JPH05341303A - Bonding device - Google Patents

Abstract

PURPOSE:To provide the bonding device which can bond TAB parts an a glass substrate with good accuracy with decreased failures. CONSTITUTION:This bonding device has a press welding block 18 which presses the TAB parts 2 to the wiring patterns of the glass substrate 1 via an anisotropic conductive film and heats these parts, a cylinder 17 for a low pressure which pressurizes this press welding block 18 always with a prescribed bonding pressure P and a cylinder 14 for a high pressure which can vertically drive this cylinder 17 for the low pressure with the pressure F higher than the bonding pressure P.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for mounting a liquid crystal driving IC, which is a TAB component, on a liquid crystal glass substrate via an anisotropic conductive film.

[0002]

2. Description of the Related Art In a manufacturing process of a liquid crystal panel, as shown in FIG. 5, a liquid crystal driving IC 2 (hereinafter referred to as "IC") is mounted around a liquid crystal glass substrate 1 (hereinafter referred to as "glass substrate"). .. Generally, the liquid crystal driving IC is TAB
This is a (Tape Automated Bonding) component, and mounting is to connect the lead protruding from the film carrier of the IC 2 and the wiring pattern of the liquid crystal glass substrate 1.

As this connection method, a method of bonding using an anisotropic conductive film (anisotropic conductive adhesive) is widely adopted. The anisotropic conductive film is roughly classified into a thermosetting type and a thermoplastic type depending on its characteristics. In both cases, the lead of the IC 2 and the glass substrate 1 are interposed via the anisotropic conductive film.
The wiring pattern is positioned and temporarily fixed, and then, as shown in FIG. 6, the lead is pressed against the wiring pattern using a crimping block 3 and heated to join the two. is there.

Conventionally, the crimping block 3 employs either a constant heat method (constant heating method) or a pulse heat method (instantaneous heating method). The pressure-bonding block 3 is vertically driven by an air cylinder 4, and the IC 2 is bonded to the glass substrate 1 by pressing the IC 2 against the glass substrate 1 with a predetermined bonding pressure P.

[0005]

By the way, the conventional bonding apparatus has the following drawbacks.

That is, first, when the IC 2 is pressure-bonded to the glass substrate 1 via the anisotropic conductive film, the carrier tape of the IC 2 is expanded by heating by the pressure-bonding block 3, and the pre-aligned glass is used. Positional deviation occurs between the wiring pattern of the substrate 1 and the lead of the IC 2, and secondly, it is difficult to maintain the accuracy such as parallelism and flatness of the pressing surface of the crimping block 3. Is to be.

When the pulse heat method is adopted as the heating method for the pressure-bonding block 3, it is possible to suppress the elongation of the film carrier by starting the electric heating after the completion of the pressurization. However, in the pulse heat method, there is a limit in the length (size) of the pressing surface of the crimping block 3 that can obtain uniform temperature distribution, strength, and accuracy due to its nature. Therefore, the liquid crystal driving IC 2 which is a relatively large TAB component
Is not suitable for bonding. Further, since the life of the pulse heat type pressure-bonding block 3 is short, there is a drawback that maintenance costs are high. On the other hand, when the constant heat method is adopted, it has higher rigidity and longer life than the pulse heat method.

However, as shown in FIG. 6, in an apparatus equipped with one pressure-bonding block 3 containing a heater and one air cylinder 4 for vertically driving the pressure-bonding block 3, the film carrier before pressurization is completed. Crimping block 3 to suppress elongation
There is no way but to set the descending speed of. However, if the lowering speed of the crimping block 3 is set earlier, the impact when the crimping block 3 comes into contact with the IC 2 is large, and the IC 2 and the glass substrate 1 may be damaged.

On the other hand, when a high pressure cylinder for generating a pressure higher than the bonding pressure is used as the air cylinder 4, the lead can be pressed strongly from the initial state, but the pressure is higher than the bonding pressure P. Therefore, there is a problem that the IC 2 and the glass substrate 1 are damaged.

Further, as shown in FIG. 6, in the case of manufacturing a liquid crystal panel having a relatively short side, it is possible to collectively bond using one crimp block 3, but a large IC.
When manufacturing a relatively large liquid crystal panel including 2 ..., Similar to the pulse heat type, there is a problem in accuracy.

Therefore, in the case of bonding a large number of ICs 2, as shown in FIG. 7, the pressing surface of the pressure bonding block 3 is shortened and a plurality of ICs 2 are provided. However, as shown in FIG. 5, when the mounting intervals of the mounted ICs 2 are narrow, there is a problem that the adjacent crimping blocks 3 interfere with each other and the crimping block 3 is difficult to dispose.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a bonding apparatus which is less likely to damage a glass substrate or a TAB component and which can perform good bonding with high accuracy. It is a thing.

[0013]

The first means of the present invention is to provide a crimping block for bonding a TAB component to a wiring pattern of a substrate through a bonding material, and to hold the crimping block and to predetermine the crimping block. And a high-pressure cylinder capable of vertically driving the low-pressure cylinder at a pressure higher than the above-mentioned bonding pressure.

A second means is a bonding apparatus for bonding a plurality of TAB components to a substrate, the pressure bonding block having a pressing surface corresponding to the bonding width of at least one TAB component, the pressure bonding block and the substrate. And driving means for causing the pressing surface of the pressure-bonding block to sequentially face the unbonded TAB component by moving the and.

[0015]

According to such a structure, it is possible to provide a bonding apparatus that can perform good bonding with less damage to the electronic components and the crimping block.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. The same components as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted. First, the first embodiment will be described.

Reference numeral 9 in the figure denotes a mounting table. The mounting table 9 holds the liquid crystal glass substrate 1 on the upper surface of which a plurality of liquid crystal driving ICs 2 are temporarily fixed by anisotropic conductive films (5 shown in FIGS. 3 and 4) as a bonding material. .. The mounting table 9 is held by the XYθ drive means 10,
Pitch feed drive is performed in the direction indicated by the arrow (a) in the figure.

A column 11 of this bonding apparatus is erected on the side of the above-mentioned mounting table 9. A first drive source 12 is attached to one surface of the column 11 on the placement table 9 side. The first drive source 12 is
The casing 13, the first high-pressure air cylinder 14 (high-pressure cylinder) provided on the upper surface of the casing 13, and one surface of the casing 13 on the side of the mounting table 9 described above. The slider 15 is provided so as to be slidable and is vertically driven by the first air cylinder 14.

Further, the slider 15 has a holding plate portion 15a which projects substantially horizontally. The holding plate portion 15a has three low pressure second cylinders 17 ...
(Low-pressure cylinders) are fixed in parallel with their axes vertical. A drive shaft (not shown) of the second cylinder 17 extends below the holding plate portion 15a, and a crimp block 18 is provided on the drive shaft.

The crimping block 18 is of the constant heat type (constant heating type) and has a pressing surface 18a corresponding to the bonding width of one IC2. The crimp blocks 18 are provided so as to be separated from each other at an interval corresponding to the length of one IC 2. Next, the operation of this bonding apparatus will be described with reference to FIG. FIG. 3 is a schematic view showing a simplified relationship between the first and second cylinders 14 and 17 and the crimping block 18 of the above bonding apparatus.

That is, the first air cylinder 14 is fixed to the column 11, and the drive shaft 14a of the first air cylinder 14 has the second cylinder 17 attached thereto. Therefore, by operating the first air cylinder 14, the entire second cylinder 17 is vertically driven. A compression block 18 is provided on the drive shaft 17a of the second air cylinder 17.

The first cylinder 14 is connected to a high-pressure pump 20 via a closed center type four-port valve 19. The high-pressure pump 20 is the first cylinder 1
4 has a role of driving the drive shaft 14a at a maximum pressure F higher than the bonding pressure P.

The second cylinder 17 is connected to a low pressure pump 21 which drives a drive shaft 17a of the second cylinder 17 at a maximum pressure P (F> P), and a relief valve 22 is connected to this circuit. Has been done. This relief valve 22 is the second
It operates when the pressure in the cylinder 17 becomes P or more, and has a role of always keeping the pressure in the second cylinder 17 at P. Next, referring to FIG. 4, the first and second cylinders 1
The operations of Nos. 4 and 17 and the crimping block 18 will be described.

(A) is the same as the state shown in FIG. 2, which is the state before the operation. In this state, the 4-port valve 19 operates and the first air cylinder 14 operates, and the second cylinder 14 and the crimping block 18 are driven downward. At this time, the descending speed of the pressure bonding block 18 is set to a value that does not give an impact to the IC 2 or the glass substrate 1. At this time, the pressure inside the second cylinder 17 is already kept at P.

Then, as shown in (b), when the pressing surface 18a of the crimping block 18 comes into contact with the IC2,
The first cylinder 17 increases the pressing force. When the pressing force reaches P, the drive shaft 14a of the second cylinder 14 is driven in the compression direction, but the relief valve 2
Since the air is released from 2, the pressing force of the crimping block 18 does not rise above P.

As shown in (c) and (d), the first cylinder 17 is further lowered to drive the second air cylinder 14 downward. During this time, the above-mentioned relief valve 22
Is operated, the lead of the IC2 is pressed against the wiring pattern of the glass substrate 1 with pressure P through the anisotropic conductive film. As a result, the IC 2 is mounted on the glass substrate 1.

Then, the four-port valve 19 is switched,
The crimp block 18 is raised. And the above XY
The θ driving means 10 is operated to drive the mounting table 9 described above, and the glass substrate 1 is moved in the direction indicated by an arrow (a) in FIG.
The IC 2 is fed and driven by the IC pitch, and the unbonded IC 2 is positioned below the pressure-bonding block 18 so as to face it. Then, the pressure bonding block 18 is driven by the same operation as described above to bond the IC 2 to the glass substrate 1.

According to this structure, since the first cylinder 14 is a high pressure cylinder, the crimp block 1 is used.
Even if 8 is slowly lowered, the pressing force of the crimping block 18 instantly reaches a predetermined pressure P. Further, thereafter, since the pressure of the pressure-bonding block 17 is constantly maintained at P by the operation of the relief valve 19, the IC 2 is not pressed by the pressure of P or more.

As a result, since the pressing force can be instantly increased without giving a shock to the IC2, it is possible to effectively suppress the expansion of the TAB component due to heat. Further, since it is possible to prevent the IC2 from being impacted or pressed with a large pressure, the IC2 is less likely to be damaged.

On the other hand, in the above-mentioned bonding apparatus, since the ICs 2 arranged side by side in parallel are separately bonded in two times, the ICs 2 can be effectively and accurately used even when the interval between the ICs 2 is narrow. It is possible to bond. It should be noted that the present invention is not limited to the above-described embodiment, but can be variously modified without changing the gist of the invention. For example, in the above-mentioned one embodiment, three crimping blocks are provided in parallel, but when manufacturing a relatively small liquid crystal panel, one crimping block may be used.

Even in this case, as shown in FIG. 2, one crimping block 18 'includes the first and second cylinders 14 and 1.
7 and operates in the same manner as described above, and the ICs 2 ... Can be effectively bonded to the glass substrate 1.

Further, in the above-mentioned one embodiment, a device for bonding the IC 2 to the glass substrate 1 has been shown as a bonding device, but the present invention is not limited to this, and bonding for mounting a TAB component on an ordinary pudding wiring substrate. It may be a device.

Further, in the above-mentioned one embodiment, the lead of the TAB component (IC2) and the wiring pattern of the wiring substrate (glass substrate 1) are joined together through the anisotropic conductive film. However, the present invention is not limited to this, and a soldering material or the like may be used as the bonding material.

[0034]

As described above, according to the first structure of the bonding apparatus of the present invention, the wiring pattern of the substrate is formed by the TAB.
A crimping block for bonding components through a bonding material, a low pressure cylinder for holding the crimping block and pressurizing the crimping block at a predetermined bonding pressure or less,
This low pressure cylinder is provided with a high pressure cylinder that can be driven up and down at a pressure higher than the bonding pressure.

According to the first structure, the displacement of the TAB component due to the expansion of the tape can be prevented without damaging the TAB component or the substrate, so that the bonding can be performed more accurately. ..

The second structure is that a plurality of TABs are formed on the substrate.
A bonding apparatus for bonding components, comprising: a crimping block having a pressing surface corresponding to a bonding width of at least one TAB component; and the crimping block and the substrate are moved relative to each other so that the pressing surface of the crimping block is And a drive means for sequentially facing the TAB components which have not been bonded yet. According to the second configuration, there is an effect that good bonding can be performed even when the arrangement interval of the TAB components to be bonded is narrow.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a main part of the present invention.

FIG. 2 is a perspective view of the same.

FIG. 3 is also a schematic diagram.

FIGS. 4A to 4D are process diagrams showing a bonding operation similarly.

FIG. 5 is a perspective view showing a general liquid crystal panel.

FIG. 6 is a perspective view showing a conventional example.

FIG. 7 is a perspective view of the same.

[Explanation of symbols]

1 ... Glass substrate (substrate), 2 ... Liquid crystal driving IC (TAB)
Parts), 5 ... Anisotropic conductive film (bonding material), 10 ... XYθ driving means (driving means), 14 ... First air cylinder (high pressure cylinder), 17 ... Second air cylinder (low pressure cylinder) , 18 ... Crimping block, 18a ... Pressing surface.

Claims (2)

[Claims] 1. A pressure-bonding block for bonding a TAB component to a wiring pattern of a substrate via a bonding material, a low-pressure cylinder for holding the pressure-bonding block and pressurizing the pressure-bonding block with a predetermined bonding pressure, and this low-pressure cylinder. And a high-pressure cylinder capable of vertically driving the working cylinder at a pressure higher than the above-mentioned bonding pressure. 2. A bonding apparatus for bonding a plurality of TAB components to a substrate, wherein at least one T
A crimping block having a pressing surface corresponding to the joining width of the AB component, and a driving means for moving the crimping block and the substrate relative to each other so that the pressing surface of the crimping block sequentially faces the unbonded TAB component. A bonding apparatus comprising: