CN110740578A - Circuit board taphole screen printing solder mask process - Google Patents
Circuit board taphole screen printing solder mask process Download PDFInfo
- Publication number
- CN110740578A CN110740578A CN201911105266.1A CN201911105266A CN110740578A CN 110740578 A CN110740578 A CN 110740578A CN 201911105266 A CN201911105266 A CN 201911105266A CN 110740578 A CN110740578 A CN 110740578A
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- circuit board
- hole
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- baffle
- screen printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a circuit board plug hole screen printing solder mask process which comprises the following steps of S1, manufacturing a circuit board with a through hole, placing the prepared circuit board in an existing drilling machine, drilling a needed through hole by the drilling machine, S2, manufacturing a nail bed, preparing an etched substrate, fixing flat nails and sharp nails vertically upwards on the substrate in a staggered mode, wherein the sharp nails correspond to the through hole on the circuit board, the flat nails and the sharp nails are distributed in an array mode, the filling amount of the plug holes is controlled to be 90-100% of an ideal state, an added baffle reduces the problem of ink soaking caused by over-thick ink on the surface of a hole ring, pre-baking, curing and tin spraying are adopted after the plug holes are punched by an ink solvent, sectional baking is adopted, the plug holes are arranged in baking ovens, continuous temperature rising baking and curing are adopted, the temperature change of the plug hole ink is changed, the windowing design of the added baffle is adopted, the surface tension of the through hole of the circuit board is increased when the plug holes are plugged by the solder resist ink, the ovens is lower, and.
Description
Technical Field
The invention relates to a plug hole screen printing solder mask process, in particular to a circuit board plug hole screen printing solder mask process.
Background
At present, layers of aluminum sheets drilled are adhered to a screen printing plate, holes in the aluminum sheets correspond to holes in a circuit board needing solder resist ink hole plugging, ink is filled into the holes in the circuit board through the aluminum sheets in a screen printing mode, however, the hole diameter of the drilled holes in the aluminum sheets in the process is equal to the hole diameter of the circuit board needing ink hole plugging, the ink cannot accurately enter the holes to be plugged and is easily adhered to an orifice, the orifice is blocked, subsequent ink is prevented from entering the holes, during hole plugging, only times of screen printing are carried out from surfaces of the printed circuit board, after hole plugging is completed, the hole plugging is easily incomplete, after the whole solder resist flow is completed, the red phenomenon of the orifice can be shown, and subsequent procedures such as surface treatment and welding can be influenced.
Disclosure of Invention
The invention aims to provide an circuit board plug hole screen printing solder mask process, which has the advantages that a sharp nail is utilized to plug a through hole part, an additional baffle is added, and the problem of ink stain caused by over-thick ink on the surface of a hole ring is solved.
In order to achieve the purpose, the invention provides the following technical scheme that the circuit board plug hole screen printing solder mask process comprises the following steps:
s1: manufacturing a circuit board with a through hole, placing the prepared circuit board in an existing drilling machine, and drilling the required through hole by using the drilling machine;
s2: manufacturing a nail bed: preparing an etched substrate, and fixing vertically upward flat nails and sharp nails on the substrate in a staggered manner, wherein the flat nails and the sharp nails are distributed in an array manner;
s3: positioning: the circuit board is placed above the nail bed, the plane of the flat nail is connected with the circuit board to play a supporting role, and the sharp nail is placed outside the forming area or in the blank of the substrate;
s4, manufacturing a baffle, namely preparing a baffle with the same size as the circuit board, aligning the baffle with the four ends of the circuit board, feeding the baffle into a drilling machine, penetrating a drill bit of the drilling machine through the circuit board and the baffle, and enabling a via hole on the circuit board to correspond to a windowing position on the baffle;
s5, plugging, namely, attaching a baffle plate to the upper surface of the circuit board, wherein a window on the baffle plate corresponds to the through hole , the circuit board is adhered on the screen printing plate, the baffle plate is positioned between the circuit board and the circuit board, the brush head on the screen printing plate moves back and forth, solder resist ink is continuously printed twice, and solder resist ink plugging is carried out;
s6: baking: controlling the humidity of solder resist ink on the baked circuit board to be 68-78 ℃;
s7: exposure and development: windowing is carried out at the position corresponding to the position of the through hole of the negative plate and the circuit board, and 8-10 grade and normal development is adopted for exposure;
s8: and (3) curing: placing the circuit board into an oven for low-temperature baking, and then placing the circuit board into an oven for high-temperature baking and segmented curing;
the brush head moves back and forth at an oblique angle, the angle of the oblique angle is set according to the moving track of the brush head, the brush head and the moving track of the brush head form an acute angle, and the brush head is provided with two holes for back-plugging the holes.
, the ink must be full after plugging the holes, and the windows of the baffle are subject to ink overflow.
the step of segmented solidification is that the temperature of is 60 ℃ for 60min, the temperature of 80 ℃ for 30min in the second segment, the temperature of 120 ℃ for 20min in the third segment and the temperature of 155 ℃ for 60min in the fourth segment.
Compared with the prior art, the invention has the beneficial effects that:
this circuit board consent silk screen printing hinders technique of welding, the full volume control of consent is at 90-100% ideal state, the baffle of installing additional reduces the problem that the blotted ink appears in the surperficial china ink of orifice ring is too thick, adopt behind the consent to dry by the fire in advance, solidification and tin spraying are printing ink solvent and volatilize, the consent adopts the segmentation stoving, the setting is in ovens, the stoving solidification of heating up in succession, change the change of consent printing ink temperature, the design of windowing of the baffle that increases, let the conducting hole of circuit board when being hindered the printing ink consent by welding, the tension on increase surface, lower at the oven temperature, the temperature of the hole explosion has been solved.
Drawings
FIG. 1 is a schematic view of the structure of the nail bed of the present invention;
FIG. 2 is a flow chart of the circuit board plug hole screen printing solder resist process of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be made clear below with reference to the drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only partial embodiments of the present invention , rather than all embodiments, and all other embodiments obtained by those skilled in the art without any creative effort based on the embodiments of the present invention belong to the protection scope of the present invention.
Example :
referring to fig. 1-2, the invention discloses a circuit board plug hole screen printing solder mask process, which comprises the following steps:
step , manufacturing a circuit board with a through hole, placing the prepared circuit board in the existing drilling machine, drilling the required via hole by the drilling machine, and developing the PCB to high density and high difficulty along with the development of electronic products to the directions of light, thin, short and small, so that a large amount of PCBs with SMT and BGA are required to be plugged when components are mounted, and the via hole of the circuit board must be plugged in order to meet the requirements of customers;
step two: manufacturing a nail bed: preparing an etched substrate, and fixing vertically upward flat nails and sharp nails on the substrate in a staggered manner, wherein the flat nails and the sharp nails are distributed in an array manner, and the substrate is beneficial to air release and reduces the printing times;
step three: positioning: the circuit board is placed above the nail bed, the plane of the flat nail is connected with the circuit board to play a supporting role, the sharp nail is placed outside the forming area or in the blank of the substrate, the sharp nail blocks the bottom end of the through hole, the flat nail plays a supporting role on the substrate, the sharp nail plays a supporting role on the through hole, and the sharp nail is placed outside the forming area or in the blank of the substrate and cannot damage the copper surface of the circuit board;
preparing a baffle plate with the same size as the circuit board, aligning the baffle plate with the four ends of the circuit board, starting to feed the baffle plate into a drilling machine, penetrating a drill bit of the drilling machine through the circuit board and the baffle plate, and enabling a via hole on the circuit board to correspond to a windowing position on the baffle plate;
plugging, namely, attaching a baffle to the upper surface of a circuit board, wherein a window on the baffle corresponds to a through hole , the circuit board is adhered on a screen, the baffle is positioned between the circuit board and the circuit board, a brush head on the screen moves back and forth, solder resist ink is continuously printed for two times, the brush head moves back and forth at an inclined angle and is arranged according to the moving track of the brush head at the inclined angle, the moving track of the brush head and the moving track of the brush head form an acute angle, the brush head is provided with two holes for hole return plugging, the solder resist ink hole plugging is carried out, the ink after the hole plugging is full, the ink overflows when the window of the baffle is opened, the short circuit caused by the fact that tin penetrates through an element surface from the through hole when the PCB passes through wave soldering is prevented;
step six: baking: controlling the humidity of solder resist ink on the baked circuit board at 68 ℃;
step seven: exposure and development: windowing is carried out at the position corresponding to the position of the through hole of the negative plate and the circuit board, and 8-10 grade and normal development is adopted for exposure;
and step eight, curing, namely placing the circuit board into an oven for low-temperature baking, then placing the circuit board into the oven for high-temperature baking and segmented curing, wherein the segmented curing respectively comprises th segment at 60 ℃ for 60min, 80 ℃ for 30min for the second segment, 120 ℃ for 20min for the third segment and 155 ℃ for 60min for the fourth segment.
The filling amount of the plug holes is controlled to be in an ideal state of 90-100%, the added baffle plate reduces the problem of ink stain caused by over-thick ink on the surface of a hole ring, an aluminum sheet needing plug holes is drilled by a numerical control drilling machine in the process flow to manufacture a screen printing plate for plug holes, the plug holes are ensured to be full through hole plugging, the plug hole ink plug holes can be plugged by the plug hole ink, the plug hole ink can also be used by thermosetting ink, the process flow has the characteristics of large hardness, small resin shrinkage change and good bonding force with hole walls, pre-baking, curing and tin spraying are adopted after the plug holes are plugged to volatilize ink solvent, the plug holes are baked in sections and are arranged in ovens, continuous heating baking and curing are carried out, the temperature change of the plug hole ink is changed, the opening design of the added baffle plate is increased, the surface tension is increased when the plug holes.
Example two:
A circuit board plug hole screen printing solder mask process comprises the following steps:
, manufacturing a circuit board with a through hole, placing the prepared circuit board in the existing drilling machine, and drilling the required through hole by the drilling machine;
step , manufacturing a circuit board with a through hole, placing the prepared circuit board in the existing drilling machine, drilling the required via hole by the drilling machine, and developing the PCB to high density and high difficulty along with the development of electronic products to the directions of light, thin, short and small, so that a large amount of PCBs with SMT and BGA are required to be plugged when components are mounted, and the via hole of the circuit board must be plugged in order to meet the requirements of customers;
preparing an etched substrate, and fixing vertical upward flat nails and sharp nails on the substrate in a staggered manner, wherein the sharp nails correspond to the through holes on the circuit board, and the flat nails and the sharp nails are distributed in an array manner, so that the substrate is favorable for air release and the printing frequency is reduced;
step three: positioning: the circuit board is placed above the nail bed, the plane of the flat nail is connected with the circuit board to play a supporting role, the sharp nail is placed outside the forming area or in the blank of the substrate, the sharp nail blocks the bottom end of the through hole, the flat nail plays a supporting role on the substrate, the sharp nail plays a supporting role on the through hole, and the sharp nail is placed outside the forming area or in the blank of the substrate and cannot damage the copper surface of the circuit board;
preparing a baffle plate with the same size as the circuit board, aligning the baffle plate with the four ends of the circuit board, starting to feed the baffle plate into a drilling machine, penetrating a drill bit of the drilling machine through the circuit board and the baffle plate, and enabling a via hole on the circuit board to correspond to a windowing position on the baffle plate;
plugging, namely, attaching a baffle to the upper surface of a circuit board, wherein a window on the baffle corresponds to a through hole , the circuit board is adhered on a screen, the baffle is positioned between the circuit board and the circuit board, a brush head on the screen moves back and forth, solder resist ink is continuously printed for two times, the brush head moves back and forth at an inclined angle and is arranged according to the moving track of the brush head at the inclined angle, the moving track of the brush head and the moving track of the brush head form an acute angle, the brush head is provided with two holes for hole return plugging, the solder resist ink hole plugging is carried out, the ink after the hole plugging is full, the ink overflows when the window of the baffle is opened, the short circuit caused by the fact that tin penetrates through an element surface from the through hole when the PCB passes through wave soldering is prevented;
step six: baking: controlling the humidity of solder resist ink on the circuit board after baking to be 73 ℃;
step seven: exposure and development: windowing is carried out at the position corresponding to the position of the through hole of the negative plate and the circuit board, and 8-10 grade and normal development is adopted for exposure;
and step eight, curing, namely placing the circuit board into an oven for low-temperature baking, then placing the circuit board into the oven for high-temperature baking and segmented curing, wherein the segmented curing respectively comprises th segment at 60 ℃ for 60min, 80 ℃ for 30min for the second segment, 120 ℃ for 20min for the third segment and 155 ℃ for 60min for the fourth segment.
The filling amount of the plug holes is controlled to be in an ideal state of 90-100%, the added baffle plate reduces the problem of ink stain caused by over-thick ink on the surface of a hole ring, an aluminum sheet needing plug holes is drilled by a numerical control drilling machine in the process flow to manufacture a screen printing plate for plug holes, the plug holes are ensured to be full through hole plugging, the plug hole ink plug holes can be plugged by the plug hole ink, the plug hole ink can also be used by thermosetting ink, the process flow has the characteristics of large hardness, small resin shrinkage change and good bonding force with hole walls, pre-baking, curing and tin spraying are adopted after the plug holes are plugged to volatilize ink solvent, the plug holes are baked in sections and are arranged in ovens, continuous heating baking and curing are carried out, the temperature change of the plug hole ink is changed, the opening design of the added baffle plate is increased, the surface tension is increased when the plug holes.
Example three:
A circuit board plug hole screen printing solder mask process comprises the following steps:
, manufacturing a circuit board with a through hole, placing the prepared circuit board in the existing drilling machine, and drilling the required through hole by the drilling machine;
step , manufacturing a circuit board with a through hole, placing the prepared circuit board in the existing drilling machine, drilling the required via hole by the drilling machine, and developing the PCB to high density and high difficulty along with the development of electronic products to the directions of light, thin, short and small, so that a large amount of PCBs with SMT and BGA are required to be plugged when components are mounted, and the via hole of the circuit board must be plugged in order to meet the requirements of customers;
preparing an etched substrate, and fixing vertical upward flat nails and sharp nails on the substrate in a staggered manner, wherein the sharp nails correspond to the through holes on the circuit board, and the flat nails and the sharp nails are distributed in an array manner, so that the substrate is favorable for air release and the printing frequency is reduced;
step three: positioning: the circuit board is placed above the nail bed, the plane of the flat nail is connected with the circuit board to play a supporting role, the sharp nail is placed outside the forming area or in the blank of the substrate, the sharp nail blocks the bottom end of the through hole, the flat nail plays a supporting role on the substrate, the sharp nail plays a supporting role on the through hole, and the sharp nail is placed outside the forming area or in the blank of the substrate and cannot damage the copper surface of the circuit board;
preparing a baffle plate with the same size as the circuit board, aligning the baffle plate with the four ends of the circuit board, starting to feed the baffle plate into a drilling machine, penetrating a drill bit of the drilling machine through the circuit board and the baffle plate, and enabling a via hole on the circuit board to correspond to a windowing position on the baffle plate;
plugging, namely, attaching a baffle to the upper surface of a circuit board, wherein a window on the baffle corresponds to a through hole , the circuit board is adhered on a screen, the baffle is positioned between the circuit board and the circuit board, a brush head on the screen moves back and forth, solder resist ink is continuously printed for two times, the brush head moves back and forth at an inclined angle and is arranged according to the moving track of the brush head at the inclined angle, the moving track of the brush head and the moving track of the brush head form an acute angle, the brush head is provided with two holes for hole return plugging, the solder resist ink hole plugging is carried out, the ink after the hole plugging is full, the ink overflows when the window of the baffle is opened, the short circuit caused by the fact that tin penetrates through an element surface from the through hole when the PCB passes through wave soldering is prevented;
step six: baking: controlling the humidity of solder resist ink on the baked circuit board to be 78 ℃;
step seven: exposure and development: windowing is carried out at the position corresponding to the position of the through hole of the negative plate and the circuit board, and 8-10 grade and normal development is adopted for exposure;
and step eight, curing, namely placing the circuit board into an oven for low-temperature baking, then placing the circuit board into the oven for high-temperature baking and segmented curing, wherein the segmented curing respectively comprises th segment at 60 ℃ for 60min, 80 ℃ for 30min for the second segment, 120 ℃ for 20min for the third segment and 155 ℃ for 60min for the fourth segment.
The filling amount of the plug holes is controlled to be in an ideal state of 90-100%, the added baffle plate reduces the problem of ink stain caused by over-thick ink on the surface of a hole ring, an aluminum sheet needing plug holes is drilled by a numerical control drilling machine in the process flow to manufacture a screen printing plate for plug holes, the plug holes are ensured to be full through hole plugging, the plug hole ink plug holes can be plugged by the plug hole ink, the plug hole ink can also be used by thermosetting ink, the process flow has the characteristics of large hardness, small resin shrinkage change and good bonding force with hole walls, pre-baking, curing and tin spraying are adopted after the plug holes are plugged to volatilize ink solvent, the plug holes are baked in sections and are arranged in ovens, continuous heating baking and curing are carried out, the temperature change of the plug hole ink is changed, the opening design of the added baffle plate is increased, the surface tension is increased when the plug holes.
In conclusion, according to the circuit board plug hole screen printing solder mask process, the filling amount of plug holes is controlled to be in an ideal state of 90-100%, the problem of ink stain caused by over-thick ink on the surface of a hole ring is solved by the aid of the additionally arranged baffle, pre-baking, curing and tin spraying are adopted after plug holes, an ink solvent is volatilized, the plug holes are baked in a segmented mode and are arranged in baking ovens, continuous heating baking and curing are achieved, the temperature change of the plug hole ink is changed, the window opening design of the added baffle is adopted, when the plug holes of a circuit board are subjected to solder mask ink plug holes, the surface tension is increased, the temperature of the oven is low, and the temperature of hole explosion is solved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (4)
- The circuit board plug hole screen printing solder mask process is characterized by comprising the following steps of:s1: manufacturing a circuit board with a through hole, placing the prepared circuit board in an existing drilling machine, and drilling the required through hole by using the drilling machine;s2: manufacturing a nail bed: preparing an etched substrate, and fixing vertically upward flat nails and sharp nails on the substrate in a staggered manner, wherein the flat nails and the sharp nails are distributed in an array manner;s3: positioning: the circuit board is placed above the nail bed, the plane of the flat nail is connected with the circuit board to play a supporting role, and the sharp nail is placed outside the forming area or in the blank of the substrate;s4, manufacturing a baffle, namely preparing a baffle with the same size as the circuit board, aligning the baffle with the four ends of the circuit board, feeding the baffle into a drilling machine, penetrating a drill bit of the drilling machine through the circuit board and the baffle, and enabling a via hole on the circuit board to correspond to a windowing position on the baffle;s5, plugging, namely, attaching a baffle plate to the upper surface of the circuit board, wherein a window on the baffle plate corresponds to the through hole , the circuit board is adhered on the screen printing plate, the baffle plate is positioned between the circuit board and the circuit board, the brush head on the screen printing plate moves back and forth, solder resist ink is continuously printed twice, and solder resist ink plugging is carried out;s6: baking: controlling the humidity of solder resist ink on the baked circuit board to be 68-78 ℃;s7: exposure and development: windowing is carried out at the position corresponding to the position of the through hole of the negative plate and the circuit board, and 8-10 grade and normal development is adopted for exposure;s8: and (3) curing: and placing the circuit board into an oven for low-temperature baking, and then placing the circuit board into an oven for high-temperature baking and segmented curing.
- 2. The circuit board plug hole screen printing solder mask process of claim 1, wherein in step S5, the brush head moves back and forth at an oblique angle, the oblique angle is set according to the moving track of the brush head, the moving track of the brush head and the brush head form an acute angle, and the brush head is provided with two holes for plug holes.
- 3. The circuit board plug hole screen printing solder mask process of claim 1, wherein in step S5, the ink must be full after plug hole, and the ink overflows from the windows of the baffle.
- 4. The circuit board plug hole screen printing solder mask process of claim 1, wherein the step S8 includes segmented curing at deg.C for 60min, at 80 deg.C for 30min, at 120 deg.C for 20min, and at 155 deg.C for 60 min.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114311974A (en) * | 2021-12-27 | 2022-04-12 | 河源市皓吉达通讯器材有限公司 | Surface treatment method of camera optical channel material |
| CN115209633A (en) * | 2022-09-14 | 2022-10-18 | 深圳万和兴电子有限公司 | Manufacturing method of single-sided windowing hole plugging of PCB lead-free tin-sprayed plate |
| CN115214247A (en) * | 2021-04-16 | 2022-10-21 | 江苏协和电子股份有限公司 | Segmented curing method for solder mask plug hole of 5G high-frequency product |
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