CN207573722U - The filling perforation jig of copper-based printed board - Google Patents
The filling perforation jig of copper-based printed board Download PDFInfo
- Publication number
- CN207573722U CN207573722U CN201721802393.3U CN201721802393U CN207573722U CN 207573722 U CN207573722 U CN 207573722U CN 201721802393 U CN201721802393 U CN 201721802393U CN 207573722 U CN207573722 U CN 207573722U
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- China
- Prior art keywords
- copper
- printed board
- based printed
- filling perforation
- cryogenic film
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Abstract
The utility model discloses a kind of filling perforation jig of copper-based printed board, and the copper-based printed board has several holes for treating filler；The filling perforation jig includes cryogenic film；The cryogenic film is two, is attached at the both sides of the copper-based printed board respectively；The cryogenic film crosses glue hole equipped with several；The position in the glue hole excessively is adapted with the position of described hole, and the glue hole excessively is identical with the diameter of described hole.The technical solution of the utility model, filling perforation to copper-based printed board is realized by cryogenic film, it can ensure the plumpness of filling perforation, it and will not be by resin residue in copper-based printed board, and then it can ensure the smoothness on the surface of copper-based printed board, the quality of multilayer printed circuit board is promoted, and can effectively promote the production efficiency of multilayer printed circuit board.
Description
Technical field
The utility model is related to copper-based printed board technique field, more particularly to a kind of filling perforation jig of copper-based printed board.
Background technology
Printed wiring board is to form the substance of conductor circuit pattern on the base material, is led in the connection pan portion of conductor circuit
Cross plumb joint electronic unit, the circuit part other than terminal pad in order to protect conductor and covered with solder resist.In this way, welding resistance
Solder attachment is in unnecessary portion when agent can prevent from overlapping electronic unit on a printed circuit on the one hand, while also has anti-
The only function of circuit oxidation or corrosion.
However, in recent years, the downsizing of the graph thinning and mounting area of the conductor circuit pattern of printed wiring board is being in progress,
Have miniaturization, the multifunction of the machine of printed circuit substrate further for reply, it is expected the further of printed wiring board
Light and shortization.
In order to solve the above-mentioned technical problem, it is existing it is a kind of by several copper-based printed boards fit together and made of multilayer print
Brush wiring board.In the manufacturing process of multilayer printed circuit board, in order to ensure the tight type being bonded between copper-based printed board, need pair
Hole in copper-based printed board is filled, even surface is made.The existing hole side of being filled in copper-based printed board
Formula is generally：Make consent web plate；Consent web plate is covered in copper-based printed board；By consent web plate to copper-based printed board
Filling perforation resin in hole.However, filling perforation can be caused not full for this filling mode or resin overflows, and be attached to the hole of hole
The situation of mouth occurs, and has seriously affected the quality and production efficiency of multilayer printed circuit board.
Utility model content
The main purpose of the utility model is to provide a kind of filling perforation jig of copper-based printed board, it is intended to optimize copper-based printed board
Filling perforation processing procedure, and then ensure the quality of multilayer printed circuit board, promote the production efficiency of multilayer printed circuit board.
To achieve the above object, the utility model proposes a kind of filling perforation jig of copper-based printed board, the copper-based printed boards
With several holes for treating filler；The filling perforation jig includes cryogenic film；The cryogenic film crosses glue hole equipped with several；It is described to cross glue
The position in hole is adapted with the position of described hole, and the glue hole excessively is identical with the diameter of described hole.
Optionally, the cryogenic film is two, is attached at the both sides of the copper-based printed board respectively.
Optionally, the cryogenic film is Kapton.
Optionally, the overall dimensions of the cryogenic film are more than the overall dimensions of the copper-based printed board.
Optionally, the overall dimensions of the cryogenic film are equal to the overall dimensions of the copper-based printed board.
Optionally, the thickness of the cryogenic film is 0.06mm, 0.08mm or 0.11mm.
Optionally, the adhesion strength of the cryogenic film is 5-6g/25mm, 6.5g/25mm or 7g/25mm.
Optionally, the tensile strength of the cryogenic film is 115kg/25mm, 160kg/25mm or 250kg/25mm.
Optionally, the elongation at break of the cryogenic film is 50%, 70% or 150%.
Optionally, the heat resistance of the cryogenic film is 260 DEG C.
The technical solution of the utility model realizes the filling perforation to copper-based printed board, it is ensured that filling perforation by cryogenic film
Plumpness, and will not be by resin residue in copper-based printed board, and then can ensure the smoothness on the surface of copper-based printed board, it is promoted
The quality of multilayer printed circuit board, and can effectively promote the production efficiency of multilayer printed circuit board.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other attached drawings can also be obtained according to the structure shown in these attached drawings.
The dimensional structure diagram of the filling perforation jig of the copper-based printed board of Fig. 1 the utility model；
Fig. 2 is the use state diagram of filling perforation jig shown in FIG. 1.
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that described embodiment is only the part of the embodiment rather than whole of the utility model
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work premise
Lower all other embodiments obtained, shall fall within the protection scope of the present invention.
The utility model proposes a kind of filling perforation jigs of copper-based printed board.
It is shown referring to FIG. 1 and FIG. 2, the dimensional structure diagram of the filling perforation jig of the copper-based printed board of Fig. 1 the utility model；
Fig. 2 is the use state diagram of filling perforation jig shown in FIG. 1.
In the present embodiment, the copper-based printed board 100 has several holes 102 for treating filler.The filling perforation jig packet
Include cryogenic film 200；The cryogenic film 200 crosses glue hole 202 equipped with several；The position for crossing glue hole 202 and described hole 102
Position is adapted, and the glue hole 202 excessively is identical with the diameter of described hole 102.
Specifically, the cryogenic film 200 is Kapton, it is amber (tea yellow) system.The cryogenic film 200
Thickness be 0.06mm, 0.08mm or 0.11mm；Adhesion strength is 5-6g/25mm, 6.5g/25mm or 7g/25mm；Tensile strength
For 115kg/25mm, 160kg/25mm or 250kg/25mm；Elongation at break is 50%, 70% or 150%；Heat resistance is
260℃。
Further, in practical filling perforation processing procedure, using the intrinsic viscosity of the cryogenic film 200, by two external form rulers
It is very little to be slightly larger than or fit in the copper-based printed board respectively equal to the cryogenic film 200 of the overall dimensions of the copper-based printed board 100
100 both sides.It drills in the cryogenic film 200 again.Since the cryogenic film 200 is transparent film, so operation
Person can penetrate the hole 102 that the cryogenic film 200 is clear that in the copper-based printed board 100.Described in correspondence
The position of hole 102 drills to the cryogenic film 200, to form glue hole 202 in the cryogenic film 200.It has drilled
Cheng Hou injects resin to described cross in glue hole 202, and resin is entered by the glue hole 202 of crossing in described hole 102, is realized
Filling to described hole 102.When injecting resin, in order to ensure described hole 102 fill full weight, can be suitably it is more
Inject some resins.After described hole 102 fills up, due to being between the cryogenic film 200 and the copper-based printed board 100
Fit-state, so, extra resin will not remain in the surface of the copper-based printed board 100, but remain in the low temperature
The surface of film 200.It after the completion of filling, is toasted, so that the resin solidification.Finally, by the cryogenic film 200 with it is described
Copper-based printed board 100 detaches, and filling perforation processing procedure is completed.When by the cryogenic film 200 by being removed in the copper-based printed board 100,
The extra resin in the cryogenic film 200 is remained on, can also be removed together, does not interfere with the copper-based printed board 100
The smoothness on surface, and then can ensure the quality of multilayer printed circuit board, promote the production efficiency of multilayer printed circuit board.
The technical solution of the present embodiment realizes the filling perforation to copper-based printed board 100, it is ensured that fill out by cryogenic film 200
The plumpness in hole, and will not be by resin residue in copper-based printed board 100, and then can ensure the surface of copper-based printed board 100
Smoothness promotes the quality of multilayer printed circuit board, and can effectively promote the production efficiency of multilayer printed circuit board.
The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention,
Under every utility model in the utility model is conceived, equivalent structure made based on the specification and figures of the utility model
Transformation or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of filling perforation jig of copper-based printed board, the copper-based printed board has several holes for treating filler；It is characterized in that,
The filling perforation jig includes cryogenic film；The cryogenic film crosses glue hole equipped with several；The position for crossing glue hole and described hole
Position is adapted, and the glue hole excessively is identical with the diameter of described hole.
2. the filling perforation jig of copper-based printed board as described in claim 1, which is characterized in that the cryogenic film is two, respectively
It is attached at the both sides of the copper-based printed board.
3. the filling perforation jig of copper-based printed board as described in claim 1, which is characterized in that the cryogenic film is thin for polyimides
Film.
4. the filling perforation jig of copper-based printed board as described in claim 1, which is characterized in that the overall dimensions of the cryogenic film are big
In the overall dimensions of the copper-based printed board.
5. the filling perforation jig of copper-based printed board as described in claim 1, which is characterized in that overall dimensions of the cryogenic film etc.
In the overall dimensions of the copper-based printed board.
6. the filling perforation jig of copper-based printed board as described in claim 1, which is characterized in that the thickness of the cryogenic film is
0.06mm, 0.08mm or 0.11mm.
7. the filling perforation jig of copper-based printed board as described in claim 1, which is characterized in that the adhesion strength of the cryogenic film is 5-
6g/25mm, 6.5g/25mm or 7g/25mm.
8. the filling perforation jig of copper-based printed board as described in claim 1, which is characterized in that the tensile strength of the cryogenic film is
115kg/25mm, 160kg/25mm or 250kg/25mm.
9. the filling perforation jig of copper-based printed board as described in claim 1, which is characterized in that the elongation at break of the cryogenic film
It is 50%, 70% or 150%.
10. the filling perforation jig of copper-based printed board as described in claim 1, which is characterized in that the heat resistance of the cryogenic film is
260℃。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721802393.3U CN207573722U (en) | 2017-12-18 | 2017-12-18 | The filling perforation jig of copper-based printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721802393.3U CN207573722U (en) | 2017-12-18 | 2017-12-18 | The filling perforation jig of copper-based printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207573722U true CN207573722U (en) | 2018-07-03 |
Family
ID=62685782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721802393.3U Active CN207573722U (en) | 2017-12-18 | 2017-12-18 | The filling perforation jig of copper-based printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207573722U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110493960A (en) * | 2019-08-12 | 2019-11-22 | 珠海杰赛科技有限公司 | A kind of method and its machining tool of macroporous plate filling holes with resin |
| CN110740578A (en) * | 2019-11-13 | 2020-01-31 | 惠州市永盛隆电子科技有限公司 | Circuit board taphole screen printing solder mask process |
-
2017
- 2017-12-18 CN CN201721802393.3U patent/CN207573722U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110493960A (en) * | 2019-08-12 | 2019-11-22 | 珠海杰赛科技有限公司 | A kind of method and its machining tool of macroporous plate filling holes with resin |
| CN110740578A (en) * | 2019-11-13 | 2020-01-31 | 惠州市永盛隆电子科技有限公司 | Circuit board taphole screen printing solder mask process |
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