JP3355983B2 - Electronic component mounting device and liquid crystal display element manufacturing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and a liquid crystal display element manufacturing apparatus. For example, a TAB (Tape Auto) is connected to an input terminal of a liquid crystal display.
A mounting device and a liquid crystal display for mounting each electronic component by crimping using an anisotropic conductive adhesive used for connection of terminals of fine pitch, such as when electrically connecting terminals of the IC (mated bonding) or IC. The present invention relates to a device manufacturing device.

[0002]

2. Description of the Related Art For connection between electronic components such as semiconductor devices, especially between fine pitch terminals, such as connection between an input terminal provided on an electrode glass of a liquid crystal display and a terminal (bump) of a TAB. An anisotropic conductive adhesive is used.

[0003] The bonding using the anisotropic conductive adhesive is performed by temporarily bonding the anisotropic conductive adhesive between the electronic components and then pressing the electronic components together with a pressing head.

[0004] At this time, a part of the anisotropic conductive adhesive protrudes from between the electronic components and adheres to the pressure bonding head. It is prevented from adhering to the head (see JP-A-6-295940).

That is, as shown in FIG. 3A, a COG (Chip On Glass) type liquid crystal display element 10 in which a liquid crystal driver IC 12 is directly mounted on an electrode glass 11.
Is manufactured, the IC 12 is temporarily fixed on the glass 11 via an anisotropic conductive adhesive, and is arranged on the lower head 3.

[0006] A protective tape 5 is arranged between the liquid crystal display element 10 and the pressure bonding head 4 which is arranged above the lower head 3 so as to face the lower head 3. The protective tape 5 is configured such that both ends (not shown) are connected to a take-out reel and a take-up reel, respectively, so that the protective tape 5 is fed out at predetermined intervals, and is guided by a guide roller 6.

[0007] Then, as shown in FIG. 3 (B), the pressure bonding head 4 is moved downward (toward the liquid crystal display element 10), and is pressed against the IC 12 via the protective tape 5. At this time, even if the anisotropic conductive adhesive is extruded from between the glass 11 and the IC 12, the adhesive is blocked by the protective tape 5 and does not adhere to the pressure bonding head 4.

When the pressure bonding for a predetermined time is completed, the pressure bonding head 4 is returned upward, the protective tape 5 is fed out by a predetermined amount, and a new tape 5 is placed between the guide rollers 6. By repeating the above procedure, the glass 11 and the IC 1
2 was performing the mounting work.

[0009]

However, in the conventional apparatus, only the pressure bonding head 4 moves and the guide roller 6 moves.
Does not move, the protection tape 5 is urged by the moved pressure bonding head 4 to apply a greater tension to the protection tape 5, and the protection tape 5 is damaged at the edge of the pressure bonding head 4. was there.

As a result, the tension applied to the protection tape 5 is increased, and when the protection tape 5 is pressed against the IC 12, there is a problem that the position of the IC 12 is shifted due to the tension. In addition, the magnitude of the tension applied to the protective tape 5 is not constant due to the damage of the protective tape 5, and the pressure bonding head 3 is connected to the IC 1 via the protective tape 5.
2 has a problem that an error occurs in the flatness and parallelism of the pressure-bonded surface of the protective tape 5 when pressed. In particular,
In the case of an anisotropic conductive adhesive, if an error occurs in the flatness or parallelism of the press-bonded surface, uniform bonding cannot be performed, and there has been a problem that the bonding strength and the reliability of conduction are reduced.

An object of the present invention is to provide an electronic component mounting apparatus and a liquid crystal display element manufacturing apparatus which can prevent a tension caused by a pressure bonding head from being applied to a protective tape.

[0012]

SUMMARY OF THE INVENTION The present invention relates to a mounting apparatus for moving a crimping head toward an electronic component and crimping the electronic component to another electronic component. An unwinding means for unwinding one side of the protective tape disposed therebetween, a winding means for winding the other side of the protective tape, and a guide for guiding the protective tape to be disposed with the pressing head interposed therebetween Wherein the unwinding means and the winding means are configured to be able to advance and retreat in a direction toward the electronic component together with the tape guide. The present invention also relates to an apparatus for manufacturing a liquid crystal display element for moving a pressure bonding head toward a TAB or an IC to pressure-bond the TAB or the IC to glass. Unwinding means for unwinding one side of the protective tape disposed on the sheet, winding means for winding the other side of the protective tape, and a sheet guide arranged between the pressure bonding head to guide the protective tape. Wherein the unwinding means and the winding means are configured to be able to advance and retreat in a direction toward the TAB or the IC together with the tape guide.

In the present invention, since the tape guide is configured to be able to move forward and backward toward the electronic component, the tape guide is moved simultaneously with the movement of the pressure bonding head or before the movement of the pressure bonding head. A protective tape,
The crimping head of the electronic component can be brought into contact with the crimped surface to be crimped. Therefore, it is possible to prevent the protective tape from being urged by the pressure bonding head to apply tension or to be damaged, to control the tension of the protective tape to a predetermined size, and to prevent the electronic components from being displaced. The anisotropic conductive adhesive can be pressed uniformly, and the adhesive force and the reliability of conduction can be secured.

In the present invention, only the tape guide may be moved forward and backward, but together with the tape guide, the unwinding means and the winding means may be configured to be able to move forward and backward toward the electronic component. .

If the unwinding means and the winding means together with the tape guide are configured to be able to advance and retreat, the positional relationship between the unwinding means and the winding means and the tape guide can always be kept constant. There is no fluctuation or the like, and the tension of the protective tape can be set with high accuracy.

Further, the mounting method of the electronic component of the present invention is as follows.
An anisotropic conductive adhesive is arranged between the two electronic components, and the electronic component is sandwiched between a protective tape guided at one end by one end connected to the unwinding means and connected at the other end to the winding means. After the tape guide and the pressure bonding head are arranged at a position facing the pressure bonding head, the tape guide and the pressure bonding head are simultaneously moved to the electronic component side, and the pressure bonding head is pressed against the electronic component via the protection tape. Things.

When the tape guide is moved at the same time as the pressure bonding head is moved, the cycle time at the time of mounting can be shortened, and the operating rate can be improved.

On the other hand, the tape guide is moved to the electronic component side, the protective tape between the tape guides is moved to a predetermined position on the electronic component side, and then the pressure head is moved to the electronic component side. The electronic component may be pressure-bonded via the protective tape.

As described above, if the pressure bonding head and the tape guide are configured to be independently movable, even if the distance (interval) between the pressure bonding head and the tape guide, that is, the protection tape, is increased, the tension fluctuation of the protection tape may occur. You can move without. For this reason, it is possible to reliably prevent the tape from expanding or deforming due to the influence of the heat of the pressure bonding head on the protective tape during standby.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a mounting apparatus 1 according to the present embodiment. The mounting apparatus 1 includes a support 2 on which an electrode glass 11 of a liquid crystal display element 10 as an electronic component is placed, a lower head 3 disposed adjacent to the support 2, and a lower head 3
And a pressure bonding head (upper head) 4 which is arranged to face the lower head 3 and is vertically movable toward the lower head 3.

The support 2 is detachable from the heads 3 and 4 so that the liquid crystal display element 10 can be attached to and detached from the support 2 at another location. Support 2
Are provided so that the liquid crystal display element 10 can be attached to and detached from the other support 2 when one of the supports 2 is arranged between the heads 3 and 4 to perform the pressure bonding step. ing. Further, the pressure bonding head 4 has a built-in heater for heating the head 4 to a predetermined temperature.

The mounting apparatus 1 is provided with an unwinding reel 21 which is unwinding means connected to one end of a protective tape 5 made of Teflon tape or polyimide tape, and a take-up reel 22 connected to the other end. ing. A take-up motor 23 is connected to the take-up reel 22, and the reel 22 and the motor 23 constitute a take-up means.

Below the reels 21 and 22, there are provided guide rollers 24 and 25, which are tape guides for guiding the protective tape 5, respectively. Guide roller 24,
Reference numeral 25 denotes each of the reels 21 and
2 are connected. Each of the reels 21 and 22 and the guide rollers 24 and 25 are configured to be vertically movable integrally by an elevating device (not shown).

Next, a method of mounting the liquid crystal display element 10 using such a mounting device 1 will be described.

First, the IC 12 is temporarily fixed on the electrode glass 11 via an anisotropic conductive adhesive and attached to the support 2. Then, the support table 2 is arranged adjacent to each head 3, and FIG.
As shown in (A), the electrode glass 11 and the IC 12 are arranged between the heads 3 and 4. Further, the motor 23 is operated to feed out the protective tape 5 by a fixed amount, and the guide rollers 24,
A new unused portion of the protective tape 5 is arranged between the reference numerals 25.

Next, as shown in FIG. 2B, the guide rollers 24 and 25 and the respective reels 21 and 22 are moved to the electrode glass 11 side, that is, downward, and the guide rollers 24 and 25 are moved.
The interposed protective tape 5 is arranged at a position where it contacts the IC 12.

Thereafter, as shown in FIG. 2C, the pressure bonding head 4 is moved to the electrode glass 11 side, and the IC 12 is pressure bonded via the protective tape 5, and the electrode glass 11 and the IC glass 12 are pressed.
With an anisotropic conductive adhesive. At this time, the electrode glass 1
Even when the anisotropic conductive adhesive protrudes from between the IC chip 1 and the IC 12, the adhesive is blocked by the protective tape 5 and does not adhere to the pressure bonding head 4.

Thereafter, the pressure bonding head 4 and the guide rollers 24 and 25 are sequentially raised to return to the state shown in FIG.
The motor 23 is operated to feed the protective tape 5 by a predetermined amount. Then, the steps described above are repeated, and the liquid crystal display element 1
0 are sequentially performed. Note that these operations are automated by the controller of the mounting apparatus 1.

According to this embodiment, the following effects can be obtained.

The guide rollers 24 and 25 are the electrode glass 1
1 so that the pressure roller 4 can move forward and backward (up and down).
The protection tape 5 can be brought into contact with the IC 12 by moving the protection tape 5.

Therefore, even when the pressure bonding head 4 is moved, the protection tape 5 is not urged by the pressure bonding head 4 and the tension (tension) applied to the protection tape 5 by the pressure bonding head 4 increases. Can be prevented. Therefore,
The tension of the protective tape 5 can be controlled to a predetermined value, the position of the IC 12 can be prevented from shifting due to the increase in the tension, and the anisotropic conductive adhesive can be uniformly pressed to improve the adhesion and the reliability of conduction. Can be secured.

Further, since the protective tape 5 is not urged by the pressure bonding head 4, the protective tape 5 can be prevented from being damaged, the tension of the protective tape 5 does not change due to the damage, and the tension can be controlled with high precision. can do.

The pressure bonding head 4 and the guide rollers 24 and 25
Are independently moved, the distance (interval) between the pressure bonding head 4 and the guide rollers 24 and 25, that is, the protection tape 5, can be increased, and the pressure bonding head 4
The tape can be reliably prevented from being stretched or deformed by the heat of the tape.

Since not only the guide rollers 24 and 25 but also the respective reels 21 and 22 are moved, the respective reels 2 and 22 are moved.
The positional relationship between the guide rollers 24 and 25 and the guide rollers 24 and 25 can be kept constant. For this reason, it is also possible to prevent the tension of the protective tape 5 from being changed due to a change in their relative position, and it is possible to control the tension of the protective tape 5 with high accuracy.

It should be noted that the present invention is not limited to the above-described embodiment, but includes modifications and improvements as long as the object of the present invention can be achieved.

For example, in the above-described embodiment, the pressure roller 4 is moved after the guide rollers 24 and 25 are moved. However, the guide rollers 24 and 25 and the pressure roller 4 may be moved simultaneously. In this case as well, the effects (1) to (4) can be obtained, the cycle time of the pressure bonding step can be shortened, and the manufacturing efficiency can be further improved.

In the above embodiment, the guide roller 2
Although the reels 21 and 22 are connected to the respective reels 21 and 22 by the connecting rod 26 and moved integrally, the reels 21 and 22 may be fixed and only the guide rollers 24 and 25 may be moved. In this case, the tension may be controlled by moving the guide rollers 24 and 25 to move the protective tape 5 away from the reels 21 and 22 to control the tension. The tension may be controlled such that the length of the protective tape 5 between the reels 21 and 22 does not change by moving the guide rollers 24 and 25 in the direction in which they approach each other.

Further, when the guide rollers 24 and 25 and the reels 21 and 22 are moved, the structure is not limited to the structure using the connecting rods 26, and for example, each may be provided with an elevating device to perform synchronous operation.

The tape guide for guiding the protective tape 5 is not limited to the guide rollers 24 and 25, but may be a guide pin or the like. What is necessary is just to be able to arrange in parallel.

The electronic component mounting apparatus 1 is not limited to one set of heads 3 and 4, but may be one in which two or more sets are arranged. In this case, the guide rollers 24 and 25 are arranged with a plurality of sets of the heads 3 and 4 interposed therebetween, and the protective tape 5 is arranged between the heads 3 and 4 so that the plurality of electrode glasses 11 are formed.
And the IC 12 can be pressed at the same time.

Further, the mounting apparatus 1 of the present invention can be widely used not only for bonding electronic components constituting a liquid crystal display but also for conducting various electronic components. The size, shape, and the like may be appropriately set according to the type of the electronic component to be applied.

[0043]

According to the present invention as described above, it is possible to prevent the tension from being applied to the protective tape by the pressure bonding head, and to control the tension of the protective tape.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a main part of a mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a mounting method according to the embodiment.

FIG. 3 is a diagram for explaining a conventional mounting method of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mounting device 3 lower head 4 pressure bonding head (upper head) 5 protective tape 10 liquid crystal display element 11 electrode glass 12 liquid crystal driver IC 21 unwinding reel 22 winding reel 23 winding motor 24, 25 guide roller 26 connecting rod

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 G02F 1/1345

Claims (2)

(57) [Claims] 1. A mounting apparatus for moving a pressure bonding head toward an electronic component to pressure-bond the electronic component to another electronic component, comprising: a protective tape disposed between the pressure bonding head and the electronic component. Unwinding means for unwinding one side, and winding means for winding the other side of the protective tape,
And a tape guide for guiding the protection tape disposed across the pressure bonding head, wherein the unwinding means and the winding means are movable forward and backward in a direction toward the electronic component together with the tape guide. A mounting device characterized by being configured as described above. 2. An apparatus for manufacturing a liquid crystal display device for moving a pressure bonding head toward a TAB or an IC to pressure-bond the TAB or the IC to glass, wherein a liquid crystal display element is provided between the pressure bonding head and the TAB or the IC. Unwinding means for unwinding one side of the protection tape to be arranged, winding means for winding the other side of the protection tape, and guides for the protection tape which are arranged with the pressure bonding head interposed therebetween. Wherein the unwinding means and the winding means are configured to be movable forward and backward in a direction toward the TAB or the IC together with the tape guide. manufacturing device.