JP2018152148A - Suspension substrate with circuit unit, suspension substrate with circuit assembly, and manufacturing method of suspension substrate with circuit assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a suspension substrate with circuit unit, a suspension substrate with circuit assembly and a manufacturing method of the suspension substrate with circuit assembly capable of inspecting a position of an electronic element with high accuracy and improving manufacturing efficiency of the suspension substrate with circuit assembly.SOLUTION: An assembly sheet 1 comprises a suspension substrate with circuit 5 and an inspection part 4. The suspension substrate with circuit 5 includes an element mounting terminal 26 electrically connected to a mounted electronic element via a connection solder 56, and the inspection part 4 includes an inspection terminal 47 on which an inspection solder 57 inspecting a volume of the connection solder 56 placed between the electronic element and the element mounting terminal 26 is arranged.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a suspension board unit with circuit, a suspension board assembly with circuit, and a method for manufacturing a suspension board assembly with circuit.

  Conventionally, it is known that a mounting component is connected to a terminal of a wiring board by solder. For example, in order to connect a mounting component to a terminal of a wiring board, solder is printed on the terminal of the wiring board, and after mounting the mounting component, the terminal of the wiring board and the lead of the mounting component are soldered by reflow. .

  In addition, it is known that the amount (volume) of solder printed on a terminal is inspected by a three-dimensional optical appearance inspection, and it is desirable to inspect the amount of solder after reflow in order to confirm the soldering strength and the like. It is rare.

  However, after reflow, the lead connected to the terminal becomes an obstacle, and it is difficult to inspect the amount of solder connecting the terminal and the lead by visual inspection.

  Thus, for example, a solder inspection method has been proposed in which the solder volume printed before mounting a mounted component is measured and the amount of solder after reflow is calculated (see, for example, Patent Document 1).

Japanese Patent Laying-Open No. 2015-179032

  However, when an electronic element such as a piezoelectric element is mounted on a suspension board with circuit, the electronic element is required to have strict positional accuracy in order to ensure stable operation and suppress contact with surrounding members. Since the position accuracy of such an electronic element depends on the amount of solder located between the electronic element and the terminal of the suspension board with circuit, the position of the electronic element can be inspected by inspecting the amount of solder. Be considered.

  However, the solder inspection method of Patent Document 1 does not actually measure the amount of solder after reflow, but only calculates the amount of solder after reflow, and the inspection accuracy is insufficient. Therefore, the position of the electronic element cannot be accurately inspected, and it is difficult to improve the manufacturing efficiency of the suspension board assembly with circuit on which the electronic element is mounted.

  The present invention provides a suspension board unit with circuit, a suspension board assembly with circuit, and a method for manufacturing a suspension board assembly with circuit, which can accurately inspect the position of an electronic element and can improve the manufacturing efficiency of the suspension board assembly with circuit. provide.

  The present invention [1] includes a suspension board with circuit and an inspection unit, and the suspension board with circuit has an element mounting terminal electrically connected to an electronic element to be mounted via a connection solder. A suspension board unit with circuit, comprising: an inspection terminal on which an inspection solder for inspecting a volume of the connection solder located between the electronic element and the element mounting terminal is disposed. Contains.

  According to such a configuration, the connection solder for electrically connecting the electronic element and the element mounting terminal can be disposed on the element mounting terminal of the suspension board with circuit, and the inspection terminal of the inspection unit includes Inspection solder having substantially the same volume as the connection solder can be disposed.

  Since the inspection terminal is a terminal on which the inspection solder is arranged and the electronic element is not connected, the volume of the inspection solder can be accurately measured without the electronic element being in the way.

  As a result, the volume of the solder for connection located between the electronic element and the element mounting terminal can be accurately inspected from the measurement result of the volume of the inspection solder, and consequently the position of the electronic element is inspected with high precision. it can. Thereby, the manufacturing efficiency of the suspension board assembly with circuit can be improved.

  The present invention [2] includes a plurality of the suspension boards with circuits, and a support portion that collectively supports the plurality of suspension boards with circuits, and continuously supports the plurality of suspension boards with circuits. The section includes the suspension board unit with circuit described in [1], which is provided in the support section.

  According to such a configuration, since the inspection unit is provided on the support unit that collectively supports the plurality of suspension boards with circuit, it is necessary to secure a space for arranging the inspection unit on the suspension board with circuit. Therefore, the suspension board with circuit can be reduced in size.

  In addition, since each of the plurality of suspension boards with circuit and the inspection unit is integrated with each other through the support unit, it is possible to stably arrange substantially the same volume of solder on each of the element mounting terminal and the inspection terminal, A correlation between the volume of the connecting solder disposed on the element mounting terminal and the volume of the inspection solder disposed on the inspection terminal can be stably secured. As a result, the volume of the connecting solder positioned between the electronic element and the element mounting terminal can be inspected more accurately from the measurement result of the volume of the inspecting solder.

  In the present invention [3], when the inspection terminals are projected in the parallel direction of the plurality of suspension boards with circuits, they are arranged in parallel at intervals in a direction orthogonal to the thickness direction of the suspension boards with circuits. The suspension board unit with circuit according to the above [2], which is disposed so as to overlap at least one of the element mounting terminals among the plurality of element mounting terminals.

  According to such a configuration, the inspection terminal is arranged so as to overlap at least one element mounting terminal among the plurality of element mounting terminals when projected in the parallel direction. The solder having substantially the same volume can be more stably disposed on each of the at least one element mounting terminal, and the volume of the connecting solder disposed on the element mounting terminal and the inspection terminal. The correlation with the volume of the solder for inspection can be secured more stably.

  According to the present invention [4], the plurality of suspension boards with circuit are arranged in parallel at intervals in a direction orthogonal to the thickness direction of the suspension board with circuit, and the inspection terminal includes a plurality of suspensions with circuit. When projecting in a direction orthogonal to both the parallel direction of the substrate and the thickness direction, at least one of the plurality of element mounting terminals is disposed so as to overlap with the element mounting terminal. 2] of the suspension board unit with circuit described in [2].

  According to such a configuration, the inspection terminal overlaps at least one element mounting terminal among the plurality of element mounting terminals when projected in a direction perpendicular to both the parallel direction and the thickness direction. Therefore, it is possible to more stably arrange the solder of substantially the same volume on each of the inspection terminal and the at least one element mounting terminal, and the connection solder arranged on the element mounting terminal The correlation between the volume and the volume of the inspection solder arranged on the inspection terminal can be more stably ensured.

  According to the present invention [5], the suspension board with circuit includes a magnetic head terminal electrically connected to the magnetic head, a magnetic head wiring connected to the magnetic head terminal, and the element mounting terminal. The suspension board unit with circuit according to any one of the above [1] to [4], comprising: an element wiring to be connected.

  According to such a configuration, the suspension board with circuit includes the magnetic head terminal that is electrically connected to the magnetic head in addition to the element mounting terminal. Electronic elements can be mounted.

  The present invention [6] includes a metal support layer, a first insulating layer disposed on one side in the thickness direction of the metal support layer, a conductor layer disposed on the one side in the thickness direction of the first insulating layer, Any one of the above [1] to [5], wherein the inspection terminal is included in the conductor layer or the metal support layer. The suspension board unit with circuit according to claim 1 is included.

  According to such a configuration, since the inspection terminal is included in the conductor layer or the metal support layer, the inspection solder can be stably disposed on the inspection terminal.

  In the present invention [7], the element mounting terminal is included in the conductor layer and is adjacent to the first insulating layer and / or the second insulating layer in a direction orthogonal to the thickness direction of the suspension board with circuit. The inspection terminal is included in the conductor layer and is adjacent to the first insulating layer and / or the second insulating layer in a direction orthogonal to the thickness direction. A suspension board unit is included.

  According to such a configuration, the element mounting terminal is included in the conductor layer, adjacent to the first insulating layer and / or the second insulating layer, the inspection terminal is included in the conductor layer, and the first insulating layer And / or adjacent to the second insulating layer. That is, the element mounting terminal and the inspection terminal can be configured similarly. Therefore, the solder of approximately the same volume can be more stably disposed on each of the inspection terminal and the element mounting terminal, and the volume of the connecting solder disposed on the element mounting terminal and the inspection terminal The correlation with the volume of the inspection solder to be arranged can be secured more stably.

  The invention [8] is the above [6], wherein the inspection terminal is included in the metal support layer and is adjacent to the metal support layer in a direction orthogonal to the thickness direction of the suspension board with circuit. A suspension board unit with circuit is included.

  According to such a configuration, the inspection terminal can be simplified.

  The present invention [9] includes a suspension board unit with circuit according to any one of the above [1] to [8], a piezoelectric element as the electronic element, the piezoelectric element, and the element mounting terminal. A suspension board assembly with circuit comprising: a connecting solder which is disposed between and electrically connects the piezoelectric element and the element mounting terminal; and a testing solder which is disposed on the testing terminal. It is out.

  According to such a configuration, since the inspection solder is arranged on the inspection terminal, the volume of the inspection solder can be accurately measured. Therefore, from the measurement result of the volume of the solder for inspection, the volume of the connecting solder positioned between the electronic element and the element mounting terminal can be inspected with high accuracy, and the position of the electronic element can be inspected with high accuracy.

  The present invention [10] includes a first step of preparing the suspension board unit with circuit according to any one of the above [1] to [8], and disposing connection solder on the element mounting terminal. A second step of disposing the inspection solder on the inspection terminal; a third step of disposing the electronic element in contact with the connection solder; and heating the suspension board unit with circuit to connect the connection A fourth step of melting the solder for soldering, joining the electronic device and the device mounting terminal while self-aligning the electronic device, and melting the solder for testing, and the inspection after the fourth step. A fifth step of measuring the volume of the solder for the test and inspecting the volume of the solder for connection located between the electronic device and the device mounting terminal. Contain assembly manufacturing method.

  According to such a method, the solder for inspection and the solder for connection are dissolved, and the electronic element and the device mounting terminal are joined while self-aligning the electronic element. Improvements can be made.

  After that, the volume of the dissolved solder for inspection is measured to inspect the volume of the connecting solder located between the electronic element and the element mounting terminal. It is possible to accurately inspect the volume of the connecting solder located between the device mounting terminal and the element mounting terminal, and thus it is possible to accurately inspect the position of the electronic element.

  The present invention [11] further includes the step of measuring the volume of the inspection solder after the second step and before the fourth step, wherein the suspension board assembly with circuit according to [10] is manufactured. Includes methods.

  According to such a method, the volume of the inspection solder is measured before the inspection solder is melted. That is, the volume of the inspection solder is measured before and after melting. Therefore, when the volume of the connecting solder to be inspected from the measurement result of the volume of the inspection solder after melting is poor, the measurement result of the volume of the inspection solder before and after melting is fed back, and the suspension board with circuit Conditions for each step of the assembly manufacturing method (for example, the amount of solder disposed in the second step, the heating conditions in the fourth step, etc.) can be adjusted. As a result, the manufacturing efficiency of the suspension board assembly with circuit can be further improved.

  According to the suspension board unit with circuit, the suspension board assembly with circuit, and the suspension board assembly with circuit according to the present invention, the position of the electronic element can be accurately inspected, and the manufacturing efficiency of the suspension board assembly with circuit can be improved. .

FIG. 1 is a plan view of an assembly sheet as a first embodiment of a suspension board unit with circuit of the present invention. FIG. 2 is an enlarged view of the suspension board with circuit and the inspection unit shown in FIG. FIG. 3A is a cross-sectional view taken along line AA of the element mounting terminal shown in FIG. FIG. 3B is a cross-sectional view of the inspection terminal shown in FIG. FIG. 4 is a cross-sectional view of the element mounting terminal and the inspection terminal shown in FIG. FIG. 5 shows a bottom view of the suspension board with circuit and the inspection section shown in FIG. FIG. 6A shows a process of arranging a connecting solder on the element mounting terminal. FIG. 6B shows a step of placing the inspection solder on the inspection terminal. FIG. 7 shows a process of placing the piezoelectric element in contact with the connecting solder. FIG. 8A shows a process of joining the piezoelectric element and the element mounting terminal. FIG. 8B shows a step of measuring the volume of the solder for inspection. FIG. 9 is an explanatory diagram for explaining self-alignment of the piezoelectric element in the step of joining the piezoelectric element and the element mounting terminal shown in FIG. 8A. FIG. 10 shows a plan view of an assembly sheet as a second embodiment of the suspension board unit with circuit of the present invention. FIG. 11 is a plan view of a suspension inspection unit pair unit as a third embodiment of the suspension board unit with circuit of the present invention. FIG. 12A shows a plan view of a first modification of the inspection terminal shown in FIG. 12B shows a DD cross-sectional view of the inspection terminal shown in FIG. 12A. FIG. 12C shows a plan view of a second modification of the inspection terminal shown in FIG. FIG. 12D shows an EE cross-sectional view of the inspection terminal shown in FIG. 12C.

  In FIG. 1, the up and down direction of the paper surface is the front-rear direction (first direction), the upper side of the paper surface is the front side (one side in the first direction), and the lower side of the paper surface is the rear side (the other side in the first direction).

  In FIG. 1, the left and right direction on the paper surface is the left and right direction (second direction orthogonal to the first direction), the left side on the paper surface is the left side (second side in the second direction), and the right side on the paper surface is the right side (the other side in the second direction). is there.

  In FIG. 1, the paper thickness direction is the vertical direction (the third direction orthogonal to the first direction and the second direction), the back side of the paper is the lower side (one side in the third direction), and the front side of the paper is the upper side (the first direction). 3 direction other side). Specifically, it conforms to the direction arrow in each figure.

<First Embodiment>
1. Assembly Sheet Hereinafter, an assembly sheet 1 as a first embodiment of the suspension board unit with circuit of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the assembly sheet 1 includes a plurality of suspension groups 2, a support unit 3 that supports the plurality of suspension groups 2, and a plurality of inspection units 4. In FIG. 1, for the sake of convenience, the number of the plurality of suspension groups 2 is four and the number of the plurality of inspection units 4 is six. However, the numbers of the suspension groups 2 and the inspection units 4 are particularly limited. Not.

  The plurality of suspension groups 2 are separated from each other by a lattice-like frame body 11 described later. The plurality of suspension groups 2 have a plurality of (two) suspension groups 2 arranged in the left-right direction in the front-rear direction. Each of the plurality of suspension groups 2 includes a plurality of suspension boards with circuits 5. Each suspension board with circuit 5 has a flat belt shape extending in the front-rear direction. In each suspension group 2, the plurality of suspension boards with circuit 5 are arranged in parallel at intervals in the left-right direction (an example of a direction orthogonal to the thickness direction of the suspension board with circuit).

  The support unit 3 supports the plurality of suspension boards with circuits 5 in a lump in succession to the plurality of suspension boards with circuits 5. The support part 3 includes a frame body 11 and a plurality of connection parts 12. The frame body 11 has a lattice shape, and one suspension group 2 is arranged in each of the plurality of openings 11A defined by the frame body 11. Thereby, the frame 11 surrounds each suspension group 2 one by one, and divides the plurality of suspension groups 2. The plurality of connecting portions 12 connect the plurality of suspension boards with circuit 5 and the frame body 11.

  The plurality of inspection units 4 are provided on the frame 11 of the support unit 3. The plurality of inspection units 4 are arranged one on each of the left and right sides of each suspension group 2 so as to sandwich each suspension group 2 in the left-right direction.

2. Next, details of the suspension board with circuit 5 will be described with reference to FIGS. 2, 3A and 5. FIG.

  As shown in FIG. 3A, the suspension board with circuit 5 has the metal support 7, the base insulating layer 8, the conductor pattern 9, and the cover insulating layer 10 facing downward (an example of one side in the thickness direction). Prepare in order. In FIG. 5, the insulating cover layer 10 is omitted for convenience.

  As shown in FIG. 2, the metal support 7 extends in the front-rear direction. The metal support 7 includes a stage 13, a suspension body 14, and a bridging portion 15.

  The stage 13 is a tip portion of the metal support 7 and has a substantially rectangular shape in plan view.

  The suspension body 14 is disposed on the rear side of the stage 13. The suspension body 14 has a flat belt shape extending in the front-rear direction. The front side portion of the suspension body 14 has an opening 16. The opening 16 has a concave shape that opens toward the front side. The tip of the suspension body 14 forms a recess 17 that is recessed rearward along the opening 16.

  The bridging portion 15 connects the rear end edge of the stage 13 and the front end edge of the suspension body 14.

  Examples of the material of the metal support 7 include metal materials such as stainless steel, 42 alloy, aluminum, copper-beryllium, and phosphor bronze, and preferably stainless steel. The thickness of the metal support 7 is, for example, 10 μm or more, preferably 15 μm or more, for example, 35 μm or less, preferably 25 μm or less.

  As shown in FIG. 3A, the insulating base layer 8 is disposed on the lower surface (one side in the thickness direction) of the metal support 7. As shown in FIG. 5, the insulating base layer 8 is provided as a predetermined pattern corresponding to the conductor pattern 9. The insulating base layer 8 includes a stage base 20, a main body base 21, and a bridging base 22.

  The stage base 20 is disposed on the lower surface of the stage 13. The stage base 20 has a substantially rectangular shape in bottom view. The rear end edge of the stage base 20 is located behind the rear end edge of the stage 13.

  The main body base 21 is disposed on the lower surface of the suspension main body 14. The main body base 21 has an opening 23 at a position overlapping the concave portion 17 (see FIG. 2) when viewed from above and below. The opening 23 has a substantially rectangular shape in bottom view extending in the left-right direction. As shown in FIG. 2, the rear end edge of the opening 23 is located ahead of the rear end edge of the recess 17.

  As shown in FIG. 5, the bridging base 22 connects the rear end edge of the stage base 20 and the front end edge of the main body base 21.

  Examples of the material of the base insulating layer 8 include synthetic resins such as polyimide resin, polyamideimide resin, acrylic resin, polyether resin, nitrile resin, polyethersulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin. Preferably, a polyimide resin is mentioned. The insulating base layer 8 has a thickness of, for example, 1 μm or more, preferably 3 μm or more, for example, 25 μm or less, preferably 15 μm or less.

  As shown in FIG. 3A, the conductor pattern 9 is disposed on the lower surface (one side in the thickness direction) of the base insulating layer 8. As shown in FIG. 5, the conductor pattern 9 includes a plurality (four) of magnetic head terminals 25, a plurality (four) of element mounting terminals 26, a plurality (six) of external connection terminals 27, A plurality (four) of magnetic head wirings 28 and a plurality (four) of element wirings 29 are provided.

  The plurality of (four) magnetic head terminals 25 are electrically connected to the magnetic heads provided in the slider when a slider (not shown) is mounted on the suspension board with circuit 5. The plurality of magnetic head terminals 25 are arranged on the stage base 20 at intervals in the left-right direction.

  The plurality of (four) element mounting terminals 26 are electrically connected to the piezoelectric elements 58 via connection solders 56 when a piezoelectric element 58 described later is mounted on the suspension board with circuit 5. The plurality of element mounting terminals 26 include a plurality (two) of first mounting terminals 30 and a plurality (two) of second mounting terminals 31.

  As shown in FIGS. 3A and 5, the plurality of first mounting terminals 30 are disposed in the opening 23 and are spaced apart from each other in the left-right direction. The plurality of first mounting terminals 30 are adjacent to the front side with respect to the rear end edge of the opening 23. Thereby, the first mounting terminal 30 is adjacent to the base insulating layer 8 in a direction orthogonal to the thickness direction of the suspension board with circuit 5.

The first mounting terminal 30 extends away from the adjacent insulating base layer 8 and is exposed from the metal support 7 and the insulating base layer 8 when viewed from above. The first mounting terminal 30 has a substantially rectangular shape in plan view. The dimension in the left-right direction of the first mounting terminal 30 is, for example, 120 μm or more, preferably 210 μm or more, for example, 250 μm or less, preferably 230 μm or less. The front-rear dimension of the first mounting terminal 30 is, for example, 30 μm or more, preferably 50 μm or more, for example, 100 μm or less, preferably 90 μm or less. Area of the first mounting terminals 30 are, for example, 0.001 mm ² or more, preferably, 0.01 mm ² or more, for example, 0.025 mm ² or less, or preferably 0.020 mm ² or less.

  The plurality of second mounting terminals 31 are adjacent to the rear end of the stage base 20 on the rear side. Thereby, the second mounting terminal 31 is adjacent to the base insulating layer 8 in a direction orthogonal to the thickness direction of the suspension board with circuit 5. The plurality of second mounting terminals 31 are spaced apart from each other in the left-right direction so as to sandwich the bridging base 22. Further, the second mounting terminal 31 is located at a distance from the first mounting terminal 30 on the front side.

  The second mounting terminal 31 extends away from the adjacent insulating base layer 8 (stage base 20), and is exposed from the metal support 7 and the insulating base layer 8 when viewed from above.

  The second mounting terminal 31 has a substantially rectangular shape in plan view. The range of the dimension in the left-right direction of the second mounting terminal 31 is, for example, the same as the range of the dimension in the left-right direction of the first mounting terminal 30. The range of the dimension in the front-rear direction of the second mounting terminal 31 is the same as the range of the dimension in the front-rear direction of the first mounting terminal 30, for example. The area range of the second mounting terminal 31 is, for example, the same as the area range of the first mounting terminal 30.

  Also, as shown in FIG. 3A, a plating layer 32 is provided on the upper surfaces of the plurality of element mounting terminals 26 (first mounting terminal 30 and second mounting terminal 31). Examples of the material of the plating layer 32 include metal materials such as nickel and gold, and preferably gold. The thickness of the plating layer 32 is, for example, 0.1 μm or more, preferably 0.25 μm or more, for example, 5 μm or less, preferably 2.5 μm or less.

  As shown in FIG. 5, the plurality (six) of external connection terminals 27 are arranged on the rear end portion of the main body base 21 so as to be spaced apart from each other in the left-right direction.

  The plurality (four) of magnetic head wirings 28 are connected to the plurality of magnetic head terminals 25. Specifically, the plurality of magnetic head wirings 28 are routed on the base insulating layer 8 to electrically connect the plurality of magnetic head terminals 25 and the same number of external connection terminals 27 as the magnetic head terminals 25. To do.

  A plurality (four) of element wirings 29 are connected to a plurality of element mounting terminals 26. Specifically, the plurality of element wirings 29 include a plurality of power supply wirings 33 connected to the plurality of first mounting terminals 30 and a plurality of ground wirings 34 connected to the plurality of second mounting terminals 31. .

  The power supply wiring 33 is connected to the rear end portion of the first mounting terminal 30 and is disposed on the main body base 21 so as to form a step with the first mounting terminal 30. The plurality of power supply wires 33 are routed on the main body base 21, and the plurality of first mounting terminals 30 and the external connection terminals 27 that are not connected to the magnetic head wiring 28 among the plurality of external connection terminals 27. Are electrically connected.

  The ground wiring 34 is connected to the tip of the second mounting terminal 31 and is disposed on the stage base 20 so as to form a step with the second mounting terminal 31. The plurality of ground wirings 34 extend toward the front side on the stage base 20, then pass through the stage base 20 and contact (ground) the stage 13.

  Examples of the material of the conductor pattern 9 include conductor materials such as copper, nickel, gold, solder, and alloys thereof, and preferably copper. The thickness of the conductor pattern 9 is, for example, 1 μm or more, preferably 3 μm or more, for example, 20 μm or less, preferably 12 μm or less.

  As shown in FIG. 3A, the insulating cover layer 10 includes a lower surface (one side in the thickness direction) of the conductive pattern 9 and a lower surface (one side in the thickness direction) exposed from the conductive pattern 9 so as to cover the conductive pattern 9. Side). Specifically, the cover insulating layer 10 exposes the magnetic head terminal 25 and the external connection terminal 27 when viewed from the lower side (one side in the thickness direction), and the element mounting terminal 26, the magnetic head wiring 28, and the element wiring. 29 has a pattern shape to cover 29.

  As shown in FIGS. 3A and 4, the insulating cover layer 10 includes the first mounting terminal 30 and the second mounting terminal in addition to the lower surfaces of the first mounting terminal 30 and the second mounting terminal 31. The peripheral end surface of the terminal 31 is covered. Thus, each of the first mounting terminal 30 and the second mounting terminal 31 is adjacent to the insulating cover layer 10 in a direction orthogonal to the thickness direction of the suspension board with circuit 5.

  Examples of the material of the insulating cover layer 10 include the same synthetic resin as that of the insulating base layer 8, and preferably a polyimide resin. The thickness of the cover insulating layer 10 is appropriately set.

3. Next, with reference to FIG. 1, the detail of the support part 3 is demonstrated.

  The support part 3 is integral with the metal support 7 described above, and the support part 3 and the metal support 7 are located on the same plane. The support 3 and the metal support 7 constitute an example of a metal support layer.

  As described above, the support portion 3 includes the frame body 11 and the plurality of connection portions 12.

  The frame 11 has a lattice shape, and integrally includes a plurality (three) of vertical frames 35 and a plurality (three) of horizontal frames 36.

  Each of the plurality of vertical frames 35 has a substantially rectangular shape in plan view extending over the entire front-rear direction of the assembly sheet 1. The plurality of vertical frames 35 are arranged at intervals from each other so as to sandwich each suspension group 2 in the left-right direction. The vertical frame 35 is disposed with a space in the left-right direction with respect to the suspension group 2 (the suspension board with circuit 5).

  Each of the plurality of horizontal frames 36 has a substantially rectangular shape in plan view extending over the entire left and right direction of the assembly sheet 1. The plurality of horizontal frames 36 are arranged at intervals from each other so as to sandwich the suspension groups 2 in the front-rear direction. The plurality of horizontal frames 36 are connected to the plurality of vertical frames 35 so as to form a grid with the plurality of vertical frames 35. The horizontal frame 36 is disposed at a distance from the suspension group 2 (the suspension board with circuit 5) in the front-rear direction.

  The plurality of connecting portions 12 correspond to the plurality of suspension boards with circuits 5. As shown in FIG. 2, the support portion 3 includes a plurality (two) of connection portions 12 for one suspension board with circuit 5.

  The plurality of connection portions 12 corresponding to each suspension board with circuit 5 include a front side connection portion 37 and a rear side connection portion 38. The front side connection portion 37 connects the stage 13 and the horizontal frame 36 positioned on the front side of the corresponding suspension board with circuit 5, and the rear side connection portion 38 includes a rear end portion of the suspension body 14, and The horizontal frame 36 located behind the corresponding suspension board with circuit 5 is connected.

4). Next, the details of the inspection unit 4 will be described with reference to FIGS. 2, 3 </ b> B, and 5.

  As shown in FIGS. 2 and 3B, the inspection unit 4 is provided in the vertical frame 35 of the support unit 3. The inspection unit 4 includes an inspection opening 40, an inspection insulating layer 41, an inspection conductor layer 42, and an inspection cover layer 43.

  The inspection opening 40 is formed in the vertical frame 35. The inspection opening 40 has a substantially rectangular shape in plan view extending in the front-rear direction.

  The inspection insulating layer 41 is disposed on the lower surface (one side in the thickness direction) of the vertical frame 35 and is located on the same plane as the base insulating layer 8. The material of the inspection insulating layer 41 is the same as the material of the base insulating layer 8. The inspection insulating layer 41 and the base insulating layer 8 constitute an example of a first insulating layer.

  As shown in FIG. 5, the inspection insulating layer 41 includes a first inspection insulating layer 45 and a second inspection insulating layer 46.

  The first inspection insulating layer 45 is disposed on the rear peripheral edge of the inspection opening 40. The first inspection insulating layer 45 has a substantially rectangular shape in bottom view extending in the left-right direction. The leading edge of the first inspection insulating layer 45 is located on the front side of the trailing edge of the inspection opening 40.

  The second inspection insulating layer 46 is disposed at the front peripheral edge of the inspection opening 40, and is disposed at a distance from the first inspection insulating layer 45 on the front side. The second inspection insulating layer 46 has a substantially rectangular shape in bottom view extending in the left-right direction. The rear end edge of the second inspection insulating layer 46 is located behind the front end edge of the inspection opening 40.

  As shown in FIGS. 3B and 5, the inspection conductor layer 42 includes a plurality of inspection terminals 47 and a plurality of inspection wirings 50. The plurality of inspection terminals 47 are located on the same virtual plane as the plurality of element mounting terminals 26, and the plurality of inspection wirings 50 are located on the same virtual plane as the plurality of element wirings 29. The material of the inspection conductor layer 42 is the same as the material of the conductor pattern 9. The inspection conductor layer 42 and the conductor pattern 9 constitute an example of a conductor layer. Therefore, the element mounting terminal 26 and the inspection terminal 47 are included in the conductor layer.

  A plurality of inspection terminals 47 are provided with inspection solder 57 in a method of manufacturing a suspension board assembly with circuit described later. The plurality of inspection terminals 47 include a first inspection terminal 48 and a second inspection terminal 49.

  The first inspection terminal 48 is adjacent to the leading end of the first inspection insulating layer 45 on the front side. Thus, the first inspection terminal 48 is adjacent to the inspection insulating layer 41 in a direction orthogonal to the thickness direction of the suspension board with circuit 5. The first inspection terminal 48 extends away from the adjacent first inspection insulating layer 45 and is exposed from the frame 11 and the inspection insulating layer 41 when viewed from above.

  As shown in FIG. 2, when the first inspection terminal 48 is projected in the left-right direction (an example of the parallel direction of the plurality of suspension boards with circuit 5), at least one of the plurality of first mounting terminals 30 is used. It arrange | positions so that it may overlap with the terminal 30 for 1st mounting. In the present embodiment, as shown in FIG. 1, the first inspection terminals 48 are arranged so as to overlap all the first mounting terminals 30 when projected in the left-right direction.

  As shown in FIG. 2, the first inspection terminal 48 has a substantially rectangular shape in plan view. The dimension in the left-right direction of the first inspection terminal 48 is, for example, 100 ± 10, preferably 100, where 100 is the dimension in the left-right direction of the first mounting terminal 30. The front-rear direction dimension of the first inspection terminal 48 is, for example, 100 ± 10, preferably 100, where the front-rear direction dimension of the first mounting terminal 30 is 100. The area of the first inspection terminal 48 is, for example, 100 ± 10, preferably 100, where the dimension of the area of the first mounting terminal 30 is 100.

  As shown in FIGS. 3B and 5, the second inspection terminal 49 is adjacent to the rear end edge of the second inspection insulating layer 46 on the rear side, and the front side with respect to the first inspection terminal 48. Are arranged at intervals. Thus, the second inspection terminal 49 is adjacent to the inspection insulating layer 41 in the direction orthogonal to the thickness direction of the suspension board with circuit 5. The second inspection terminal 49 extends away from the adjacent second inspection insulating layer 46 and is exposed from the frame 11 and the inspection insulating layer 41 when viewed from above.

  As shown in FIG. 2, the second inspection terminal 49 is arranged so as to overlap with at least one second mounting terminal 31 among the plurality of second mounting terminals 31 when projected in the left-right direction. ing. In the present embodiment, as shown in FIG. 1, the second inspection terminals 49 are arranged so as to overlap all the second mounting terminals 31 when projected in the left-right direction.

  The second inspection terminal 49 has a substantially rectangular shape in plan view. The dimension in the left-right direction of the second inspection terminal 49 is, for example, 100 ± 10, preferably 100, where the dimension in the left-right direction of the second mounting terminal 31 is 100. The front-rear direction dimension of the second inspection terminal 49 is, for example, 100 ± 10, preferably 100, where the front-rear direction dimension of the second mounting terminal 31 is 100. The area of the second inspection terminal 49 is, for example, 100 ± 10, preferably 100, where the dimension of the area of the second mounting terminal 31 is 100.

  Further, as shown in FIG. 3B, a plating layer 32 is provided on the upper surfaces of the plurality of inspection terminals 47 (the first inspection terminal 48 and the second inspection terminal 49) in the same manner as the plurality of element mounting terminals 26. It is done.

  A plurality (two) of inspection wirings 50 are connected to a plurality of inspection terminals 47. Specifically, the plurality of inspection wirings 50 include a first inspection wiring 51 connected to the first inspection terminal 48 and a second inspection wiring 52 connected to the second inspection terminal 49.

  The first inspection wiring 51 is connected to the rear end portion of the first inspection terminal 48 and is disposed on the first inspection insulating layer 45 so as to form a step with the first inspection terminal 48. The second inspection wiring 52 is connected to the distal end portion of the second inspection terminal 49 and is disposed on the second inspection insulating layer 46 so as to form a step with the second inspection terminal 49.

  The inspection cover layer 43 is disposed on the lower surface (one side in the thickness direction) of the inspection conductor layer 42 and the lower surface (one side in the thickness direction) of the inspection insulating layer 41 exposed from the inspection conductor layer 42 so as to cover the inspection conductor layer 42. Has been. The inspection cover layer 43 is located on the same virtual plane as the cover insulating layer 10. The material of the inspection cover layer 43 is the same as the material of the cover insulating layer 10. The inspection cover layer 43 and the cover insulating layer 10 constitute an example of a second insulating layer.

  The inspection cover layer 43 covers the respective peripheral end surfaces of the first inspection terminal 48 and the second inspection terminal 49 in addition to the lower surfaces of the first inspection terminal 48 and the second inspection terminal 49. . Thereby, each of the first inspection terminal 48 and the second inspection terminal 49 is adjacent to the inspection cover layer 43 in a direction orthogonal to the thickness direction of the suspension board with circuit 5.

5. Manufacturing Method of Suspension Board Assembly with Circuit Next, an embodiment of a manufacturing method of the suspension board assembly with circuit of the present invention will be described with reference to FIGS.

  In the manufacturing method of the suspension board assembly with circuit, first, the assembly sheet 1 shown in FIG. 1 is prepared (first step).

  Next, as shown in FIGS. 6A and 6B, the connection solder 56 is disposed on the element mounting terminal 26, and the inspection solder 57 is disposed on the inspection terminal 47 (second step).

  Specifically, the plating layers 32 of the plurality of element mounting terminals 26 (first mounting terminal 30 and second mounting terminal 31) are formed by a known method (for example, printing by a known printing machine, application by a dispenser, etc.). Solder is simultaneously arranged on the upper surface and the upper surface of the plating layer 32 of the plurality of inspection terminals 47 (first inspection terminal 48 and second inspection terminal 49).

  In this embodiment, the moving direction (printing direction) of the printing press or dispenser is the left-right direction, and solder is collectively disposed on the plurality of element mounting terminals 26 and the plurality of inspection terminals 47 arranged in the left-right direction. To do.

  The solder contains, for example, Sn, Ag, Cu, Bi, Ni, In, and the like, and preferably includes only Sn, Ag, and Cu. The connection solder 56 disposed on the element mounting terminal 26 and the inspection solder 57 disposed on the inspection terminal 47 have the same composition.

The volume of the connection solder 56 disposed in each element mounting terminal 26 is, for example, 1 × 10 ⁻⁸ cm ³ or more, preferably 1 × 10 ⁻⁷ cm ³ or more, for example, 1 × 10 ⁻⁵ cm ^3. Hereinafter, it is preferably 1 × 10 ⁻⁶ cm ³ or less. Moreover, the volume of the connection solder 56 disposed in each element mounting terminal 26 is, for example, 1 × 10 ⁻⁵ cm ³ / cm ² or more per unit area, preferably 1 × 10 ⁻⁴ cm ³ / cm. ² or more, for example, 1 × 10 ⁻² cm ³ / cm ² or less, preferably 1 × 10 ⁻³ cm ³ / cm ² or less.

  If the volume of each connecting solder 56 is equal to or greater than the lower limit, the piezoelectric element 58 can be surely self-aligned, and the positional accuracy of the piezoelectric element 58 can be improved. If the volume of each connecting solder 56 is not more than the above upper limit, the thickness of the connecting solder 56 after reflow (fourth step) can be reduced.

  The volume of the inspection solder 57 disposed on each inspection terminal 47 is substantially the same as the volume of the connection solder 56 disposed on each element mounting terminal 26. For example, the volume is disposed on each element mounting terminal 26. When the volume of the connecting solder 56 is 100, it is 100 ± 10, preferably 100.

  Next, as shown in FIG. 7, a piezoelectric element 58 as an example of an electronic element is disposed so as to be in contact with the connection solder 56 (third step).

  The piezoelectric element 58 is an actuator that can be expanded and contracted in the front-rear direction, and expands and contracts when electricity is supplied and the voltage is controlled. In the present embodiment, two piezoelectric elements 58 are mounted on each suspension board with circuit 5.

  The piezoelectric element 58 is made of, for example, a known piezoelectric material, more specifically, a piezoelectric ceramic.

Examples of piezoelectric ceramics include BaTiO ₃ (barium titanate), PbTiO ₃ (lead titanate), Pb (Zr, Ti) O ₃ (lead zirconate titanate (PZT)), SiO ₂ (quartz), LiNbO ₃ ( Lithium niobate), PbNb ₂ O ₆ (lead metaniobate) and the like, preferably PZT.

  The piezoelectric element 58 includes a plurality of element terminals 61. The plurality of element terminals 61 correspond to the plurality of element mounting terminals 26 and include a first element terminal 59 and a second element terminal 60. The 1st element terminal 59 and the 2nd element terminal 60 are arrange | positioned at intervals at the front-back direction.

  In the third step, the first element terminal 59 is in contact with the connection solder 56 on the first mounting terminal 30 and the second element terminal 60 is connected to the second mounting terminal 31 in the third step. It arrange | positions so that the solder 56 may be contacted. Note that, as shown in FIG. 6B, the piezoelectric element 58 is not disposed in the inspection unit 4.

  The time from the placement of solder (second step) to the placement of piezoelectric elements 58 (third step) is, for example, 60 minutes or less, preferably 5 minutes or less.

  If the time from the second step to the third step is in the above range, the deterioration of the connection solder 56 and the inspection solder 57 can be suppressed.

  Next, as shown in FIGS. 8A and 8B, the assembly sheet 1 on which the piezoelectric elements 58 are arranged is heated (reflowed) to melt the connection solder 56, and the piezoelectric elements 58 and the plurality of element mounting terminals 26. And the inspection solder 57 are melted (fourth step).

  The heating temperature (reflow temperature) is appropriately changed depending on the composition of the solder, and is, for example, 120 ° C. or higher, preferably 130 ° C. or higher, for example, 280 ° C. or lower, preferably 260 ° C. or lower. When the solder consists only of Sn, Ag, and Cu, the heating temperature (reflow temperature) is, for example, 230 ° C. or higher, preferably 240 ° C. or higher, for example, 280 ° C. or lower, preferably 260 ° C. or lower. .

  If the heating temperature is in the above range, the correlation between the volume of each connection solder 56 and the volume of each inspection solder 57 can be reliably ensured after the fourth step.

  The heating time (reflow time) is, for example, 3 seconds or more, preferably 5 seconds or more, for example, 300 seconds or less, preferably 200 seconds or less.

  If the heating time is within the above range, the correlation between the volume of each connection solder 56 and the volume of each inspection solder 57 can be reliably ensured after the fourth step.

  In the fourth step, the piezoelectric element 58 is self-aligned as shown in FIG. Specifically, in the step of disposing the piezoelectric element 58 shown in FIG. 7, the piezoelectric element 58 may be disposed so as to be shifted from the predetermined position and tilted in the left-right direction. In this case, the center of the first element terminal 59 and the center of the first mounting terminal 30 are shifted from each other when viewed from the vertical direction, and the center of the second element terminal 60 and the center of the second mounting terminal 31 are Is located out of position.

  When the assembly sheet 1 on which the piezoelectric elements 58 are arranged is reflowed, the connection solder 56 is applied to the entire upper surfaces (specifically, the plating layer 32) of the first mounting terminals 30 and the second mounting terminals 31. It melts so as to spread out wet (see FIG. 8A).

  At this time, the center of the first element terminal 59 and the center of the first mounting terminal 30 coincide with each other and the center of the second element terminal 60 is seen from the vertical direction due to the surface tension of the molten connection solder 56. A force is applied to the piezoelectric element 58 so that the center of the second mounting terminal 31 coincides with the center. Thereby, the piezoelectric element 58 is self-aligned from the state shifted from the predetermined position toward the predetermined position.

  8A, the connecting solder 56 joins the first mounting terminal 30 and the second mounting terminal 31, and the first element terminal 59 and the second element terminal 60 together.

  Thereby, the connecting solder 56 is provided between each element terminal 61 and each element mounting terminal 26 (between the first element terminal 59 and the first mounting terminal 30, and between the second element terminal 60 and the second element terminal 60. (Between the mounting terminals 31). The connection solder 56 electrically connects each element terminal 61 and each element mounting terminal 26. That is, each element mounting terminal 26 is electrically connected to the piezoelectric element 58 to be mounted via the connection solder 56.

  Further, as shown in FIG. 8B, when the assembly sheet 1 is reflowed, the inspection solder 57 is similar to the connection solder 56 in the respective upper surfaces of the first inspection terminal 48 and the second inspection terminal 49. (In detail, the plating layer 32) melts so as to spread over the entire surface (see FIG. 8B).

  Next, the volume of the inspection solder 57 wetted and spread on each inspection terminal 47 is measured to inspect the volume of the connection solder 56 positioned between each element terminal 61 and each element mounting terminal 26 ( (5th process).

  Examples of the method for measuring the volume of the inspection solder 57 include a known three-dimensional optical system appearance measurement, preferably automatic optical measurement (AOI), laser microscope measurement, and the like, and more preferable from the viewpoint of cost. Includes laser microscope measurement.

The volume of each test solder 57, for example, 1 × ¹⁰ -8 cm ³ or more, preferably, 1 × ¹⁰ -7 cm ³ or more, e.g., 1 × ¹⁰ -5 cm ³ or less, preferably, 1 × 10 ^{- 6} cm ³ or less.

The volume of each inspection solder 57 per unit area is, for example, 1 × 10 ⁻⁵ cm ³ / cm ² or more, preferably 1 × 10 ⁻⁴ cm ³ / cm ² or more, for example, 1 × 10 ^{− It is 2} cm ³ / cm ² or less, preferably 1 × 10 ⁻³ cm ³ / cm ² or less.

  Here, the volume of the solder 57 for inspection and the volume of the solder 56 for connection have a correlation. For example, the volume of each inspection solder 57 is, for example, 100 ± 30, preferably 100, where the volume of each connection solder 56 is 100.

  Thus, the volume of the connecting solder 56 located between each element terminal 61 and each element mounting terminal 26 is inspected.

  Further, from the inspection result of the volume of each connection solder 56, the quality of the position of the piezoelectric element 58 (front and rear, left and right direction (XY direction) and up and down (Z direction)) is judged.

Specifically, when the volume of each connection solder 56 is, for example, 1 × 10 ⁻⁴ cm ³ / cm ² or more and 5 × 10 ⁻³ cm ³ / cm ² or less per unit area, the positional accuracy of the piezoelectric element 58 is determined. Is judged to be good.

  At this time, the thickness of each connection solder 56 is, for example, 3 μm or more, preferably 10 μm or more, more preferably 15 μm or more, for example, 50 μm or less, preferably 40 μm or less, more preferably 30 μm or less, and particularly preferably. Is 25 μm or less.

  When the thickness of each connection solder 56 is equal to or greater than the above lower limit, the piezoelectric element 58 can be stably self-aligned, and the positional accuracy of the piezoelectric element 58 in the front and rear direction (XY direction) is reliably ensured. be able to.

  When the thickness of each connection solder 56 is equal to or less than the above upper limit, the piezoelectric element 58 can be prevented from coming into contact with surrounding members when the suspension board with circuit 5 is mounted on a hard disk drive (not shown). .

  Specifically, the suspension board with circuit 5 is mounted on a hard disk drive (not shown) by supporting the suspension body 14 (see FIG. 2) on the load beam 66. At this time, the tip end portion of the load beam 66 is located on the upper side (the other side in the thickness direction) with respect to the piezoelectric element 58. Therefore, when the thickness of each connecting solder 56 exceeds the above range, the piezoelectric element 58 and the load beam 66 come into contact with each other. On the other hand, when the thickness of each connection solder 56 is not more than the above upper limit, the contact between the piezoelectric element 58 and the load beam 66 can be suppressed.

Further, when the volume of each connection solder 56 is less than 1 × 10 ⁻⁴ cm ³ / cm ² per unit area, or exceeds 5 × 10 ⁻³ cm ³ / cm ² , for example, the piezoelectric element It is determined that the position accuracy of 58 is poor.

  In this case, the measurement result of the volume of each inspection solder and the inspection result of the volume of each connection solder 56 are fed back to determine the solder placement amount (printing amount) and solder placement (second step) in the second step. The time until the arrangement of the piezoelectric elements 58 (third step), the heating conditions (temperature and time) in the fourth step, and the like are appropriately adjusted.

  Thus, the suspension board assembly with circuit 55 on which the piezoelectric element 58 is mounted is manufactured. The suspension board assembly with circuit 55 is formed on the assembly sheet 1, the piezoelectric element 58, the connection solder 56 disposed between each element terminal 61 and each element mounting terminal 26, and each inspection terminal 47. And an inspection solder 57 to be arranged.

  Thereafter, if necessary, the plurality of suspension boards with circuit 5 are separated from the support part 3 by cutting the connection part 12.

  In the assembly sheet 1, as shown in FIG. 8A and FIG. 8B, a connection solder 56 that electrically connects the electronic element and the element mounting terminal 26 is provided on the element mounting terminal 26 of the suspension board with circuit 5. An inspection solder 57 having substantially the same volume as the connection solder 56 can be disposed on the inspection terminal 47 of the inspection unit 4.

  The inspection terminal 47 is a terminal on which the inspection solder 57 is arranged, and an electronic element is not connected. Therefore, the volume of the inspection solder 57 is accurately measured without disturbing the electronic element. Etc. can be measured.

  As a result, the volume of the connecting solder 56 positioned between the piezoelectric element 58 and the element mounting terminal 26 can be accurately inspected from the measurement result of the volume of the inspection solder 57, and as a result, The position can be inspected with high accuracy. Thereby, the manufacturing efficiency of the assembly sheet 1 can be improved.

  As shown in FIGS. 1 and 2, the inspection unit 4 is provided on a support unit 3 that collectively supports a plurality of suspension boards with circuits 5. Therefore, it is not necessary to secure a space for arranging the inspection unit 4 in the suspension board with circuit 5, and the suspension board with circuit 5 can be downsized.

  In addition, since each of the plurality of suspension boards with circuit 5 and the inspection unit 4 is integrated with each other via the support unit 3, substantially the same volume of solder is stably disposed on each of the element mounting terminal 26 and the inspection terminal 47. Thus, the correlation between the volume of the connection solder 56 disposed on each element mounting terminal 26 and the volume of the inspection solder 57 disposed on each inspection terminal 47 can be stably secured. . As a result, the volume of the connection solder 56 positioned between the piezoelectric element 58 and the element mounting terminal 26 can be inspected with higher accuracy from the measurement result of the volume of the inspection solder 57.

  In addition, as shown in FIG. 2, the inspection terminal 47 is disposed so as to overlap all of the plurality of element mounting terminals 26 when projected in the left-right direction. Therefore, by setting the moving direction (printing direction) of the dispenser or the like to the left-right direction, it is possible to more stably dispose substantially the same volume of solder on each inspection terminal 47 and each element mounting terminal 26. . As a result, the correlation between the volume of the connection solder 56 disposed on each element mounting terminal 26 and the volume of the inspection solder 57 disposed on each inspection terminal 47 can be more stably ensured.

  Further, as shown in FIG. 5, since the suspension board with circuit 5 includes a magnetic head terminal 25 electrically connected to the magnetic head in addition to the element mounting terminal 26, the suspension board with circuit 5 In addition, a magnetic head and a piezoelectric element 58 (not shown) can be mounted.

  Further, as shown in FIGS. 3A and 3B, the inspection terminal 47 is included in the inspection conductor layer 42. Therefore, the inspection solder 57 can be stably disposed on the inspection terminal 47.

The element mounting terminal 26 is included in the conductor pattern 9 and is adjacent to the base insulating layer 8 and the cover insulating layer 10. The inspection terminal 47 is included in the inspection conductor layer 42, and the inspection insulating layer 41 and the inspection cover are included. Adjacent to layer 43. Therefore, the element mounting terminal 26 and the inspection terminal 47 can have the same configuration. As a result, approximately the same volume of solder can be more stably disposed on each of the inspection terminal 47 and the element mounting terminal 26. The volume of each connection solder 56 and the volume of each inspection solder 57 Can be more stably ensured.
Further, as shown in FIGS. 8A and 8B, in the suspension board assembly with circuit 55, the inspection solder 57 is disposed on the inspection terminal 47 that is not connected to the electronic element. It can be measured well. Therefore, from the measurement result of the volume of the inspection solder 57, the volume of the connection solder 56 positioned between the piezoelectric element 58 and the element mounting terminal 26 can be inspected with high accuracy. As a result, the position of the piezoelectric element 58 can be accurately detected. Can be inspected.

  Further, in the method of manufacturing the suspension board assembly with circuit 55, as shown in FIGS. 8A and 9, in the fourth step, the inspection solder 57 is melted, the connection solder 56 is melted, and the piezoelectric element 58 is self-assembled. The piezoelectric element 58 and the element mounting terminal 26 are joined while being aligned. Therefore, the positional accuracy of the piezoelectric element 58 can be improved.

  Thereafter, as shown in FIG. 8B, the volume of the melted inspection solder 57 is measured, and the volume of the connection solder 56 located between the piezoelectric element 58 and the element mounting terminal 26 is inspected. From the measurement result of the volume of the solder for solder 57, the volume of the connecting solder 56 located between the piezoelectric element 58 and the element mounting terminal 26 can be inspected with high accuracy. As a result, the position of the piezoelectric element 58 can be accurately detected. Can be inspected.

Second Embodiment
Next, with reference to FIG. 10, the assembly sheet | seat 1 as 2nd Embodiment of this invention is demonstrated. In the second embodiment, the same reference numerals are given to the same members as those in the first embodiment, and the description thereof is omitted.

  In the first embodiment, as shown in FIG. 2, the inspection unit 4 is provided on the vertical frame 35 of the support unit 3, and the inspection terminal 47 overlaps the element mounting terminal 26 when projected in the left-right direction. However, the present invention is not limited to this.

  In the second embodiment, as shown in FIG. 10, the inspection section 4 is provided on the horizontal frame 36 of the support section 3 so as to correspond to each of the plurality of suspension boards with circuit 5.

  The inspection unit 4 includes a plurality (two) of inspection terminals 47 arranged at intervals in the left-right direction. The plural (two) inspection terminals 47 are arranged so as to overlap at least one element mounting terminal 26 among the element mounting terminals 26 provided in the corresponding suspension board with circuit 5 when projected in the front-rear direction. ing.

  In the present embodiment, when projected in the front-rear direction, the right inspection terminal 47 of the two inspection terminals 47 is the right of the four element mounting terminals 26 included in the corresponding suspension board with circuit 5. The left inspection terminal 47 of the two inspection terminals 47 overlaps the left two of the four element mounting terminals 26.

  In this embodiment, the moving direction (printing direction) of the printing press or dispenser is the front-rear direction, and solder is collectively applied to the plurality of element mounting terminals 26 and the plurality of inspection terminals 47 arranged in the front-rear direction. Arrange.

  Therefore, according to the second embodiment, similarly to the first embodiment, it is possible to more stably dispose the solder of substantially the same volume in each of the inspection terminals 47 and each of the element mounting terminals 26. The correlation between the volume of the connection solder 56 disposed on the element mounting terminal 26 and the volume of the inspection solder 57 disposed on each inspection terminal 47 can be more stably ensured.

  Moreover, in 2nd Embodiment, there can exist an effect similar to 1st Embodiment.

<Third Embodiment>
Next, with reference to FIG. 11, a suspension inspection unit pair unit 70 as a third embodiment of the present invention will be described. In the third embodiment, the same reference numerals are given to the same members as those in the first embodiment, and the description thereof is omitted.

  As shown in FIG. 1, the assembly sheet 1 includes a plurality of suspension boards with circuits 5, but the present invention is not limited to this.

  As shown in FIG. 11, the suspension inspection unit pair unit 70 according to the third embodiment includes one suspension board with circuit 5, a support unit 3 that supports the suspension board with circuit 5, and an inspection unit provided in the support unit 3. 4.

  Also according to the third embodiment, it is possible to achieve the same operational effects as those of the first embodiment.

<Fourth embodiment>
Next, the manufacturing method of the assembly sheet 1 of 4th Embodiment of this invention is demonstrated.

  In the first embodiment, only the volume of the inspection solder 57 after the fourth step is measured, but the present invention is not limited to this. The fourth embodiment further includes a step of inspecting the volume of the inspection solder 57 after the second step and before the fourth step.

  As a method of measuring the volume of the solder 57 for inspection before the fourth step, for example, the above-described three-dimensional optical system appearance measurement can be mentioned, preferably, automatic optical measurement (AOI), laser microscope measurement, More preferably, laser microscope measurement is mentioned from a viewpoint of cost.

  In the fourth embodiment, the volume of the inspection solder 57 is measured before the inspection solder 57 is melted. That is, the volume of the inspection solder 57 is measured both before and after melting (both before and after the fourth step). Therefore, when the volume of the connection solder 56 to be inspected from the measurement result of the volume of the inspection solder 57 after melting is defective, the measurement result of the volume of the inspection solder 57 before and after melting is fed back, and the above The conditions of each step of the assembled sheet 1 can be adjusted with higher accuracy. As a result, the manufacturing efficiency of the assembly sheet 1 can be further improved.

<Modification>
In the first to fourth embodiments, as shown in FIG. 3B, in the inspection unit 4, the first inspection terminal 48 is adjacent to the front end edge of the first inspection insulating layer 45. The second inspection terminal 49 is adjacent to the rear side of the rear end edge of the second inspection insulating layer 46, but the configuration of the inspection unit 4 is not limited to this.

  For example, as shown in FIGS. 12A and 12B, each of the first inspection insulating layer 45 and the second inspection insulating layer 46 has an opening 67, and the first inspection terminal 48 has an opening of the first inspection insulating layer 45. The second inspection insulating layer 46 may be filled in the opening 67 of the second inspection insulating layer 46.

  12C and 12D, the plating layer 32 may be provided on the lower surface of the frame 11, and the portions where the plating layer 32 is provided may be used as the first inspection terminal 48 and the second inspection terminal 49. In this case, each of the first inspection terminal 48 and the second inspection terminal 49 is included in the frame body 11 and is adjacent to the frame body 11 in the front-rear direction and the left-right direction. According to this, the 1st inspection terminal 48 and the 2nd inspection terminal 49 can be made into a simple structure.

  Further, the arrangement and number of the inspection units 4 are not particularly limited. In the assembly sheet 1, only one inspection unit 4 can be provided. Further, the inspection unit 4 can be provided in the suspension board with circuit 5.

  Also by these, the same operation effect as a 1st embodiment can be produced.

DESCRIPTION OF SYMBOLS 1 Assembly sheet | seat 3 Support part 4 Inspection part 5 Suspension board with a circuit 7 Metal support body 8 Base insulating layer 9 Conductor pattern 10 Cover insulating layer 25 Magnetic head terminal 26 Element mounting terminal 28 Magnetic head wiring 29 Element wiring 41 Inspection insulation layer 42 Inspection conductor layer 43 Inspection cover layer 47 Inspection terminal 55 Suspension board assembly with circuit 58 Piezoelectric element 70 Suspension inspection part pair unit

Claims (11)

A suspension board with circuit and an inspection unit;
The suspension board with circuit includes an element mounting terminal that is electrically connected to an electronic element to be mounted via a connection solder,
The suspension with circuit, wherein the inspection unit includes an inspection terminal on which an inspection solder for inspecting a volume of the connection solder located between the electronic element and the element mounting terminal is disposed. Board unit. A plurality of suspension boards with circuit;
A plurality of suspension boards with circuits, and a support portion that collectively supports the plurality of suspension boards with circuits,
The suspension board unit with circuit according to claim 1, wherein the inspection unit is provided in the support unit. The plurality of suspension boards with circuit are arranged in parallel at intervals in a direction orthogonal to the thickness direction of the suspension board with circuit,
The inspection terminal is disposed so as to overlap at least one of the plurality of element mounting terminals when projected in the parallel direction of the plurality of suspension boards with circuit. The suspension board unit with circuit according to claim 2. The plurality of suspension boards with circuit are arranged in parallel at intervals in a direction orthogonal to the thickness direction of the suspension board with circuit,
When the inspection terminal is projected in a direction perpendicular to both the parallel direction of the plurality of suspension boards with circuit and the thickness direction, at least one of the plurality of element mounting terminals is used for mounting the element. The suspension board unit with circuit according to claim 2, wherein the suspension board unit with circuit is arranged so as to overlap with a terminal. The suspension board with circuit is
A magnetic head terminal electrically connected to the magnetic head;
Magnetic head wiring connected to the magnetic head terminals;
The suspension board unit with circuit according to claim 1, further comprising: an element wiring connected to the element mounting terminal. A metal support layer;
A first insulating layer disposed on one side in the thickness direction of the metal support layer;
A conductor layer disposed on one side in the thickness direction of the first insulating layer;
A second insulating layer disposed on one side in the thickness direction of the conductor layer,
The suspension board unit with circuit according to claim 1, wherein the inspection terminal is included in the conductor layer or the metal support layer. The element mounting terminal is included in the conductor layer and is adjacent to the first insulating layer and / or the second insulating layer in a direction orthogonal to the thickness direction of the suspension board with circuit.
The inspection terminal is included in the conductor layer and is adjacent to the first insulating layer and / or the second insulating layer in a direction orthogonal to the thickness direction. Suspension board unit with circuit.   The suspension with circuit according to claim 6, wherein the inspection terminal is included in the metal support layer and is adjacent to the metal support layer in a direction orthogonal to a thickness direction of the suspension board with circuit. Board unit. A suspension board unit with circuit according to any one of claims 1 to 8,
A piezoelectric element as the electronic element;
Solder for connection that is disposed between the piezoelectric element and the element mounting terminal, and electrically connects the piezoelectric element and the element mounting terminal;
A suspension board assembly with circuit, comprising: an inspection solder disposed on the inspection terminal. A first step of preparing the suspension board unit with circuit according to any one of claims 1 to 8,
A second step of disposing a connection solder on the element mounting terminal and disposing an inspection solder on the inspection terminal;
A third step of placing the electronic element in contact with the connecting solder;
The suspension board unit with circuit is heated to melt the connection solder, and while the electronic element is self-aligned, the electronic element and the element mounting terminal are joined and the inspection solder is dissolved. A fourth step;
Measuring the volume of the inspection solder after the fourth step, and inspecting the volume of the connection solder located between the electronic element and the element mounting terminal. A method of manufacturing a suspension board assembly with circuit, which is characterized.   The method of manufacturing a suspension board assembly with circuit according to claim 10, further comprising a step of measuring a volume of the inspection solder after the second step and before the fourth step.

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