JP2009289905A - Tab tape and method of manufacturing the same, and method of manufacturing wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a TAB tape which is reliably connected to a terminal for external connection even if shifting in position during heat crimping to the terminal for external connection occurs, to provide a method of manufacturing the same, and to provide a method of manufacturing a wiring board. <P>SOLUTION: The TAB tape 1 has a conductor layer made of a metal conductor on at least one surface of an insulating film substrate 2, wherein the conductor layer is a wiring layer where wiring 3 and outer lead portions 8 as a plurality of arrayed terminals for external connection are formed, and is also connected to the terminal 22 for external connection by heating predetermined heated portions 11 of the outer lead portions 8. The plurality of arrayed outer lead portions 8 have at lest two or more kinds of terminal widths Wk (k=1, 2, 3, ..., n) where, for example, W1<Wn corresponding to their positions in the array is satisfied. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention provides a TAB tape suitable for being used by being mounted with a liquid crystal driving IC by a COF (Chip On Flexible or Chip On Film) method and connected to a connection terminal of a liquid crystal display panel, for example. In addition, the present invention relates to a method for manufacturing a wiring board suitable for use in connection with such a TAB tape.

In recent years, COF type TAB tape has been actively developed as an important part for constituting the main part of a mounting package suitable for mounting liquid crystal driving ICs and various semiconductor elements. It was.
FIG. 5 shows one of semiconductor devices (mounting package in which semiconductor elements are mounted) on a TAB tape that employs a conventional general COF method and is used for mounting semiconductor elements such as a liquid crystal driving IC. FIG. 6 is a diagram showing an example of a state in which a semiconductor device mounted on the TAB tape shown in FIG. 5 is connected to a liquid crystal display panel.
For example, a thin polyimide tape is used as the insulating film substrate 101. A wiring layer 102 is formed by patterning a copper foil stretched on one surface of the insulating film substrate 101 by an etching method (photolithography) method or the like.
In the wiring layer 102, an outer lead portion 114, an inner lead portion 115, and an outer lead portion 116 are used as so-called external connection terminals for connection to the external liquid crystal display panel 107, the semiconductor element 109, and the printed wiring board 111. Is formed. On those surfaces, a metal plating layer 104 is formed by tin plating or the like. Then, except for the portion in the semiconductor mounting region 113 in which the inner lead portions 115 are arranged and the portion in which the outer lead portions 114 and 116 are formed, the wiring layer 102 in the portion where the other wiring is formed. A solder resist 105 is provided on the top for reinforcing insulation and mechanical strength.

A bump 108 of the semiconductor element 109 is connected to the surface of the metal plating layer 104 on the inner lead portion 115. A connection terminal 103 of a liquid crystal display panel 107 is connected to the surface of the metal plating layer 104 on the outer lead portion 114 via an anisotropic conductive film (ACF) 106. A connection terminal (not shown) of an external printed wiring board 111 is connected to the surface of the metal plating layer 104 on the outer lead portion 116 via a solder bump 110. The semiconductor element 109 connected in this manner drives the liquid crystal display panel 107 in accordance with an electrical signal from the printed wiring board 111.

  The above is a description of the so-called wiring surface side structure in which the wiring layer 104 having the wiring pattern is formed on both the front and back surfaces of the TAB tape 100, but the opposite surface (generally the GND surface side and the surface). In some cases, a ground layer made of copper foil (ground layer; hereinafter also referred to as a GND layer) is provided. However, for simplicity of explanation, the TAB tape 100 of FIGS. 5 and 6 is a so-called single-sided copper-clad type that does not have a GND layer on the GND surface side.

When connecting the semiconductor element 109 and the inner lead portion 115, when connecting the liquid crystal display panel 107 and the outer lead portion 114, and when connecting the printed wiring board 111 and the outer lead portion 116, the inner lead The ACF 106 and the bump 108 are pressed by pressing a heating jig against a predetermined heated part in the part 115 and the outer lead parts 114 and 116 and pressing the part to the other connection terminal while locally heating the part.
The connection between the liquid crystal display panel 107 and the outer lead portion 114, the connection between the semiconductor element 109 and the inner lead portion 115, and the connection between the printed wiring board 111 and the outer lead portion 116 are performed via the solder bumps 110, respectively. (See Patent Document 1 above).
In such a conventional TAB tape or printed wiring board, as schematically shown in FIG. 7, a plurality of external connection terminals 114 (114-1, 114-2... 114-k. 114-n) are all formed to have the same terminal width (W1 = Wk = Wn).

JP 2004-96072 A

  However, in the conventional TAB tape as described above, the connection terminal 103 on the liquid crystal display panel 107 side is caused by, for example, heating or application of pressure when connected to the external liquid crystal display panel 107 by thermocompression bonding. And a positional shift that cannot be ignored in the positional relationship with the external connection terminal 114 on the TAB tape 100 side, and there is a problem that it causes a connection failure.

  That is, taking the connection between the liquid crystal display panel 107 and the TAB tape 100 as an example, the connection terminal 103 on the liquid crystal display panel 107 side is formed on the glass substrate of the liquid crystal display panel 107, while The external connection terminal 114 on the TAB tape 100 side is formed on the surface of the insulating film substrate 101 of the TAB tape 100. The thermal expansion coefficient of the glass substrate in the liquid crystal display panel 107 is about 5 ppm / ° C., whereas the thermal expansion coefficient of the insulating film substrate 101 in the TAB tape 100 is about 15 ppm / ° C., which is the TAB tape 100 side. The insulating film substrate 101 has a thermal expansion coefficient that is about three times as large. Therefore, as shown in FIG. 8 as an example, insulation is caused by heating when the connection terminal 103 on the liquid crystal display panel 107 side and the external connection terminal 114 on the TAB tape 100 side are connected by thermocompression bonding. The film substrate 101 greatly expands thermally, and the external connection terminals 114 formed on the surface of the film substrate 101 cannot be ignored with respect to the arrangement position of the connection terminals 103 on the liquid crystal display panel 107 side (exceeding an allowable error range). ) As a result, misalignment occurs.

  In recent years, the number of terminals tends to increase more and more in order to achieve higher definition of the display screen of the liquid crystal display panel. For this reason, the terminal pitch and terminal width of the connection terminal 103 and the external connection terminal 114 tend to be further narrowed. As a result, even if a slight misalignment occurs between the connection terminal 103 and the external connection terminal 114, this substantially reduces the substantial contact area between the terminals 103 and 114, resulting in poor connection. And the reliability of the connection is significantly reduced.

In order to avoid the occurrence of a connection failure or the like due to such misalignment, the position of each external connection terminal 114 is formed in anticipation of the amount of misalignment of the external connection terminal 114 due to thermal expansion in advance. It is also conceivable to use a method in which the design is corrected in advance.
However, even if such correction is performed, the actual connection process does not necessarily have a large size that is expected in advance due to various manufacturing conditions for each lot or subtle differences in the working environment even in the same lot. This is not the case. For this reason, even if it is assumed that the position is misaligned in advance and the position where each external connection terminal 114 is formed is corrected, it will actually shift to a position different from that position, resulting in poor connection. Etc. often occur. Moreover, such a tendency tends to become even more fatal as the terminal width becomes smaller as described above. Alternatively, the process conditions and the like at the time of thermocompression bonding may be managed so that the positional displacement of the external connection terminal 114 that occurs in the actual thermocompression bonding step is within an allowable error range with respect to the amount of positional displacement expected in advance. However, in practice, such management must be performed with great accuracy, which is very cumbersome and impractical.

  The present invention has been made in view of such a problem, and its purpose is to ensure that even if a positional shift occurs during thermocompression bonding to an external connection terminal, the external connection terminal is reliable. It is an object to provide a TAB tape that can be connected, a method for manufacturing the TAB tape, and a method for manufacturing a wiring board.

The TAB tape of the present invention includes a conductor layer made of a metal conductor on at least one surface of an insulating film substrate, and the conductor layer is a wiring layer formed by forming a wiring pattern and a plurality of arranged external connection terminals. And a TAB tape that is set so that a predetermined heated portion in the external connection terminal is heated and connected to an external connection terminal, and the plurality of arranged external connection terminals include: It is characterized by having at least two different terminal widths corresponding to the positions in the array.
The method for producing a TAB tape of the present invention includes a step of patterning a metal conductor on at least one surface of an insulating film substrate to form a wiring layer having a wiring pattern and a plurality of arranged external connection terminals; A method of manufacturing a TAB tape, comprising: heating a predetermined heated portion in a connection terminal to connect the external connection terminal to an external wiring board or a connection terminal of a semiconductor device, In the forming step, each terminal width of the plurality of external connection terminals is determined by the size of positional deviation between the terminals occurring at each position in the array due to thermal expansion of the insulating film substrate during the heating. It is characterized by setting the size corresponding to each.
The method for producing a wiring board of the present invention includes a step of patterning a metal conductor on at least one surface of an insulating substrate to form a wiring layer having a wiring pattern and a plurality of external connection terminals arranged in series with the wiring pattern, A method of manufacturing a wiring board, comprising: heating a predetermined heated portion in a connection terminal to connect the external connection terminal to an external TAB tape or a connection terminal of a semiconductor device or a wiring board, Respective terminal widths of the external connection terminals, a distance between the position of the external connection terminal and the center position in the array, L [mm], and an error rate of the positions of the plurality of external connection terminals α [%], The terminal width of the external connection terminal is W [μm], the allowable deviation rate between the terminals allowed for connection with the external connection terminal is β [%], and the plurality of external connections Terminal for terminal Standard deviation as the σ [μm],
α ≦ {β · (W−γ)} / (1000 · L), where γ = 3σ
It is characterized in that it is set based on a design rule expressed by the following formula.

  According to the present invention, the terminal widths of the plurality of external connection terminals arranged are not uniform terminal widths, but corresponding to the positions in the arrangement, for example, the positions of both ends where the greatest misalignment is assumed The external connection terminal is made wider than the external connection terminal at the position of the central portion in the arrangement direction where the positional deviation is assumed to be the smallest, so that at least two different terminal widths are used. Thus, when this TAB tape is connected to an external liquid crystal display panel by thermocompression bonding, for example, the external connection terminals at both ends of the arrangement on the TAB tape are not allowed to be allowed by the conventional technique. Even if a misalignment occurs, the misalignment can be tolerated by the wide terminal width of the external connection terminals at both ends. As a result, the external connection terminal can be reliably connected to an external connection terminal such as a connection terminal of a liquid crystal display panel, for example, without causing a connection failure or the like.

Hereinafter, a TAB tape, a manufacturing method thereof, and a manufacturing method of a wiring board according to embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing a planar configuration of a main part on the wiring surface side in a TAB tape according to an embodiment of the present invention, and FIG. 2 is a liquid crystal display panel in the TAB tape according to the embodiment of the present invention. FIG. 3 is a diagram schematically showing a portion where outer lead portions to be connected are arranged, and FIG. 3 is a diagram for connecting the outer lead portion of the TAB tape shown in FIG. 2 and a connection terminal of the liquid crystal display panel. FIG. 4 is a diagram schematically showing a state where the TAB tape according to one embodiment of the present invention is mounted, and FIG. 4 is a diagram illustrating an example of a state in which a semiconductor element is mounted and connected to a liquid crystal display panel and a printed wiring board. is there.

The TAB tape 1 is formed on one surface of an insulating film substrate 2 made of, for example, polyimide tape (hereinafter, for the sake of convenience, the one surface is also referred to as a wiring surface side). A wiring layer having the wiring pattern body 3 is formed.
In many cases, a so-called GND layer (not shown) is provided on the other surface (hereinafter, the other surface is also referred to as a GND surface for convenience), but here, for the sake of simplicity of explanation. The TAB tape 1 is of a so-called single-sided plate type that does not have a GND layer on the GND surface side.
Perforation holes 5 are provided at predetermined pitches at both left and right ends in the width direction of the insulating film substrate 2 so as to be arranged along the longitudinal direction of the insulating film substrate 2.

More specifically, the TAB tape 1 has a wiring pattern body 3 formed by patterning a copper foil, which is a general conductor layer forming material, on the wiring surface side by an etching method or the like (in FIG. 1 which is a plan view). Since it is covered with the solder resist 6, only a part is drawn with a dotted line and the others are not shown), and outer lead portions 7 and 8 and an inner lead portion 10 connected to the wiring pattern main body 3 are formed. The inner lead portions 10 are arranged in the semiconductor mounting region 9 along the periphery thereof.
As shown in FIG. 4, a metal plating layer 12 (not shown in FIGS. 1, 2, and 3) is formed on the surfaces of the outer lead portions 7 and 8 and the inner lead portion 10 by tin plating or the like. A solder resist 6 is provided on the wiring pattern main body 3 except for the outer lead portions 7 and 8 and the inner lead portion 10 for reinforcement of insulation and mechanical strength. The outer lead portions 7 and 8 and the inner lead portion 10 are provided as so-called external connection terminals, and are used to heat-treat the heated portion 11 (11a, 11b, 11c; hereinafter collectively referred to as reference numeral 11). Connected to the printed wiring board 30, the liquid crystal display panel 23, and the semiconductor element 40 through solder bumps 31, ACFs 24, and bumps 41, respectively, by pressing and pressing a tool or the like (not shown). Is set to be.

In the TAB tape 1, the plurality of arranged outer lead portions 8 are set to have at least two different terminal widths corresponding to positions in the arrangement, rather than a uniform terminal width.
More specifically, the terminal widths W1, Wk, and Wn of the plurality of outer lead portions 8-1..., 8-k. The distance between each of the outer lead portions 8 and the center position represented by the center line 20 in FIGS. 2 and 3 in the arrangement is L [mm], and the error rate of the positions of the plurality of outer lead portions 8 is α [ %], The outer lead portion 8-1 positioned at the center line 20 is counted as the first, the terminal width of the kth outer lead portion 8-k is Wk [μm], and the surface of the external liquid crystal display panel 23 is Assuming that the allowable deviation rate between the terminals allowed for connection with the connecting terminal 22 provided is β [%], the standard deviation of the terminal width of the plurality of outer lead portions 8 is σ [μm],
α ≦ {β · (Wk−γ)} / (1000 · L), where γ = 3σ (Expression 1)
It is set based on the design rule expressed by the following formula.
Therefore, in the TAB tape 1, W1 <W2 <... <Wk <... <Wn. That is, the terminal width Wk of the kth external connection terminal counted from the first outer lead portion 8-1 at the center position is (k = 1, 2, 3,..., N), The terminal width W1 of the outer lead portion 8-1 arranged closest to the center of the array (that is, formed at the position of the center line 20) is the smallest, and the array is arranged in the middle from there toward the both ends. The terminal widths W2, W3, W4... Of the outer lead portions 8-2, 8-3, 8-4. The terminal width Wn is the maximum. In the present embodiment, the terminal width Wk of the outer lead portion 8 is the width in the arrangement direction of the upper surface of each outer lead portion 8, that is, the surface connected to face the external connection terminals 22 and the like. It shall refer to size (the same shall apply hereinafter).

Next, the manufacturing method of the TAB tape 1 according to the present embodiment is related to the connection process by thermocompression bonding with the external liquid crystal display panel 23, particularly focusing on the setting process of the terminal width Wk of the outer lead portion 8. I will explain it with.
Each of the outer lead portions 8-k of the TAB tape 1 has an insulating film substrate 2 so as to have a terminal width Wk set based on the above calculation formula corresponding to each arranged position. It is formed by patterning a conductive foil such as a copper foil laminated on one side of the film using a photolithography method, an etching method, or the like. The photolithography process and etching process itself used for the pattern processing may be general. Also, the respective steps before and after that may be general ones. Rather, the manufacturing method of the TAB tape according to the present embodiment is an etching used for a general TAB tape except for the process of setting the terminal width Wk of each outer lead portion 8-k, which is the most characteristic process. The general pattern can be changed without using a special pattern processing process different from the process, etc., or making the pattern processing process extremely complicated to further improve the pattern processing accuracy of the outer lead 8. It also has the merit of being able to follow the machining process.

The outer lead portion 8 of the TAB tape 1 is connected to the connection terminal 22 of the liquid crystal display panel 23 by a thermocompression bonding method. In the thermocompression bonding, the alignment between the connection terminal 22 on the liquid crystal display panel 23 side and the outer lead portion 8 on the TAB tape 1 side is generally performed with reference to the center line 20 of the arrangement of both terminals. Is.
As a result, the outer lead portion 8-1 and the connection terminal 22-1 located on the center line 20 are connected with high accuracy with the least positional deviation, and as the center line 20 goes to both ends. The displacement due to the thermal expansion of the insulating film substrate 2 increases cumulatively, and the outer lead portions 8-n at both ends and the connection terminals 22-n are connected with the largest displacement. The Rukoto. The tendency of the magnitude of the positional deviation occurring at each position is universal, but the magnitude of the magnitude of the positional deviation varies depending on various factors.

However, in the TAB tape manufacturing method according to the present embodiment, the terminal width Wk of each outer lead portion 8-k is expressed by the above-described formula;
α ≦ {β · (Wk−γ)} / (1000 · L), where γ = 3σ (Equation 1)
Of the outer lead portion 8-k of the TAB tape 1 and the liquid crystal display panel 23 that are expected to occur at each position due to thermal expansion of the insulating film substrate 2 during heating and pressurization in the connection step. Corresponding to the size of the positional deviation between the terminals with the connection terminal 22-k, the positional deviation is set to an allowable width.
As a result, as shown in FIG. 3, due to the thermal expansion of the insulating film substrate 2 of the TAB tape 1, there is a large misalignment between the terminals that could not be allowed by the conventional technology. Even if it occurs or an unexpected variation occurs in the positional deviation, the positional deviation or variation can be allowed by the appropriately expanded terminal width Wk of each outer lead portion 8-k. As a result, all the outer lead parts 8 are connected to the liquid crystal display panel 2 of the other party.
Thus, it is possible to reliably connect all the three connection terminals 22 with no fear of connection failure or the like.

Here, when the above equation 1 is transformed to solve for Wk,
(1000 · L · α) / β + γ ≦ Wk (Formula 2)
Therefore, in practice, a condition that a predetermined allowable deviation rate β is ensured by calculating by substituting actual numerical values for L, α, β, and γ on the left side of the left side using Equation 2. The terminal width Wk of each outer lead portion 8-k that satisfies the above can be set.
For example, in a general TAB tape, the specific numerical values of L, α, and β are as follows:
L = 0.1 to 24 [mm],
α = 0.03 [%],
β = 30 [%],
Degree. For the sake of simplifying the calculation, assuming that σ = 0, substituting the numerical values of α and β into the above equation 2,
L ≦ Wk (Formula 3)
It becomes. By substituting a specific numerical value of the distance L [mm] from the center line 20 of the outer lead portion 8 to be calculated here into L of this expression 3, even if a positional deviation occurs, A specific minimum value of the terminal width Wk that can allow (or surpass) and secure a reliable connection can be set.
For example, in the case of the terminal width of the outer lead portion 8-k at a position 10 mm away from the center line 20, since L = 10, 10 ≦ Wk according to Equation 3. That is, in this example, the terminal width Wk of the outer lead portion 8-k provided at a position 10 mm away from the center line 20 may be set to 10 μm or more.

Alternatively, as another example, in addition to the above specific numerical values of L, α, and β, when σ is not 0, for example, σ = 0.7 μm (that is, γ = 2.1). Substituting those numbers into Equation 2,
(L + 2.1) ≦ Wk (Formula 4)
It becomes. By substituting a specific numerical value of the distance L [mm] at the position where the outer lead portion 8 for which the terminal width is to be set is substituted for L in the equation 4, the specific terminal width Wk at this time is specified. Minimum value can be set.
For example, in the case of the terminal width of the outer lead portion 8-k at a position 10 mm away from the center line 20, L = 10. Therefore, when calculating by substituting the value of L into Equation 4, 12.1 ≦ Wk Become. That is, in the case of the outer lead portion 8-k located 10 mm away from the center line 20, the terminal width Wk may be set to a size of 12.1 μm or more. Further, when L = 20 mm, calculation is performed by substituting L = 20 into Equation 4, and 22.1 ≦ Wk. In this case, the terminal width Wk may be set to a size of 22.1 μm or more. It turns out that.

Here, as a practical numerical range of the above L, α, β, specifically,
L [mm] is 0.1 to 24,
α [%] is 0.01 to 0.05,
β [%] is 40 or less,
σ [μm] is 5 or less.
When the numerical values of L, α, and β are values within such numerical ranges, the terminal width Wk [μm] is set to 5 or more and 50 or less when calculated according to Equation 2.
However, the above-mentioned L, α, β, and Wk are numerical modes that are considered desirable from the viewpoint of practically effective for TAB tapes of general specifications, and are TABs according to the embodiments of the present invention. Needless to say, the specific numerical values applicable as the method of manufacturing the tape and its manufacturing method and the wiring board are not limited to this.

  Here, in the above formulas 1 and 2, the maximum value of the terminal width Wk is not stipulated, but this allows a reliable connection by allowing the positional deviation and variations of the outer lead portions 8-k. This is because the larger the terminal width Wk, the better from the viewpoint of achieving it, and it is meaningless to define the maximum value. The maximum value of each terminal width Wk that can be practically used is, for example, a terminal that can ensure the minimum terminal spacing required as the spacing between terminals, which is called the so-called minimum required gap, within a given terminal pitch. It will be defined as the size of the width.

Next, the operation of the TAB tape according to the embodiment of the present invention will be described.
Each outer lead portion 8-k of the TAB tape 1 has a terminal width Wk set based on the design rule expressed by the above formula 1 and is like a copper foil bonded to one surface of the insulating film substrate 2. The conductive foil is formed by patterning using a general photolithography process and etching process. Each outer lead portion 8-k of the TAB tape 1 is connected to each connection terminal 22-k of the liquid crystal display panel 23 by a thermocompression bonding method, as shown in FIG. At the time of the connection, the outer lead portion 8-1 and the connection terminal 22-1 located at the center indicated by the center line 20 in FIGS. 2 and 3 are used as a reference for alignment. In the thermocompression bonding process in which the connection is performed, the outer lead portions 8 formed on the surface of the insulating film substrate 2 due to the insulating film substrate 2 of the TAB tape 1 being heated and thermally expanded. -K also causes misalignment. For this reason, in the outer lead part 8-1 located in the center part, it becomes the minimum position shift, and the position shift increases cumulatively as it is closer to both ends. And the position shift of the outer lead part 8-n located at both left and right ends becomes the largest.
The magnitude of such misalignment is certainly a qualitative tendency, as described above, that it tends to be smaller at the center and closer to both ends, but the specific numerical value of the magnitude is Depending on various conditions, there are often variations that deviate significantly from previously anticipated values. For this reason, in the method of arranging the outer lead portions in advance by shifting the formation position of each outer lead part in advance, as previously proposed, the magnitude of the position deviation is preliminarily determined. The amount of misalignment expected in advance is often different, and the terminal width of each outer lead is uniformly thin. This has caused a fatal inconvenience that it is difficult to secure even the minimum connection area.

However, according to the TAB tape and the manufacturing method thereof according to the embodiment of the present invention, the terminal width Wk of the outer lead portions 8-k to be arranged is not the uniform terminal width as in the conventional case, but the above-described terminal width Wk. Based on Formula 1 (or Formula 2), the outer lead portion 8-1 located at the central portion where the positional deviation is assumed to be the smallest is set to the smallest terminal width W1, and gradually approaches the both ends from there. The outer lead portions 8-n located at both end portions where the largest positional deviation is assumed are set to the widest terminal width Wn.
Thus, when the TAB tape 1 according to the embodiment of the present invention is connected to the liquid crystal display panel 23 by thermocompression bonding, the outer lead portions 8 arranged on the TAB tape 1 are arranged on the outer lead portions 8. Even if a large misalignment that cannot be allowed by the conventional technology occurs or even if the misalignment occurs, the misalignment is allowed by the appropriately expanded terminal width Wk. The lead portion 8 can be connected to an external connection terminal such as the connection terminal 22 of the counterpart liquid crystal display panel 23 without causing a connection failure, and each manufacturing process and various processes used for it are complicated. It is possible to connect securely without involving.

  Here, α on the left side of Equation 1 is an error rate of the position of the outer lead portion 8 caused by thermal expansion or the like of the insulating film substrate 2 (in other words, positional variation accuracy or positional deviation rate). . That is, due to the thermal expansion of the insulating film substrate 2 due to heating during thermocompression bonding, the outer lead portions 8 formed on the surface of the insulating film substrate 2 are displaced. However, the error rate [%] when the positional deviation is regarded as an error from the position before the deviation occurs (this is regarded as a true value). In other words, this is the variation accuracy of the position of the outer lead portion 8. Therefore, this expression 1 can be regarded as meaning that the right side defines the maximum error rate or position variation accuracy on the left side. Then, the maximum value α of the error rate on the left side can be relaxed by appropriately increasing the terminal width Wk in the formula on the right side of Equation 1. Based on the consideration from such a viewpoint, the TAB tape according to the embodiment of the present invention, the method for manufacturing the TAB tape, and the method for manufacturing the wiring board, the outer lead portion 8 of the insulating film substrate 2 due to the thermal expansion or the like. Since it is possible to relax the control conditions for positional error or variation accuracy, a poorly connected board made of a material that is commonly used, easy to use and inexpensive, but has a high coefficient of thermal expansion, such as polyimide film, is used. The insulating film substrate 2 can be used simply and at low cost without causing the occurrence of such problems and without causing complicated manufacturing processes and strict management of process conditions.

  It should be noted that the terminal width Wk of each outer lead portion 8-k increases in an arithmetic progression as it moves away from the center line 20 toward both ends, that is, W1 <W2 <W3 <... <Wk <. .. <Wn, each of the outer lead portions 8-k may be set by changing the size, but in addition to this, the positional deviation is accumulated and the allowable deviation For each stage where the rate cannot be satisfied, for example, W1 = W2 = W3 <W4 = W5 = W6 <W7 = W8 = W9 <. Also good.

  In the above embodiment, the case where the present invention is applied to the external connection terminal of the TAB tape connected to the connection terminal of the liquid crystal display panel has been described. It is also possible to apply to various wiring boards such as the above, and connection terminals formed on the surface of various semiconductor elements such as the semiconductor element 40. Even in such a case, it is a matter of course that the same effect as in the case of the TAB tape 1 can be obtained by setting each terminal width Wk in the same manner as in the case of the TAB tape 1. However, in such a case, the specific numerical values of L, α, β, and σ are the same as those of the TAB tape 1 described above, depending on the material such as the thermal expansion / contraction rate of the substrate used as the insulating substrate and various specifications. Since it is generally different from the case, it is needless to say that it is necessary to select a practical practical value suitable for each case.

  In the above embodiment, the case where the insulating film substrate 2 is thermally expanded during thermocompression bonding and the outer lead portion 8 is displaced in the direction extending from the center toward both ends has been described. Needless to say, the present invention can also be applied to the case where the position of the outer lead portion 8 is shifted in the direction of contraction toward the center due to the contraction of the insulating film substrate 2 in the opposite direction. .

It is a figure which shows the planar structure of the principal part by the side of the wiring surface in the TAB tape which concerns on one embodiment of this invention. FIG. 2 is a diagram schematically showing a portion of the TAB tape according to the embodiment of the present invention in which outer lead portions connected to a liquid crystal display panel are arranged and formed. It is a figure which shows typically the state which connected the outer lead part of the TAB tape shown in FIG. 2, and the terminal for a connection of a liquid crystal display panel. It is a figure which shows an example of the state in which the TAB tape which concerns on one embodiment of this invention was mounted with the semiconductor element and was connected to the liquid crystal display panel and the printed wiring board. It is a figure which shows the planar structure of the part corresponding to one semiconductor device in the TAB tape which employ | adopted the conventional general COF system used in order to mount semiconductor elements, such as IC for liquid crystal drive. FIG. 6 is a diagram showing an example of a state in which a semiconductor device mounted on the TAB tape shown in FIG. 5 is connected to a liquid crystal display panel. It is the figure which extracts and shows typically the part in which the outer lead part connected with respect to a liquid crystal display panel in the conventional TAB tape was arranged. It is a figure which shows typically the state which connected the outer lead part of the TAB tape shown in FIG. 7, and the terminal for a connection of a liquid crystal display panel.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 TAB tape 2 Insulating film board 3 Wiring pattern main body 4 GND layer 5 Perforation hole 6 Solder resist 7, 8 Outer lead part 9 Semiconductor mounting area 10 Inner lead part 11 Heated part 12 Metal plating layer

Claims (7)

A conductive layer made of a metal conductor is provided on at least one surface of the insulating film substrate, and the conductive layer is a wiring layer formed with a wiring pattern and a plurality of arranged external connection terminals, and for the external connection A TAB tape set so that a predetermined heated portion in the terminal is heated and connected to an external connection terminal,
The TAB tape, wherein the plurality of arranged external connection terminals have at least two different terminal widths corresponding to positions in the arrangement. The TAB tape according to claim 1,
The TAB tape characterized in that the external connection terminals at both ends in the array have a terminal width wider than the terminal width of the external connection terminals closer to the center in the array. The TAB tape according to claim 2,
The terminal widths of the plurality of external connection terminals are the distances between the positions of the external connection terminals and the center position in the array, L [mm], and the positions of the plurality of external connection terminals. The error rate is α [%], the terminal width of the external connection terminal is W [μm], the allowable deviation rate of the position between the terminals allowed for connection with the external connection terminal is β [%], Assuming that the standard deviation of the terminal widths of a plurality of external connection terminals is σ [μm],
α ≦ {β · (W−γ)} / (1000 · L), where γ = 3σ
A TAB tape, which is set based on a design rule expressed by the following formula. The TAB tape according to claim 3,
The distance L [mm] is 0.1 to 24,
The error rate α [%] is 0.01 to 0.05,
The allowable deviation rate β [%] is 40 or less,
The standard deviation σ [μm] is 5 or less,
And the said terminal width W [micrometer] is 5-50, The TAB tape characterized by the above-mentioned. Patterning a metal conductor on at least one surface of the insulating film substrate to form a wiring layer having a wiring pattern and a plurality of arranged external connection terminals; and a predetermined heated portion in the external connection terminals. Heating and connecting the external connection terminal to an external wiring board or a connection terminal of a semiconductor device, and a method for producing a TAB tape,
In the step of forming the wiring layer, each terminal width of the plurality of external connection terminals is a position between terminals generated at each position in the array due to thermal expansion of the insulating film substrate during the heating. A method for producing a TAB tape, characterized in that the width is set in accordance with the size of each deviation. In the manufacturing method of the TAB tape of Claim 5,
Respective terminal widths of the external connection terminals, distances between the positions of the external connection terminals and the center positions in the array, L [mm], and error rates of the positions of the plurality of external connection terminals α [%], the terminal width of each external connection terminal is W [μm], the allowable deviation rate between the terminals allowed for connection with the external connection terminal is β [%], The standard deviation of the terminal width of the external connection terminal is σ [μm],
α ≦ {β · (W−γ)} / (1000 · L), where γ = 3σ
A method for producing a TAB tape, which is set based on a design rule expressed by the following formula. Patterning a metal conductor on at least one surface of an insulating substrate to form a wiring layer having a wiring pattern and a plurality of external connection terminals arranged in series therewith, and a predetermined heated portion in the external connection terminal. Heating and connecting the external connection terminal to an external TAB tape or a connection terminal of a semiconductor device or a wiring board,
Respective terminal widths of the external connection terminals, distances between the positions of the external connection terminals and the center positions in the array, L [mm], and error rates of the positions of the plurality of external connection terminals α [%], the terminal width of each external connection terminal is W [μm], the allowable deviation rate between the terminals allowed for connection with the external connection terminal is β [%], The standard deviation of the terminal width of the external connection terminal is σ [μm],
α ≦ {β · (W−γ)} / (1000 · L), where γ = 3σ
A method of manufacturing a wiring board, characterized in that the wiring board is set based on a design rule expressed by the following formula.

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