JPH04119689A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH04119689A JPH04119689A JP24081690A JP24081690A JPH04119689A JP H04119689 A JPH04119689 A JP H04119689A JP 24081690 A JP24081690 A JP 24081690A JP 24081690 A JP24081690 A JP 24081690A JP H04119689 A JPH04119689 A JP H04119689A
- Authority
- JP
- Japan
- Prior art keywords
- land
- electrode
- wiring board
- solder
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 20
- 239000004020 conductor Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- 238000005476 soldering Methods 0.000 abstract description 6
- 239000011295 pitch Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、表面実装用電子部品を搭載するプリント配線
板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a printed wiring board on which surface-mounted electronic components are mounted.
従来の技術
電子機器の小型化が促進される今日、電子部品も大幅な
小型化が要求されており、プリント配線板実装用の回路
部品として、リード線を有さない表面実装型の回路部品
が実用化されてきた。これらの回路部品には、抵抗、コ
ンデンサ等、両端部に電極を有するチップ型電子部品や
、二辺あるいは四辺に装着用リード端子を設置した各種
ＬＳＩパッケージがあり、それぞれ、厳しい小型化の要
求に対応する電子部品が開発されている。Conventional technology Today, as electronic devices become smaller, electronic components are required to be significantly smaller, and surface-mounted circuit components without lead wires are being used as circuit components for mounting on printed wiring boards. It has been put into practical use. These circuit components include chip-type electronic components such as resistors and capacitors that have electrodes on both ends, and various LSI packages that have mounting lead terminals on two or four sides. Corresponding electronic components have been developed.
なかでも、チップ型表面実装用電子部品として、サイズ
が１．６ｍＸ０．８ｍｍや１．０閣×０．５醜の超小型
電子部品が使用され、ＬＳＩパッケージにおいても、リ
ードピッチの狭ピッチ化がすすみ、０．６５ｎ＋＋ｎピ
ツチから０．５ｍピッチ、さらに０．４ｍピッチへと移
行するに従い、実装関連の技術は大幅な進展をみせてい
る。Among these, ultra-small electronic components with a size of 1.6 m x 0.8 mm or 1.0 mm x 0.5 mm are used as chip-type surface-mount electronic components, and lead pitches are becoming narrower in LSI packages as well. As progress has progressed from a 0.65n++n pitch to a 0.5m pitch and then to a 0.4m pitch, mounting-related technology has made significant progress.
上記の表面実装用電子部品対応のプリント配線板として
、従来のものは、第３図に示すように、表面実装用電子
部品１の電極部２に対応させた位置に、導電層よりなる
パターンで表面の平滑なランド４を形成し、上記表面実
装用電子部品１の電極２をこのランド４にはんだ３で接
合するという構成であった。As shown in FIG. 3, the conventional printed wiring board compatible with the above surface-mounted electronic components has a pattern made of a conductive layer at a position corresponding to the electrode part 2 of the surface-mounted electronic component 1. The structure was such that a land 4 with a smooth surface was formed, and the electrode 2 of the surface-mounted electronic component 1 was bonded to this land 4 with a solder 3.
発明が解決しようとする課題
しかし搭載部品の小型化がすすむに従い、当然、電子部
品の電極部の寸法や、プリント配線板のはんだ接合用ラ
ンドの寸法も小さくなる。たとえば、チップ型電子部品
の装着用ランドを考えた場合、通常、３２１６ （サイ
ズ３．２ｍｍＸ１．６ｍｍ）型チップ部品では、ランド
寸法１．５ｍＸ１．６ｎ＋ｍ、面積２．４＋ｍ２程度で
あるのに対し、２１２５（サイズ２．１ ｗ＊Ｘ ２．
５ｍ）型チップ部品では、ランド寸法１．０ｍＸ１．２
ｗｍ、面積１．２ｍ２程度となり、１６０８（サイズ１
、６ ｍ Ｘ ０ 、８ ｖｍ ）型チップ部品では
、ランド寸法０６８■Ｘ １．Ｏａ＋、面積０、．８ｗ
ｍ２程度となる。さらに１００５（サイズ１、ＯｗｅＸ
ｏ、５■）型チップ部品では、ランド寸法０．５■Ｘ０
．６＋ｗ、面積０．３ｍ２程度となり、小型化するにつ
れて、急激にランド面積が小さくなってくる。そのため
、接合部の接合表面積や、接合はんだの量も少なくなり
、電気的接続の信頼性や機械的接続強度が著しく低下す
る危険性を有している。Problems to be Solved by the Invention However, as the size of mounted components progresses, the dimensions of the electrode portions of electronic components and the dimensions of solder joint lands of printed wiring boards naturally become smaller. For example, when considering a mounting land for a chip-type electronic component, normally for a 3216 (size 3.2mm x 1.6mm) type chip component, the land size is 1.5m x 1.6n+m and the area is about 2.4+m2. 2125 (Size 2.1 w*X 2.
For 5m) type chip parts, the land size is 1.0m x 1.2
wm, area is about 1.2 m2, 1608 (size 1
, 6 m x 0, 8 vm) type chip parts, the land size is 068 x 1. Oa+, area 0, . 8w
It will be about m2. In addition, 1005 (size 1, OweX
o, 5■) type chip parts, the land size is 0.5■X0
．． 6+w, the area is about 0.3 m2, and as the size becomes smaller, the land area becomes smaller rapidly. Therefore, the bonding surface area of the bonding portion and the amount of bonding solder decrease, and there is a risk that the reliability of the electrical connection and the strength of the mechanical connection will decrease significantly.
プリント配線板の接合用ランドの寸法を大きくすること
により、接続の信頼性や機械的強度は向上するが、本来
の、小型化、高密度実装の目的から逸脱したプリント配
線板の回路設計となってしまう。Increasing the dimensions of the bonding land on a printed wiring board improves the reliability and mechanical strength of the connection, but it also results in a printed wiring board circuit design that deviates from the original purpose of miniaturization and high-density mounting. It ends up.
また実装工法において、接合はんだ量を多くするため、
接合用ランドへのクリームはんだ塗布量を増加させた場
合は、ランドの表面積が小さいために、リフロー後、は
んだブリッジ不良をひき起こすという問題があった。In addition, in the mounting method, in order to increase the amount of bonding solder,
When the amount of cream solder applied to the bonding land is increased, there is a problem in that the surface area of the land is small, resulting in poor solder bridging after reflow.
課題を解決するための手段
このような課題を解決するために本発明は、表面実装用
電子部品の電極が接続されるプリント配線板上のランド
部分に凹部を設けたものである。Means for Solving the Problems In order to solve the above problems, the present invention provides a concave portion in a land portion on a printed wiring board to which an electrode of a surface-mounted electronic component is connected.
作用
表面実装用電子部品の電極が接続されるランド部分に凹
部を設けることにより、接合時の接合表面積が増加し、
さらに接合はんだの量も多（なる。またランド部分の凹
部を、表面実装部品の電極の底面側との間に隙間が形成
される位置に設けた場合は、電極とランドの間にも十分
なはんだが供給されるため、ランドの寸法を大きくする
ことなく、表面実装用電子部品の搭載用として、電気的
接続の信頼性が高く、また機械的接続強度の強いプリン
ト配線板とすることができる。By providing a concave portion in the land area where the electrodes of surface-mounted electronic components are connected, the bonding surface area during bonding increases.
In addition, the amount of solder required for bonding is large.Also, if the concave part of the land is located at a position where a gap is formed between the bottom side of the electrode of the surface mount component, there should be enough solder between the electrode and the land. Since solder is supplied, it is possible to create a printed wiring board with high reliability of electrical connection and strong mechanical connection strength for mounting electronic components for surface mounting without increasing the land size. .
実施例 以下、本発明の実施例を図面と共に説明する。Example Embodiments of the present invention will be described below with reference to the drawings.
第１図に示したように表面実装用電子部品１の電極２が
接続されるプリント配線板のランド１４にφ０．３−の
逆円すい状の凹部１５を設けた形状とし、表面実装用電
子部品１を装着した後、リフローはんだ付けの方法やフ
ローはんだ付けの方法により前記表面実装用電子部品１
の電極２をはんだ３で接合する。このとき、ランド部分
の凹部１５にはんだが充填されるため、接続表面積が大
きくなる。As shown in FIG. 1, the land 14 of the printed wiring board to which the electrode 2 of the surface mount electronic component 1 is connected is provided with an inverted conical recess 15 of φ0.3-. 1, the surface mount electronic component 1 is attached using a reflow soldering method or a flow soldering method.
The electrodes 2 are joined with solder 3. At this time, the concave portion 15 of the land portion is filled with solder, so that the connection surface area becomes large.
また第２図に示したように、ランド部分１４の凹部１５
を、表面実装用電子部品１の電極２の底面側部分との間
に隙間が形成される位置に設け、前記と同様、表面実装
部品１を装着した後、リフローはんだ付けの方法やフロ
ーはんだ付けの方法により、表面実装部品１の電極２を
はんだ３で接合する。このとき、電極２とランド１４の
間に凹部１５による隙間が形成されるため、電極底面部
分とランドの間に十分なはんだ３が供給され、接続信頼
性が大きく向上する。Further, as shown in FIG. 2, the recess 15 of the land portion 14
is provided at a position where a gap is formed between the surface mount electronic component 1 and the bottom side of the electrode 2, and as described above, after mounting the surface mount component 1, reflow soldering or flow soldering is performed. The electrodes 2 of the surface mount component 1 are bonded with the solder 3 by the method described above. At this time, since a gap is formed by the recess 15 between the electrode 2 and the land 14, sufficient solder 3 is supplied between the electrode bottom surface portion and the land, and connection reliability is greatly improved.
尚、本発明の実施例ではランド部分の凹部の形状をφ０
．３ｍ＋の逆円すい状としたが、ランド部分の凹部の形
状１寸法、および回数は限定されるものではなく、平滑
なランド部分に対して凹部となり、接合部の面積が増加
する形状であれば任意のものでよい。In the embodiment of the present invention, the shape of the concave portion of the land portion is φ0.
．． Although the shape is a 3m+ inverted cone, the shape of the concave part of the land part and the number of times are not limited, but any shape can be used as long as it becomes a concave part with respect to the smooth land part and increases the area of the joint part. It's fine to use one.
発明の効果
以上のように本発明によれば、表面実装用電子部品の電
極をプリント配線板の接合用ランドに接合する際に、接
合面積が大きくなり、また接合はんだの量も増加するた
め、電気的接続の信頼性や、機械的接合の強度が大幅に
向上する。Effects of the Invention As described above, according to the present invention, when bonding an electrode of a surface-mounted electronic component to a bonding land of a printed wiring board, the bonding area becomes large and the amount of bonding solder increases. The reliability of electrical connections and the strength of mechanical joints are greatly improved.
第１図及び第２図はそれぞれ本発明の実施例における表
面実装部品のプリント配線板の接合用うンドに接合した
構成を示す断面図、第３図は従来の表面実装部品の接合
の構成を示す断面図である。
１・・・・・・表面実装部品、２・・・・・・表面実装
部品の電極、３・・・・・・はんだ、１４・・・・・・
ラント、１５・・・・・・凹部。
代理人の氏名 弁理士小鍜治明 ほか２名１ 表面宍裟
用ｔ＋音Ｐ品
２ 表面実装用１＋告？品ｆ）を極
３ はんに゛FIGS. 1 and 2 are cross-sectional views showing a structure in which a surface mount component is bonded to a bonding pad for a printed wiring board in an embodiment of the present invention, respectively, and FIG. 3 is a sectional view showing a structure in which a conventional surface mount component is bonded. FIG. 1...Surface mount component, 2...Electrode of surface mount component, 3...Solder, 14...
Runt, 15... recess. Name of agent: Patent attorney Haruaki Ogata and 2 others 1 T + sound P product for surface mounting 2 1 + notification for surface mounting? Product f) to pole 3
Claims (2)
体ランド部分に凹部を設けたプリント配線板。(1) A printed wiring board in which a recess is provided in the conductor land portion to which the electrode of a surface-mounted electronic component is connected by solder.
品の電極の底面側部分との間に隙間が形成される位置に
設けた、請求項１記載のプリント配線板。(2) The printed wiring board according to claim 1, wherein the recessed portion of the conductive land portion is provided at a position where a gap is formed between the recessed portion and the bottom side portion of the electrode of the surface-mounted electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24081690A JPH04119689A (en) | 1990-09-10 | 1990-09-10 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24081690A JPH04119689A (en) | 1990-09-10 | 1990-09-10 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04119689A true JPH04119689A (en) | 1992-04-21 |
Family
ID=17065120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24081690A Pending JPH04119689A (en) | 1990-09-10 | 1990-09-10 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04119689A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902692A (en) * | 2014-03-07 | 2015-09-09 | Skw电子有限责任公司 | Structuring of the solder resist mask of circuit boards for improving soldering results |
| CN106171048A (en) * | 2014-03-14 | 2016-11-30 | 住友电装株式会社 | Printed base plate and the band terminal printed base plate employing this printed base plate |
| CN110290642A (en) * | 2019-06-19 | 2019-09-27 | 厦门天马微电子有限公司 | A kind of circuit board, lamp bar, backlight module and display device |
-
1990
- 1990-09-10 JP JP24081690A patent/JPH04119689A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902692A (en) * | 2014-03-07 | 2015-09-09 | Skw电子有限责任公司 | Structuring of the solder resist mask of circuit boards for improving soldering results |
| CN106171048A (en) * | 2014-03-14 | 2016-11-30 | 住友电装株式会社 | Printed base plate and the band terminal printed base plate employing this printed base plate |
| CN110290642A (en) * | 2019-06-19 | 2019-09-27 | 厦门天马微电子有限公司 | A kind of circuit board, lamp bar, backlight module and display device |
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