CN209676597U - A kind of pad structure - Google Patents
A kind of pad structure Download PDFInfo
- Publication number
- CN209676597U CN209676597U CN201920047973.9U CN201920047973U CN209676597U CN 209676597 U CN209676597 U CN 209676597U CN 201920047973 U CN201920047973 U CN 201920047973U CN 209676597 U CN209676597 U CN 209676597U
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- CN
- China
- Prior art keywords
- pad structure
- solder sections
- solder
- connector
- sections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 101
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000003466 welding Methods 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The application provides a kind of pad structure, the pad structure includes substrate and at least two solder sections being laid on the substrate, interval region is equipped between the solder sections, so that the pad structure forms at least two independent scolding tin join domains in the welding process with connector.In the embodiment of the present application, connector is contacted by being formed by spherical protuberance at least two solder sections on pad structure, so that connector is tended to keep same position simultaneously by tin buoyancy effect mutual between multiple spot scolding tin, the case where being displaced due to single-point tin buoyancy effect is easy to appear unbalance stress is avoided, and then improves the connection reliability between pad structure and connector.
Description
Technical field
This application involves field of electronic components manufacturing, in particular to a kind of pad structure.
Background technique
When processing the wiring board of electronic equipment, the pin of existing elastic slice or component is needed through SMT (Surface
Mount Technology, surface mounting technology) technique is welded on the pad of wiring board.
The surface of general pad is complete soldering-tin layer, when assist side and electronic component pass through SMT technique, pad
On soldering-tin layer can melt to form a spherical protuberance, if the pin of the small volume of elastic slice or component, elastic slice or component
It is easy the tin buoyancy effect by scolding tin and floats, lead to the case where being displaced, reduce elastic slice or component's feet and line
Connection reliability between the plate of road.
Summary of the invention
The application provides a kind of pad structure, and the connection reliability between pad structure and connector can be improved.
The embodiment of the present application provides a kind of pad structure, and the pad structure includes at least two scolding tin for being equipped with scolding tin
Portion is equipped with interval region between the solder sections, so that the pad structure is formed at least when with the welding of a pin of element
Two independent scolding tin join domains.
Optionally, the pad structure includes two solder sections.
Optionally, described two solder sections are symmetrical arranged, and the solder area of each solder sections is suitable.
Optionally, the pad structure includes three solder sections.
Optionally, three solder sections are arranged in the pad structure along first axis, and the scolding tin of each solder sections
Area is suitable.
Optionally, three solder sections include the first solder sections, the second solder sections and third solder sections, described first
Solder sections are located at the side of the pad structure, and second solder sections and the third solder sections are located in the pad structure
The other side opposite with first solder sections.
Optionally, first solder sections in the pad structure along the second axial width, with second solder sections,
The welding region of third solder sections composition is suitable in the width of the second axial direction of the pad structure.
Optionally, the solder area of first solder sections is greater than the solder side of second solder sections, third solder sections
Product.
Optionally, the pad structure includes four solder sections.
From the foregoing, it will be observed that the embodiment of the present application passes through pad structure composed by least two solder sections, by solder sections
Between set interval region so that pad structure forms at least two independent scolding tin bonding pads when with the welding of a pin of element
Domain.Connector is contacted by being formed by spherical protuberance at least two solder sections on pad structure, so that connector is same
When tended to by tin buoyancy effect mutual between multiple spot scolding tin keep same position, avoid because single-point tin buoyancy effect hold
The case where easily there is unbalance stress and be displaced, and then improve the connection reliability between pad structure and connector.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of pad structure provided by the embodiments of the present application.
Attachment structure schematic diagram of the Fig. 2 between pad structure provided by the embodiments of the present application and connector.
Fig. 3 is another structural schematic diagram of pad structure provided by the embodiments of the present application.
Fig. 4 is another structural schematic diagram of pad structure provided by the embodiments of the present application.
Fig. 5 is another structural schematic diagram of pad structure provided by the embodiments of the present application.
Specific embodiment
The preferred embodiment of the application is described in detail with reference to the accompanying drawing so that the advantages of the application and feature more
It is easily readily appreciated by one skilled in the art, to make apparent define to the protection scope of the application.
In the description of the present application, it is to be understood that term " on ", "lower", "front", "rear", "left", "right",
The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside", " head ", " tail " is orientation based on the figure or position
Relationship is merely for convenience of description the application and simplifies description, rather than the device or element of indication or suggestion meaning must have
There is specific orientation, be constructed and operated in a specific orientation, therefore should not be understood as the limitation to the application.
Referring to Fig. 1, showing the structural schematic diagram of pad structure provided by the embodiments of the present application in figure.
As shown in Figure 1, the pad structure 1 includes substrate 11 and at least two solder sections being laid on the substrate 11
12, interval region 13 is equipped between the solder sections 12, so that pad structure 1 forms at least two in the welding process with connector
A independent scolding tin join domain.
Specifically, the substrate 11 can be existing plate, such as printed circuit board (PCB, Printed Circuit
Board) or flexible circuit board (FPCB, Flexible Printed Circuit Board), specific plate can basis
Depending on actual conditions.
The connector is used to realize with pad and weld, and can be elastic slice or component's feet.
The solder sections 12 have soldering-tin layer, which can be fused into the scolding tin of liquid, pass through when passing through SMT technique
Cabling on elastic slice or component's feet and substrate 11 can be attached fixation by the scolding tin, to realize electrical connection.
Between solder sections 12 two-by-two, it is equipped with interval region 13, scolding tin is not laid in the interval region 13, so as to weld two-by-two
Even if by SMT technique between tin portion 12, the scolding tin melted will not stick to each other, connected with forming mutually independent scolding tin
Connect region.
Referring to Fig. 2, showing the connection structure of pad structure 1 and connector provided by the embodiments of the present application in figure.
As shown in Fig. 2, the pad structure 1 includes two solder sections 12 in conjunction with Fig. 1, two solder sections 12 are passing through SMT work
When skill processing, two spherical protuberances 121 can be generated after soldering-tin layer fusing, the both ends of them of connector 1 ' can be with two balls at this time
121 contact of shape protuberance, and connection is realized in scolding tin solidification after completing SMT technique.
Specifically, two solder sections 12 are symmetrical arranged, and the solder area of each solder sections 12 is suitable, so that solder sections
12 be formed by spherical protuberance 121 height it is also suitable, the spherical protuberance that scolding tin is formed in the connector 1 ' and pad structure 1
After 121 contacts, it can to form parallel relation between connector 1 ' and pad structure 1.
During this, because the spherical protuberance 121 of two solder sections 12 is understood and forms stress balance between connector 1 ', from
And the connector 1 ' is made to be not in swing, or release original position by tin buoyancy.And pad structure 1 and connector
1 ' forms two o'clock connection, can provide and connect better connection effect guarantee than single-point, to reduce the wind of 1 ' rosin joint of connector
The connection reliability between pad structure 1 and connector 1 ' is improved in danger.
When carrying out SMT process, the soldering-tin layer in each solder sections 12 can melt, so that each self-forming one is spherical grand
Play 121.Connector 1 ' is contacted by being formed by spherical protuberance 121 at least two solder sections 12 on pad structure 1, is made
It obtains connector 1 ' to be tended to keep same position simultaneously by tin buoyancy effect mutual between multiple spot scolding tin, avoid because of single-point
The case where tin buoyancy effect is easy to appear unbalance stress and is displaced, and then improve the company between pad structure 1 and connector 1 '
Connect reliability.
In some embodiments, as shown in figure 3, the pad structure 2 include substrate 21 and be laid on substrate 21 three
A solder sections 22 are equipped with interval region 23 between solder sections 22, so that pad structure 2 is formed in the welding process with connector
Three independent scolding tin join domains.
In this embodiment, which arranges in pad structure 2 along first axis A, and each solder sections 22
Solder area it is suitable.
Each solder area is suitable in three solder sections 22, can make the spherical bump height base formed in welding process
This is consistent, so that connector is tended to keep same position simultaneously by tin buoyancy effect mutual between 3 scolding tin.
Meanwhile relative to the embodiment in Fig. 1,2, which provides between pad structure 2 and connector more connects
Contact can also further increase the connection reliability between pad structure 2 and connector.
In further embodiments, as shown in figure 4, the pad structure 3 equally including substrate 31 and is laid in substrate 31
On three solder sections 32, interval region 33 is equipped between solder sections 32, so that pad structure 3 is in the welding process with connector
Three independent scolding tin join domains of middle formation.
Relative to Fig. 3, which includes the first solder sections 321, the second solder sections 322 and third solder sections
323, which is located at the side of pad structure 3, and second solder sections 322 and third solder sections 323 are located at pad
The other side opposite with the first solder sections 321 in structure 3.
In some embodiments, the first solder sections 321 in pad structure 3 along the width of the second axial direction B, with the second solder sections
322, width of the welding region that third solder sections 323 form in the second axial direction B of the pad structure 3 is suitable.
Triangle arrangement is formed between first solder sections 321, the second solder sections 322 and third solder sections 323, so that should
Scolding tin join domain is formed by between pad structure 3 and connector when through SMT technique and realizes the mutual stress of triangle, connection
Part is maintained on the same plane parallel with substrate 31 using the triangle stress.
In some embodiments, the solder area of first solder sections 321 is greater than the second solder sections 322, third solder sections
323 solder area.Obviously, by the way that the solder area of biggish first scolding tin is arranged, the first scolding tin and connector can be made
Between scolding tin join domain it is bigger, ensure that the connection reliability between connector and pad structure 3.
In still other embodiments, as shown in figure 5, the pad structure 4 includes substrate 41 and is laid on substrate 41
Four solder sections 42 are equipped with interval region 43 between solder sections 42, so that the shape in the welding process with connector of pad structure 4
At four independent scolding tin join domains.
Specifically, forming the quadrangle of rectangular pads structure 4 between four solder sections 42, and pass through four solder sections 42
Connection is realized between interconnecting piece.
Similar reason based on the above embodiment, connector with four solder sections 42 on pad structure 4 by being formed by
Spherical protuberance is contacted, so that connector is tended to keep same by mutual tin buoyancy effect between multiple spot scolding tin simultaneously
Position avoids the case where being displaced due to single-point tin buoyancy effect is easy to appear unbalance stress, so improve pad structure 4 with
Connection reliability between connector.
Presently filed embodiment is explained in detail above in conjunction with attached drawing, but the application is not limited to above-mentioned implementation
Mode within the knowledge of a person skilled in the art can also be under the premise of not departing from the application objective
Various changes can be made.
Claims (9)
1. a kind of pad structure, which is characterized in that the pad structure includes substrate and is laid on the substrate at least
Two solder sections are equipped with interval region between the solder sections, so that the pad structure is in the welding process with connector
Form at least two independent scolding tin join domains.
2. pad structure as described in claim 1, which is characterized in that the pad structure includes two solder sections.
3. pad structure as claimed in claim 2, which is characterized in that described two solder sections are symmetrical arranged, and each scolding tin
The solder area in portion is suitable.
4. pad structure as described in claim 1, which is characterized in that the pad structure includes three solder sections.
5. pad structure as claimed in claim 4, which is characterized in that three solder sections are in the pad structure along first
Axial alignment, and the solder area of each solder sections is suitable.
6. pad structure as claimed in claim 4, which is characterized in that three solder sections include the first solder sections, second
Solder sections and third solder sections, first solder sections are located at the side of the pad structure, second solder sections and institute
It states third solder sections and is located at the other side opposite with first solder sections in the pad structure.
7. pad structure as claimed in claim 6, which is characterized in that first solder sections are in the pad structure along second
Axial width, second axial direction of the welding region formed with second solder sections, third solder sections in the pad structure
Width it is suitable.
8. pad structure as claimed in claims 6 or 7, which is characterized in that the solder area of first solder sections is greater than institute
State the solder area of the second solder sections, third solder sections.
9. pad structure as described in claim 1, which is characterized in that the pad structure includes four solder sections.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920047973.9U CN209676597U (en) | 2019-01-11 | 2019-01-11 | A kind of pad structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920047973.9U CN209676597U (en) | 2019-01-11 | 2019-01-11 | A kind of pad structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209676597U true CN209676597U (en) | 2019-11-22 |
Family
ID=68565364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920047973.9U Expired - Fee Related CN209676597U (en) | 2019-01-11 | 2019-01-11 | A kind of pad structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209676597U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113765478A (en) * | 2021-08-24 | 2021-12-07 | 滁州隆基乐叶光伏科技有限公司 | Junction box, photovoltaic module and photovoltaic module manufacturing method |
| WO2022061770A1 (en) * | 2020-09-25 | 2022-03-31 | 京东方科技集团股份有限公司 | Flexible circuit board, light bar, backlight module, and liquid crystal display device |
-
2019
- 2019-01-11 CN CN201920047973.9U patent/CN209676597U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022061770A1 (en) * | 2020-09-25 | 2022-03-31 | 京东方科技集团股份有限公司 | Flexible circuit board, light bar, backlight module, and liquid crystal display device |
| US11899307B2 (en) | 2020-09-25 | 2024-02-13 | Boe Optical Science And Technology Co., Ltd. | Flexible printed circuit, light bar, backlight module and liquid crystal display device |
| CN113765478A (en) * | 2021-08-24 | 2021-12-07 | 滁州隆基乐叶光伏科技有限公司 | Junction box, photovoltaic module and photovoltaic module manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191122 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |