 outside the region irradiated with the active light 6 by the contact exposure of the process (C1) is suppressed on the first side. As a result, the thickness of the solder resist layer 2 was reduced by 0.5 μm.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm was covered with the solder resist layer 2 having a thickness of 30 μm and 19.5 μm on the first surface, and a dam for filling the plug which had a thickness of 10.5 μm corresponding to the step was formed. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a solder resist layer 2 having a thickness of 9.5 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the solder resist layer 2 having a thickness of 38 μm and a diameter of 500 μm, and a part of the external connection connecting pad 4 is exposed. .

Then, the surface roughness of the solder resist layer 2 having a thickness of 19.5 μm which is an outer circumference of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface and a thickness of 19.5 μm from the outer periphery of the end portion of 400 μm is measured. The surface roughness Ra was 0.40 μm. Further, the surface roughness of the solder resist layer 2 between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.40 μm.

(Example 9)

The process (A) to the process (D) were carried out in the same manner as in Example 7 except that the exposure amounts of the processes (C4) and (C5) were 200 mJ/cm ² . As a result of observing with an optical microscope, the residue of the solder resist layer 2 was not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. In addition, the solder resist layer 2 is filled up to 6.0 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface. By the non-contact exposure in the oxygen environment of the processes (C4) and (C5), the photopolymerization of the surface of the solder resist layer 2 outside the region irradiated with the active light 6 by the contact exposure of the process (C1) is suppressed on the first side. As a result, the thickness of the solder resist layer 2 was reduced by 1.0 μm.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm was covered with the solder resist layer 2 having a thickness of 30 μm and 19 μm on the first surface, and a dam for filling the plug having a thickness of 11 μm corresponding to the step was formed. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a solder resist layer 2 having a thickness of 9.0 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the solder resist layer 2 having a thickness of 38 μm and a diameter of 500 μm, and a part of the external connection connecting pad 4 is exposed. .

Then, the outer surface of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface and the surface of the solder resist layer 2 having a thickness of 19 μm from the outer portion of the end portion of 400 μm are measured. The thickness and the surface roughness Ra were 0.50 μm. Further, the surface roughness of the solder resist layer 2 between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.50 μm.

(Embodiment 10)

The process (A) to the process (D) were carried out in the same manner as in Example 6, except that the exposure amounts of the processes (C4) and (C5) were 1000 mJ/cm ² . As a result of observing with an optical microscope, the residue of the solder resist layer 2 was not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. In addition, the solder resist layer 2 was filled up to 5.0 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface, and the first cause of the polymerization inhibition of oxygen in the processes (C4) and (C5) was not confirmed. The film of the solder resist layer 2 is reduced.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm was covered with the solder resist layer 2 having a thickness of 30 μm and 20 μm on the first surface, and a dam for filling the plug having a thickness of 10 μm corresponding to the step was formed. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a solder resist layer 2 having a thickness of 10.0 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the solder resist layer 2 having a thickness of 38 μm and a diameter of 500 μm, and a part of the external connection connecting pad 4 is exposed. .

Then, the surface roughness of the solder resist layer 2 having a thickness of 20 μm from the outer circumference of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface and the thickness of the region between the outer portions of the end portion of 400 μm and the outer circumference is measured. The surface roughness Ra was 0.30 μm. Further, the surface roughness of the solder resist layer 2 between the adjacent electronic component connection connecting pads 3 was measured, and the surface roughness Ra was 0.30 μm.

(Example 11)

In the processes (C4) and (C5), the processes (A) to (D) were carried out in the same manner as in Example 7 except that exposure was performed by contact exposure. As a result of observing with an optical microscope, the residue of the solder resist layer 2 was not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. In the first surface, the solder resist layer 2 is filled between the electronic component connecting connecting pads 3 until 5.0 μm below the surface of the electronic component connecting connecting pad 3 . In the processes (C4) and (C5), the exposure is performed in a non-oxygen environment by sufficiently performing the exhaust gas during the contact exposure, so that the surface of the solder resist layer 2 is not roughened, and as a result, the thickness of the solder resist layer 2 is obtained. Not reduced.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm was covered with the solder resist layer 2 having a thickness of 30 μm and 20 μm on the first surface, and a dam for filling the plug having a thickness of 10 μm corresponding to the step was formed. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a solder resist layer 2 having a thickness of 10.0 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the solder resist layer 2 having a thickness of 38 μm and a diameter of 500 μm, and a part of the external connection connecting pad 4 is exposed. .

Then, the surface roughness of the solder resist layer 2 having a thickness of 20 μm from the outer circumference of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface and the thickness of the region between the outer portions of the end portion of 400 μm and the outer circumference is measured. The surface roughness Ra was 0.10 μm. Further, the surface roughness of the solder resist layer 2 between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.10 μm.

In the seventh to eleventh embodiments, since the solder resist layer 2 having a sufficient thickness between the adjacent electronic component connecting pads 3 is provided, it is possible to surely prevent an electrical short circuit caused by the solder when the electronic component is mounted. Since the residue of the solder resist layer 2 does not exist on the external connection connecting pad 4, when it is mounted on an external electric board, it is possible to manufacture a wiring board having high reliability without causing electrical insulation failure. In the case of the wiring boards manufactured in the eleventh embodiment, the wiring boards manufactured in the seventh to tenth embodiments are smoother than the wiring boards manufactured in the eleventh embodiment in which the surface of the solder resist layer 2 between the electronic component connecting pads 3 and the periphery is smooth. The adhesive has high adhesion and excellent connection reliability.

(Comparative Example 2) <Process (A)>

A circuit in which conductor wirings 7 are formed on both surfaces by a half addition method Substrate 1 (area 170 mm × 200 mm, conductor thickness 15 μm, substrate thickness 0.4 mm). On the surface (first surface), there is a conductor wiring having a line width of 25 μm and a spacing of 50 μm which is used as the connection pad 3 for electronic component connection. On the back surface (second surface), a circular conductor wiring having a diameter of 600 μm used as the external connection connecting mat 4 was formed. Next, a 25 mm-thick solder mask (manufactured by TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) was vacuum-compressed using a vacuum laminator (lamination temperature: 75 ° C, suction time: 30 seconds). The pressurization time is 10 seconds) on both surfaces of the circuit board 1 described above. Thereby, the solder resist layer 2 is formed. In the solder resist layer 2 of the first surface, the thickness from the surface of the insulating layer 8 was 30 μm, and the thickness of the connection pad 3 for electronic component connection was 15 μm. In the solder resist layer 2 of the second surface, the thickness from the surface of the insulating layer 8 was 38 μm, and the thickness of the external connection connecting pad 4 was 23 μm. On the first side where the conductor wiring density is small, the thickness of the solder resist layer 2 is 8 μm thinner than the second surface having a larger conductor wiring density.

<Process (C1)>

For the solder resist layer 2 of the first surface, the photomask 5 of the pattern of the active light rays 6 is irradiated with a region in which the end portion of the connection pad 3 of the plurality of electronic component connection is 200 μm and the outer side is irradiated with an exposure amount of 200 mJ/cm. ² Implementation of contact exposure.

<Process (C2)>

In the solder resist layer 2 on the second surface, a circular opening portion having a diameter of 500 μm is disposed on the external connection connecting pad 4, and the mask 5 that irradiates the pattern of the active light 6 to the outside of the circular opening portion is exposed. Contact exposure was carried out at a quantity of 200 mJ/cm ² .

<Process (B1)>

After peeling off the support layer film on the first surface and the second surface of the solder resist layer 2, using a 10% by mass aqueous sodium metasilicate solution (liquid temperature: 25 ° C) as a thin film treatment liquid, with the first side facing up, The circuit board 1 was immersed in the thin film processing liquid for 25 seconds, and subjected to micellization treatment (thinning treatment). Thereafter, a micelle removal treatment, a water washing treatment (liquid temperature: 25° C.), and a drying treatment using a spray of a micelle removal liquid (liquid temperature: 25° C.) are performed to the solder resist layer 2 of the non-exposed portion of the first surface. When the thickness is 5.0 μm on the surface of the connection pad 3 for electronic component connection, thinning of the solder resist layer 2 of an average of 10 μm is performed. Observation by an optical microscope revealed that the surface of the solder resist layer 2 on the first side was not unevenly treated, and good in-plane uniformity was obtained. On the other hand, the solder resist layer 2 of the second surface is also thinned by an average of 10 μm. However, the bubbles in the thin film processing liquid adhere to the solder resist layer 2 of the non-exposed portion of the second surface, and the film thickness is uneven. The part. Further, on the external connection connecting pad 4, a residue of the solder resist layer 2 of about 13 μm remains.

<Process (C4)>

For the solder mask layer 2 of the first surface, a mask that irradiates the pattern of the active light rays 6 to the outer circumference of the end portion of the connection pad 3 for connecting the plurality of electronic components and the region between the outer circumferences of the end portion of 400 μm is used. 5. Exposure was carried out at an exposure amount of 400 mJ/cm ² by non-contact exposure in an oxygen atmosphere.

<Process (B2)>

Using a 10% by mass aqueous solution of sodium metasilicate (liquid temperature: 25 ° C) as a thin film treatment liquid, the first substrate was faced upward, and the circuit board 1 was immersed in the thin film treatment liquid for 25 seconds to carry out micellization treatment (film Treatment). Thereafter, a micelle removal treatment, a water washing treatment (liquid temperature: 25 ° C), and a drying treatment using a spray of a micelle removal liquid (liquid temperature: 25 ° C) were carried out to obtain a solder resist layer 2 of the non-exposed portion of the first surface. When the thickness is 5.0 μm below the surface of the connection pad 3 for electronic component connection, the thickness of the solder resist layer 2 having an average of 10 μm is formed. Observation by an optical microscope revealed that the surface of the solder resist layer 2 on the first side was not unevenly treated, and good in-plane uniformity was obtained. By the non-contact exposure in the oxygen atmosphere of the process (C4), the surface of the solder resist 2 from the outer periphery of the end portion of the connecting portion 3 of the electronic component connecting connection pad 3 disposed on the first surface to the outer periphery of the distance of 400 μm The photopolymerization was suppressed, and as a result, the thickness of the solder resist layer 2 was reduced by 0.5 μm. On the other hand, the solder resist layer 2 of the second surface is also thinned by an average of 10 μm. However, the bubbles in the thin film processing liquid adhere to the solder resist layer 2 of the non-exposed portion of the second surface, and the film thickness is uneven. The part. Further, on the external connection connecting pad 4, a residue of the solder resist layer 2 of about 3 μm remains.

Next, in order to cure the solder resist layer 2 of the first surface and the second surface, total exposure was performed at an exposure amount of 1000 mJ/cm ² , and then heat hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring substrate. As a result of observation with an optical microscope, the conductor wiring 7 having a thickness of 15 μm was covered with the solder resist layer 2 having a thickness of 30 μm and 19.5 μm on the first surface, and a dam for filling the plug which had a thickness of 10.5 μm corresponding to the step was formed. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a solder resist layer 2 having a thickness of 9.5 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a circular opening portion having a solder resist layer 2 having a thickness of 38 μm and a diameter of 500 μm is formed in a part of the external connection connecting pad 4 having a thickness of 15 μm. However, on the external connection connecting pad 4, Residue of the 3 μm solder resist layer 2 remained.

When the electronic component is mounted, the solder resist layer 2 having a sufficient thickness is provided between the adjacent electronic component connecting connecting pads 3, and the electrical short circuit caused by the solder can be surely prevented. However, when it is mounted on the external electrical substrate, it remains in the external connection. The residue of the solder resist layer 2 on the bonding pad 4 causes electrical insulation failure of the solder bump connection.

The surface roughness of the solder resist layer 2 between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.03 μm. The wiring board manufactured in the comparative example 2 which is smooth compared with the soldering surface of the connection pad 3 of the electronic component connection is the wiring board manufactured by the Example 7-11, and the adhesiveness of the filler is high, and the connection reliability is excellent.

Examples 12 to 16 are related examples of the method (3) for manufacturing the wiring board shown in Figs. 6-1, 6-2, and 6-3.

(Embodiment 12) <Process (A1)>

A circuit in which conductor wirings 7 are formed on both surfaces by a half addition method Substrate 1 (area 170 mm × 200 mm, conductor thickness 15 μm, substrate thickness 0.4 mm). On the surface (first surface), there is a conductor wiring having a line width of 25 μm and a spacing of 50 μm which is used as the connection pad 3 for electronic component connection. On the back surface (second surface), a circular conductor wiring having a diameter of 600 μm used as the external connection connecting mat 4 was formed. Next, a 15 mm-thick solder mask (manufactured by TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) was vacuum-compression bonded to the surface of the above-mentioned circuit board 1 using a vacuum laminator. A 25 μm solder mask (manufactured by TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) was vacuum-compression bonded to the back surface of the above-mentioned circuit board 1 (overlap temperature: 75 ° C, suction time: 30 seconds, pressurization) Time 10 seconds). Thereby, the first solder resist layer 2-1 is formed. In the first solder resist layer 2-1 of the first surface, the thickness from the surface of the insulating layer 8 is 20 μm, and the thickness of the connecting pad 3 for electronic component connection is 5 μm. In the first solder resist layer 2-1 on the second surface, the thickness from the surface of the insulating layer 8 was 38 μm, and the thickness of the external connection connecting pad 4 was 23 μm.

<Process (C1)>

For the first solder resist layer 2-1 of the first surface, the mask 5 of the pattern of the active light rays 6 is irradiated with a region in which the end portion of the connection pad 3 for the electronic component connection is 200 μm and the outer side of the connection pad 3 is exposed. Contact exposure was carried out at a quantity of 200 mJ/cm ² .

<Process (C2)>

In the first solder resist layer 2-1 on the second surface, a circular opening portion having a diameter of 500 μm is disposed on the external connection connecting pad 4, and a mask that illuminates the pattern of the active light 6 outside the circular opening portion is used. 5. Contact exposure was performed at an exposure amount of 200 mJ/cm ² .

<Process (B)>

After peeling off the support layer film on the first solder mask layer 2-1 on the first surface and the second surface, a 10% by mass aqueous sodium metasilicate solution (liquid temperature 25 ° C) is used as a thin film treatment liquid to make the first surface The circuit board 1 was immersed in the thin film processing liquid for 25 seconds, and subjected to micellization treatment (thinning treatment). Thereafter, a micelle removal treatment, a water washing treatment (liquid temperature: 25° C.), and a drying treatment using a spray of a micelle removal liquid (liquid temperature: 25° C.) are performed to the first solder resist layer of the non-exposed portion of the first surface. When the thickness of 2-1 is 5.0 μm below the surface of the connection pad 3 for electronic component connection, the first solder resist layer 2-1 having an average thickness of 10 μm is formed into a thin film. Observed by an optical microscope, the surface of the first solder resist layer 2-1 on the first side was not treated unevenly, and good in-plane uniformity was obtained. On the other hand, the first solder resist layer 2-1 of the second surface is also thinned by an average of 10 μm, however, the bubbles in the thin film processing liquid adhere to the first solder resist layer 2 of the non-exposed portion of the second surface. -1, where the film thickness is uneven. Further, on the external connection connecting pad 4, the residue of the first solder resist layer 2-1 of about 13 μm remains.

<Process (C3)>

For the first solder resist layer 2-1 of the first surface, a mask 5 for irradiating the pattern of the active light rays 6 to the thinned region of the process (B) is used, and the non-contact exposure under an oxygen atmosphere is used for an exposure amount of 400 mJ/cm. ² implementation of exposure.

<Process (A2)>

A solder mask (available from TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) having a thickness of 15 μm was vacuum-compression bonded to the circuit substrate 1 until completion of the process (C3) using a vacuum laminator. The first solder mask layer 2-1 on the first side (the superimposed temperature is 75 ° C, the suction time is 30 seconds, and the pressurization time is 10 seconds). Thereby, the second solder resist layer 2-2 of the first surface is formed. In the second solder resist layer 2-2 of the first surface, the thickness from the surface of the insulating layer 8 is 30 μm.

<Process (C6)>

For the second solder resist layer 2-2 of the first surface, the mask 5 of the pattern of the active light rays 6 is irradiated with a region on the outer side of the outer peripheral portion of the connecting pad 3 of the electronic component connecting connecting pad 3, which is 400 μm, to the exposure amount of 200 mJ. /cm ² performs contact exposure.

<Process (D1)>

Development was carried out for 30 seconds using a 1% by mass aqueous sodium carbonate solution (liquid temperature: 30° C., spray pressure: 0.15 MPa) to remove the second solder resist layer 2-2 of the non-exposed portion of the first surface and the non-exposed portion of the second surface. The first solder mask layer 2-1. In this way, the entangled plug dam is formed, and the electronic component connecting connecting pad 3 in a state in which the first solder resist layer 2-1 covered by the second solder resist layer 2-2 is exposed again and its surroundings is formed. The first solder resist layer 2-1 is exposed. Light When the microscope was observed, the first solder resist layer 2-1 and the second solder resist layer 2 were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. -2 residue. In addition, the first solder resist layer 2-1 is filled up to 5.5 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface. The photopolymerization of the surface of the first solder resist layer 2-1 disposed between the electronic component connection connecting pads 3 on the first surface is suppressed by the non-contact exposure in the oxygen atmosphere of the process (C3), and as a result, the first The thickness of the first solder resist layer 2-1 is reduced by 0.5 μm.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . After exposure, heat-hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring board. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a first solder resist layer 2-1 having a thickness of 9.5 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Then, the first solder resist layer 2-1 having a thickness of 20 μm from the outer circumference of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface and the region between the outer portions of the end portion of 400 μm and the outer circumference of the end portion is measured. The surface roughness and the surface roughness Ra were 0.05 μm. Further, the surface roughness of the first solder resist layer 2-1 in the region between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.40 μm.

(Example 13)

The process (A1) to the process (D1) were carried out in the same manner as in Example 12 except for the order of the process (C1) and the process (C2). As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 is filled up to 5.5 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface. The photopolymerization of the surface of the first solder resist layer 2-1 disposed between the electronic component connection connecting pads 3 on the first surface is suppressed by the non-contact exposure in the oxygen atmosphere of the process (C3), and as a result, the first The thickness of the solder resist layer 2-1 is reduced by 0.5 μm.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . After exposure, heat-hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring board. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a first solder resist layer 2-1 having a thickness of 9.5 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Then, the outer surface of the outer surface of the plurality of electronic component connection connecting pads 3 disposed on the first surface, and the first solder resist layer 2-1 having a thickness of 20 μm from the outer peripheral portion of the end portion of 400 μm are measured. The surface roughness and the surface roughness Ra were 0.05 μm. Further, the surface roughness of the first solder resist layer 2-1 in the region between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.40 μm.

(Example 14)

The process (A1) to the process (D1) were carried out in the same manner as in Example 12 except that the exposure amount of the process (C3) was 200 mJ/cm ² . As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 is filled up to 6.0 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface. The photopolymerization of the surface of the first solder resist layer 2-1 disposed between the electronic component connection connecting pads 3 on the first surface is suppressed by the non-contact exposure in the oxygen atmosphere of the process (C3), and as a result, the first The thickness of the solder resist layer 2-1 was reduced by 1.0 μm.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . After exposure, heat-hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring board. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and the first solder resist layer 2-1 having a thickness of 9.0 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Then, the outer surface of the outer surface of the plurality of electronic component connection connecting pads 3 disposed on the first surface, and the first solder resist layer 2-1 having a thickness of 20 μm from the outer peripheral portion of the end portion of 400 μm are measured. The surface roughness and the surface roughness Ra were 0.05 μm. Further, the surface roughness of the first solder resist layer 2-1 in the region between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.50 μm.

(Example 15)

The process (A1) to the process (D1) were carried out in the same manner as in Example 12 except that the exposure amount of the process (C3) was 1000 mJ/cm ² . As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 was filled up to 5.0 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface, and the first cause of the polymerization inhibition of oxygen in the process (C3) was not confirmed. The film of the first solder resist layer 2-1 is reduced.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . Exposure, followed by heat hardening treatment at 150 ° C for 60 minutes. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a first solder resist layer 2-1 having a thickness of 10.0 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Then, the outer surface of the outer surface of the plurality of electronic component connection connecting pads 3 disposed on the first surface, and the first solder resist layer 2-1 having a thickness of 20 μm from the outer peripheral portion of the end portion of 400 μm are measured. The surface roughness and the surface roughness Ra were 0.05 μm. Further, the surface roughness of the first solder resist layer 2-1 in the region between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.30 μm.

(Embodiment 16)

In the process (C3), the process (A1) to the process (D1) were carried out in the same manner as in Example 12 except that exposure was performed by contact exposure. As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 is filled up to 5.0 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface. In the process (C3), the exposure is performed in a non-oxygen environment by sufficiently performing the exhaust gas during the contact exposure, so that the surface of the first solder resist layer 2-1 is not roughened, and as a result, the first solder resist layer 2 is obtained. The thickness of -1 is not reduced.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . Exposure, followed by heat hardening treatment at 150 ° C for 60 minutes. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a first solder resist layer 2-1 having a thickness of 10.0 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Secondly, measuring the complex electronic structure of the first surface The outer thickness of the end portion of the connection bonding pad 3 and the surface roughness of the first solder resist layer 2-1 having a thickness of 20 μm from the outer portion of the end portion of 400 μm, the surface roughness Ra was 0.05 μm. Further, the surface roughness of the first solder resist layer 2-1 between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.10 μm.

In the examples 12 to 16, the first solder resist layer 2-1 having a sufficient thickness between the adjacent electronic component connecting pads 3 can surely prevent an electrical short circuit caused by the solder when the electronic component is mounted. When the residue of the first solder resist layer 2-1 is not present on the external connection connecting pad 4, when it is mounted on an external electric board, it is possible to manufacture a wiring board having high reliability without causing electrical insulation failure. In Comparative Examples 12 to 16, the wiring boards manufactured in Example 16 which were smoother than the surface of the first solder resist layer 2-1 between the electronic component connection connecting pads 3 were produced in Examples 12 to 15. The wiring board has high adhesion to the glue and excellent connection reliability.

Examples 17 to 21 are related examples of the method (4) for manufacturing the wiring board shown in Figs. 7-1, 7-2, and 7-3.

(Example 17) <Process (A1)>

The circuit board 1 (having an area of 170 mm × 200 mm, a conductor thickness of 15 μm, and a substrate thickness of 0.4 mm) on which conductor wirings 7 were formed on both surfaces was produced by a half addition method. On the surface (first surface), there is a conductor wiring having a line width of 25 μm and a spacing of 50 μm which is used as the connection pad 3 for electronic component connection. On the back side (second side), it is formed as a connection pad 4 for external connection. A circular conductor wire having a diameter of 600 μm. Next, a 15 mm-thick solder mask (manufactured by TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) was vacuum-compression bonded to the surface of the above-mentioned circuit board 1 using a vacuum laminator. A 25 μm solder mask (manufactured by TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) was vacuum-compression bonded to the back surface of the above-mentioned circuit board 1 (overlap temperature: 75 ° C, suction time: 30 seconds, pressurization) Time 10 seconds). Thereby, the first solder resist layer 2-1 is formed. In the first solder resist layer 2-1 of the first surface, the thickness from the surface of the insulating layer 8 is 20 μm, and the thickness of the connecting pad 3 for electronic component connection is 5 μm. In the first solder resist layer 2-1 on the second surface, the thickness from the surface of the insulating layer 8 was 38 μm, and the thickness of the external connection connecting pad 4 was 23 μm.

<Process (C1)>

For the first solder resist layer 2-1 of the first surface, the mask 5 of the pattern of the active light rays 6 is irradiated with a region in which the end portion of the connection pad 3 for the electronic component connection is 200 μm and the outer side of the connection pad 3 is exposed. Contact exposure was carried out at a quantity of 200 mJ/cm ² .

<Process (C2)>

In the first solder resist layer 2-1 on the second surface, a circular opening portion having a diameter of 500 μm is disposed on the external connection connecting pad 4, and a mask that irradiates the pattern of the active light 6 to the outside of the circular opening portion is used. 5. Contact exposure was performed at an exposure amount of 200 mJ/cm ² .

<Process (B)>

After peeling off the support layer film on the first solder mask layer 2-1 on the first surface and the second surface, a 10% by mass aqueous sodium metasilicate solution (liquid temperature 25 ° C) is used as a thin film treatment liquid to make the first surface The circuit board 1 was immersed in the thin film processing liquid for 25 seconds, and subjected to micellization treatment (thinning treatment). Thereafter, a micelle removal treatment, a water washing treatment (liquid temperature: 25° C.), and a drying treatment using a spray of a micelle removal liquid (liquid temperature: 25° C.) are performed to the first solder resist layer of the non-exposed portion of the first surface. When the thickness of 2-1 is 5.0 μm below the surface of the connection pad 3 for electronic component connection, the first solder resist layer 2-1 having an average thickness of 10 μm is formed into a thin film. Observed by an optical microscope, the surface of the first solder resist layer 2-1 on the first side was not treated unevenly, and good in-plane uniformity was obtained. On the other hand, the first solder resist layer 2-1 of the second surface is also thinned by an average of 10 μm, however, the bubbles in the thin film processing liquid adhere to the first solder resist layer 2 of the non-exposed portion of the second surface. -1, where the film thickness is uneven. Further, on the external connection connecting pad 4, the residue of the first solder resist layer 2-1 of about 13 μm remains.

<Process (C3)>

For the first solder resist layer 2-1 of the first surface, a mask 5 for irradiating the pattern of the active light rays 6 to the thinned region of the process (B) is used, and the non-contact exposure under an oxygen atmosphere is used for an exposure amount of 400 mJ/cm. ² implementation of exposure.

<Process (D)>

Use 1% by mass aqueous sodium carbonate solution (liquid temperature 30 ° C, spray The development was carried out for 30 seconds at a pressure of 0.15 MPa), and the first solder resist layer 2-1 of the non-exposed portion of the second surface was removed.

<Process (A2)>

A solder mask (available from TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) having a thickness of 15 μm was vacuum-compression bonded to the circuit substrate 1 until completion of the process (D) using a vacuum laminator. The first solder mask layer 2-1 on the first side (the superimposed temperature is 75 ° C, the suction time is 30 seconds, and the pressurization time is 10 seconds). Thereby, the second solder resist layer 2-2 of the first surface is formed. In the second solder resist layer 2-2 of the first surface, the thickness from the surface of the insulating layer 8 is 30 μm.

<Process (C6)>

For the second solder resist layer 2-2 of the first surface, the mask 5 of the pattern of the active light rays 6 is irradiated with a region on the outer side of the outer peripheral portion of the connecting pad 3 of the electronic component connecting connecting pad 3, which is 400 μm, to the exposure amount of 200 mJ. /cm ² performs contact exposure.

<Process (D2)>

Development was carried out for 30 seconds using a 1% by mass aqueous sodium carbonate solution (liquid temperature: 30 ° C, spray pressure: 0.15 MPa) to remove the second solder resist layer 2-2 of the non-exposed portion on the first surface. In this way, the entangled plug dam is formed, and the electronic component connecting connecting pad 3 in a state in which the first solder resist layer 2-1 covered by the second solder resist layer 2-2 is exposed again and its surroundings is formed. First solder mask 2-1 exposed. As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 is filled up to 5.5 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface. The photopolymerization of the surface of the first solder resist layer 2-1 disposed between the electronic component connection connecting pads 3 on the first surface is suppressed by the non-contact exposure in the oxygen atmosphere of the process (C3), and as a result, the first The thickness of the first solder resist layer 2-1 is reduced by 0.5 μm.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . After exposure, heat-hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring board. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a first solder resist layer 2-1 having a thickness of 9.5 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Then, the first solder resist layer 2-1 having a thickness of 20 μm from the outer circumference of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface and the region between the outer portions of the end portion of 400 μm and the outer circumference of the end portion is measured. The surface roughness and the surface roughness Ra were 0.05 μm. Further, the surface roughness of the first solder resist layer 2-1 in the region between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.40 μm.

(Embodiment 18)

The process (A1) to the process (D2) were carried out in the same manner as in Example 17, except that the order of the process (C1) and the process (C2) were replaced. As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 is filled up to 5.5 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface. The photopolymerization of the surface of the first solder resist layer 2-1 disposed between the electronic component connection connecting pads 3 on the first surface is suppressed by the non-contact exposure in the oxygen atmosphere of the process (C3), and as a result, the first The thickness of the first solder resist layer 2-1 is reduced by 0.5 μm.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . After exposure, heat-hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring board. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a first solder resist layer 2-1 having a thickness of 9.5 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Then, the outer surface of the outer surface of the plurality of electronic component connection connecting pads 3 disposed on the first surface, and the first solder resist layer 2-1 having a thickness of 20 μm from the outer peripheral portion of the end portion of 400 μm are measured. The surface roughness and the surface roughness Ra were 0.05 μm. Further, the surface roughness of the first solder resist layer 2-1 in the region between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.40 μm.

(Embodiment 19)

The process (A1) to the process (D2) were carried out in the same manner as in Example 17, except that the exposure amount of the process (C3) was 200 mJ/cm ² . As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 is filled up to 6.0 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface. The photopolymerization of the surface of the first solder resist layer 2-1 disposed between the electronic component connection connecting pads 3 on the first surface is suppressed by the non-contact exposure in the oxygen atmosphere of the process (C3), and as a result, the first The thickness of the first solder resist layer 2-1 was reduced by 1.0 μm.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . After exposure, heat-hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring board. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and the first solder resist layer 2-1 having a thickness of 9.0 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Then, the outer surface of the outer surface of the plurality of electronic component connection connecting pads 3 disposed on the first surface, and the first solder resist layer 2-1 having a thickness of 20 μm from the outer peripheral portion of the end portion of 400 μm are measured. The surface roughness and the surface roughness Ra were 0.05 μm. Further, the surface roughness of the first solder resist layer 2-1 in the region between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.50 μm.

(Embodiment 20)

The process (A1) to the process (D2) were carried out in the same manner as in Example 17 except that the exposure amount of the process (C3) was 1000 mJ/cm ² . As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 was filled up to 5.0 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface, and the first cause of the polymerization inhibition of oxygen in the process (C3) was not confirmed. The film of the first solder resist layer 2-1 is reduced.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . After exposure, heat-hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring board. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a first solder resist layer 2-1 having a thickness of 10.0 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Then, the outer surface of the outer surface of the plurality of electronic component connection connecting pads 3 disposed on the first surface, and the first solder resist layer 2-1 having a thickness of 20 μm from the outer peripheral portion of the end portion of 400 μm are measured. The surface roughness and the surface roughness Ra were 0.05 μm. Further, the surface roughness of the first solder resist layer 2-1 in the region between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.30 μm.

(Example 21)

In the process (C3), the process (A1) to the process (D2) were carried out in the same manner as in Example 17 except that exposure was performed by contact exposure. As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 is filled up to 5.0 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface. In the process (C3), the exposure is performed in a non-oxygen environment by sufficiently performing the exhaust gas during the contact exposure, so that the surface of the first solder resist layer 2-1 is not roughened, and as a result, the first solder resist layer 2 is obtained. The thickness of -1 is not reduced.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . Exposure, followed by heat hardening treatment at 150 ° C for 60 minutes. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a first solder resist layer 2-1 having a thickness of 10.0 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Secondly, measuring the complex electronic structure of the first surface The outer thickness of the end portion of the connection bonding pad 3 and the surface roughness of the first solder resist layer 2-1 having a thickness of 20 μm from the outer portion of the end portion of 400 μm, the surface roughness Ra was 0.05 μm. Further, the surface roughness of the first solder resist 2-2 between the adjacent electronic component connection pads 3 was measured, and the surface roughness Ra was 0.10 μm.

In the case of the first to the second embodiments, the first solder resist layer 2-1 having a sufficient thickness between the adjacent electronic component connecting pads 3 can reliably prevent an electrical short circuit caused by the solder when the electronic component is mounted. When the residue of the first solder resist layer 2-1 is not present on the external connection connecting pad 4, when it is mounted on an external electric board, it is possible to manufacture a wiring board having high reliability without causing electrical insulation failure. In Comparative Examples 17 to 21, the wiring boards manufactured in Example 21 which were smoother than the surface of the first solder resist layer 2-1 between the electronic component connecting pads 3 were produced in Examples 17 to 20. The wiring board has high adhesion to the glue and excellent connection reliability.

Examples 22 to 25 are related examples of the method (5) for manufacturing the wiring board shown in Figs. 8-1, 8-2, and 8-3.

(Example 22) <Process (A1)>

The circuit board 1 (having an area of 170 mm × 200 mm, a conductor thickness of 15 μm, and a substrate thickness of 0.4 mm) on which conductor wirings 7 were formed on both surfaces was produced by a half addition method. On the surface (first surface), there is a conductor wiring having a line width of 25 μm and a spacing of 50 μm which is used as the connection pad 3 for electronic component connection. On the back side (second side), it is formed as a connection pad 4 for external connection. A circular conductor wire having a diameter of 600 μm. Next, a 15 mm-thick solder mask (manufactured by TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) was vacuum-compression bonded to the surface of the above-mentioned circuit board 1 using a vacuum laminator. A 25 μm solder mask (manufactured by TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) was vacuum-compression bonded to the back surface of the above-mentioned circuit board 1 (overlap temperature: 75 ° C, suction time: 30 seconds, pressurization) Time 10 seconds). Thereby, the first solder resist layer 2-1 is formed. In the first solder resist layer 2-1 of the first surface, the thickness from the surface of the insulating layer 8 is 20 μm, and the thickness of the connecting pad 3 for electronic component connection is 5 μm. In the first solder resist layer 2-1 on the second surface, the thickness from the surface of the insulating layer 8 was 38 μm, and the thickness of the external connection connecting pad 4 was 23 μm.

<Process (C2)>

In the first solder resist layer 2-1 on the second surface, a circular opening portion having a diameter of 500 μm is disposed on the external connection connecting pad 4, and a mask that irradiates the pattern of the active light 6 to the outside of the circular opening portion is used. 5. Contact exposure was performed at an exposure amount of 200 mJ/cm ² .

<Process (B)>

After peeling off the support layer film on the first solder mask layer 2-1 on the first surface and the second surface, a 10% by mass aqueous sodium metasilicate solution (liquid temperature 25 ° C) is used as a thin film treatment liquid to make the first surface The circuit board 1 was immersed in the thin film processing liquid for 25 seconds, and subjected to micellization treatment (thinning treatment). Thereafter, the micelles of the spray using the micelle removal liquid (liquid temperature 25 ° C) are removed. After the treatment, the water washing treatment (liquid temperature: 25 ° C), and the drying treatment, the thickness of the first solder resist layer 2-1 in the non-exposed portion of the first surface is 5.0 μm below the surface of the connecting member 3 for the electronic component connection. Thinning of the first solder resist layer 2-1 having an average of 10 μm is performed. Observed by an optical microscope, the surface of the first solder resist layer 2-1 on the first side was not treated unevenly, and good in-plane uniformity was obtained. On the other hand, the first solder resist layer 2-1 of the second surface is also thinned by an average of 10 μm, however, the bubbles in the thin film processing liquid adhere to the first solder resist layer 2 of the non-exposed portion of the second surface. -1, where the film thickness is uneven. Further, on the external connection connecting pad 4, the residue of the first solder resist layer 2-1 of about 13 μm remains.

<Process (C3)>

For the first solder resist layer 2-1 of the first surface, a mask 5 for irradiating the pattern of the active light rays 6 to the thinned region of the process (B) is used, and the non-contact exposure under an oxygen atmosphere is used for an exposure amount of 400 mJ/cm. ² implementation of exposure.

<Process (A2)>

A solder resist film (manufactured by TAIYO INK MFG. CO., LTD., trade name: PFR-800 AUS410) having a thickness of 20 μm was vacuum-compression bonded to the circuit substrate 1 until completion of the process (C) using a vacuum laminator. The first solder mask layer 2-1 on the first side (the superimposed temperature is 75 ° C, the suction time is 30 seconds, and the pressurization time is 10 seconds). Thereby, the second solder resist layer 2-2 of the first surface is formed. In the second solder resist layer 2-2 of the first surface, the thickness from the surface of the insulating layer 8 is 30 μm.

<Process (C6)>

For the second solder resist layer 2-2 of the first surface, the mask 5 of the pattern of the active light rays 6 is irradiated with a region on the outer side of the outer peripheral portion of the connecting pad 3 of the electronic component connecting connecting pad 3, which is 400 μm, to the exposure amount of 200 mJ. /cm ² performs contact exposure.

<Process (B3)>

After peeling off the support layer film on the second solder resist layer 2-2 of the first surface, using a 10% by mass aqueous sodium metasilicate solution (liquid temperature: 25 ° C) as a thin film treatment liquid, with the first side facing up, The circuit board 1 was immersed in the thin film processing liquid for 25 seconds, and subjected to micellization treatment (thinning treatment). Thereafter, a micelle removal treatment, a water washing treatment (liquid temperature: 25° C.), and a drying treatment using a spray of a micelle removal liquid (liquid temperature: 25° C.) are performed to a second solder resist layer of the non-exposed portion of the first surface. The thickness of 2-2 is 5.0 μm on the surface of the connection pad 3 for electronic component connection, and the second solder resist layer 2-2 having an average thickness of 10 μm is formed into a thin film. Observed by an optical microscope, the surface of the second solder resist layer 2-2 on the first side was not treated unevenly, and good in-plane uniformity was obtained. On the other hand, the first solder resist layer 2-1 of the second surface is also thinned by an average of 10 μm, however, the bubbles in the thin film processing liquid adhere to the first solder resist layer 2 of the non-exposed portion of the second surface. -1, where the film thickness is uneven. Further, on the external connection connecting pad 4, the residue of the first solder resist layer 2-1 of about 3 μm remains.

<Process (C7)>

For the second solder resist layer 2-2 of the first surface, the mask 5 of the pattern of the active light rays 6 is irradiated with a region on the outer side of the outer portion of the connecting pad 3 of the connecting member 3 for a distance of 200 μm, and the oxygen mask is used. The non-contact exposure was carried out at an exposure amount of 400 mJ/cm ² .

<Process (D1)>

Development was carried out for 30 seconds using a 1% by mass aqueous sodium carbonate solution (liquid temperature: 30° C., spray pressure: 0.15 MPa) to remove the second solder resist layer 2-2 of the non-exposed portion of the first surface and the non-exposed portion of the second surface. The first solder mask layer 2-1. In this way, the entangled plug dam is formed, and the electronic component connecting connecting pad 3 in a state in which the first solder resist layer 2-1 covered by the second solder resist layer 2-2 is exposed again and its surroundings is formed. The first solder resist layer 2-1 is exposed. As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 is filled up to 5.5 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface. The photopolymerization of the surface of the first solder resist layer 2-1 disposed between the electronic component connection connecting pads 3 on the first surface is suppressed by the non-contact exposure in the oxygen atmosphere of the process (C3), and as a result, the first The thickness of the first solder resist layer 2-1 is reduced by 0.5 μm. Further, by the non-contact exposure in the oxygen atmosphere of the process (C7), the outer circumference of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface is 200 μm, and the outer circumference of the end portion is 400 μm. The second defense of the thickness of the area 20μm The photopolymerization of the surface of the solder layer 2-2 was suppressed, and as a result, the surface thickness of the second solder resist layer 2-2 having a thickness of 20 μm was reduced by 0.5 μm.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . After exposure, heat-hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring board. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm was covered with the second solder resist layer 2-2 having a thickness of 30 μm and 19.5 μm, and a filler of 10.5 μm having a thickness corresponding to the step was formed. Plug the dam. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a first solder resist layer 2-1 having a thickness of 9.5 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Next, the second solder resist layer 2-2 having a thickness of 19.5 μm from the outer circumference of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface and the region between the outer portions of the end portion of 400 μm and the outer circumference is measured. The surface roughness and the surface roughness Ra were 0.40 μm. Further, the surface roughness of the first solder resist layer 2-1 in the region between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.40 μm.

(Example 23)

The process (A1) to the process (D1) were carried out in the same manner as in Example 22 except that the exposure amounts of the processes (C3) and (C7) were 200 mJ/cm ² . As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 is filled up to 6.0 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface. The photopolymerization of the surface of the first solder resist layer 2-1 disposed between the electronic component connection connecting pads 3 on the first surface is suppressed by the non-contact exposure in the oxygen atmosphere of the process (C3), and as a result, the first The thickness of the first solder resist layer 2-1 was reduced by 1.0 μm. Further, by the non-contact exposure in the oxygen atmosphere of the process (C7), the outer circumference of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface is 200 μm, and the outer circumference of the end portion is 400 μm. The photopolymerization of the surface of the second solder resist layer 2-2 having a thickness of 20 μm was suppressed, and as a result, the thickness of the surface of the second solder resist layer 2-2 having a thickness of 20 μm was reduced by 1.0 μm.

Next, in order to cure the solder resist layers 2-1 and 2-2 of the first surface and the first solder resist layer 2-1 of the second surface, full exposure is performed at an exposure amount of 1000 mJ/cm ² , followed by 150 ° C. The wiring substrate was obtained by a heat hardening treatment for 60 minutes. Observation with an optical microscope revealed that the conductor wiring 7 having a thickness of 15 μm was covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 19 μm on the first surface, forming a step corresponding to the step. The dam is filled with a plug of 11 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and the first solder resist layer 2-1 having a thickness of 9.0 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Then, the second solder resist layer 2-2 having a thickness of 19 μm from the outer periphery of the end portion of the plurality of electronic component connecting connecting pads 3 disposed on the first surface and the region between the outer portions of the end portion of 400 μm and the outer periphery of the connecting portion 3 was measured. The surface roughness and the surface roughness Ra were 0.50 μm. Further, the surface roughness of the first solder resist layer 2-1 in the region between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.50 μm.

(Example 24)

The process (A1) to the process (D1) were carried out in the same manner as in Example 22 except that the exposure amounts of the processes (C3) and (C7) were 1000 mJ/cm ² . As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. In addition, the first solder resist layer 2-1 was filled up to 5.0 μm below the surface of the connection pad 3 for electronic component connection disposed on the first surface, and the polymerization polymerization of the processes (C3) and (C7) was not confirmed. The film of the first solder resist layer 2-1 on the first side and the second solder resist layer 2-2 on the first side is reduced.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . After exposure, heat-hardening treatment was performed at 150 ° C for 60 minutes to obtain a wiring board. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a first solder resist layer 2-1 having a thickness of 10.0 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Then, the second solder resist layer 2-2 having a thickness of 20 μm from the outer periphery of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface and the region between the outer portions of the end portion of 400 μm and the outer circumference of the connecting portion 3 was measured. The surface roughness and the surface roughness Ra were 0.30 μm. Further, the surface roughness of the first solder resist layer 2-1 in the region between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.30 μm.

(Embodiment 25)

In the processes (C3) and (C7), the process (A1) to the process (D1) were carried out in the same manner as in Example 22 except that exposure was performed by contact exposure. As a result of observing with an optical microscope, the first solder resist layer 2-1 and the second solder resist layer were not found on the first and second surfaces of the electronic component connecting connecting pad 3 and the external connecting connecting pad 4. 2-2 residue. Further, to the connection pad 3 for electronic component connection disposed on the first surface The first solder resist layer 2-1 is filled up to 5.0 μm below the surface. In the processes (C3) and (C7), the exposure is performed in a non-oxygen environment by fully performing the exhaust gas during the contact exposure, so that the surface of the solder resist layer 2 is not roughened, and as a result, the first surface is first. The thickness of the solder resist layer 2-1 and the second solder resist layer 2-2 of the first surface is not reduced.

Next, in order to harden the first solder resist layer 2-1, the second solder resist layer 2-2, and the first solder resist layer 2-1 of the second surface, the exposure amount is 1000 mJ/cm ² . Exposure, followed by heat hardening treatment at 150 ° C for 60 minutes. As a result of observation with an optical microscope, as a result, on the first surface, the conductor wiring 7 having a thickness of 15 μm is covered by the first solder resist layer 2-1 and the second solder resist layer 2-2 having a thickness of 30 μm and 20 μm, forming a step corresponding to the step. The dam is filled with a plug of 10 μm in thickness. In addition, the electronic component connecting connecting pads 3 having a thickness of 15 μm are exposed, and a first solder resist layer 2-1 having a thickness of 10 μm is filled between the adjacent electronic component connecting connecting pads 3. Further, on the second surface, a part of the external connection connecting pad 4 having a thickness of 15 μm is formed with a circular opening portion of the first solder resist layer 2-1 having a thickness of 38 μm and a diameter of 500 μm, and the external connection connecting pad is formed. One of the 4 parts is exposed.

Then, the second solder resist layer 2-2 having a thickness of 20 μm from the outer periphery of the end portion of the plurality of electronic component connection connecting pads 3 disposed on the first surface and the region between the outer portions of the end portion of 400 μm and the outer circumference of the connecting portion 3 was measured. The surface roughness and the surface roughness Ra were 0.10 μm. Further, the surface roughness of the first solder resist layer 2-1 between the adjacent electronic component connecting pads 3 was measured, and the surface roughness Ra was 0.10 μm.

In the case of the second to fifth embodiments, the first solder resist layer 2-1 having a sufficient thickness between the adjacent electronic component connecting pads 3 can reliably prevent an electrical short circuit caused by the solder when the electronic component is mounted. When the residue of the first solder resist layer 2-1 is not present on the external connection connecting pad 4, when it is mounted on an external electric board, it is possible to manufacture a wiring board having high reliability without causing electrical insulation failure. Comparing the examples 22 to 25, the surface of the first solder resist layer 2-1 and the second solder resist layer 2-2 around the connecting pad 3 for electronic component connection are smoother than those of the electronic component connecting connecting pads 3. In the wiring board manufactured in Example 25, the wiring boards manufactured in Examples 22 to 24 had high adhesion to the glue and excellent connection reliability.

As described above, in the wiring board manufactured in the first to sixth embodiments, a part of the electronic component connecting connecting pad 3 on the first surface is exposed from the solder resist layer 2. When the wiring board is connected by the wiring board, the wiring board of the connection pad 3 for the electronic component connection is disposed at a high density, and the solder resist layer 2 having a sufficient thickness between the adjacent electronic component connection pads 3 can be used. It does prevent electrical shorts caused by flux when mounting electronic components. In addition, the bonding strength of the insulating layer 8 and the connecting pad 3 for electronic component connection, and the bonding strength between the connecting pad 3 for electronic component connection and the flux are increased, and high connection reliability is obtained. In addition, when the process (C3) is performed by the non-contact exposure method in an oxygen atmosphere, the surface of the solder resist layer 2 around the connection pad 3 for electronic component connection is sufficiently roughened, and the adhesiveness of the glue is good. And get high link reliability. Further, since the surface of the external connection connecting pad 4 on the second surface does not have the residue of the solder resist layer 2, when it is mounted on the external substrate, high connection reliability is obtained in which electrical insulation failure that does not cause solder connection is obtained. Sex.

As described above, in the wiring board manufactured in the examples 7 to 26, one portion of the connection pad 3 for electronic component connection is exposed from the solder resist layer 2 (first solder resist layer 2-1), and has a two-stage structure. A dam for filling the plug formed by the solder resist layer 2 (the first solder resist layer 2-1 and the second solder resist layer 2-2). When the wiring board is used for the flip chip connection, it is possible to prevent the rubber filling between the electronic component and the wiring board from overflowing to the surroundings and adversely affecting the electrical connection reliability. Further, even when the wiring board of the connection pad 3 for electronic component connection is disposed at a high density, the solder resist layer 2 (first solder resist layer 2-1) having a sufficient thickness between the adjacent connection pads 3 for electronic component connection is provided. It can surely prevent the electrical short circuit caused by the flux when the electronic component is mounted. The bonding strength between the insulating layer 8 and the connecting pad 3 for electronic component connection, and the bonding strength between the connecting pad 3 for electronic component connection and the flux are increased, and high connection reliability is obtained. Further, the processes (C4) and (C5) of the method (2) of manufacturing the wiring board, the manufacturing method (3) of the wiring board, the process (C3) of (4), (5), and the manufacturing method of the wiring board (5) When the exposure of the process (C7) is performed by a non-contact exposure method in an oxygen atmosphere, the solder resist layer 2 between the connection pads 3 for electronic components and the periphery (the first solder resist layer 2-1, the first) The surface of the second solder resist layer 2-2) is sufficiently roughened, and the adhesiveness of the filler is good, and high connection reliability is obtained. Further, since the surface of the external connection connecting pad 4 on the second surface does not have the residue of the first solder resist layer 2-1, when mounted on the external substrate, high connection reliability is obtained without causing electrical connection failure of the solder connection. .

[Industrial availability]

The method for producing a wiring board of the present invention is, for example, applied to a wiring board having a plurality of connection pads for the purpose of connecting electronic components such as semiconductor wafers and other printed wiring boards.

1‧‧‧ circuit substrate

2‧‧‧ solder mask

3‧‧‧Connecting pads for electronic components and connecting pads for the first side

4‧‧‧Connecting mat for external connection and connecting mat for second side

7‧‧‧Conductor wiring

8‧‧‧Insulation

Claims (21)

A method of manufacturing a wiring board, comprising: a circuit board having an insulating layer on both surfaces and a bonding pad formed on a surface of the insulating layer; and having a solder resist layer on both surfaces of the circuit board, and a part of the bonding pad is removed from the solder resist layer The method for manufacturing an exposed wiring substrate, comprising: a process (A) for forming a solder resist layer having different thicknesses on both surfaces of a circuit board having an insulating layer on both surfaces and a connection pad formed on the surface of the insulating layer; The solder resist layer having a thickness smaller than the first surface of the solder mask of the second surface is subjected to a process (C1) of the process of the post-process (B) exposed to the portion outside the thinned region; and the solder resist for the second face The layer is subjected to a process (C2) of exposing a portion of the process other than the developed region in the process of the post-process (D2); and the film-forming treatment liquid is used to make the solder resist layer of the non-exposed portion equal to the thickness of the connection pad on the first surface a process (B) for exposing one portion of the connection pad to the film formation, a process for exposing the portion of the first surface to the exposed portion of the process (B), and a developing process (C3); The liquid removes the non-exposed portion of the second side Process solder layer (D). A method of manufacturing a wiring board, comprising: a circuit board having an insulating layer on both surfaces and a bonding pad formed on a surface of the insulating layer; and having a solder resist layer on both surfaces of the circuit board, and a part of the bonding pad is removed from the solder resist layer A method of manufacturing an exposed wiring substrate, comprising: a process (A) for forming a solder resist layer having different thicknesses on both surfaces of the circuit substrate having the insulating layer and the connection pads formed on the surface of the insulating layer; and the first solder resist layer having a thickness thinner than the second surface The solder resist layer of the surface, the process (B1) of the process of performing the post-process (B1) is exposed to a portion other than the thinned region (C1); the solder resist layer of the second surface is applied to the process of the post-process (D) developed region a process (C2) for exposing the other portion; a process for forming a thin film of the non-exposed portion of the non-exposed portion (B1) on the first surface in a range where the bonding pad is not exposed; The solder resist layer is subjected to a process (C4) of exposing a portion other than the thinned region in the process (B2) of the post-process; on the first side, the solder resist layer of the non-exposed portion is formed as a bonding pad by the thin film processing liquid. a process of thinning the thickness of the film to a portion of the bonding pad (B2); a process for exposing the solder resist layer of the first surface to a portion of the process (B2) to be thinned (C5); And a process (D) of removing the solder resist layer of the non-exposed portion of the second surface by the developer. A method of manufacturing a wiring board, comprising: a circuit board having an insulating layer on both surfaces and a bonding pad formed on a surface of the insulating layer; and having a solder resist layer on both surfaces of the circuit board, and a part of the bonding pad is removed from the solder resist layer A method of manufacturing an exposed wiring substrate, comprising: an insulating layer on both surfaces; and a bonding pad formed on a surface of the insulating layer a process for forming a first solder resist layer having a different thickness (A1) on both surfaces of the circuit board; and a first solder resist layer having a first surface of the first solder resist layer having a thickness thinner than the second surface, performing the post-process Process (B) is a process for exposing a portion other than the thinned region (C1); for the first solder resist layer of the second face, a process for performing a post-process (D1) exposure to a portion other than the developed region (C2) On the first surface, a thin film formation process is performed in which the first solder resist layer of the non-exposed portion is formed to have a thickness equal to or less than the thickness of the connection pad, and the process (B) of exposing one of the connection pads is performed; a first solder mask layer, a process (C3) for exposing the portion of the thinned region of the process (B); and a first solder resist layer on the first side of the circuit substrate until the process of (C3) is completed, a process for forming a second solder resist layer (A2); a second solder resist layer for the first surface, a process (C6) for performing a post-process (D1) exposure to a portion other than the developed region; and removing the developer The process (D1) of the first solder resist layer of the non-exposed portion of the first surface and the first solder resist layer of the non-exposed portion of the second surface. A method of manufacturing a wiring board, comprising: a circuit board having an insulating layer on both surfaces and a bonding pad formed on a surface of the insulating layer; and having a solder resist layer on both surfaces of the circuit board, and a part of the bonding pad is removed from the solder resist layer A method of manufacturing an exposed wiring board, comprising: a process of forming a first solder resist layer having different thicknesses by providing an insulating layer on both surfaces and a circuit board formed on a connection pad on a surface of the insulating layer (A1); a first solder resist layer having a thickness thinner than a first surface of the first solder resist layer of the second surface, a process (C1) of performing a post-process process (B) exposure of a portion other than the thinned region The first solder resist layer on the second side is subjected to a process (C2) for exposing a portion of the process other than the developed region in the process of the post-process; on the first side, the non-exposed portion is implemented by using a thin film processing solution The first solder resist layer is formed into a film having a thickness equal to or less than the thickness of the bonding pad, and a part (b) of the bonding pad is exposed; and the first solder resist layer on the first surface is formed into a thin film in the process (B). a process for exposing a portion of the region (C3); a process for removing the first solder resist layer of the non-exposed portion of the second face by the developer (D); and a first face of the circuit substrate until the process of completing the process (D) a process for forming a second solder resist layer on a solder resist layer (A2); a process for exposing a portion of the second solder resist layer on the first side to a portion of the process (D2) outside the developed region (C6) And a process (D2) of removing the second solder resist layer of the non-exposed portion of the first surface by the developer. A method of manufacturing a wiring board, comprising: a circuit board having an insulating layer on both surfaces and a bonding pad formed on a surface of the insulating layer; and having a solder resist layer on both surfaces of the circuit board, and a part of the bonding pad is removed from the solder resist layer A method of manufacturing an exposed wiring substrate, comprising: an insulating layer on both surfaces; and a bonding pad formed on a surface of the insulating layer a process for forming a first solder resist layer having a different thickness on both surfaces of the circuit substrate (A1); and a first solder resist layer on the second surface, a process (D1) of the post-process is exposed by a portion other than the developed region Process (C2); in the first surface, the first solder resist layer of the non-exposed portion is formed into a film thickness equal to or less than the thickness of the connection pad, and a part of the connection pad is exposed (B); a first solder resist layer on the first side, a process (C3) for exposing the portion of the process (B) to the thinned region; and a first solder resist on the first side of the circuit substrate until the (C3) process is completed a process of forming a second solder resist layer on the layer (A2); a process for exposing the second solder resist layer on the first side to a portion of the post-process (B3) that is exposed outside the thinned region (C6); In the first surface, in the range where the bonding pad is not exposed, the thinning process of the second solder resist layer in the non-exposed portion is performed by the thin film processing liquid (B3); the second solder resist layer on the first surface is applied to the second surface Process (D1) of the process of exposure outside the developed area (C7); and removal of the first side by the developer The second portion of the solder resist layer and the second surface of the non-exposed portion of the process of the first solder resist layer (D1). The method of manufacturing a wiring board according to any one of claims 1 to 4, wherein the process (C2) is performed before the process (C1). The method of manufacturing a wiring board according to any one of the first to fourth aspects of the invention, wherein At the same time, the process (C1) and the process (C2) are implemented. The method for producing a wiring board according to any one of claims 1, 3, and 4, wherein the exposure of the process (C3) is performed by a non-contact exposure method in an oxygen atmosphere. The method for producing a wiring board according to the fifth aspect of the invention, wherein the exposure of the process (C3) and the process (C7) is performed by a non-contact exposure method in an oxygen atmosphere. The method for producing a wiring board according to the second aspect of the invention, wherein the exposure of the process (C4) and the process (C5) is performed by a non-contact exposure method in an oxygen atmosphere. The method for producing a wiring board according to any one of the first to third aspects, wherein the exposure amount of the process (C3) is one time or more and five times or less the exposure amount of the process (C1). The method of manufacturing a wiring board according to the fifth or ninth aspect of the invention, wherein the exposure amount of the process (C3) and the process (C7) is 1 time or more and 5 times or less of the exposure amount of the process (C6). The method for manufacturing a wiring board according to claim 2, wherein the exposure amount of the process (C4) and the process (C5) is a process (C1). The exposure amount is 1 time or more and 5 times or less. The method for producing a wiring board according to any one of the items 1 to 3, wherein the film formation treatment of the solder resist layer of the process (B) is performed with the film processing surface facing upward. The method for producing a wiring board according to the fifth or ninth aspect of the invention, wherein the thinning treatment of the solder resist layer of the process (B) and the process (B3) is performed with the film-formed surface facing upward. The method for producing a wiring board according to the second or tenth aspect of the invention, wherein the thinning treatment of the solder resist layer of the process (B1) and the process (B2) is performed with the film-formed surface facing upward. The method for producing a wiring board according to the eighth aspect of the invention, wherein the exposure amount of the process (C3) is one time or more and five times or less the exposure amount of the process (C1). The method for producing a wiring board according to the eighth aspect of the invention, wherein the thinning treatment of the solder resist layer of the process (B) is performed with the thinned surface facing up. The method for producing a wiring board according to the eleventh aspect of the invention, wherein the thinning treatment of the solder resist layer of the process (B) is a thinned surface Implement it upwards. The method for producing a wiring board according to claim 12, wherein the thinning treatment of the solder resist layer of the process (B) and the process (B3) is performed with the film-formed surface facing upward. The method for producing a wiring board according to claim 13, wherein the thinning treatment of the solder resist layer of the process (B1) and the process (B2) is performed with the film-formed surface facing upward.