CN106546640A - A kind of carrier for biosensor and preparation method thereof and application - Google Patents
A kind of carrier for biosensor and preparation method thereof and application Download PDFInfo
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- CN106546640A CN106546640A CN201510595276.3A CN201510595276A CN106546640A CN 106546640 A CN106546640 A CN 106546640A CN 201510595276 A CN201510595276 A CN 201510595276A CN 106546640 A CN106546640 A CN 106546640A
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- substrate
- catalytic metal
- carrier
- biosensor
- metal substrate
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Abstract
The present invention relates to a kind of carrier for biosensor and preparation method thereof and application, the sensor base includes at least one catalytic metal substrate and the circuit structure being connected with each catalytic metal substrate respectively, insulating barrier is provided with the outer circumferential side of each catalytic metal substrate, the poroid sensor accommodation space of ladder between described each catalytic metal substrate and insulating barrier, is each formed with.The characteristics of present invention has that low production cost, performance are good, makes high precision, on same substrate can integrated various different test electrodes, be that the integrated of different type biosensor creates condition.
Description
Technical field
The present invention relates to a kind of carrier for biosensor and preparation method thereof and application, belong to biological biography
Sensor technical field.
Background technology
Biosensor is the sensor of a class specific form, by biomolecule recognition component and all kinds of physics,
Chemical transducer composition, for the analysis and detection of various living matters and chemical substance.Biosensor melts
Biology, chemistry, physicss, information science and correlation technique have been developed as one very in one
Active research field.Biosensor is to biological material sensitive and its concentration is converted to the signal of telecommunication carries out
The instrument of detection.Biosensor has the function of accepter and transducer.Bio-sensing of the prior art
Device is used mostly silicon chip or ceramics as carrier, and this two classes carrier is required for carrying out metallized mistake on surface
Journey.Metallized process generally has magnetron sputtering and electrochemical deposition two ways, the former due in fixture and
Non-active area wastes substantial amounts of noble metal and causes cost very high, the latter's electro-deposition in non metallic substrate
Need the first pre-activate that carries out in substrate to thus result in the decline of coating purity, therefore all there is certain defect.
The content of the invention
In order to overcome the deficiencies in the prior art, it is an object of the invention to provide a kind of for biosensor
Carrier and preparation method thereof and application, with low production cost, performance it is good, make high precision the characteristics of；Enter
One step ground, on same substrate can integrated various different catalytic metal substrates, being that different type is biological passes
The integrated of sensor creates condition.
To solve the above problems, the technical scheme that first purpose of the present invention is adopted is as follows：
A kind of carrier for biosensor, including substrate, the sensor base being arranged on substrate, its
It is characterised by：The sensor base include at least one catalytic metal substrate and respectively with each catalytic metal base
The circuit structure of bottom connection, is provided with insulating barrier, described each catalytic gold in the outer circumferential side of each catalytic metal substrate
The poroid sensor accommodation space of ladder is each formed between category substrate and insulating barrier.
Preferably, solder mask layer of the insulating barrier for the solder mask layer or UV photocurings of heat cure.
Preferably, the substrate is copper coated foil plate.Copper coated foil plate is soaked by reinforcing material with Resin adhesive,
By drying, cutting, blank is overlapped into, is then covered with Copper Foil, with steel plate as mould, in hot press
Jing High Temperature High Pressure is formed and is made.Available substrate has paper substrate, glass fabric base, composite base (CEM
Series), the different reinforcing material systems such as build-up multilayerboard base and special material base (ceramic, metal-cored base etc.)
Into copper coated foil plate, preferred glass fabric base epoxy copper coated foil plate FR-4.
Preferably, the catalytic metal substrate is gold substrate, platino bottom or SERS substrate.
The circuit structure includes at least one pad, and each pad is drawn with a plug wire by a conductive lead wire respectively
Foot connects；Catalyzing metal layer is electroplate with respectively on each pad of the circuit structure, obtains biosensor
Required catalytic metal substrate；The catalytic metal substrate includes row's gold substrate, row's platino bottom and a row
SERS substrate.
The sensor accommodation space is the shoulder hole that radius increases successively from the bottom up.
Described circuit structure is obtained by substrate Jing PCB circuit etch techniques, is electroplate with circuit structure successively
Nickel dam and layer gold.
The technical scheme that second object of the present invention is adopted is as follows：
A kind of manufacture method of the carrier for biosensor, it is characterised in that comprise the following steps：
1) substrate is provided, the substrate is copper coated foil plate；
2) circuit makes:On the substrate by the PCB chemical etching processes of standard, by unnecessary Copper Foil
Remove, obtain pre-designed circuit structure, the circuit structure includes at least one pad, each pad
It is connected with a pinouts by a conductive lead wire respectively；
3) make catalytic metal substrate：Electroplate catalytic metal on each pad of the circuit structure respectively
Layer, obtains the catalytic metal substrate needed for biosensor；
4) make sensor accommodation space：
4-1)) welding resistance windowing operation：Solder mask is coated on substrate, by crosslinking developing procedure being exposed right
The position of catalytic metal substrate is answered to open a window and obtain the exposed region of predefined size；The shapes and sizes of exposed region
Depending on the sensor for being carried, can be the arbitrarily geometrical pattern such as rectangle, circle, after solder mask solidification
An accommodation space is formed between the insulating barrier of formation and exposed each catalytic metal substrate；
Step 4-1 is completed 4-2)) after, repeating carries out welding resistance windowing operation at least one times；
The poroid sensor accommodation space of ladder is each formed between insulating barrier and each catalytic metal substrate finally.
Preferably, step 3) in, nickel dam and Bao Jin in successively plating on the circuit structure, then each
Upper different catalytic metal, the catalytic metal substrate needed for obtaining are electroplated on pad.
The technical scheme that third object of the present invention is adopted is as follows：
The biosensor of carrier described in a kind of first purpose including the present invention, the sensor can be each
Ion-selective electrode is planted, its upper surface for being included in described catalytic metal substrate is set gradually from bottom to top
Internal reference electrode layer, solid-state electrolyte layer and the semi-transparent film layer of selectivity ion.The effect of ion semipermeable membrane is
Only allow test substance to penetrate through and enter into Inner electrolysis matter layer to react so as to form one inside and outside film layer
Individual stable electric potential difference.The specific manufacturing process of the sensor is included but is not limited to：With standard galvanoplastic or
Ag/AgCl is covered and obtain internal reference electrode layer in the corresponding catalytic metal substrate of sensor base by chemical method,
Or first fine silver galvanoplastic or chemical method are covered in corresponding catalytic metal substrate, then with villaumite and silver
Generation chemical reaction generates silver chloride and obtains internal reference electrode layer；Using point gum machine just it is pre-configured not
The drop of same electrolyte solution is clicked and entered in the corresponding ground floor accommodation space of sensor carrier, treats that solvent volatilizees
It is dried to obtain solid-state electrolyte layer；The drop of pre-configured different ion-sensitive coating solution is clicked and entered into biography
In the corresponding second layer accommodation space of sensor carrier, treat that solvent volatile dry obtains selectivity ion film layer, most
Ion selectivity sensor of the end form into 3 layers of stereochemical structure, the poroid sensor of corresponding 3 layers of ladder are housed
The size of fixed each layer of electrode material, shape, thickness, the function of volume can be played in space, to guarantee sensing
The concordance that device makes.
Compared to existing technology, the beneficial effects of the present invention is：
1st, it is that electrode material is successively printed onto base by techniques such as silk screen printings that prepared by electrode of the prior art
On plate, and the present invention is to obtain a poroid accommodation space of ladder by opening a window to solder mask layer welding resistance,
Successively titrate each layer electrode material again to obtain, the sensor carrier is similar to shoulder hole one by one, each layer of platform
The border of rank can be used for size, shape and the longitudinal thickness for controlling biosensor drop, be sensor
Make and excellent carrier is provided.The present invention forms different shape, difference by way of multiple welding resistance opens a window
The three-dimensional stair like control strategy border of size, improves the precision and concordance of biosensor.
2nd, the present invention carries out the making of biosensor carrier using PCB processing technique, is obtained by etch process
Needed for circuit structure, on the pad of circuit structure with electroplate by way of obtain needed for catalytic metal
Substrate, reuses the solder mask with sensitive material, using the mode of exposure crosslinking development in substrate surface system
Make at least two-layer welding resistance protective layer, and open a window at corresponding catalytic metal substrate position, ultimately form sensor
Carrier needed for making, has the advantages that low production cost and function admirable.The present invention uses PCB as load
Body, by way of parcel plating, realizes that integrated various different catalytic substrates are (such as on same pcb board
Gold, platinum, silver etc.), it is that the integrated of different type biosensor creates condition.
With reference to the accompanying drawings and detailed description the present invention is described in further detail.
Description of the drawings
The embodiment of the present invention is further elucidated below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of the carrier of embodiment 1；
Fig. 2 is the sectional view of the carrier of embodiment 1；
Fig. 3 is the sectional view of the carrier of embodiment 2；
Fig. 4 is the sectional view of the carrier of embodiment 3；
Wherein, 1, substrate；21st, catalytic metal substrate；22nd, conductive lead wire；23rd, pinouts；3、
Insulating barrier；4th, sensor accommodation space；5th, inert metal layer.
Specific embodiment
Embodiment 1：
With reference to Fig. 1-2, a kind of carrier for biosensor, there is the sensor of three-decker for carrying,
Including substrate 1, sensor base on substrate 1 is set, the sensor base includes each catalytic metal base
Bottom 21 and the circuit structure being connected with each catalytic metal substrate, are provided with absolutely in the outer circumferential side of each catalytic metal substrate
Edge layer 3, it is 3 grades of steps that vertical section is respectively formed between described each catalytic metal substrate 21 and insulating barrier 3
The poroid sensor accommodation space 4 of ladder.The sensor accommodation space 4 increases successively for radius from the bottom up
Shoulder hole.
Solder mask layer of the insulating barrier 3 for heat cure.The substrate 1 is copper coated foil plate.It is described to cover copper
Paper tinsel plate is glass fabric base epoxy copper coated foil plate FR-4.
The circuit structure includes at least one pad, and each pad passes through a conductive lead wire 22 and a plug wire respectively
Pin 23 connects；Catalyzing metal layer is electroplate with respectively on each pad of the circuit structure, obtains biological biography
Catalytic metal substrate 21 needed for sensor；The catalytic metal substrate 21 includes row's gold substrate, row's platino
Bottom and row's SERS substrate.
.In Fig. 1 from top to bottom, first row is gold substrate, and second row is platino bottom, and the 3rd row is SERS substrate.
A kind of manufacture method of the carrier for biosensor, comprises the following steps：
1) substrate is provided, baseplate material selects glass fabric base epoxy copper coated foil plate FR-4；
2) circuit makes:On the substrate by the PCB chemical etching processes of standard, by unnecessary Copper Foil
Remove, obtain pre-designed circuit structure, the circuit structure includes three row's pads, each pad difference
It is connected with a pinouts by a conductive lead wire；
3) make catalytic metal substrate：Electroplate thick layer gold on the first row pad of the circuit structure respectively,
Upper thickness platinum layer is electroplated on second row pad, upper thickness silver layer is electroplated on the 3rd row's pad, biosensor institute is obtained
The catalytic metal substrate for needing；
4) make sensor accommodation space：
4-1)) welding resistance windowing operation：Solder mask is coated on substrate, by crosslinking developing procedure being exposed right
Answer the position of catalytic metal substrate to open a window and obtain the exposed region of predefined size, exposed region it is generally circular in shape,
An accommodation space is formed between the insulating barrier formed after solder mask solidification and exposed catalytic metal substrate.
Step 4-1 is completed 4-2)) after, repeating carries out welding resistance windowing operation twice；Final insulating barrier with respectively urge
The poroid sensor accommodation space of the ladder of 3 grades of steps is respectively formed between change metallic substrates, the sensor holds
It is radius increases successively from the bottom up shoulder hole between being empty.
A kind of biosensor including the carrier, which is included in the upper surface of described catalytic metal substrate
Internal reference electrode layer Ag/AgCl, solid-state electrolyte layer and the selectivity ion semipermeable membrane for setting gradually from bottom to top
Layer.The effect of the semi-transparent film layer of selectivity ion is only to allow test substance to penetrate through and enter into dielectric substrate
React generation electric current.
Embodiment 2：
With reference to the characteristics of Fig. 3, the present embodiment it is：In a kind of manufacture method of the carrier for biosensor
Step 3) in, the nickel dam in first plating on described circuit structure, thickness is 1-7um, afterwards thin gold in re-plating,
Thickness is 0.01-0.1um, subsequently electroplates thick layer gold respectively on first row pad, on second row pad in plating
Thick platinum layer, electroplates upper thickness silver layer, obtains the catalytic metal substrate needed for biosensor on the 3rd row's pad；
Other are same as Example 1.
Embodiment 3：
With reference to the characteristics of Fig. 4, the present embodiment it is：In a kind of manufacture method of the carrier for biosensor
Step 4-2) in, the above-mentioned welding resistance windowing operation of repetition four times；Step 4-3) described in sensor accommodation space
4 cross section has four steps.Other are same as Example 1.
Other embodiment：
The quantity of the catalytic metal substrate be one, two, three, four, five, ten, 20
It is individual or more.The catalytic metal substrate is gold substrate, platino bottom, one or more in SERS substrate
Combination.The cross section of the sensor accommodation space has step, four steps or more steps.
Above-mentioned embodiment is only the preferred embodiment of the present invention, it is impossible to present invention protection is limited with this
Scope, the change and replacement of any unsubstantiality that those skilled in the art is done on the basis of the present invention
Belong to scope of the present invention.
Claims (10)
1. a kind of carrier for biosensor, including substrate, the sensor base being arranged on substrate,
It is characterized in that：The sensor base include at least one catalytic metal substrate and respectively with each catalytic metal
The circuit structure of substrate connection, is provided with insulating barrier, described each catalysis in the outer circumferential side of each catalytic metal substrate
The poroid sensor accommodation space of ladder is each formed between metallic substrates and insulating barrier.
2. the carrier for biosensor according to claim 1, it is characterised in that the insulation
Solder mask layer of the layer for the solder mask layer or UV photocurings of heat cure.
3. the carrier for biosensor according to claim 1, it is characterised in that：The substrate
For copper coated foil plate.
4. the carrier for biosensor according to claim 1, it is characterised in that：The catalysis
Metallic substrates are gold substrate, platino bottom or SERS substrate.
5. the carrier for biosensor according to claim 1, it is characterised in that：The circuit
Structure includes at least one pad, and each pad is connected with a pinouts by a conductive lead wire respectively；It is described
Catalyzing metal layer is electroplate with respectively on each pad of circuit structure, obtains the catalytic gold needed for biosensor
Category substrate；The catalytic metal substrate includes row's gold substrate, row's platino bottom and row's SERS substrate.
6. the carrier for biosensor according to claim 1, it is characterised in that：The sensing
Device accommodation space is the shoulder hole that radius increases successively from the bottom up.
7. the carrier for biosensor according to claim 1, it is characterised in that：Described electricity
Line structure is obtained by substrate Jing PCB circuit etch techniques, is electroplate with nickel dam and layer gold on circuit structure successively.
8. a kind of making of the carrier for biosensor according to any one in claim 1-6
Method, it is characterised in that comprise the following steps：
1) substrate is provided, the substrate is copper coated foil plate；
2) circuit makes:Pre-designed circuit structure is obtained by PCB etch process on the substrate,
The circuit structure includes at least one pad, and each pad passes through a conductive lead wire respectively and a pinouts connect
Connect；
3) make catalytic metal substrate：Electroplate catalytic metal on each pad of the circuit structure respectively
Layer, obtains the catalytic metal substrate needed for biosensor；
4) make sensor accommodation space：
4-1)) welding resistance windowing operation：Solder mask is coated on substrate, by crosslinking developing procedure being exposed right
Answer the position of catalytic metal substrate to open a window and obtain the exposed region of predefined size, formed after solder mask solidification
An accommodation space is formed between insulating barrier and exposed each catalytic metal substrate；
Step 4-1 is completed 4-2)) after, repeating carries out welding resistance windowing operation at least one times；Final each insulating barrier
The poroid sensor accommodation space of ladder is respectively formed between each catalytic metal substrate.
9. the manufacture method of the carrier for biosensor according to claim 8, it is characterised in that
Step 3) in, the electronickelling on the circuit structure, thickness are 1-7um, the gold of re-plating afterwards, and thickness is 0.01-0.1um,
Different catalytic metals in plating on each pad, obtains required catalytic metal substrate again.
10. a kind of biosensor including carrier described in any one in claim 1-7, the catalytic gold
The surface of category substrate is disposed with internal reference electrode layer, solid-state electrolyte layer and selectivity ion from bottom to top
Semi-transparent film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510595276.3A CN106546640A (en) | 2015-09-16 | 2015-09-16 | A kind of carrier for biosensor and preparation method thereof and application |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510595276.3A CN106546640A (en) | 2015-09-16 | 2015-09-16 | A kind of carrier for biosensor and preparation method thereof and application |
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| CN106546640A true CN106546640A (en) | 2017-03-29 |
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| CN201510595276.3A Pending CN106546640A (en) | 2015-09-16 | 2015-09-16 | A kind of carrier for biosensor and preparation method thereof and application |
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| CN111970850A (en) * | 2020-08-17 | 2020-11-20 | 鹤山市中富兴业电路有限公司 | PCB for medical detection and manufacturing method of PCB |
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Application publication date: 20170329 |