CN108901144A - Enhance the method for printed wiring board rigid-flex combined strength - Google Patents
Enhance the method for printed wiring board rigid-flex combined strength Download PDFInfo
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- CN108901144A CN108901144A CN201810783553.7A CN201810783553A CN108901144A CN 108901144 A CN108901144 A CN 108901144A CN 201810783553 A CN201810783553 A CN 201810783553A CN 108901144 A CN108901144 A CN 108901144A
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- Prior art keywords
- wiring board
- solid
- printed wiring
- state
- combined strength
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to the processing technique fields more particularly to a kind of method for enhancing printed wiring board rigid-flex combined strength for wiring board.Enhance the method for printed wiring board rigid-flex combined strength, solid-state bonding film is mounted on wiring underlayer plate, flexible circuit board is placed or mounted again onto the wiring underlayer plate for having mounted electronic component and solid-state bonding film, then flexible circuit board and wiring underlayer plate are pressed using jig, the jig for being loaded with wiring board is put into reflow soldering and carries out reflow soldering.The invention be able to solve wiring board production efficiency existing in the prior art and do over again low efficiency the technical issues of.
Description
Technical field
The invention belongs to the processing technique fields more particularly to a kind of soft or hard board group of enhancing printed wiring board for wiring board
The method for closing intensity.
Background technique
With miniaturization of electronic products, intelligentized development, more and more micro elements or route template die group are applied
Into the design and production of product, especially flexible circuit board is ultra-thin and can make fine since it is with material softness
The characteristics of route, can be processed to the mould set product with various complicated circuits and function, then with the mainboard of electronic product
Very small and exquisite circuit board module can be formed after welding, be thus effectively reduced the volume and thickness of electronic product,
It has broad prospects in current market.
According to the appearance of environmental regulation and the country《Electronics and IT products pollution control management method》(Chinese RoHS) just
(RoHS is the mandatory standard formulated by European Union's legislation, its full name is by formula implementation and European Union RoHS《About limitation
The instruction of certain harmful components is used in electronic and electrical equipment》Restriction of Hazardous Substances),
(energy consumption produces by WEEE (the electronic electric equipment Waste Electrical and Electronic Equipment scrapped) and EuP
Product, " Energy-using Products, abbreviation EuP ", refers to and inputs by the energy --- electric power, petrochemical industry and generative fuel are
Can operation and those be used to start, transport and measure the commercialized product of the energy) implementation, pb-free solder will be required to answer
In welding process for any electronic product, the unleaded of electronic manufacture has become the immutable fact.Therefore increase
The weld strength of pb-free solder improves the soldering reliability of leg, especially the raising contour integrated electronic of printed wire template die group
The soldering reliability of the miniature welding component such as element and flexible circuit board is design of electronic products and electronics manufacturing enterprise
Need key problems-solving.
Previous major manufacturing enterprise in order to improve the soldering reliability of component, generally use increase component pads area or
The mode being filled after welding using epoxy resin carries out consolidation process to component, but these electronic components often by
In the integrated of small volume or height, itself can not construct biggish bonding pad area, thus weld strength be unable to reach it is subsequent
The requirement of processing technology needs to bend it and wound especially when route template die group is assembled due to often requiring that,
This just more increases a possibility that solder joint failure, when being filled using liquid-state epoxy resin glue to circuit board module, by
The effect caused by curing mode difference is also different, and thermohardening type liquid glue needs production firm to add spot gluing equipment,
Place and corresponding operation personnel, this will cause the increase of manufacturer's production cost.
UV solidification glue can cause solidification to be not thorough because of that can not carry out illumination using ultraviolet light completely on the inside of wiring board, glue
Due intensity and rigidity cannot be reached after body solidification, reduce the reliability of Product jointing.In addition, to the wiring board after solidification
Component often causes difficult or generation route of doing over again due to being filled with epoxide-resin glue if it find that when defect needs to do over again
Plate is scrapped, and virtually increases the manufacturing cost of production firm in this way, increases additional burden for enterprise.
Further, since the viscosity of epoxy glue and flow direction are different, residue glue can be generated in dispensing region, these
Residue glue will form hard blob of viscose after solidifying, the size of blob of viscose is directly related with the gap between dispensing amount and wiring board, but raw
Between gap be unable to completely control and will cause in the case where dispensing amount controls good situation due between wiring board between wiring board in production
The difference of gap and cause glue amount cured glue block size also different situation, these blob of viscoses some can exceed subsequent packaging technology
Structure size requirement, seriously affect being normally carried out for subsequent wiring board assembling, therefore reduce production efficiency.
Consolidation process is carried out to circuit board module using liquid-state epoxy resin glue during traditional circuit template die group welding
When, need to increase additional personnel, equipment and relevant place, this also increases the manufacturing expenses of manufacturer.And due to
Epoxy resin after solidification imposes temperature greater than 300 degrees Celsius returning man-hour requirement, and heating process easily causes wiring board
Or its surface-pasted electronic component damage, thus scrapping for many products and material is caused, increase doing over again for manufacturer
Cost.
Summary of the invention
The purpose of the present invention is to provide the methods of enhancing printed wiring board rigid-flex combined strength, to solve the prior art
Present in wiring board production efficiency and do over again low efficiency the technical issues of.
Solid-state bonding film is mounted on wiring underlayer plate by the method for enhancing printed wiring board rigid-flex combined strength,
Flexible circuit board is placed or mounted again onto the wiring underlayer plate for having mounted electronic component and solid-state bonding film, then
Flexible circuit board and wiring underlayer plate are pressed using jig, the jig for being loaded with wiring board is put into reflow soldering and carries out Reflow Soldering
It connects.
The present invention enhances having the beneficial effect that for the method for printed wiring board rigid-flex combined strength：
Due to being accomplished that softening, melting, infiltration, capillary in solid-state bonding film assist side solder reflow process and consolidating
The physical process of change, the raw material of solid-state bonded adhesives flake products does not generate any chemical change in this process, with bottom line
The crosslinking of road plate and flexible circuit board also belongs to physical crosslinking, therefore this process has invertibity.When circuit board module is found
When quality problems and production process defect, the method that heating can be directly used carries out place of doing over again to bonding circuit board module
Reason, process of rework will not generate the damage of any element and wiring board, therefore rework cost can significantly reduce.
Solid-state can be disposably completed during Reflow Soldering using this composite type heat blow state bonding film to be bonded
Film softening, melts, infiltration, and bonding and fixed effect, it does not need any additional investment, therefore can effectively improve
Production capacity is produced, reduces personnel, the consumption of equipment and place resource reduces technical process and greatly reduces caused by product does over again
Material scrap, especially apply more in surface mount elements, circuit board module size is small, cabling is intensive and the collection number of plies is more or cost compared with
Manufacturing cost can greatly be reduced in high electronic product production process.
Preferred technical solution, supplementary features are that it is that no tack solid-state is bonded film that solid-state, which is bonded film, are inciting somebody to action
Before no tack solid-state bonding film mounts on sandwich circuit board on earth, arrived in no tack solid-state bonding film bottom silk-screen one
Two for being temporarily bonded the tin point of solid-state bonding film.
Further preferred technical solution, supplementary features are that the shape of tin point is round or rectangular.
Technical solution still further preferably, supplementary features are that tin point is the circle or side length of diameter 0.2-0.3mm
0.2-0.3mm's is rectangular.
Preferred technical solution, supplementary features are that it is thermoplastic material that solid-state, which is bonded film,.
Further preferred technical solution, supplementary features are, thermoplastic material be polyester, polyurethane, polyimides,
One of rubber.
Further preferred technical solution, supplementary features are that the softening temperature that solid-state is bonded film is 80-90 DEG C,
Melting temperature is 180-192 DEG C.
Further preferred technical solution, supplementary features are that solid-state bonding film is packaged in braid, with electronics member
Part is mounted on the position that printed wiring board needs to enhance Joint Strength by full-automatic chip mounter together.
Further preferred technical solution, supplementary features are that tin point is formed by tin cream, and tin cream is by solder powder, helps
Solder flux and surfactant, thixotropic agent are mixed, the paste mixture of formation.
Preferred technical solution, supplementary features are, in reflow soldering, reflow soldering temperature curve is average to heat up
Speed is lower than 3 DEG C per second, and 150-200 DEG C of soaking time is 60-180s, and the soaking time greater than 217 DEG C is 60-150s, peak value
245-250 DEG C of temperature, cooling zone rate of temperature fall is lower than 6 DEG C per second, from 25 DEG C to the peak temperature time lower than 480s.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the flow diagram of the method for the enhancing printed wiring board rigid-flex combined strength of the embodiment of the present invention one；
Fig. 2 is the knot in embodiment one after solid-state is bonded film and flexible circuit board is both placed on bottom circuit board
Structure schematic diagram；
Fig. 3 is the three-dimensional disassembly diagram of Fig. 2；
Fig. 4 is to be bonded film and flexible circuit board in solid-state in the embodiment of the present invention two to be both placed on bottom circuit board it
Structural schematic diagram afterwards；
Fig. 5 is the three-dimensional disassembly diagram of Fig. 4.
Icon：1- wiring underlayer plate；2- tin cream；3- solid-state is bonded film；4- flexible circuit board；5- pad；Other electricity of 6-
Subcomponent.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Embodiment one
As shown in Figure 1-Figure 3, the method for enhancing printed wiring board rigid-flex combined strength mounts solid-state bonding film 3
On wiring underlayer plate 1, then flexible circuit board 4 is placed or mounted to having mounted electronic component and solid-state and is bonded film 3
Wiring underlayer plate 1 on, then flexible circuit board 4 and wiring underlayer plate 1 are pressed using jig, the jig of wiring board will be loaded with
It is put into reflow soldering and carries out reflow soldering.
Solid-state bonding film 3 can need the area size being bonded to be designed and be cut into corresponding ruler according to printed wiring board
Very little and thickness can be strip, blocky, and round pie or other special-shaped shapes, this solid-state are bonded 3 melted by heating of film and flow
And capillary percolation is finally frozen into firm solid with the reduction of temperature between the wiring board and component to be bonded
Firmly to lock wiring board and component in position, and in electronic product actual production and use process, lower
Assembling and vibration, mechanical damage caused by falling.
Due to solid-state bonding 3 assist side solder reflow process of film in be accomplished that softening, melting, infiltration, capillary and
Cured physical process, the raw material of solid-state bonded adhesives flake products does not generate any chemical change in this process, with bottom
The crosslinking of wiring board 1 and flexible circuit board 4 also belongs to physical crosslinking, therefore this process has invertibity.Work as circuit board module
It was found that the method that heating can be directly used returns bonding circuit board module when quality problems and production process defect
Work processing, process of rework will not generate the damage of any element and wiring board, therefore rework cost can significantly reduce.
Solid-state can be disposably completed during Reflow Soldering using this composite type heat blow state bonding film to be bonded
Film softening, melts, infiltration, and bonding and fixed effect, it does not need any additional investment, therefore can effectively improve
Production capacity is produced, reduces personnel, the consumption of equipment and place resource reduces technical process and greatly reduces caused by product does over again
Material scrap, especially apply more in surface mount elements, circuit board module size is small, cabling is intensive and the collection number of plies is more or cost compared with
Manufacturing cost can greatly be reduced in high electronic product production process.
Further particularly, it is polyester, polyurethane, polyimides, rubber etc. that solid-state bonding film 3, which is thermoplastic material,
Thermoplastic material.The softening temperature that solid-state is bonded film 3 is about 80-90 DEG C, and melting temperature is about 180-192 DEG C.
The material that solid-state is bonded film 3 is the thermoplastic polymer with higher hardness fusing point and intensity, thermosetting property polymerization
Object or its mixture, it includes one or more inorganic fillers, catalyst, chain extender and crosslinking agent, plasticizer, colorant, resistance
Fire the additive of the compositions such as agent or other auxiliary agents.It is resistant to acid, the chemical attacks such as alkali and oil plant have very high sheet resistance
Rate, material flowability is good when melted by heating.This material uses extrusion molding, rolls, and is cast, blow molding, the techniques such as impregnation or casting
Coating materials is made, its surface can be pressed into different decorative pattern or shape so as to Nian Jie with subsequent needs and solid in process of production
Fixed printed wiring board or electronic component forms good cooperation.
Particularly, solid-state bonding film 3 is no tack solid-state bonding film 3, will be without tack solid-state bonded adhesives
Before piece 3 mounts on sandwich circuit board 1 on earth, 3 bottom silk-screen of film one to two are bonded for temporarily viscous in no tack solid-state
Connect the tin point of solid-state bonding film.Specifically, the shape without tack solid-state bonding film 3 should be without tack solid-state bonded adhesives
Flake products need to consider that solid-state bonding film bottom is temporarily bonded the tin point position of solid-state bonding film in application, it can be by
It is placed on the pad 5 of any cabling or ground line or ground wire.
Further particularly, tin point be diameter 0.2-0.3mm circle or side length 0.2-0.3mm it is rectangular.It can be to prevent
Since the high-speed motion of machine makes solid-state bonded adhesives when the solid-state bonding film assist side only mounted mounts other electronic components 6
Piece 3 generates offset or rotation, to cause the attachment of subsequent element bad and welding defect.
Further particularly, tin point is formed by tin cream 2, tin cream 2 be by solder powder, scaling powder and surfactant,
Thixotropic agent is mixed, the paste mixture of formation.It is mainly used for SMT (surface mounting technology Surface Mount
Technology) the welding of the electronic components such as industry PCB surface resistance, capacitor, integrated circuit and route template die group.?
According to different products in production, the printed wiring board of component has been mounted using the heating of specific reflux temperature curve,
Tin cream 2 is melted, solder joint is formed between component and printed circuit board after alloying component cooled and solidified and realizes metallurgy even
The technology connect.Solder(ing) paste 2 has certain viscosity at normal temperature, and it is just viscous solid-state solid-state can be bonded other electronic components of film machine
It,, will be by weldering component and printed circuit pad with the volatilization of solvent and portions additive under welding temperature in commitment positions
5 be welded together to form it is permanently connected.
Further particularly, solid-state bonding film 3 is packaged in braid, by full-automatic chip mounter together with electronic component
It is mounted on the position that printed wiring board needs to enhance Joint Strength.This position is typically disposed in the fringe region or needs of wiring board
The solder joint peripheral position of reinforcement, thus the adhesive strength of enhancement line plate module edge to greatest extent.
Particularly, in reflow soldering, reflow soldering temperature curve, average heating speed is lower than 3 DEG C per second, 150-200
DEG C soaking time be 60-180s, soaking time greater than 217 DEG C is 60-150s, 245-250 DEG C of peak temperature, cooling zone drop
Warm rate is lower than 6 DEG C per second, from 25 DEG C to the peak temperature time lower than 480s.Using above-mentioned temperature curve, it is ensured that patch
Chip solid-state, which is bonded film 3, to realize melting and impregnation process well in assist side welding process.
In addition, wiring underlayer plate 1 can be rigid circuit board or flexible circuit board, it is the base of electronic component electric appliance connection
Plinth material, wiring board have the conductive welding disk of conductive trace and exposing on the surface.PCB surface, which prints one layer, has insulation
And the anti-solder ink of welding resistance performance is to avoid between route and route, the solder shorts between route and element, between pcb layer
The insulating properties of route and each interlayer is kept with dielectric layer.It needs when the route of two layers or more the number of plies being needed to be connected each other in phase
The position production via hole answered.
Flexible circuit board 4 is that have height reliability using polyimides or polyester film as one kind made of substrate, excellent
Flexible printed circuit.Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.In Current electronic product
It is miniaturized, is widely applied in the design and production of miniaturization.Wiring board has conductive trace and exposing on the surface
Conductive welding disk.
PCB surface has the insulating layer of insulation and welding resistance performance, to avoid between route and route, route and element
Between solder shorts, the insulating properties of route and each interlayer is kept between pcb layer with dielectric layer.Need two layers or with upper layer
It needs to make via hole in corresponding position when several routes is connected each other.
The concrete operations of this method are：
Firstly the need of the attachment for the silk-screen and electronic component for carrying out tin cream 2 in wiring underlayer plate 1, while consolidating what can be mounted
For the attachment of state bonded adhesives to the corresponding position on wiring board bottom plate, this position is typically disposed in the fringe region of wiring board, can also be with
The solder joint enhanced against needs.
Diameter of the solid-state bonding film 3 of no tack using 1 to 2 silk-screens in solid-state bonding film bottom arrives for 0.2
0.3 millimeter of round or rectangular tin point carries out temporary fixation to it, and mounted solid-state can be prevented to be bonded film assist side
High-speed motion when mounting other electronic components 6 due to machine makes solid-state bonding film generate offset or rotation, thus after causing
The attachment of continuous element is bad and welding defect.
When mounting solid-state bonding film 3, then flexible circuit board 4 placed with hand or using machine attachment to having mounted
On the wiring underlayer plate 1 of electronic component and blob of viscose, then two pieces of wiring boards are closely pressed using dedicated jig, will finally be carried
There is the jig of wiring board to be put into reflow soldering and carries out reflow soldering.
Blob of viscose first softens in reflow soldering production process, then melts, during melting with printed wiring board and
The surface infiltration and sufficiently capillary percolation of solder joint are into the gap between two pieces of wiring boards, and final online road plate is by Reflow Soldering
Solidify when cooled region and two pieces of wiring boards closely bond together, this bonding effect enhances the weldering of circuit board module
Reliability is connect, even if solder joint is smaller or components welding region is limited, but due to having used these bonding solid-state bonding films, so that
The intensity of solder joint has obtained effective raising and can resist circuit board module in subsequent assembling process after circuit board module welding
In suffered extra-stress.
Since the size of solid-state bonding film is to need the area size being bonded according to printed wiring board and design,
When solid-state bonding film melting, after infiltrating and cooling and solidifying, the excessive glue situation other than bonding region will not be generated, therefore can be complete
The influence that complete solution is determined to the subsequent assembling procedure of circuit board module reduces production cost to effectively raise production efficiency.
Power management plate of this application for lithium battery in current various consumer electronics products, camera mould group and other kinds of
The components welding of rigid plate and flexible board or flexible board and flexible board is widely used meaning.
Circuit pads 5 are that outer metal surface is exposed in printed wiring board production process, to silk-screen tin cream.It
With inside wiring board conducting wire or via hole be connected, weld together in solder reflow process with the surface mount elements of PCB surface
Forming circuit is to complete complicated circuit function.5 surface of pad can carry out it is tin plating, it is gold-plated and it is chemical it is anti-oxidation processing to enhance
The solderability of wiring board.
Other electronic components 6 refer to resistance, capacitor, diode, connector, and the elements such as chip are welded on printed wire
Plate surface is connected to form complicated logic circuit by cabling inside pad 5 and wiring board, independent electricity can be completed after energization
Subfunction.
Embodiment two
As shown in fig. 4-5, it is in place of the present embodiment and the difference of embodiment one, the solid-state bonded adhesives in the present embodiment
Piece 3 is the solid-state bonding film condensation material of tack, can not be limited by the printed wire cabling of wiring underlayer plate 1, can be by
It is mounted on any one position of PCB surface.When wiring underlayer plate 1 mounts other electronic components 6 due to the high speed of machine
When movement, any displacement and deviation will not be generated.
Correspondingly, also just without mounting silk-screen on wiring underlayer plate 1.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
In addition, term " first ", " second ", " third " are used for description purposes only, it is not understood to indicate or imply phase
To importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, those skilled in the art should understand that：Its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement, such as：
(1) in embodiment one, it is that solid-state bonding film 3 is alternatively provided at against the solder joint for needing to enhance, actually may be used
To select to need to enhance the solder joint of weld strength far from these.
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution
Range.
Claims (10)
1. enhancing the method for printed wiring board rigid-flex combined strength, which is characterized in that solid-state bonding film is mounted on bottom
On wiring board, then by flexible circuit board placement or mount to the wiring underlayer for having mounted electronic component and solid-state bonding film
On plate, then the flexible circuit board and the wiring underlayer plate are pressed using jig, the jig for being loaded with wiring board is put into
Reflow soldering carries out reflow soldering.
2. the method for enhancing printed wiring board rigid-flex combined strength according to claim 1, which is characterized in that described solid
State is bonded film and is bonded film for no tack solid-state, mounts by the no tack solid-state bonding film to the bottom line
Before on the plate of road, film is bonded for being temporarily bonded solid-state in no tack solid-state bonding film bottom silk-screen one to two
Tin point.
3. the method for enhancing printed wiring board rigid-flex combined strength according to claim 2, which is characterized in that the tin
The shape of point is round or rectangular.
4. the method for enhancing printed wiring board rigid-flex combined strength according to claim 3, which is characterized in that the tin
Point be diameter 0.2-0.3mm circle or side length 0.2-0.3mm it is rectangular.
5. the method for enhancing printed wiring board rigid-flex combined strength according to claim 1, which is characterized in that described solid
It is thermoplastic material that state, which is bonded film,.
6. the method for enhancing printed wiring board rigid-flex combined strength according to claim 5, which is characterized in that the heat
Plastic material is one of polyester, polyurethane, polyimides, rubber.
7. the method for enhancing printed wiring board rigid-flex combined strength according to claim 5, which is characterized in that described solid
The softening temperature that state is bonded film is 80-90 DEG C, and melting temperature is 180-192 DEG C.
8. according to the method for enhancing printed wiring board rigid-flex combined strength described in claim 5 or 6 or 7, which is characterized in that
The solid-state bonding film is packaged in braid, is mounted on printed wiring board needs by full-automatic chip mounter together with electronic component
Enhance the position of Joint Strength.
9. the method for enhancing printed wiring board rigid-flex combined strength, feature according to any one of claim 2-4
It is, the tin point is formed by tin cream, and the tin cream is mixed by solder powder, scaling powder and surfactant, thixotropic agent
It closes, the paste mixture of formation.
10. the method for enhancing printed wiring board rigid-flex combined strength described in any one of -7 according to claim 1, feature
It is, in reflow soldering, reflow soldering temperature curve, average heating speed is lower than 3 DEG C per second, 150-200 DEG C of soaking time
For 60-180s, the soaking time greater than 217 DEG C is 60-150s, and 245-250 DEG C of peak temperature, cooling zone rate of temperature fall is lower than every
6 DEG C of the second, from 25 DEG C to the peak temperature time lower than 480s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810783553.7A CN108901144A (en) | 2018-07-17 | 2018-07-17 | Enhance the method for printed wiring board rigid-flex combined strength |
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| CN201810783553.7A CN108901144A (en) | 2018-07-17 | 2018-07-17 | Enhance the method for printed wiring board rigid-flex combined strength |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111246683A (en) * | 2020-02-21 | 2020-06-05 | 佳格科技(浙江)股份有限公司 | Circuit board welding process |
| CN113438826A (en) * | 2021-06-29 | 2021-09-24 | 荣成歌尔微电子有限公司 | Underfill packaging method and device |
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| TW200503222A (en) * | 2003-03-28 | 2005-01-16 | Motorola Inc | Flip-chip assembly with thin underfill and thick solder mask |
| CN101116383A (en) * | 2005-02-03 | 2008-01-30 | 3M创新有限公司 | Method for connecting printed circuit board |
| CN101233608A (en) * | 2005-08-04 | 2008-07-30 | 日立化成工业株式会社 | Process for producing junction structure |
| CN101347052A (en) * | 2006-08-07 | 2009-01-14 | 日本亚比欧尼克斯股份有限公司 | Method and apparatus for connecting printed wiring boards |
| CN103160237A (en) * | 2011-12-16 | 2013-06-19 | 日立化成工业株式会社 | Adhesive composition, film-like adhesive, adhesive sheet and connection structure |
| CN202488885U (en) * | 2012-03-05 | 2012-10-10 | 杭州九和电子有限公司 | Printed circuit board (PCB) welded by surface mounting technology (SMT) |
| CN105792516A (en) * | 2016-02-25 | 2016-07-20 | 广东欧珀移动通信有限公司 | Flexible-rigid circuit board and mobile terminal |
| CN205953916U (en) * | 2016-08-25 | 2017-02-15 | 天津瑞科美和激光工业有限公司 | Hot melt film with tie coat |
| CN106686905A (en) * | 2016-12-26 | 2017-05-17 | 苏州维信电子有限公司 | Surface mount technology for sheet components |
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| CN111246683A (en) * | 2020-02-21 | 2020-06-05 | 佳格科技(浙江)股份有限公司 | Circuit board welding process |
| CN113438826A (en) * | 2021-06-29 | 2021-09-24 | 荣成歌尔微电子有限公司 | Underfill packaging method and device |
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