JP2000312070A - Method of connecting electrode terminal - Google Patents
Method of connecting electrode terminalInfo
- Publication number
- JP2000312070A JP2000312070A JP11907699A JP11907699A JP2000312070A JP 2000312070 A JP2000312070 A JP 2000312070A JP 11907699 A JP11907699 A JP 11907699A JP 11907699 A JP11907699 A JP 11907699A JP 2000312070 A JP2000312070 A JP 2000312070A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- electrode terminals
- flexible substrate
- pitch
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Liquid Crystal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電極端子の接続方法
に関し、さらに詳しく言えば、液晶表示素子の端子部に
液晶駆動用の外部基板を異方性導電膜を介して加熱圧着
する電極端子の接続方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting electrode terminals, and more particularly, to a method for connecting an electrode terminal for thermocompression bonding an external substrate for driving a liquid crystal to a terminal portion of a liquid crystal display element via an anisotropic conductive film. It relates to the connection method.
【０００２】[0002]
【従来の技術】液晶表示素子は受動部品であるため、そ
の組み立て工程の最終段階で、それ専用の駆動回路と接
続される。その液晶駆動回路には、フレキシブル基板上
に液晶駆動用のベアチップを実装したＴＣＰ（ｔａｐｅ
ｃａｒｒｉｅｒ ｐａｃｋａｇｅ）基板が多く用いら
れている。2. Description of the Related Art Since a liquid crystal display device is a passive component, it is connected to a dedicated driving circuit at the final stage of its assembly process. The liquid crystal drive circuit includes a TCP (tape) in which a bare chip for driving a liquid crystal is mounted on a flexible substrate.
Carrier package substrates are often used.
【０００３】その接続方法を図３により説明する。よく
知られているように、液晶表示素子１は周辺シール材を
介して貼り合わせられた一対の透明電極基板１１，１２
を含み、その一方の透明電極基板１１には端子部１１ａ
が連設されている。図示されていないが、この端子部１
１ａには、多数の引出電極端子が所定ピッチで短冊状に
形成されている。The connection method will be described with reference to FIG. As is well known, the liquid crystal display element 1 has a pair of transparent electrode substrates 11 and 12 bonded together via a peripheral sealing material.
And one of the transparent electrode substrates 11 has a terminal portion 11a
Are connected. Although not shown, this terminal 1
In 1a, a large number of extraction electrode terminals are formed in a strip shape at a predetermined pitch.
【０００４】この端子部１１ａに、液晶駆動回路として
のＴＣＰのフレキシブル基板２が接続されるのである
が、この端子部２ａにも同様に、多数の出力電極端子が
液晶表示素子１側の引出電極端子と１：１で対応するよ
うに所定ピッチで短冊状に形成されている。A flexible substrate 2 of a TCP as a liquid crystal drive circuit is connected to the terminal portion 11a. Similarly, a large number of output electrode terminals are connected to the lead portion on the liquid crystal display element 1 side. Strips are formed at a predetermined pitch so as to correspond to the terminals in a 1: 1 ratio.
【０００５】これら多数同士の引出電極端子と出力電極
端子とを接続するには異方性導電膜３が用いられる。す
なわち、フレキシブル基板２の端子部２ａを異方性導電
膜３を介して液晶表示素子１の端子部１１ａ上に配置す
る。そして、端子部２ａの上から平行度補正用のクッシ
ョン材４を介して所定温度に加熱されたヒータバー５を
押し付ける。これにより、多数の引出電極端子と出力電
極端子とが一括して電気的に接続される。[0005] An anisotropic conductive film 3 is used to connect the plurality of lead electrode terminals and output electrode terminals. That is, the terminal portion 2a of the flexible substrate 2 is disposed on the terminal portion 11a of the liquid crystal display element 1 via the anisotropic conductive film 3. Then, the heater bar 5 heated to a predetermined temperature is pressed from above the terminal portion 2a via the cushion member 4 for correcting the parallelism. Thereby, a large number of extraction electrode terminals and output electrode terminals are collectively electrically connected.
【０００６】この異方性導電膜３による接続条件は、一
般的に、加熱温度１６０〜２００℃、圧力２０〜６０ｋ
ｇ／ｃｍ２、圧着時間５〜２０秒であるが、次の点に注
意が必要とされる。[0006] The connection conditions of the anisotropic conductive film 3 are generally as follows: a heating temperature of 160 to 200 ° C and a pressure of 20 to 60 k.
g / cm < 2 > and the crimping time is 5 to 20 seconds, but the following points need to be noted.
【０００７】すなわち、フレキシブル基板２は多くの場
合ポリイミド樹脂からなり、液晶表示素子１の透明電極
基板（ガラス基板）に比べて熱膨張係数が大きい。した
がって、加熱圧着時の熱によりフレキシブル基板２側に
伸びが生じ、これが原因で両電極端子の端子間ピッチが
ずれて接続不良を引き起こすことになる。That is, the flexible substrate 2 is often made of a polyimide resin and has a larger coefficient of thermal expansion than the transparent electrode substrate (glass substrate) of the liquid crystal display element 1. Therefore, the heat at the time of thermocompression bonding causes the flexible substrate 2 to expand, which causes the pitch between the two electrode terminals to shift, thereby causing poor connection.
【０００８】そこで、その伸び対策の一つとして、フレ
キシブル基板の伸び率に応じて、設計段階で電極端子の
端子間ピッチを補正するようにしている（例えば、特開
平４−２８９８２４号公報参照）。例えば、その伸び率
を見込んで、フレキシブル基板側の電極端子の端子間ピ
ッチをあらかじめ一定の比率で狭くするようにしてい
る。Therefore, as one of the measures against the elongation, the pitch between the electrode terminals is corrected at the design stage according to the elongation ratio of the flexible substrate (for example, see Japanese Patent Application Laid-Open No. 4-289824). . For example, in consideration of the elongation, the pitch between the electrode terminals on the flexible substrate is narrowed at a fixed ratio in advance.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら、上記従
来技術では伸び補正するにしても、すべての電極端子に
一定の比率で補正をかけているため、フレキシブル基板
の実際の伸び率と合わないことがあり、正確さに欠ける
という課題があった。狭ピッチ化、狭端子化するに連れ
て上記従来技術では、その対応が困難になってきてい
る。However, in the above-mentioned prior art, even if the elongation is corrected, since all the electrode terminals are corrected at a fixed ratio, they may not match the actual elongation of the flexible substrate. There was a problem of lack of accuracy. With the narrowing of pitch and terminals, it is becoming difficult to cope with the above prior art.
【００１０】また、別の従来技術として、フレキシブル
基板の端子部に、その電極端子の並び方向に沿って金属
パターンを形成して、フレキシブル基板の伸びを拘束す
るようにしたものがある（例えば、特開平８−１３００
４７号公報参照）。Further, as another conventional technique, there is a technique in which a metal pattern is formed on a terminal portion of a flexible substrate along a direction in which the electrode terminals are arranged so as to restrain the expansion of the flexible substrate (for example, JP-A-8-1300
No. 47).
【００１１】しかしながら、これによるとフレキシブル
基板上に電気的には何ら関与しない金属パターンを設け
ることになるため、その分、余計なスペースが必要とな
るので好ましくない。また、金属パターンが付着された
面の伸びは抑えられるとしても、そこから離れた部分の
伸びまでも抑えきれるものではなく信頼性に乏しい。However, according to this, since a metal pattern which does not have any electrical connection is provided on the flexible substrate, an extra space is required, which is not preferable. Further, even if the elongation of the surface to which the metal pattern is adhered can be suppressed, the elongation of a portion distant from the surface cannot be suppressed, and the reliability is poor.
【００１２】[0012]
【課題を解決するための手段】本発明者らは、上記異方
性導電膜の接続条件下で、幅３２ｍｍのポリイミド製フ
レキシブル基板の伸びを実際に測定した。図１に伸びの
測定位置と伸び量の相関グラフを示すが、これから分か
るように、幅方向において伸びは一様ではない。Means for Solving the Problems The present inventors actually measured the elongation of a 32 mm-wide flexible substrate made of polyimide under the conditions for connecting the anisotropic conductive film. FIG. 1 shows a correlation graph between the measurement position of elongation and the amount of elongation. As can be seen, the elongation is not uniform in the width direction.
【００１３】中央部では伸びが少なく、端に行くほど伸
びが大きくなっており、実線で示すように２次曲線的に
伸び量が変化している。ちなみに、上記従来技術を適用
して、全幅にわたって均一に補正率をかけた場合、その
補正値は鎖線で示す１次直線となり、実際の伸びと比べ
て中央部から１０ｍｍ前後の位置でずれが最大になる。The elongation is small at the center portion and increases toward the end, and the amount of elongation changes in a quadratic curve as shown by the solid line. By the way, when the above-described conventional technology is applied and the correction rate is uniformly applied over the entire width, the correction value is a linear line indicated by a dashed line, and the deviation is the largest at a position about 10 mm from the center compared to the actual elongation. become.
【００１４】本発明は、このような知見に基づいてなさ
れたもので、その構成上の特徴は、多数の引出電極端子
が所定ピッチで短冊状に形成されている液晶表示素子の
端子部と、同じく多数の出力電極端子が上記各引出電極
端子に１：１で対応するように短冊状に形成されている
フレキシブル基板の端子部とを異方性導電膜を介して加
熱圧着して、上記引出電極端子と上記出力電極端子とを
電気的に導通させる電極端子の接続方法において、上記
引出電極端子もしくは上記出力電極端子のいずれか一方
の端子間ピッチを一定とし、いずれか他方の端子間ピッ
チについては、上記フレキシブル基板の熱膨張率に応じ
た伸び補正を端子部の中央部側では小さく設定し、その
端部側に行くにしたがってその伸び補正を大きく設定し
て、上記両端子部を上記異方性導電膜を介して加熱圧着
することにある。The present invention has been made on the basis of such knowledge, and its structural features include a terminal portion of a liquid crystal display element in which a large number of extraction electrode terminals are formed in a strip shape at a predetermined pitch. Similarly, a terminal portion of a flexible substrate, which is formed in a strip shape so that a large number of output electrode terminals correspond to the respective extraction electrode terminals in a 1: 1 ratio, is heated and pressed through an anisotropic conductive film. In the method of connecting an electrode terminal for electrically connecting the electrode terminal and the output electrode terminal, a pitch between any one of the extraction electrode terminal and the output electrode terminal is fixed, and a pitch between any one of the other terminals is determined. The extension correction according to the coefficient of thermal expansion of the flexible substrate is set to be small at the center of the terminal portion, and the extension correction is set to be large toward the end of the terminal portion. It is to heat and pressure via the anisotropic conductive film.
【００１５】本発明の好ましい態様によれば、上記他方
の端子間ピッチの伸び補正は、その電極端子の所定本数
を１グループとして、そのグループごとに行なわれる。
なお、上記の１：１とは電気的に接続される各電極端子
が１：１に対応することを意味し、例えば端子部側には
この他に疑似端子が設けられていてもよい。According to a preferred aspect of the present invention, the correction of the extension of the pitch between the other terminals is performed for each group, with a predetermined number of the electrode terminals as one group.
Note that 1: 1 means that each electrode terminal electrically connected corresponds to 1: 1. For example, a pseudo terminal may be provided on the terminal side.
【００１６】端子間ピッチの補正は、狭くなるように補
正する場合と、広くなるように補正する場合の２通りが
ある。透明電極基板をガラス基板とする液晶表示素子側
の端子間ピッチを一定とする場合には、フレキシブル基
板側の端子間ピッチは狭くなるように補正される。There are two ways of correcting the pitch between terminals, that is, correction to make the pitch narrower and correction to make the pitch wider. When the pitch between terminals on the liquid crystal display element side using a transparent electrode substrate as a glass substrate is fixed, the pitch between terminals on the flexible substrate side is corrected to be narrow.
【００１７】これに対して、フレキシブル基板側の端子
間ピッチを一定とする場合には、液晶表示素子側の端子
間ピッチは広くなるように補正される。これらは相対的
なもので、いずれの場合も補正率は同一とされる。On the other hand, when the pitch between the terminals on the flexible substrate is fixed, the pitch between the terminals on the liquid crystal display element is corrected to be wider. These are relative, and the correction rate is the same in each case.
【００１８】[0018]
【発明の実施の形態】次に、本発明を図２により説明す
る。なお、異方性導電膜を使用しての接続方法それ自体
は先に図３で説明したとおりであり、本発明を実施する
上で特に変更は要しない。Next, the present invention will be described with reference to FIG. Note that the connection method using the anisotropic conductive film itself is as described above with reference to FIG. 3, and no particular change is required for implementing the present invention.
【００１９】図２は、説明の便宜上、液晶表示素子側の
端子部１１ａとフレキシブル基板側の端子部２ａの各一
部分を対向的に配置した状態の平面図である。これによ
ると、液晶表示素子側の端子部１１ａ上には、多数の引
出電極端子１０が所定の端子間ピッチで短冊状に形成さ
れている。同様に、フレキシブル基板側の端子部２ａに
も、多数の出力電極端子２０が各引出電極端子１０と
１：１で対応するように短冊状に形成されている。FIG. 2 is a plan view showing a state in which the terminals 11a on the liquid crystal display element and a part of the terminals 2a on the flexible substrate are opposed to each other for convenience of explanation. According to this, a large number of extraction electrode terminals 10 are formed in a strip shape at a predetermined terminal pitch on the terminal portion 11a on the liquid crystal display element side. Similarly, a large number of output electrode terminals 20 are also formed in a strip shape in the terminal portion 2 a on the flexible substrate side so as to correspond to each of the lead electrode terminals 10 in a one-to-one correspondence.
【００２０】この実施例において、液晶表示素子側の引
出電極端子１０の端子間ピッチｐＡは、すべての引出電
極端子１０について一定である。これに対して、フレキ
シブル基板側の出力電極端子２０の端子間ピッチｐＢは
可変とされている。In this embodiment, the inter-terminal pitch pA of the extraction electrode terminals 10 on the liquid crystal display element side is constant for all the extraction electrode terminals 10. On the other hand, the pitch pB between the output electrode terminals 20 on the flexible substrate side is variable.
【００２１】すなわち、各端子部１１ａ，２ａの中央部
をＣＬとして、その中央部ＣＬ側寄りに位置する出力電
極端子２０については補正値が小さくされ、中央部ＣＬ
から距離的に離れるにしたがって、補正値が大きくされ
る。この補正値はマイナスの値であり、中央部ＣＬから
基板端部に行くにしたがって端子間ピッチｐＢは漸次狭
くされる。That is, the central portion of each of the terminal portions 11a and 2a is designated as CL, and the correction value for the output electrode terminal 20 located closer to the central portion CL is reduced, and the central portion CL is reduced.
The correction value increases as the distance from the distance increases. This correction value is a negative value, and the terminal pitch pB is gradually narrowed from the central portion CL toward the substrate edge.
【００２２】この補正値は、図１で説明した実際の伸び
量に基づいて設定されるが、図２に示されているよう
に、多数の出力電極端子２０を所定本数単位で第１グル
ープＧ１，第２グループＧ２，…のようにグループ分け
し、その各グループごとに補正値を変更するようにして
もよく、現実的にはこの手法が採用される。This correction value is set based on the actual amount of elongation described with reference to FIG. 1, but as shown in FIG. 2, a large number of output electrode terminals 20 are connected to the first group G1 in units of a predetermined number. , The second group G2,..., And the correction value may be changed for each group. In practice, this method is adopted.
【００２３】なお、この実施例とは異なり、フレキシブ
ル基板側の出力電極端子２０の端子間ピッチｐＢを一定
とする場合には、液晶表示素子側の引出電極端子１０の
端子間ピッチｐＡが可変とされる。この場合には、補正
値はプラスの値であり、これにより、液晶表示素子側の
引出電極端子１０の端子間ピッチｐＡは中央部ＣＬから
基板端部に行くにしたがって漸次広くされる。Unlike this embodiment, when the terminal pitch pB of the output electrode terminals 20 on the flexible substrate is constant, the terminal pitch pA of the lead electrode terminals 10 on the liquid crystal display element is variable. Is done. In this case, the correction value is a positive value, whereby the inter-terminal pitch pA of the lead electrode terminals 10 on the liquid crystal display element side is gradually increased from the central part CL to the substrate end.
【００２４】[0024]
【実施例】《実施例１》厚さ２５μｍで幅３２ｍｍのフ
レキシブル基板に、設計値ピッチ０．１ｍｍで３００本
の電極端子を短冊状に形成するにあたって、その基板中
央部から５０端子目までの補正率を０．０５％、５１端
子目から１００端子目までの補正率を０．１５％、１０
１端子目から１２５端子目までの補正率を０．３％、１
２６端子目から１５０端子目までの補正率を０．４５％
として、電極端子を形成した。Embodiment 1 In forming a strip of 300 electrode terminals at a design pitch of 0.1 mm on a flexible substrate having a thickness of 25 μm and a width of 32 mm, from the center of the substrate to the 50th terminal. The correction rate is 0.05%, and the correction rate from the 51st terminal to the 100th terminal is 0.15%, 10%.
The correction rate from the first terminal to the 125th terminal is 0.3%,
The correction rate from the 26th terminal to the 150th terminal is 0.45%
As a result, an electrode terminal was formed.
【００２５】一方、ガラス基板上には、設計値ピッチ
０．１ｍｍとして３００本の電極端子を形成した。そし
て、両基板を異方性導電膜を介して対向させ、１７０
℃，３０ｋｇｆ／ｃｍ２，１０秒間の条件で圧着した。
その結果、上記従来技術では１００端子目付近で８μｍ
という最大の伸びずれ量が生じたが、この実施例の場合
にはそれが１μｍまでに低減した。On the other hand, 300 electrode terminals were formed on a glass substrate at a design pitch of 0.1 mm. Then, the two substrates are opposed to each other via an anisotropic conductive film, and 170
° C., and pressed under the conditions of 30kgf / cm 2, 10 seconds.
As a result, in the above prior art, 8 μm
The maximum amount of elongation deviation occurred, but in the case of this example, it was reduced to 1 μm.
【００２６】[0026]
【発明の効果】以上説明したように、本発明によれば、
液晶表示素子側の引出電極端子もしくはフレキシブル基
板側の出力電極端子のいずれか一方の端子間ピッチを一
定とし、いずれか他方の端子間ピッチについては、フレ
キシブル基板の熱膨張率に応じた伸び補正を端子部の中
央部側では小さく設定し、その端部側に行くにしたがっ
てその伸び補正を大きく設定したことにより、フレキシ
ブル基板の伸びによる接続不良を大幅に減少させること
ができる。As described above, according to the present invention,
The pitch between any one of the extraction electrode terminal on the liquid crystal display element side and the output electrode terminal on the flexible substrate is kept constant, and for the pitch between the other terminals, elongation correction according to the coefficient of thermal expansion of the flexible substrate is performed. By setting the terminal portion to be small at the center portion side and increasing the extension correction toward the end portion side, the connection failure due to the extension of the flexible substrate can be greatly reduced.
【図１】フレキシブル基板の伸びの測定位置と伸び量の
相関グラフ。FIG. 1 is a graph showing the correlation between the measurement position of the elongation of a flexible substrate and the amount of elongation.
【図２】本発明の端子間ピッチ補正方法を説明するため
の説明図。FIG. 2 is an explanatory diagram for explaining a terminal pitch correction method of the present invention.
【図３】異方性導電膜による加熱圧着方法を示した模式
的側面図。FIG. 3 is a schematic side view showing a thermocompression bonding method using an anisotropic conductive film.
１ 液晶表示素子 １１，１２ 透明電極基板 １１ａ 端子部 ２ フレキシブル基板 ２ａ 端子部 ３ 異方性導電膜 ４ クッション材 ５ ヒータバー DESCRIPTION OF SYMBOLS 1 Liquid crystal display element 11, 12 Transparent electrode board 11a Terminal part 2 Flexible board 2a Terminal part 3 Anisotropic conductive film 4 Cushion material 5 Heater bar
フロントページの続き Ｆターム(参考） 2H092 GA49 GA50 MA29 MA32 NA29 PA01 5E319 AC03 BB16 CC12 5E344 AA02 AA22 BB02 BB04 BB12 BB14 CD04 DD10 EE23 5G435 AA14 AA17 BB12 HH18 Continued on front page F-term (reference) 2H092 GA49 GA50 MA29 MA32 NA29 PA01 5E319 AC03 BB16 CC12 5E344 AA02 AA22 BB02 BB04 BB12 BB14 CD04 DD10 EE23 5G435 AA14 AA17 BB12 HH18
Claims (2)
状に形成されている液晶表示素子の端子部と、同じく多
数の出力電極端子が上記各引出電極端子に１：１で対応
するように短冊状に形成されているフレキシブル基板の
端子部とを異方性導電膜を介して加熱圧着して、上記引
出電極端子と上記出力電極端子とを電気的に導通させる
電極端子の接続方法において、 上記引出電極端子もしくは上記出力電極端子のいずれか
一方の端子間ピッチを一定とし、いずれか他方の端子間
ピッチについては、上記フレキシブル基板の熱膨張率に
応じた伸び補正を端子部の中央部側では小さく設定し、
その端部側に行くにしたがってその伸び補正を大きく設
定して、上記両端子部を上記異方性導電膜を介して加熱
圧着することを特徴とする電極端子の接続方法。1. A terminal portion of a liquid crystal display device in which a large number of extraction electrode terminals are formed in a strip shape at a predetermined pitch, and a large number of output electrode terminals also correspond to the respective extraction electrode terminals in a one-to-one correspondence. In a method of connecting an electrode terminal for electrically connecting the lead electrode terminal and the output electrode terminal by heat-pressing a terminal portion of a flexible substrate formed in a strip shape through an anisotropic conductive film, The pitch between any one of the extraction electrode terminals or the output electrode terminals is made constant, and for the pitch between the other terminals, elongation correction according to the coefficient of thermal expansion of the flexible substrate is performed on the central portion side of the terminal portion. Let's set it small,
A method of connecting electrode terminals, wherein the elongation correction is set to be larger toward the end, and the two terminal portions are heat-pressed via the anisotropic conductive film.
その電極端子の所定本数を１グループとして、そのグル
ープごとに行なわれることを特徴とする請求項１に記載
の電極端子の接続方法。2. The method of correcting the extension of the pitch between the other terminals,
2. The method for connecting electrode terminals according to claim 1, wherein the predetermined number of the electrode terminals is regarded as one group, and the connection is performed for each group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11907699A JP2000312070A (en) | 1999-04-27 | 1999-04-27 | Method of connecting electrode terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11907699A JP2000312070A (en) | 1999-04-27 | 1999-04-27 | Method of connecting electrode terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000312070A true JP2000312070A (en) | 2000-11-07 |
Family
ID=14752295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11907699A Pending JP2000312070A (en) | 1999-04-27 | 1999-04-27 | Method of connecting electrode terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000312070A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002171059A (en) * | 2000-11-27 | 2002-06-14 | Samsung Electronics Co Ltd | Method for manufacturing printed circuit board for improving mismatching, and liquid crystal display device using the same |
| EP1780588A1 (en) * | 2005-10-25 | 2007-05-02 | L.G. Philips LCD Co., Ltd. | Liquid crystal display device |
| JP2007201282A (en) * | 2006-01-27 | 2007-08-09 | Denso Corp | Electronic device, and method of manufacturing same |
| CN100339881C (en) * | 2003-06-04 | 2007-09-26 | 友达光电股份有限公司 | Driving IC sealing assembly of liquid-crystal displaying device |
| JP2008130803A (en) * | 2006-11-21 | 2008-06-05 | Toshiba Matsushita Display Technology Co Ltd | Board device and substrate |
| US7505107B2 (en) | 2004-04-23 | 2009-03-17 | Sharp Kabushiki Kaisha | Display device having particular driving circuit connection structure |
| EP2128685A1 (en) | 2008-05-09 | 2009-12-02 | Funai Electric Co., Ltd. | Liquid crystal display apparatus and method for manufacturing liquid crystal display apparatus |
| EP2237101A1 (en) | 2009-04-01 | 2010-10-06 | Funai Electric Co., Ltd. | Liquid crystal module |
| US7812912B2 (en) | 2007-03-08 | 2010-10-12 | Chungwa Picture Tubes, Ltd. | Display panel with pins arrangement |
| CN108198808A (en) * | 2017-12-27 | 2018-06-22 | 武汉华星光电半导体显示技术有限公司 | A kind of pressing piece arrangement architecture and OLED display screen |
| CN109661106A (en) * | 2019-01-31 | 2019-04-19 | 上海天马微电子有限公司 | A kind of display device and manufacturing method |
-
1999
- 1999-04-27 JP JP11907699A patent/JP2000312070A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002171059A (en) * | 2000-11-27 | 2002-06-14 | Samsung Electronics Co Ltd | Method for manufacturing printed circuit board for improving mismatching, and liquid crystal display device using the same |
| CN100339881C (en) * | 2003-06-04 | 2007-09-26 | 友达光电股份有限公司 | Driving IC sealing assembly of liquid-crystal displaying device |
| US7505107B2 (en) | 2004-04-23 | 2009-03-17 | Sharp Kabushiki Kaisha | Display device having particular driving circuit connection structure |
| EP1780588A1 (en) * | 2005-10-25 | 2007-05-02 | L.G. Philips LCD Co., Ltd. | Liquid crystal display device |
| JP2007122054A (en) * | 2005-10-25 | 2007-05-17 | Lg Phillips Lcd Co Ltd | Liquid crystal display device |
| US7630048B2 (en) | 2005-10-25 | 2009-12-08 | Lg Display Co., Ltd. | Liquid crystal display device |
| JP2007201282A (en) * | 2006-01-27 | 2007-08-09 | Denso Corp | Electronic device, and method of manufacturing same |
| JP2008130803A (en) * | 2006-11-21 | 2008-06-05 | Toshiba Matsushita Display Technology Co Ltd | Board device and substrate |
| US7812912B2 (en) | 2007-03-08 | 2010-10-12 | Chungwa Picture Tubes, Ltd. | Display panel with pins arrangement |
| EP2128685A1 (en) | 2008-05-09 | 2009-12-02 | Funai Electric Co., Ltd. | Liquid crystal display apparatus and method for manufacturing liquid crystal display apparatus |
| EP2237101A1 (en) | 2009-04-01 | 2010-10-06 | Funai Electric Co., Ltd. | Liquid crystal module |
| US8203684B2 (en) | 2009-04-01 | 2012-06-19 | Funai Electric Co., Ltd. | Liquid crystal module |
| CN108198808A (en) * | 2017-12-27 | 2018-06-22 | 武汉华星光电半导体显示技术有限公司 | A kind of pressing piece arrangement architecture and OLED display screen |
| CN109661106A (en) * | 2019-01-31 | 2019-04-19 | 上海天马微电子有限公司 | A kind of display device and manufacturing method |
| CN109661106B (en) * | 2019-01-31 | 2021-01-15 | 上海天马微电子有限公司 | Display device and manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4047102B2 (en) | Flexible substrate and LCD module using the same | |
| JP3186925B2 (en) | Panel mounting structure, integrated circuit mounting tape and method of manufacturing the same | |
| US5258866A (en) | Method of connecting liquid crystal display and circuit board with thermal expansion compensation | |
| JP2000312070A (en) | Method of connecting electrode terminal | |
| KR100715724B1 (en) | Probe device, method of manufacture thereof, method of testing substrate using probe device | |
| EP1951014A2 (en) | Junction structure of flexible substrate | |
| JP2002171059A (en) | Method for manufacturing printed circuit board for improving mismatching, and liquid crystal display device using the same | |
| JP4385895B2 (en) | Bonding equipment | |
| JP2009289905A (en) | Tab tape and method of manufacturing the same, and method of manufacturing wiring board | |
| JP2003124262A (en) | Method of manufacturing semiconductor device | |
| JP5026032B2 (en) | Liquid crystal display device and manufacturing method thereof | |
| JPH11121682A (en) | Tape carrier package semiconductor device and liquid crystal panel display device using the same | |
| JP4488774B2 (en) | Connection structure between flexible printed circuit board and rigid board | |
| JP2937931B2 (en) | Manufacturing method of liquid crystal display device | |
| JP2833272B2 (en) | IC mounting method | |
| JPH03108789A (en) | Construction of flexible board | |
| JP2002246404A (en) | Semiconductor element with bump | |
| JPH117040A (en) | Method and device for manufacturing liquid crystal display device | |
| US6720205B2 (en) | Electronic device and method of manufacturing the same, and electronic instrument | |
| JP6734559B2 (en) | Temperature sensor and manufacturing method thereof | |
| JPH10189660A (en) | Flip chip connection circuit device | |
| JP4053507B2 (en) | Manufacturing method of semiconductor device | |
| JPH10303256A (en) | Tape carrier connection method | |
| JPH11118866A (en) | Tape carrier package semiconductor device, method of disconnection test therefor, and liquid crystal panel display device using the same | |
| JP2599789Y2 (en) | Display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040713 |
|
| A977 | Report on retrieval |
Effective date: 20061019 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061025 |
|
| A02 | Decision of refusal |
Effective date: 20070307 Free format text: JAPANESE INTERMEDIATE CODE: A02 |