JPH0817862A - Bonding method of tab part - Google Patents

Abstract

PURPOSE:To restrain a TAB part from being deformed due to a thermal effect so as to accurately bond the TAB part to a board by a method wherein the board and the TAB part are so aligned as to make their prescribed sites overlap each other, and the centers of the overlapped parts of them are spot-bonded together by thermocompression. CONSTITUTION:When a board 1b and a TAB part 2b are bonded together, the board 1b and the TAB part 2b are so aligned as to make their prescribed parts overlap each other, and the centers of the overlapped parts of them are spot-bonded together by thermocompression. For instance, a compression bonding block 16 is actuated to descend by the first and second air-cylinder, 13 and 15, of a compression bonding device, whereby the center of the outer lead of a TAB part 2b is pressed down against the center of the terminal of a glass board 1b through the intermediary of an anisotropical conductive film 6 to preliminarily bond the TAB part 2b to the glass board 1b. Thereafter, a liquid crystal cell subjected to the above-mentioned preliminary bonding process is transferred to a final thermocompression bonding process.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB component connecting method for connecting a substrate and a TAB component.

[0002]

2. Description of the Related Art In recent years, with the downsizing and thinning of the electronic crisis, the mounting technology of electronic parts has been improved by TAB (Tape Auto)
A high-density mounting technique called "material bonding" is used.

An example of using this TAB technique is a manufacturing process of a liquid crystal panel. So, as a conventional technology,
The manufacturing process of the liquid crystal panel will be described with reference to the drawings. As shown in FIG. 5, in a manufacturing process of a liquid crystal panel, a liquid crystal cell 1 formed by facing two liquid crystal glass substrates 1a and 1b to each other.
A liquid crystal driving IC is mounted around c. As the liquid crystal driving IC, a TAB component 2 (see FIG. 5) as shown in FIG.
2a and 2b) shown in are generally used.

The TAB component 2 is manufactured by inner lead bonding a semiconductor element 5 to a thin cine film-shaped film carrier 4 having a predetermined circuit pattern 3 formed on its surface.

To mount the TAB component 2 on the first and second glass substrates 1a and 1b of the liquid crystal cell 1c, for example, an anisotropic conductive film 6 is used. This anisotropic conductive film 6
Is a tape-shaped mixture of conductive particles in a thermosetting or thermoplastic resin film.
It is attached to a plurality of outer leads 7 having a width of 60 μm protruding from one end side thereof with the longitudinal direction thereof being orthogonal to the outer leads 7.

When connecting the TAB component 2 to the first and second glass substrates 1a and 1b, first, the outer lead 7 of the TAB component 4 and a wiring pattern of 60 μm width formed on the edge of the glass substrate. And are opposed to each other with the anisotropic conductive film 6 interposed therebetween. Then, the TAB component 2 is attached to the first and second glass substrates 1
By pressing and heating the a and 1b by the pressure bonding block, the TAB component 2 is moved to the first and second glass substrates 1 described above.
Temporarily press-bond to a and 1b.

After that, the outer leads 7 of the TAB component 2 that have been temporarily pressure-bonded are pressed against the first and second glass substrates 1a and 1b again to be heated, so that the TAB component 2 is separated into the first and second TAB components. Mainly pressure-bonded to the glass substrates 1a and 1b. As a result, the anisotropic conductive film 6 is softened, and the outer leads 7 and the wiring patterns of the first and second glass substrates 1a and 1b are electrically and mechanically joined.

The TAB component 2 is mounted on the first and second glass substrates 1a and 1b through the temporary pressure bonding process and the final pressure bonding process. The crimping block used in the temporary crimping step and the main crimping step has a shape as shown in FIG.

[0009]

However, in the above-described series of mounting steps, the aligned TAB component 2 is mounted on the first and second glass substrates 1a, 1 in the temporary pressure bonding step.
Since the TAB part 2 is entirely pressed and heated to be temporarily joined, the resin film carrier 4 which is the base of the TAB part 2 expands, and the terminals of the wiring patterns of the pre-aligned glass substrates 1a and 1b and the TAB part 2 are aligned. In the mounting process, a positional shift occurs between the outer lead 7 and the outer lead 7, which is a fatal problem.

In view of the above problems, the present invention suppresses the deformation of the TAB component due to thermal influence by spot-pressing the central portion of the joint portion between the aligned TAB component and the substrate in the temporary pressure bonding step. Then, a TAB component joining method capable of joining the TAB component and the substrate with high precision is provided.

[0011]

To achieve the above object, the present invention provides a TAB component joining method for joining a substrate and a TAB component, wherein a predetermined portion of the substrate and the TAB are joined together.
A predetermined part of the component is aligned so as to overlap, and spot pressure bonding is performed on the center portion of the aligned portion of the aligned substrate and the TAB component to bond the substrate and the TAB component. A characteristic TAB component joining method is provided.

[0012]

In the TAB component joining method of the present invention thus constructed, when the TAB component and the substrate are temporarily pressure-bonded, the central portion of the joint portion between the aligned TAB component and the substrate is spot-pressed. So TAB due to heat effect
It is possible to suppress the deformation of the component and accurately join the TAB component and the substrate.

[0013]

EXAMPLES TAs to which the TAB component joining method of the present invention is applied
An example of the crimping device of the B component joining device will be described with reference to the drawings. As shown in FIG. 1, a crimping device 10 of the present embodiment is provided with a holding plate 12 fixed to the upper part of a column 11 standing on a pedestal (not shown) and an upper surface of the holding plate 12. A first air cylinder 13, an inverted L-shaped slider 14 whose upper portion is bent substantially horizontally and which is provided on the side surface of the column 11 so as to be vertically slidable, and a pressing portion 2 is provided on the lower surface of the horizontal portion of the slider 14. Two second cylinders 15 are fixed in parallel with their axes vertical. And each second cylinder 15
A crimp block 16 having a lower surface as a pressing surface is connected to the. The drive shaft of the first air cylinder 13 provided on the upper surface of the holding plate 12 extends below the holding plate 12.

In the crimping device 10 thus constructed, the slider 14 is vertically driven by the first air cylinder 13 and the crimping block 16 is vertically driven by the second air cylinder 15. Has become. And
Below the crimping block 16, a plate-shaped bonding stage (backup) 17 which is erected on a stand (not shown) is provided.
However, the upper surface thereof is provided so as to face the pressing surface of the pressure bonding block 16. The bonding stage (backup) 17 is moved up and down by a cam mechanism (not shown).

As shown in FIG. 2, the crimping block 16 is in the shape of a quadrangular pyramid, and the surface area of the pressing surface 16a is smaller than the surface areas of other portions. Next, the crimping device 10 of this embodiment will be described in more detail with reference to FIG.

FIG. 3 shows the first and second air cylinders 1 described above.
It is a schematic diagram which simplifies and shows the relationship between 3, 15 and the crimping block 16. As shown in FIG. 3, the first air cylinder 13
Is fixed to the column 11, and the second air cylinder 15 is attached to the drive shaft 13a of the first air cylinder 13. Therefore, when the first air cylinder 13 operates, the entire second air cylinder 15 is vertically driven. A compression block 16 is provided on the drive shaft 15a of the second air cylinder 15.

The first air cylinder 13 is connected to a high pressure pump 19 via a closed center type four port valve 18. This high-pressure pump 19 is the drive shaft of the first air cylinder 13.
It has a role of driving 13a with a maximum pressure F larger than the bonding pressure P.

The second air cylinder 15 is connected via a relief valve 21 to a low pressure pump 20 which drives the drive shaft 15a at the maximum pressure P (F> P). The relief valve 21 operates when the pressure in the second air cylinder 15 becomes P or more,
It has a role of keeping the pressure in the second air cylinder 15 at P at all times.

Next, the operation (bonding operation) of the first and second air cylinders 13 and 15 and the crimping block 16 will be described with reference to FIG. FIG. 4A shows a state before the bonding operation. First, the bonding stage (backup) 17 is raised, and the upper surface of the bonding stage (backup) 17 holds the lower surface of the second glass substrate 1b. In this state, the 4-port valve 18 operates, the first air cylinder 13 operates, and the second air cylinder 15 and the crimping block 16 are driven downward. The speed of the crimping block 16 at this time is set to a value that does not give an impact to the second TAB component 2b or the second glass substrate 1b.
At this time, the pressure in the second air cylinder 15 is already kept at P.

Thereafter, as shown in FIG. 4 (b), when the pressing surface 16a of the crimping block 16 comes into contact with the second TAB component 2b, the first air cylinder 13, which is a high pressure cylinder, causes the second TAB to move. The pressing force of the component 2b sharply increases.
When this pressing force reaches P, the drive shaft 15a of the second air cylinder 15 is driven in the compression direction, but since air escapes from the relief valve 21, the pressing force of the crimping block 16 rises above P. There is nothing to do.

Further, as shown in FIGS. 4 (c) and 4 (d), the first air cylinder 13 is further lowered, and the second air cylinder 13
Drive down 15 During this time, by operating the relief valve 21, the central portion of the outer lead 7 of the second TAB component 2b is pressed against the central portion of the terminal of the second glass substrate 1b via the anisotropic conductive film 6.

As a result, the second TAB component 2b becomes the second
Is temporarily pressure-bonded to the glass substrate 1b. Then 4 port valve
Switch 18 and raise the crimping block 16. Then, after lowering the bonding stage (backup) 17, the second TAB component 2b which is not yet pressure-bonded by the cell stage (not shown) is pressed by the pressure surface of the pressure-bonding block 16.
Position it so that it faces 16a.

Then, the pressure bonding block 16 is driven by the same operation as described above, and the second TAB component 2b is bonded to the second glass substrate 1b. After that, the liquid crystal cell 1c that has completed the temporary pressure bonding step is transferred to the main pressure bonding step and subjected to the main pressure bonding.

[0024]

As described above, according to the present invention, in a TAB component joining method for joining a substrate and a TAB component, a predetermined portion of the substrate and a predetermined portion of the TAB component are aligned so as to overlap each other. Then, spot press-bonding is performed on the central portion of the superposed portion of the aligned substrate and the TAB component, and the substrate and the TAB component are bonded to each other, so that deformation of the TAB component due to thermal influence is suppressed. Therefore, the TAB component and the substrate can be accurately joined.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of a crimping device of a TAB component joining device to which the present invention is applied.

FIG. 2 is a schematic configuration diagram showing a crimping block shown in FIG.

FIG. 3 is a schematic diagram showing a simplified relationship between the first and second air cylinders and the crimp block shown in FIG.

4 is an explanatory view of the operation (bonding operation) of the first and second air cylinders and the pressure bonding block shown in FIG.

FIG. 5 is a schematic configuration diagram showing a general liquid crystal cell.

FIG. 6 is a schematic configuration diagram showing a general TAB component.

FIG. 7 is a schematic configuration diagram showing a conventional crimping block.

[Explanation of symbols]

1a, 1b ... liquid crystal glass substrate, 1c ... liquid crystal cell 2, 2a, 2b ... TAB parts, 10 ... crimping device 13 ... first air cylinder, 14 ... slider, 15 ... second air Cylinder, 16 ... Crimping block 17 ... Bonding stage (backup)

Claims (1)

[Claims] 1. A TAB component joining method for joining a substrate and a TAB component, wherein a predetermined portion of the substrate and the TAB are joined together.
A predetermined part of the component is positioned so as to overlap with each other, and spot pressure bonding is performed on the central portion of the superposed portion of the aligned substrate and the TAB component to bond the substrate and the TAB component. A characteristic TAB component joining method.