CN108593734A - A kind of manufacturing method of sensor element - Google Patents
A kind of manufacturing method of sensor element Download PDFInfo
- Publication number
- CN108593734A CN108593734A CN201810304257.4A CN201810304257A CN108593734A CN 108593734 A CN108593734 A CN 108593734A CN 201810304257 A CN201810304257 A CN 201810304257A CN 108593734 A CN108593734 A CN 108593734A
- Authority
- CN
- China
- Prior art keywords
- manufacturing
- cover plate
- technique
- sensor element
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 4
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000004425 Makrolon Substances 0.000 claims abstract description 4
- 239000004743 Polypropylene Substances 0.000 claims abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 4
- 239000011810 insulating material Substances 0.000 claims abstract description 4
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 4
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 4
- -1 polypropylene Polymers 0.000 claims abstract description 4
- 229920001155 polypropylene Polymers 0.000 claims abstract description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims abstract description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims abstract description 4
- 238000007639 printing Methods 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 239000004332 silver Substances 0.000 claims abstract description 4
- 239000002002 slurry Substances 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 6
- 238000002679 ablation Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 238000010884 ion-beam technique Methods 0.000 abstract description 3
- 238000002360 preparation method Methods 0.000 abstract description 3
- 238000012876 topography Methods 0.000 abstract description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
- G01N27/308—Electrodes, e.g. test electrodes; Half-cells at least partially made of carbon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Electrochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Molecular Biology (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention discloses a kind of manufacturing method of sensor element, manufacturing method includes the following steps：Select the cover plate of the insulating materials properties such as polyvinyl chloride, polypropylene, makrolon and acrylic resin, the electrode sensing plate that surface is coated with to the electrode slurrys such as silver paste or silver-colored palladium slurry is fixed on by the technique of matrix printing among cover plate and piezoelectric substrate, to form electrodes conduct band；Graphene is shifted to target substrate surface, metal grid electrode pattern is made on target substrate surface, using this preparation method, the bottleneck that ion beam etch process will not be used technique, reduce equipment investment, and more importantly technique greatly simplifies, greatly reduces the flow time, preferable magneto-resistive layer surface topography is obtained, device performance is improved.
Description
Technical field
The present invention relates to electronic component manufacturing technology field more particularly to a kind of manufacturing methods of sensor element.
Background technology
Current existing sheet type sensor structure is mainly made of 3 layers of oxidation zirconia substrate and several function thick-film layers, is aoxidized
Zirconia substrate is mainly molded by the method for being cast or rolling film, and thick film functional layer is mainly obtained by screen printing technique.Oxygen
The measuring electrode and reference electrode of sensor are respectively formed on the surfaces externally and internally of substrate, by punch forming by the middle part of substrate
One of long and narrow openning is washed open, to form reference air duct；And the platinum disposition of heating component wrapped up by ceramic insulating layer exists
On the inner surface of bottom substrate, also two through-holes are made a call to by the heating element of inner surface with outer surface end in the end of substrate
Heating electrode slice connects, and thus constitutes sensing element and the integrated chip oxygen sensor structure of heating element.
But the structural thickness is thick, volume is big, production process is complicated, and heating element is planted in the form of wrapping up in sensor internal, stability
It is poor, and it is easy electric leakage.
Invention content
In consideration of it, the present invention provides a kind of manufacturing method of sensor element, manufacturing method includes the following steps：
Step 1：The cover plate of the insulating materials properties such as polyvinyl chloride, polypropylene, makrolon and acrylic resin is selected,
The electrode sensing plate that surface is coated with to the electrode slurrys such as silver paste or silver-colored palladium slurry is fixed on cover plate by the technique of matrix printing
Among piezoelectric substrate, to form electrodes conduct band；
Step 2：Graphene is shifted to target substrate surface, metal grid electrode pattern is made on target substrate surface；
Step 3：The ceramic substrate that photoetching is completed is put into magnetron sputtering apparatus, sputters Pt metallic films；
Step 4：The above-mentioned ceramic substrate that obtains is put into the stove of O2 atmosphere ablation or is put into removal SU-8 glue in salt bath,
Finally obtain the Pt metal micro structure figures of deposition on a ceramic substrate.
To so of the invention that further describe, if 2~3 times of the thickness Pt thickness of metal film of the step 4 SU-8 glue.
Using above-mentioned technical proposal, have the advantages that：
Using this preparation method, the bottleneck that ion beam etch process will not be used technique, reduce equipment investment, and heavier
What is wanted is that technique greatly simplifies, and greatly reduces the flow time, obtains preferable magneto-resistive layer surface topography, improves device performance.
Specific implementation mode
Embodiment 1：A kind of manufacturing method of sensor element, manufacturing method include the following steps：
Step 1：The cover plate of the insulating materials properties such as polyvinyl chloride, polypropylene, makrolon and acrylic resin is selected,
The electrode sensing plate that surface is coated with to the electrode slurrys such as silver paste or silver-colored palladium slurry is fixed on cover plate by the technique of matrix printing
Among piezoelectric substrate, to form electrodes conduct band；
Step 2：Graphene is shifted to target substrate surface, metal grid electrode pattern is made on target substrate surface；
Step 3：The ceramic substrate that photoetching is completed is put into magnetron sputtering apparatus, sputters Pt metallic films；
Step 4：The above-mentioned ceramic substrate that obtains is put into the stove of O2 atmosphere ablation or is put into removal SU-8 glue in salt bath,
Finally obtain the Pt metal micro structure figures of deposition on a ceramic substrate.
To so of the invention that further describe, if 2~3 times of the thickness Pt thickness of metal film of the step 4 SU-8 glue.
Using above-mentioned technical proposal, have the advantages that：
Using this preparation method, the bottleneck that ion beam etch process will not be used technique, reduce equipment investment, and heavier
What is wanted is that technique greatly simplifies, and greatly reduces the flow time, obtains preferable magneto-resistive layer surface topography, improves device performance.
The foregoing describe the basic principles and main features of the present invention, It should be understood by those skilled in the art that of the invention
It is not restricted to the described embodiments, the above embodiments and description only illustrate the principle of the present invention, is not departing from
Under the premise of spirit and scope of the invention, various changes and improvements may be made to the invention, these changes and improvements both fall within requirement
In the scope of the invention of protection, invents claimed range and be defined by the appending claims and its equivalent thereof.
Claims (2)
1. a kind of manufacturing method of sensor element, which is characterized in that manufacturing method includes the following steps：
Step 1：The cover plate of the insulating materials properties such as polyvinyl chloride, polypropylene, makrolon and acrylic resin is selected,
The electrode sensing plate that surface is coated with to the electrode slurrys such as silver paste or silver-colored palladium slurry is fixed on cover plate by the technique of matrix printing
Among piezoelectric substrate, to form electrodes conduct band；
Step 2：Graphene is shifted to target substrate surface, metal grid electrode pattern is made on target substrate surface；
Step 3：The ceramic substrate that photoetching is completed is put into magnetron sputtering apparatus, sputters Pt metallic films；
Step 4：The above-mentioned ceramic substrate that obtains is put into the stove of O2 atmosphere ablation or is put into removal SU-8 glue in salt bath,
Finally obtain the Pt metal micro structure figures of deposition on a ceramic substrate.
2. a kind of manufacturing method of sensor element according to claim 1, which is characterized in that the step 4 SU-8 glue
If 2~3 times of thickness Pt thickness of metal film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810304257.4A CN108593734A (en) | 2018-04-08 | 2018-04-08 | A kind of manufacturing method of sensor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810304257.4A CN108593734A (en) | 2018-04-08 | 2018-04-08 | A kind of manufacturing method of sensor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108593734A true CN108593734A (en) | 2018-09-28 |
Family
ID=63624597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810304257.4A Pending CN108593734A (en) | 2018-04-08 | 2018-04-08 | A kind of manufacturing method of sensor element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108593734A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311351A (en) * | 2021-12-17 | 2022-04-12 | 中国船舶重工集团公司第七一五研究所 | Preparation method of 1-3 type piezoelectric single crystal composite material |
-
2018
- 2018-04-08 CN CN201810304257.4A patent/CN108593734A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311351A (en) * | 2021-12-17 | 2022-04-12 | 中国船舶重工集团公司第七一五研究所 | Preparation method of 1-3 type piezoelectric single crystal composite material |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180928 |