JP2937931B2 - Manufacturing method of liquid crystal display device - Google Patents
Manufacturing method of liquid crystal display deviceInfo
- Publication number
- JP2937931B2 JP2937931B2 JP9066459A JP6645997A JP2937931B2 JP 2937931 B2 JP2937931 B2 JP 2937931B2 JP 9066459 A JP9066459 A JP 9066459A JP 6645997 A JP6645997 A JP 6645997A JP 2937931 B2 JP2937931 B2 JP 2937931B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- flexible substrate
- lead
- crystal display
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は液晶表示装置の製造
方法に関し、特に液晶表示パネルの電極端子部とフレキ
シブル基板のリード端子の構造及びその接続方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of a liquid crystal display.
More particularly, the present invention relates to a structure of an electrode terminal portion of a liquid crystal display panel and a lead terminal of a flexible substrate and a connection method thereof.
【０００２】[0002]
【従来の技術】液晶表示装置はガラス基板等からなる液
晶パネルと、その周囲に接続され駆動ＩＣを載置した樹
脂フィルムからなるフレキシブル基板とから主に構成さ
れている。液晶パネルの電極端子部とフレキシブル基板
のリード端子部とを電気的かつ機械的に接続する場合、
異方性導電フィルムを液晶パネルの電極端子部の上に貼
付し、その上にリード端子部が重なるようにフレキシブ
ル基板を置き、ヒーターツールで加圧、加熱する方法が
主に用いられている。次に図面を用いて説明する。2. Description of the Related Art A liquid crystal display device mainly comprises a liquid crystal panel formed of a glass substrate or the like, and a flexible substrate formed of a resin film connected around the liquid crystal panel and having a driving IC mounted thereon. When electrically and mechanically connecting the electrode terminals of the liquid crystal panel and the lead terminals of the flexible substrate,
A method is mainly used in which an anisotropic conductive film is stuck on an electrode terminal portion of a liquid crystal panel, a flexible substrate is placed on the electrode terminal portion so as to overlap the lead terminal portion, and pressure and heat are applied by a heater tool. Next, a description will be given with reference to the drawings.
【０００３】図２は液晶パネルの上面図、図３は液晶パ
ネルの電極端子部にフレキシブル基板のリード端子部を
ヒーターツールで接続した場合の断面図である。FIG. 2 is a top view of a liquid crystal panel, and FIG. 3 is a cross-sectional view when a lead terminal of a flexible substrate is connected to an electrode terminal of the liquid crystal panel by a heater tool.
【０００４】図２、図３を参照すると液晶パネル１は、
ガラス基板２と液晶素子（図示せず）と、駆動ＩＣ７を
搭載した樹脂フィルム４からなるフレキシブル基板１０
とから主に構成されている。ガラス基板２の周辺部には
複数の電極端子３からなる電極端子群１３が形成されて
おり、この電極端子３上に接着剤中に導電粒子を入れた
異方性導電フィルム８を介してフレキシブル基板１０の
リード端子６が位置合せされ、ヒーターツール９により
加圧、加熱されて接続される。Referring to FIG. 2 and FIG. 3, the liquid crystal panel 1
Flexible substrate 10 composed of glass substrate 2, liquid crystal element (not shown), and resin film 4 on which drive IC 7 is mounted
It is mainly composed of An electrode terminal group 13 composed of a plurality of electrode terminals 3 is formed on the periphery of the glass substrate 2, and the electrode terminals 3 are flexible on the electrode terminals 3 via an anisotropic conductive film 8 containing conductive particles in an adhesive. The lead terminals 6 of the substrate 10 are aligned, pressurized and heated by the heater tool 9 and connected.
【０００５】しかしこの接続方法によると、フレキシブ
ル基板のリード端子６の先端部の方が内部より加熱時の
温度が高くなるため、加熱前は電極端子３とフレキシブ
ル基板のリード端子６とが平行に同一ピッチで配線され
ていたものが、加熱後はリード端子６の先端が左右に移
動し、ガラス基板に対しある角度を持つようになる。こ
のためリード端子６がずれ、所定の電極端子３に精度よ
く接続されず隣りの電極端子に接触し、液晶モジュール
としての正常の動作をしなくなる恐れがある。However, according to this connection method, the temperature at the time of heating is higher at the tip of the lead terminal 6 of the flexible substrate than at the inside, so that the electrode terminal 3 and the lead terminal 6 of the flexible substrate become parallel before heating. After being heated at the same pitch, the ends of the lead terminals 6 move left and right after heating, and have a certain angle with respect to the glass substrate. For this reason, the lead terminal 6 may be displaced, may not be connected to the predetermined electrode terminal 3 with high accuracy, and may come into contact with an adjacent electrode terminal, so that the liquid crystal module may not operate normally.
【０００６】このようなリード端子のずれの対策につい
て次のような接続方法が提案されている。As a countermeasure against such displacement of the lead terminals, the following connection method has been proposed.
【０００７】特開平４−２８７０２２号公報では、信号
線に斜め配線を介して端子を接続し、端子の少なくとも
１つのピッチを他のピッチよりも大きくすることにより
信号線の端子と駆動回路側の端子との接続部の信頼性が
良好になるとしている。In Japanese Patent Application Laid-Open No. Hei 4-287022, terminals are connected to signal lines via diagonal wiring, and at least one pitch of the terminals is made larger than the other pitches, so that the terminals of the signal lines are connected to the drive circuit side. It is said that the reliability of the connection with the terminal is improved.
【０００８】又、特開平４−２８９８２４号公報では、
加圧・加熱工程でフレキシブル基板のベースフィルムが
延伸することを予め考慮して端子ピッチを設定しておく
ことにより、液晶表示パネルの電極端子群とフレキシブ
ル基板のリード端子群との位置ずれを回避している。In Japanese Patent Application Laid-Open No. 4-289824,
By setting the terminal pitch in consideration of the stretching of the base film of the flexible substrate in the pressurization / heating process, it is possible to avoid displacement between the electrode terminal group of the liquid crystal display panel and the lead terminal group of the flexible substrate. doing.
【０００９】又、特開平５−１９６９５２号公報では、
フレキシブル基板の電極部分の可撓性フィルムを除去し
て露出させ熱膨張の影響を回避している。In Japanese Patent Application Laid-Open No. Hei 5-196952,
The flexible film on the electrode portion of the flexible substrate is removed and exposed to avoid the influence of thermal expansion.
【００１０】又、実開平５−８７９５０号公報では、フ
レキシブル基板側の可撓性フィルムを除去したリード端
子と相手側の基板上に敷設したリード端子が直接接合
し、この状態下で絶縁性接着剤を塗布し、リード線同士
を直接接合状態で固着することにより熱圧着の際の可撓
性フィルムの伸長による端子のズレや隣接リード端子間
の短絡を回避している。In Japanese Utility Model Application Laid-Open No. 5-87950, a lead terminal from which a flexible film on a flexible substrate is removed and a lead terminal laid on a counterpart substrate are directly joined to each other. By applying an agent and fixing the lead wires directly in a bonded state, the displacement of the terminals due to the expansion of the flexible film during thermocompression bonding and the short circuit between adjacent lead terminals are avoided.
【００１１】又、特開平７−５４８３号公報では、異方
性導電フィルムを挟んで、回路基板端子及びフレキシブ
ル基板上のリード線を重ね合わせたものに、導電粒子が
前記リード線に楔状態を形成するに足る圧力を加え、こ
の楔状態の形成後において接着剤硬化のため加熱を施す
ことにより、圧着ヘッドによる押さえ込み前のフレキシ
ブル基板の可撓性フィルムの加熱、熱変形はなく、液晶
パネルの端子とフレキシブル基板のリード線との間の位
置ずれを生じることはないとしている。In Japanese Patent Application Laid-Open No. 7-5483, conductive particles are attached to a circuit board terminal and a lead wire on a flexible board with a conductive film interposed therebetween, and a wedge state is formed on the lead wire. By applying sufficient pressure to form and applying heating to cure the adhesive after the formation of this wedge state, there is no heating or thermal deformation of the flexible film of the flexible substrate before pressing by the pressure bonding head, and the liquid crystal panel It is stated that there is no displacement between the terminal and the lead wire of the flexible substrate.
【００１２】さらに、特開平５−２４９４７９号公報で
は、フレキシブル基板のリード線間にスリットを設けて
リード線群を分割して、リード線群の形成時の累積ピッ
チ誤差及び熱圧着時の伸びを減少させることにより、両
者の位置ずれを回避している。Further, in Japanese Patent Application Laid-Open No. Hei 5-249479, a slit is provided between the lead wires of a flexible substrate to divide the lead wire group, and the accumulated pitch error in forming the lead wire group and the elongation in thermocompression bonding are reduced. By reducing the distance, a displacement between the two is avoided.
【００１３】[0013]
【発明が解決しようとする課題】しかしながら上記した
接続方法のうち特開平４−２８７０２２号公報及び特開
平４−２８９８２４号公報では、液晶パネルの端子部と
フレキシブル基板の平行方向への位置ずれのみを解決し
ようとしているため、平行な各リード端子が斜めにずれ
た場合そのずれは解決されないという問題点がある。However, among the above connection methods, JP-A-4-287022 and JP-A-4-289824 disclose only the displacement of the terminal portion of the liquid crystal panel and the flexible substrate in the parallel direction. There is a problem that if the parallel lead terminals are obliquely shifted, the shift cannot be solved.
【００１４】特開平５−１９６９５２号公報、実開平５
−８７９５０号公報及び特開平５−２４９４７９号公報
は、フレキシブル基板上のキャリアテープを除去した
り、端子間にスリットを設けたりするため、フレキシブ
ル基板単体での強度が弱くなると共にフレキシブル基板
を製造するための工数が増加するという問題点がある。Japanese Unexamined Patent Publication No. Hei 5-196952, Japanese Utility Model Laid-Open No. 5
JP-A-87950 and JP-A-5-249479 disclose removing the carrier tape on the flexible substrate and providing slits between terminals, so that the strength of the flexible substrate alone is reduced and the flexible substrate is manufactured. There is a problem that the number of man-hours for the operation increases.
【００１５】特開平７−５４８３号公報は、加圧を行っ
た後に加熱を行うため、時間的なロスが生じると言う問
題点がある。Japanese Patent Application Laid-Open No. 7-5483 has a problem that a time loss occurs because heating is performed after pressure is applied.
【００１６】本発明の目的は、液晶パネルの電極端子部
とフレキシブル基板のリード端子部とを接続する際、加
圧・加熱することにより生じる両者間の全ての位置ずれ
を回避することの出来る液晶表示装置の製造方法を提供
することにある。An object of the present invention is to provide a liquid crystal device capable of avoiding any displacement between the electrode terminals of a liquid crystal panel and the lead terminals of a flexible substrate caused by pressurizing and heating when connecting the two. An object of the present invention is to provide a method for manufacturing a display device.
【００１７】[0017]
【００１８】[0018]
【課題を解決するための手段】 本発明 の液晶表示装置の
製造方法は、液晶表示パネルのガラス基板の一辺の端部
に並列して形成され電極端子群を構成する複数の電極端
子とフレキシブル基板上に等ピッチで平行に形成された
リード端子とを異方性導電フィルムを介して熱圧着する
ことにより電気的・機械的に接続する液晶表示装置の製
造方法において、あらかじめ熱圧着により前記リード端
子の先端部が左右に扇状に膨張する割合を求めておき、
熱圧着により位置精度良く接続されるように前記電極端
子群を構成する複数の前記電極端子を扇状に設けておく
ことを特徴とするものである。 According to a method of manufacturing a liquid crystal display device of the present invention, a flexible substrate and a plurality of electrode terminals which are formed in parallel at one end of a glass substrate of a liquid crystal display panel to form an electrode terminal group are provided. In a method of manufacturing a liquid crystal display device, in which a lead terminal formed in parallel at an equal pitch on the top is electrically and mechanically connected by thermocompression bonding via an anisotropic conductive film, the lead terminal is preliminarily thermocompressed. Find the rate at which the tip of the fan expands fanwise from side to side,
A plurality of the electrode terminals constituting the electrode terminal group are provided in a fan shape so as to be connected with good positional accuracy by thermocompression bonding.
【００１９】[0019]
【作用】加圧・加熱により生じるフレキシブル基板のリ
ード端子部の先端部が左右に扇状に膨張する割合を予測
して液晶パネルの電極端子の配列を扇状に配列しておく
ことにより両端子間の位置ずれをなくすことができる。According to the present invention, the ratio of the electrode terminals of the liquid crystal panel is arranged in a fan shape by estimating the rate at which the tip of the lead terminal portion of the flexible substrate caused by pressurization and heating expands in the right and left direction. The displacement can be eliminated.
【００２０】[0020]
【発明の実施の形態】次に本発明について図面を参照し
て説明する。図１（ａ），（ｂ）は本発明の実施の形態
を説明する為の液晶パネルのガラス基板端部の平面図で
ある。以下図２、図３を併用して説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIGS. 1A and 1B are plan views of an end portion of a glass substrate of a liquid crystal panel for describing an embodiment of the present invention. This will be described below with reference to FIGS.
【００２１】図２，図３に示したように、液晶表示装置
はガラス基板２等からなる液晶パネル１と、その周囲に
接続され駆動ＩＣを載置した樹脂フィルムからなるフレ
キシブル基板１０とから主に構成されている。そしてガ
ラス基板２の一辺の端部に並列して形成され電極端子群
を構成する複数の電極端子とフレキシブル基板上に等し
いピッチで平行に形成されたリード端子６とを異方性導
電フィルム８を介して熱圧着することにより電気的・機
械的に接続するが、特にガラス基板２上の電極端子３Ａ
は、図１（ａ）に示すように、ガラス基板２の外側から
内側に向う方向に電極端子群の中央部を中心として左右
に扇状に形成されている。この形状は、あらかじめ熱圧
着によりリード端子６の先端部が左右に扇状に膨張する
割合を求めておき定める。特に最端部のリード端子のず
れの角度αを求めて電極端子３Ａの配置を定める。As shown in FIGS. 2 and 3, the liquid crystal display device mainly includes a liquid crystal panel 1 composed of a glass substrate 2 and the like, and a flexible substrate 10 composed of a resin film connected around the liquid crystal panel and having a driving IC mounted thereon. Is configured. Then, the anisotropic conductive film 8 is formed by connecting a plurality of electrode terminals formed in parallel to one end of the glass substrate 2 to form an electrode terminal group and the lead terminals 6 formed in parallel at an equal pitch on the flexible substrate. Electrical and mechanical connection by thermocompression bonding via a wire, especially the electrode terminal 3A on the glass substrate 2.
As shown in FIG. 1 (a), are formed in a fan shape on the left and right around the center of the electrode terminal group in a direction from the outside to the inside of the glass substrate 2. This shape is determined in advance by calculating the rate at which the tip end of the lead terminal 6 expands in a fan shape to the left and right by thermocompression bonding. In particular, the arrangement of the electrode terminals 3A is determined by obtaining the angle α of the deviation of the lead terminal at the end.
【００２２】このように構成されたガラス基板上の電極
端子３Ａ上に異方性導電フィルム８を介してフレキシブ
ル基板１０のリード端子６を位置合せし、ヒーターツー
ル９により熱圧着することにより、図１（ｂ）に示すよ
うに、リード端子６は扇状に広がり電極端子３Ａに位置
精度よく接続される。すなわち、水平方向及び斜め方向
のずれをほとんどなくすことができる。By positioning the lead terminals 6 of the flexible substrate 10 via the anisotropic conductive film 8 on the electrode terminals 3A on the glass substrate thus configured, and performing thermocompression bonding with the heater tool 9, As shown in FIG. 1B, the lead terminals 6 spread in a fan shape and are connected to the electrode terminals 3A with high positional accuracy. That is, the displacement in the horizontal direction and the oblique direction can be almost eliminated.
【００２３】本実施の形態の場合、フレキシブル基板の
幅＝２５ｍｍ、圧着温度＝１８０℃の場合、フレキシブ
ル基板の両端での角度のずれαは２度であった。このた
め液晶パネルのリード端子が接続される電極端子３Ａの
角度を、中央部が０度で両端の電極端子の角度αが２度
となるようにし、０度〜２度までの角度の範囲で序々に
変化していく扇状構造にした。角度のずれはフレキシブ
ル基板の中心の端子は０度となるため、電極端子群の中
心から両端にいくにつれての角度の設定は、０度〜２度
となるよう比例計算を行った。例えば、電極端子群１３
の電極端子数が２４０本の場合、端から６０本目の電極
端子３Ａの角度αは、２／２４０／（６０×２）＝１度
となる。In the case of this embodiment, when the width of the flexible substrate is 25 mm and the pressing temperature is 180 ° C., the angle deviation α at both ends of the flexible substrate is 2 degrees. For this reason, the angle of the electrode terminal 3A to which the lead terminal of the liquid crystal panel is connected is set such that the angle α between the electrode terminals at both ends is 0 ° and 2 °, and the angle α is in the range of 0 ° to 2 °. It has a fan-like structure that changes gradually. Since the angle deviation is 0 degree at the terminal at the center of the flexible substrate, the proportional calculation was performed so that the setting of the angle from the center of the electrode terminal group to both ends was 0 degree to 2 degrees. For example, the electrode terminal group 13
Is 240, the angle α of the 60th electrode terminal 3A from the end is 2/240 / (60 × 2) = 1 degree.
【００２４】[0024]
【発明の効果】以上説明したように本発明によれば、あ
らかじめ熱圧着によりリード端子の先端部が左右に扇状
に膨張する割合を求めて、電極端子を扇状に形成してお
く為、加圧・加熱の際の液晶パネルの電極端子とフレキ
シブル基板のリード端子とがずれることなく接続され、
従来のようにリード端子の位置ずれにより生じる隣接電
極端子間のショートを解決することができる。この為液
晶表示装置の信頼性を向上させることができると共に、
ファインピッチ化にも対応可能である。As described above, according to the present invention, the electrode terminals are formed in a fan shape by determining the rate at which the tip of the lead terminal expands in a fan shape in the right and left directions by thermocompression in advance.・ The electrode terminals of the liquid crystal panel during heating and the lead terminals of the flexible substrate are connected without displacement,
It is possible to solve the short circuit between the adjacent electrode terminals caused by the displacement of the lead terminal as in the related art. Therefore, the reliability of the liquid crystal display device can be improved, and
It is possible to correspond to fine pitch.
【図１】本発明の実施の形態を説明する為の液晶パネル
のガラス基板端部の平面図。FIG. 1 is a plan view of an end portion of a glass substrate of a liquid crystal panel for describing an embodiment of the present invention.
【図２】液晶パネルの上面図。FIG. 2 is a top view of a liquid crystal panel.
【図３】液晶パネル端部の断面図。FIG. 3 is a cross-sectional view of an edge portion of a liquid crystal panel.
１ 液晶パネル ２ ガラス基板 ３，３Ａ 電極端子 ４ 樹脂フィルム ６ リード端子 ７ 駆動ＩＣ ８ 異方性導電フィルム ９ ヒーターツール １０ フレキシブル基板 DESCRIPTION OF SYMBOLS 1 Liquid crystal panel 2 Glass substrate 3, 3A electrode terminal 4 Resin film 6 Lead terminal 7 Drive IC 8 Anisotropic conductive film 9 Heating tool 10 Flexible substrate
Claims (1)
部に並列して形成され電極端子群を構成する複数の電極
端子とフレキシブル基板上に等ピッチで平行に形成され
たリード端子とを異方性導電フィルムを介して熱圧着す
ることにより電気的・機械的に接続する液晶表示装置の
製造方法において、あらかじめ熱圧着により前記リード
端子の先端部が左右に扇状に膨張する割合を求めてお
き、熱圧着により位置精度良く接続されるように前記電
極端子群を構成する複数の前記電極端子を扇状に設けて
おくことを特徴とする液晶表示装置の製造方法。A plurality of electrode terminals, which are formed in parallel at one end of a glass substrate of a liquid crystal display panel and constitute an electrode terminal group, are different from lead terminals formed in parallel at an equal pitch on a flexible substrate. In a method of manufacturing a liquid crystal display device which is electrically and mechanically connected by thermocompression bonding via an isotropic conductive film, a ratio in which the tip of the lead terminal expands in a fan shape to the left and right by thermocompression is determined in advance. A method of manufacturing a liquid crystal display device, wherein a plurality of electrode terminals constituting the electrode terminal group are provided in a fan shape so as to be connected with good positional accuracy by thermocompression bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9066459A JP2937931B2 (en) | 1997-03-19 | 1997-03-19 | Manufacturing method of liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9066459A JP2937931B2 (en) | 1997-03-19 | 1997-03-19 | Manufacturing method of liquid crystal display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10260421A JPH10260421A (en) | 1998-09-29 |
| JP2937931B2 true JP2937931B2 (en) | 1999-08-23 |
Family
ID=13316385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9066459A Expired - Fee Related JP2937931B2 (en) | 1997-03-19 | 1997-03-19 | Manufacturing method of liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2937931B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6909488B2 (en) | 2002-02-28 | 2005-06-21 | Seiko Epson Corporation | Electronic device, method of manufacturing the same, and electronic instrument |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3533519B2 (en) | 2000-03-09 | 2004-05-31 | 株式会社アドバンスト・ディスプレイ | Manufacturing method of TFT substrate, film carrier and liquid crystal display element |
| JP2003046212A (en) | 2001-07-27 | 2003-02-14 | Seiko Epson Corp | Electronic device, its manufacturing method, its designing method, circuit board, and electronic equipment |
| JP5043517B2 (en) * | 2007-06-05 | 2012-10-10 | 株式会社ジャパンディスプレイイースト | Liquid crystal display device and liquid crystal display panel |
| JP7537177B2 (en) | 2020-08-18 | 2024-08-21 | セイコーエプソン株式会社 | Electro-optical device and electronic device |
-
1997
- 1997-03-19 JP JP9066459A patent/JP2937931B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6909488B2 (en) | 2002-02-28 | 2005-06-21 | Seiko Epson Corporation | Electronic device, method of manufacturing the same, and electronic instrument |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10260421A (en) | 1998-09-29 |
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