CN111246683A - Circuit board welding process - Google Patents
Circuit board welding process Download PDFInfo
- Publication number
- CN111246683A CN111246683A CN202010107679.XA CN202010107679A CN111246683A CN 111246683 A CN111246683 A CN 111246683A CN 202010107679 A CN202010107679 A CN 202010107679A CN 111246683 A CN111246683 A CN 111246683A
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- CN
- China
- Prior art keywords
- circuit board
- fpc
- pcb
- printed circuit
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000003466 welding Methods 0.000 title claims abstract description 39
- 230000008569 process Effects 0.000 title claims abstract description 34
- 238000003825 pressing Methods 0.000 claims abstract description 45
- 238000005476 soldering Methods 0.000 claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 239000002390 adhesive tape Substances 0.000 claims abstract description 6
- 230000007246 mechanism Effects 0.000 claims description 58
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 17
- 238000003475 lamination Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- UFNIBRDIUNVOMX-UHFFFAOYSA-N 2,4'-dichlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1Cl UFNIBRDIUNVOMX-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
Abstract
The invention discloses a circuit board welding process, which comprises the following steps: step S1, arranging gum on the flexible printed circuit board FPC, and bonding the flexible printed circuit board FPC and the corresponding printed circuit board PCB together through the arranged gum; s2, pressing the flexible printed circuit board FPC, and extruding moisture or/and air bubbles between the flexible printed circuit board FPC and the printed circuit board PCB; and step S3, attaching the FPC on the carrier by adopting a single-sided high-temperature adhesive tape, and then carrying out solder paste printing, surface mounting and reflow soldering on the FPC and the PCB. The circuit board welding process provided by the invention has the advantage that the FPC pasting process is added before PCB pasting, so that the production efficiency can be improved. The invention can improve the rate of finished products at one time; the invention can reduce the requirement on the planeness of the FPC, is uniformly heated, and can lead solder paste to well climb through the holes of the FPC.
Description
Technical Field
The invention belongs to the technical field of circuit board welding, relates to a circuit board welding process, and particularly relates to a welding process for combining an FPC (flexible printed circuit) with a PCB (printed circuit board).
Background
At present, the welding process of FPC and PCB is generally a Hot bar process, namely pulse heating reflow welding. Briefly, the process involves heating two pre-fluxed, tin-plated parts to a temperature sufficient to melt the solder (lead-free solder melting point; 217 deg.C), and after cooling to solidify, the two parts form a permanent electromechanical bond with the solidified solder. By loading a certain pulse voltage on the hot pressing head, the high-impedance hot pressing head is heated by using low-voltage large current, the contact position of the PCB and the FPC or an object is heated, and after the temperature is raised to the melting point of soldering tin, the two objects in contact with the PCB are welded together.
The prior art has the following defects:
firstly, when a Hot bar process is used for welding a soft and hard plate, the requirement on the flatness of a welding head is extremely high, and if the welding head is uneven, the welding head cannot be welded. The welding head is uneven more frequently; such as: (1) the tool is uneven, impurities on the workbench influence the parallelism, and the phenomenon of tin non-melting is easy to occur; (2) when the welding head is pressurized, the bonding flatness of the welding head and a product to be welded is not enough. When a welding head cylinder of the pulse hot press presses downwards, the force applied to each point of a supporting part is unbalanced due to reasons such as unreasonable design of a bottom tooling fixture, and the like, so that the welding head (electrode) cannot be completely attached to a welding product; (3) the welding head electrode is not smooth enough, and the A welding head is not smooth enough when being processed. The welding head (electrode) has long service time and is oxidized to cause unevenness.
Secondly, impurities on the surface of the welding head (electrode) cause poor and uneven heat transfer. Because the tin has the rosin soldering flux, impurities are attached to the electrode of the welding head after the welding time of the electrode of the welding head is long, so that heat cannot be transferred to a welded product, the welding heat is insufficient, and poor welding is caused; frequent cleaning of the horn electrodes is required.
Thirdly, the unreasonable electrode design causes poor tin climbing during welding and insufficient tension.
The welding end face of the welding head usually used in welding is completely flat. Certain pressure needs to be applied during welding, and tin cannot well climb through the hole of the FPC.
Fourthly, the process is complicated, the working procedures are increased, and the cost is increased.
In view of the above, there is a need to design a new circuit board soldering method to overcome the above-mentioned defects of the existing soldering method.
Disclosure of Invention
The invention provides a circuit board welding process which can improve the production efficiency, improve the one-time yield and reduce the cost.
In order to solve the technical problem, according to one aspect of the present invention, the following technical solutions are adopted:
a circuit board soldering process, comprising:
step S1, arranging gum on the flexible printed circuit board FPC, and bonding the flexible printed circuit board FPC and the corresponding printed circuit board PCB together through the arranged gum;
s2, pressing the flexible printed circuit board FPC, and extruding moisture or/and air bubbles between the flexible printed circuit board FPC and the printed circuit board PCB; and
and step S3, attaching the FPC on the carrier by adopting a single-sided high-temperature adhesive tape, and then carrying out solder paste printing, surface mounting and reflow soldering on the FPC and the PCB.
As an embodiment of the present invention, the circuit board soldering process further includes a step S4 of checking whether the FPC and PCB bonding pads of the flexible circuit board meet the set requirements.
In step S3, as an embodiment of the present invention, the flexible printed circuit FPC is vertically attached to the carrier by using a single-sided high-temperature adhesive tape.
As an embodiment of the present invention, the step S1 includes:
step S11, horizontally placing the positioning device on an electrostatic table; placing the PCB on a positioning device and aligning;
step S12, pasting the FPC on the PCB in an alignment way;
and step S13, orderly stacking the pasted PCB to the operation completion area.
As an embodiment of the present invention, the step S2 includes:
step S21, arranging the pressing device on the electrostatic table;
step S22, placing each PCB at a set position of the laminating device;
and step S23, pressing a pressing button of the pressing device, and controlling the pressing block mechanism to press the corresponding flexible circuit board FPC and the printed circuit board PCB.
As an embodiment of the present invention, the step S2 further includes:
step S24, after the pressing is automatically completed, taking the printed circuit board PCB upwards away from the pressing jig and checking whether the FPC and the PCB are tightly attached;
s25, orderly stacking the pressed PCB in an operation completion area to wait for tin printing of the carrier; and after lamination, the carrier is timely loaded with tin for tin printing, and the re-lamination without tin printing is carried out after the set time is exceeded.
In step S25, the stacked plates are pressed together by less than ten full plates each time.
As an embodiment of the present invention, the laminating device includes: the device comprises a placing platform, a pressing block mechanism, a pressing block lifting driving mechanism and a lifting control mechanism; the pressing block mechanism is arranged above the placing platform; the pressing block lifting driving mechanism is connected with the pressing block mechanism and can drive the pressing block mechanism to lift; the lifting control mechanism is connected with the pressing block lifting driving mechanism and can send a control signal to the pressing block lifting driving mechanism; the placing platform is provided with a plurality of positioning mechanisms for placing the corresponding flexible circuit boards on the corresponding positioning mechanisms; the pressing block mechanism is provided with a plurality of groove bodies, and each groove body is arranged right above the corresponding positioning mechanism; each slot body can accommodate a partial area or the whole area of the corresponding flexible circuit board.
The invention has the beneficial effects that: the circuit board welding process provided by the invention has the advantage that the FPC pasting process is added before PCB pasting, so that the production efficiency can be improved. The invention can improve the rate of finished products at one time; the invention can reduce the requirement on the FPC flatness (lower than the Hot bar process), is uniformly heated, and can well climb tin through the holes of the FPC by the tin paste. In addition, the method can reduce the cost.
Drawings
Fig. 1 is a flow chart of a circuit board soldering process according to an embodiment of the invention.
Fig. 2 is a schematic structural diagram of a pressing device used in the method of the present invention according to an embodiment of the present invention.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
For a further understanding of the invention, reference will now be made to the preferred embodiments of the invention by way of example, and it is to be understood that the description is intended to further illustrate features and advantages of the invention, and not to limit the scope of the claims.
The description in this section is for several exemplary embodiments only, and the present invention is not limited only to the scope of the embodiments described. It is within the scope of the present disclosure and protection that the same or similar prior art means and some features of the embodiments may be interchanged.
The invention discloses a circuit board welding process, and fig. 1 is a flow chart of the circuit board welding process in one embodiment of the invention; referring to fig. 1, in an embodiment of the present invention, the circuit board soldering process includes:
step S1, arranging a back adhesive on the flexible printed circuit board FPC, and bonding the flexible printed circuit board FPC and the corresponding printed circuit board PCB together through the arranged back adhesive;
(S2) pressing the flexible printed circuit board (FPC), and extruding moisture or/and bubbles between the flexible printed circuit board (FPC) and the Printed Circuit Board (PCB); and
step S3, the flexible printed circuit board FPC is attached to the carrier by using a single-sided high-temperature adhesive tape, and then solder paste printing, mounting and reflow soldering are performed on the flexible printed circuit board FPC and the printed circuit board PCB.
In an embodiment of the present invention, the circuit board soldering process further includes step S4, checking whether the flexible circuit board FPC and the printed circuit board PCB bonding pad meet the set requirements.
In an embodiment of the present invention, the step S1 includes:
step S11, horizontally placing the positioning jig on an electrostatic table;
s12, placing the PCB on a positioning jig and aligning;
s13, taking the FPC of the flexible circuit board and slightly tearing off the release paper;
step S14, folding the middle of the FPC slightly;
step S15, pasting the FPC on the PCB in an alignment way and lightly pressing and fixing the FPC by fingers;
step S16, repeating the steps S13 to S15, and attaching the connecting plates in sequence;
s17, pressing the middle and two ends to make the FPC tightly attach to the PCB;
and step S18, orderly stacking the pasted PCB to the operation completion area.
FIG. 2 is a schematic structural diagram of a pressing device used in the method of the present invention according to an embodiment of the present invention; referring to fig. 2, in an embodiment of the present invention, the step S2 includes:
step S21, the flexible circuit board FPC 9 (the flexible circuit board FPC 9 is disposed on the printed circuit board PCB8 through the adhesive) pressing device is mounted on the electrostatic table.
As shown in fig. 2, in an embodiment, the pressing device includes: the device comprises a placing platform 1, a briquetting mechanism 3, a briquetting lifting driving mechanism 5 and a lifting control device 7. The briquetting mechanism 3 is arranged above the placing platform 1; the briquetting lifting driving mechanism 5 is connected with the briquetting mechanism 3 and can drive the briquetting mechanism 3 to lift; the lifting control device 7 is connected with the briquetting lifting driving mechanism 5 and can send control signals to the briquetting lifting driving mechanism 5. The placing platform 1 is provided with a plurality of positioning mechanisms 11 for placing the corresponding flexible circuit boards 9 on the corresponding positioning mechanisms 11; the briquetting mechanism 3 is provided with a plurality of groove bodies 31, and each groove body 31 is arranged right above the corresponding positioning mechanism 11; each slot 31 can accommodate a partial area or the entire area of the corresponding flexible circuit board 9.
In an embodiment of the invention, the positioning mechanism 11 is a positioning hole, and the positioning mechanism 11 may be disposed on one side of the placing platform. The positioning mechanisms 11 may be arranged neatly on the placement platform. In addition, the width of the slot 31 corresponds to the width of the flexible circuit board 9; alternatively, the width of the slot may be slightly wider than the width of the flexible circuit board 9. In one embodiment, the flexible circuit board 9 is attached to a printed circuit board PCB8 and then together receives the compression of the compression fitting.
In an embodiment, the briquetting lifting driving mechanism 5 may include a driving motor and a transmission mechanism, and the driving motor is connected to the briquetting mechanism through the transmission mechanism and can drive the briquetting mechanism to lift. Or, the briquetting lifting driving mechanism 5 comprises an air cylinder, and the air cylinder is connected with the briquetting mechanism. Or, the briquetting lifting driving mechanism 5 comprises a hydraulic cylinder, and the hydraulic cylinder is connected with the briquetting mechanism.
Step S22, placing the PCB8 on the placing platform 1, and carrying out alignment according to the position of the positioning mechanism 11;
step S23, pressing the press button of the lift control device 7 to perform press; the lower part of the pressing block mechanism 3 is provided with a groove body 31, and the placing platform 1 is provided with a plurality of positioning mechanisms 11 (which can be positioning holes); the groove body 31 of the pressing block mechanism 3 can be pressed corresponding to the positioning hole, so that the corresponding printed circuit board PCB8 is tightly attached to the flexible circuit board FPC 9;
step S24, after the stitching is automatically completed, taking the printed circuit board PCB8 upwards away from the stitching jig and checking whether the flexible circuit board FPC 9 is tightly attached to the printed circuit board PCB 8;
step S25, orderly stacking the pressed PCBs 8 in the operation-completed area for solder printing (in one embodiment, each time the stacked PCB is pressed, the number of the stacked PCBs is less than ten whole PCBs); and after lamination, the carrier is timely loaded with tin for tin printing, and the non-tin-printed part needs to be laminated again after more than 30 minutes. After the steps S21 and S22, substantially no air bubbles are ensured between the FPC and the PCB.
In summary, the circuit board welding process provided by the invention adds the FPC pasting process before PCB pasting, so that the production efficiency can be improved. The invention can improve the rate of finished products at one time; the invention can reduce the requirement on the planeness of the FPC, is uniformly heated, and can lead solder paste to well climb through the holes of the FPC. In addition, the method can reduce the cost.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The description and applications of the invention herein are illustrative and are not intended to limit the scope of the invention to the embodiments described above. Variations and modifications of the embodiments disclosed herein are possible, and alternative and equivalent various components of the embodiments will be apparent to those skilled in the art. It will be clear to those skilled in the art that the present invention may be embodied in other forms, structures, arrangements, proportions, and with other components, materials, and parts, without departing from the spirit or essential characteristics thereof. Other variations and modifications of the embodiments disclosed herein may be made without departing from the scope and spirit of the invention.
Claims (8)
1. A circuit board soldering process, comprising:
step S1, arranging gum on the flexible printed circuit board FPC, and bonding the flexible printed circuit board FPC and the corresponding printed circuit board PCB together through the arranged gum;
s2, pressing the flexible printed circuit board FPC, and extruding moisture or/and air bubbles between the flexible printed circuit board FPC and the printed circuit board PCB; and
and step S3, attaching the FPC on the carrier by adopting a single-sided high-temperature adhesive tape, and then carrying out solder paste printing, surface mounting and reflow soldering on the FPC and the PCB.
2. The circuit board soldering process according to claim 1, wherein:
the circuit board welding process further comprises the step S4 of checking whether the FPC and PCB combined patch of the flexible circuit board meets the set requirement.
3. The circuit board soldering process according to claim 1, wherein:
in step S3, a single-sided high-temperature adhesive tape is used to vertically attach the flexible printed circuit FPC to the carrier.
4. The circuit board soldering process according to claim 1, wherein:
the step S1 includes:
step S11, horizontally placing the positioning device on an electrostatic table; placing the PCB on a positioning device and aligning;
step S12, pasting the FPC on the PCB in an alignment way;
and step S13, orderly stacking the pasted PCB to the operation completion area.
5. The circuit board soldering process according to claim 1, wherein:
the step S2 includes:
step S21, arranging the pressing device on the electrostatic table;
step S22, placing each PCB at a set position of the laminating device;
and step S23, pressing a pressing button of the pressing device, and controlling the pressing block mechanism to press the corresponding flexible circuit board FPC and the printed circuit board PCB.
6. The circuit board soldering process according to claim 5, wherein:
the step S2 further includes:
step S24, after the pressing is automatically completed, taking the printed circuit board PCB upwards away from the pressing jig and checking whether the FPC and the PCB are tightly attached;
s25, orderly stacking the pressed PCB in an operation completion area to wait for tin printing of the carrier; and after lamination, the carrier is timely loaded with tin for tin printing, and the re-lamination without tin printing is carried out after the set time is exceeded.
7. The circuit board soldering process according to claim 6, wherein:
in step S25, the stacked plates are pressed together no more than ten full plates at a time.
8. The circuit board soldering process according to claim 5, wherein:
the press-fit device includes: the device comprises a placing platform, a pressing block mechanism, a pressing block lifting driving mechanism and a lifting control mechanism;
the pressing block mechanism is arranged above the placing platform; the pressing block lifting driving mechanism is connected with the pressing block mechanism and can drive the pressing block mechanism to lift; the lifting control mechanism is connected with the pressing block lifting driving mechanism and can send a control signal to the pressing block lifting driving mechanism;
the placing platform is provided with a plurality of positioning mechanisms for placing the corresponding flexible circuit boards on the corresponding positioning mechanisms; the pressing block mechanism is provided with a plurality of groove bodies, and each groove body is arranged right above the corresponding positioning mechanism; each slot body can accommodate a partial area or the whole area of the corresponding flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010107679.XA CN111246683A (en) | 2020-02-21 | 2020-02-21 | Circuit board welding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010107679.XA CN111246683A (en) | 2020-02-21 | 2020-02-21 | Circuit board welding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111246683A true CN111246683A (en) | 2020-06-05 |
Family
ID=70874994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010107679.XA Pending CN111246683A (en) | 2020-02-21 | 2020-02-21 | Circuit board welding process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111246683A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001244623A (en) * | 2000-03-02 | 2001-09-07 | Sharp Corp | Method for connecting circuit board to flexible printed board and screen mask used therefor |
| CN105472905A (en) * | 2015-12-17 | 2016-04-06 | 昆山圆裕电子科技有限公司 | Magnetic fixture and FPC non-reinforced support electronic assembly welding process applying magnetic fixture |
| CN207150975U (en) * | 2017-09-14 | 2018-03-27 | 苏州易德龙科技股份有限公司 | A kind of Reflow Soldering welding fixture for antenna phasing unit FPC |
| CN207531171U (en) * | 2017-11-01 | 2018-06-22 | 江苏省德懿翔宇光电科技有限公司 | A kind of flexible PCB welding structure |
| CN108901144A (en) * | 2018-07-17 | 2018-11-27 | 天津瑞爱恩科技有限公司 | Enhance the method for printed wiring board rigid-flex combined strength |
-
2020
- 2020-02-21 CN CN202010107679.XA patent/CN111246683A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001244623A (en) * | 2000-03-02 | 2001-09-07 | Sharp Corp | Method for connecting circuit board to flexible printed board and screen mask used therefor |
| CN105472905A (en) * | 2015-12-17 | 2016-04-06 | 昆山圆裕电子科技有限公司 | Magnetic fixture and FPC non-reinforced support electronic assembly welding process applying magnetic fixture |
| CN207150975U (en) * | 2017-09-14 | 2018-03-27 | 苏州易德龙科技股份有限公司 | A kind of Reflow Soldering welding fixture for antenna phasing unit FPC |
| CN207531171U (en) * | 2017-11-01 | 2018-06-22 | 江苏省德懿翔宇光电科技有限公司 | A kind of flexible PCB welding structure |
| CN108901144A (en) * | 2018-07-17 | 2018-11-27 | 天津瑞爱恩科技有限公司 | Enhance the method for printed wiring board rigid-flex combined strength |
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Application publication date: 20200605 |