JP2010147084A - Circuit board and flexible substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reliably connect a terminal on the side of a substrate with wiring on the side of a flexible substrate by flexibly coping with large-sizing of the substrate and pitch reduction between terminals without increasing the manufacturing cost in a circuit board with many terminals connected with many respective wirings formed on the flexible substrate. <P>SOLUTION: In the circuit board 1a with many terminals 3 respectively conducted and connected with many external wires 21 formed on the flexible substrate 20 in a laminated state, the circuit board has an almost rectangular and planar form which is flat vertically and is wide horizontally, the many terminals are divided into a plurality of blocks 5 per predetermined number of terminals, the plurality of blocks are arrayed side by side along a long-side edge 2 of the almost rectangular form, and the terminals of the predetermined number included in one block have leading ends 6 and base terminals 7 on their right and left sides and are vertically arrayed in a comb-like form. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a circuit board provided with a large number of terminals that are electrically connected in a state of being laminated with a large number of wirings formed on a flexible substrate. It also relates to the flexible substrate. The present invention is applicable to, for example, a circuit board connected to wiring formed in FPC (Flexible Printed Circuits), TCP (Tape Carrier Package), or the like.

  Some circuit boards are provided with terminals connected to wiring formed on an FPC, TCP, or the like, that is, wiring formed on a flexible substrate. For example, a circuit board on which a driving circuit for a liquid crystal display (LCD) is mounted has a large number of terminals formed on the edge of the board in a comb-tooth shape, and a large number of comb-tooth shapes are also formed on the LCD side driven by the circuit board. Terminals are formed. Both terminals are connected to each other through the FPC.

  FIG. 11 shows a circuit board connected to an LCD using an FPC as a conventional example of the present invention. In FIG. 11, the connection structure of the circuit board 1f, the LCD 30, and the FPC 20 is shown in a plan view. FIG. 12 is an exploded view of the connection structure for each component. In FIG. 12, the shapes of the terminals and wirings of the circuit board 1f, the FPC 20, and the LCD 30 are shown. The circuit board 1 f has a substantially rectangular planar shape, and the length of the long side is substantially the same as the width of the LCD 30. The long side 2 on the side of the circuit board 1f that is connected to the FPC 20 and the lower long side 31 of the rectangular LCD 30 are disposed to face each other. Then, comb-like terminals (3, 32) are formed at the edges of the long sides (2, 31) facing each other, and both terminals (3, 32) are connected to each other through the FPC 20.

  The comb-shaped terminals 3 on the circuit board 1 f are divided into a plurality of groups 4, with a predetermined number of terminals as a group 4. A predetermined number of terminals included in each group 4 are aligned left and right at a predetermined pitch, and the terminals 3 at the left and right ends of the adjacent groups 4 are spaced apart from the distance between the terminals 3 of the same group 4. Further, the base end 7 of each terminal 3 is connected to a wiring 8 from an electronic component or the like mounted on the circuit board 1f. There are a plurality of FPCs 20 corresponding to each group 4. In this example, the pitch and arrangement of the terminals 32 on the LCD 30 side are the same as those of the terminals of the circuit board 1f. The same number of wirings 21 as the terminals 3 included in the set 4 are formed in a stripe shape.

  13 is a cross-sectional view taken along the line ff in FIG. The terminal 3 of each group 4 in the circuit board 1f and one end 23 of the stripe-like wiring 21 in the FPC 20, and the terminal 32 of the LCD 30 and the other wiring end 24 of the FPC 020 are anisotropically conductive tape (ACF) 40. The ACF functions as an adhesive layer having conductivity only in the laminating direction, and the terminal 3 of the circuit board 1 and one wiring end 23 of the FPC 20 and the FPC 20 The other wiring end 24 and the terminal 32 of the LCD 30 are electrically connected to each other.

  When connecting a terminal of a circuit board and a wiring end such as an FPC, it is necessary to accurately match the positions of the terminal on the circuit board side and the corresponding wiring in the FPC. Of course, this alignment is not performed while checking the terminals of the circuit board and the wiring end of the FPC one by one, but the positions are aligned based on the outer shape of the circuit board and the outer shape of the FPC. Specifically, alignment marks and other alignment marks are patterned on the left and right edges and the center of the long side of the substrate, and the FPCs are collectively processed based on the relative positional relationship between the marks and each FPC. Thermocompression bonding. For example, using a jig or the like, the distance between the right edge of the long side of the circuit board and the right edge of each FPC, or the distance between the center of the board and the left or right edge of the FPC is a predetermined distance. And a plurality of FPCs are thermocompression bonded together.

  By the way, recent circuit boards for driving LCDs and the like tend to have a longer width in the long side direction of the rectangle as the screen size increases. On the other hand, the terminal width and pitch tend to be narrowed with the high definition of LCD. Electronic components on a hard resin circuit board such as FR-4 are usually mounted by reflow soldering, and at this time, the circuit board thermally expands. The circuit board is thermally shrunk during cooling. Thus, the circuit board is deformed by heat history. In particular, in a rectangular circuit board, the degree of deformation increases in the long side direction, and the degree further increases as the long side becomes longer. The circuit board is designed in consideration of the tolerance, but if the actual size before mounting the electronic components on the circuit board is the upper limit or lower limit of the tolerance, considering the narrowing of the terminal spacing, the result In other words, an error between the actual size of the terminal width or inter-terminal pitch and the total size cannot be ignored, and the positional relationship between the terminal and the FPC wiring is shifted. For example, the FR-4 substrate has an outer shape deformation of about 0.012% with respect to the original side length due to the thermal history. In the FR-4 substrate having a long side width of 200 mm, the width is 24 μm.

  FIG. 14 shows various sizes (design values) of a conventional circuit board 1f actually manufactured. (A) has shown the size regarding the external shape of the circuit board 1f, (B) has shown the size regarding the terminal 3 contained in one group 4. FIG. In the illustrated circuit board 1f, a large number of terminals 3 are divided into a plurality of groups 4 for each predetermined number, and the distance L between the terminals on the left and right ends is 224.69 mm on the long side. In this circuit board 1f, the length h of the terminal 3 is 2.7 mm, and the terminal pitch p and the terminal interval d1 are 300 μm and 120 μm, respectively. That is, the terminal width w is 180 μm. The distance Lg between the terminals at both ends in one set 4 is 37.2 mm. That is, each set 4 includes 125 terminals 3. The tolerance of the distance L in the circuit board 1f is ± 0.1 mm. If the outer shape of the substrate 1f is deformed according to the above degree (0.012%) due to the thermal history, the distance between the terminals 3 at the left and right ends expands and contracts by about 24 μm, and if a tolerance is added, an error between the design size and the actual size. Is about 124 μm at the maximum.

  When the error becomes the maximum in this way, for example, when the crimping position of the FPC is adjusted with reference to the terminal 3 located at the center of the distance L between the terminals 3 on both the left and right sides of the circuit board 1f, it is directed toward the left and right ends. The error is accumulated, and a shift of about 62 μm occurs at the terminals 3 at both the left and right ends. This deviation is about half of the distance between the terminals 3 in one set 4. If the terminal 3 at either the left or right end is used as a reference, an error of 124 μm occurs at the terminal 3 at the other end, and a positional deviation of about one terminal occurs.

  In addition, when the FPC is thermocompression bonded, both the circuit board and the FPC having different thermal expansion coefficients are thermally expanded, so that the above-described positional deviation is further increased. A large misalignment may cause a conduction failure due to a decrease in the overlapping area in the stacking direction between the terminal of the circuit board and the wiring end of the FPC, or a short circuit between the different terminal and the wiring. Of course, it is possible to reduce tolerances and to strictly control temperature when mounting electronic components, so that the deformation of the outer shape and the associated terminal size can be kept within an acceptable range. Manufacturing equipment is required, and the cost for quality control in the manufacturing process increases.

  The present invention has been made in view of the above problems, and an object thereof is to increase the manufacturing cost of a circuit board having a large number of terminals connected to each of a large number of wirings formed on a flexible substrate. Therefore, it is possible to flexibly cope with the increase in the length of the substrate and the reduction in the pitch between the terminals, and to ensure that the terminals on the substrate side and the wirings on the flexible substrate side can be reliably connected.

The present invention for achieving the above object is a circuit board comprising a large number of terminals that are conductively connected in a state of being stacked with each of a large number of external wirings formed on a flexible substrate,
The circuit board has a substantially rectangular planar shape that is flat in the vertical direction and wide on the left and right.
The plurality of terminals are grouped into a plurality of blocks by forming a block for each predetermined number, and the plurality of blocks are arranged side by side along the edge of the substantially rectangular long side. ,
The predetermined number of terminals included in one block is a circuit board which has a distal end and a proximal end on the left and right sides and is arranged in a comb-like shape in the vertical direction.

  The plurality of terminals have the same shape, and the predetermined number of terminals included in the one block has a stepped shape in which the distal end rises toward the edge, and the proximal end has the long length. It is better if the circuit board is arranged so as to have a stepped shape descending toward the edge on the side, and the internal wiring formed on the circuit board is connected to the base end. .

  In any one of the above circuit boards, the terminals are formed in a rectangular island shape on the front surface of the circuit board, the internal wiring is formed on the back surface of the circuit board, and the internal wiring and the terminals are connected through a through hole. It may be connected. Alternatively, the circuit board is composed of a multilayer substrate in which a plurality of substrates are laminated, and the terminals are formed in a rectangular island shape on the uppermost surface of the multilayer substrate, and the internal wiring is formed in an inner layer of the multilayer substrate, A circuit board in which the internal wiring and the terminal are connected via a through hole or IVH may be used.

  The present invention also extends to a flexible substrate on which a large number of external wirings connected to a large number of terminals of any one of the circuit boards described above are formed. The wiring is grouped for each predetermined number corresponding to the predetermined number of terminals included in the one block, and the predetermined number of external wirings in each set extends in the vertical direction while extending in the vertical direction. The tip side connected to the terminal is bent in one of the left and right directions so as to face the terminal, and is laminated with the terminal in a line segment region from the tip of each external wiring to the bending point. Thus, a flexible substrate having a region to be connected is formed.

  According to the circuit board of the present invention, an error between the actual size of the terminal width and the terminal interval and the design size due to the outer shape deformation in the manufacturing process is allowed, and the temperature management at the time of mounting electronic components and the board size at the time of manufacturing are strictly controlled Even if it is not managed, it can flexibly respond to the lengthening of the board and the narrowing of the pitch between the terminals, and it can reliably connect the numerous terminals formed on the long edge of the rectangular board with the wiring formed on the flexible board. Can be connected to. Therefore, a highly reliable circuit board can be provided without increasing the manufacturing cost.

=== First Embodiment ===
FIG. 1 shows a terminal structure of a circuit board in the first embodiment of the present invention. The illustrated circuit board 1a has a horizontally long rectangular shape having a width approximately the same as the width of the LCD 30 as in the conventional example 1f shown in FIG. Then, this terminal is connected to a terminal of the LCD 30 through a wiring formed on the FPC 20. A large number of terminals are grouped for each predetermined number, and one FPC 20 corresponds to each group 4. The structure so far is the same as that of the conventional circuit board 1f. However, in the circuit board 1a in the first embodiment, the arrangement and arrangement of terminals are greatly different from those of the conventional circuit board 1f. In the following, description will be made according to the relationship between the top, bottom, left and right in FIG. That is, the circuit board 1a has a rectangular shape that is horizontally long on the left and right, and the terminal 3 is formed at the upper edge of the rectangle. Further, the front side and the depth direction on the paper surface are the front and rear, respectively, and the surface on which the terminals 3 are formed on the circuit board 1a is referred to as a “front surface”.

  FIG. 2 shows an outline of the circuit board 1a in the first embodiment. (A) shows the shape and arrangement of a set of four terminals 3 corresponding to one FPC 20 and the wiring of the FPC 20 connected to the terminal 3 (hereinafter referred to as external wiring). ) Is an enlarged view of the elliptical region 100 in FIG. In FIG. 2, the number of terminals 3 is made smaller than the actual number for ease of explanation. In FIG. 5B, the type of hatching is changed so that the terminal 3 and the wiring (hereinafter referred to as internal wiring) 8 on the circuit board 1a connected to the base end 7 of the terminal 3 can be identified.

  As described above, the outer shape and basic connection structure of the circuit board 1a of the first embodiment are the same as those of the conventional circuit board 1f. However, the circuit board 1a in the first embodiment is different in that the shape of the terminal 3 is parallel to the upper edge 2 of the board 1a. In the first embodiment, the terminals 3 of the circuit board 1 a are formed into groups 4 for each predetermined number of terminals 3, and the terminals 3 of each group 4 are further divided into a plurality of groups (blocks) 5. The terminals 3 of each block 5 have a rectangular shape that is flattened up and down, and are arranged in parallel in the vertical direction so that the tip end 6 and the base end 7 are aligned. Further, the same number of external wirings 21 as a set of four terminals 3 are formed in one FPC 20, and the external wirings 21 are divided into a plurality of sets 22 corresponding to each block 5 of the terminals 3. It has been. And each external wiring 21 is bent at right angles so that the front-end | tip 23 may oppose the terminal 3 of the circuit board 1a, extending from upper direction toward the downward direction. In this example, the tip 23 of the external wiring 21 is thicker in accordance with the shape of the terminal 3, but it may be the same thickness from the bending point 25 to the tip 23.

  FIG. 3 shows a connection state between each terminal 3 in one block 5 and the tip 23 of the external wiring 21. The internal wiring 8 and the external wiring 21 are indicated by different hatchings. Further, the layered portion of the terminal 3 and the external wiring 21 is shown in black. The terminal 3 and the tip 23 of the external wiring 21 are thermocompression bonded in a state where they are stacked so as to overlap in the front-rear direction via an anisotropic conductive film (ACF) 40. In the present embodiment, the ACF 40 is not divided for each terminal 5 of each block 5 or each group 4, but is one long in the vertical direction including the terminals 3 included in one block and long to the left and right. It is a tape shape.

  In the first embodiment, all the terminals 3 included in one block 5 have the same shape and both ends thereof are aligned vertically, but the base end 7 of the terminal 3 is similar to the terminal shape shown in FIG. May have a staircase shape descending from the lower side of the circuit board 1 toward the upper side (edge 2). That is, the left and right widths of the terminal 3 may gradually increase toward the edge 2. In such a terminal shape, the internal wiring 8 is connected to the base end 7 of the terminal 3 so as to be orthogonal to the horizontal direction in which the terminal 3 extends while extending in the vertical direction.

=== Substrate deformation due to temperature history ===
The circuit board of the present invention, including the circuit board 1a of the first embodiment described above, is parallel to the terminal 3 in a shape parallel to the long side of the substantially rectangular substrate and in a comb-like shape in the vertical direction. The structure is that they are lined up side by side. Due to this feature, in the circuit board of the present invention, even if the horizontal width of the circuit board, particularly in the long side direction, changes due to the temperature history, the terminal 3 mainly expands and contracts in the horizontal direction. Yes, the pitch and terminal width hardly expand or contract even if the circuit board design tolerance and quality control at the time of manufacture are not strict, and allow errors related to the alignment between the terminal 3 and the external wiring such as the external wiring 21. It can be suppressed within the range.

=== Second Embodiment ===
FIG. 5 shows a circuit board 1b according to a second embodiment of the present invention. In the figure, a connection state between the terminal 3 and the external wiring 21 is shown. Further, the terminal 3, the internal wiring 8, and the external wiring 21 are indicated by different hatchings. In the figure, the terminals 3 are indicated by lattice-like hatching, and the laminated portions of the external wiring 21 and the terminals 3 are shifted to facilitate the explanation. In the second embodiment, as in the first embodiment, a large number of terminals 3 of the circuit board 1b are divided into a plurality of groups, and a plurality of blocks 5 are formed for each group. The terminals 3 of each block 5 are arranged in a comb-like shape in the vertical direction. However, in the second embodiment, the terminal 3 of each block 5 has a stepped tip 6. The base end 7 of each terminal 3 is also stepped. That is, the left and right widths of the terminals 3 are all the same, and the terminals 3 are arranged so as to be gradually shifted in one of the left and right directions toward the edge 2 of the circuit board 1b. Further, the staircase on the tip side of the terminal 3 is shifted so as to “step up” from below to above (long edge 2). In this example, the tip is from left to right from below to above. Ascending to deviate.

  On the other hand, as in the first embodiment, the external wiring 21 connected to the terminal 3 extends in a straight line from the upper side to the lower side, and the left and right sides thereof so that the tip 23 thereof faces the tip of the terminal 3. Is bent. In FIG. 5, since the tip 6 of the terminal 3 is on the left side, the external wiring 21 extends downward from above and the tip 23 side is bent in the right direction. The tip 23 of the external terminal 21 is also stepped in accordance with the arrangement of the stepped terminal 3, and the length from the bending point 25 to the tip facing the terminal 3 matches the lateral width of the terminal 3. ing. Therefore, when the terminals 3 and the tips of the external terminals 21 are stacked, the respective regions of the bent portions of the terminals 3 and the external wirings 21 coincide with each other.

  In the first embodiment, when the tip 23 of the external wiring 21 and the terminal 3 are connected, the external wiring 21 is disposed between the two adjacent blocks 5, so that the distance between the adjacent blocks 5 is increased to some extent. There was a need to do. However, in this second embodiment, by arranging the tips 6 of the terminals 3 included in each of the blocks 5 in a stepped manner, all the upper and lower parts included in the set of external wirings 21 between the adjacent blocks 5 are arranged. There is no need to place a straight section. That is, the distance between adjacent blocks 5 can be reduced. Therefore, it can be said that the circuit board 1b in the second embodiment is effective when a larger number of terminals 3 are formed on a circuit board having a long side width limited.

  For reference, FIG. 6 illustrates the circuit board 1b in the second embodiment and the size (design value) of the terminal 3 formed on the board 1b. (A) is a figure which shows the size of the whole circuit board 1b, and the design distance L between the terminals of both right and left is 224.69 mm, which is the same as the conventional circuit board 1b shown in FIGS. . FIG. 6B is a diagram showing various sizes of terminals in each block. The length h, width w, distance d1 between terminals, and pitch p are the same as in the conventional example, and h = 2. 7 mm, w = 180 μm, d1 = 120 μm, p = 300 μm. The distance d2 between the internal wirings 8 in the same block 5 is 120 μm, which is the same as the distance d1 between the terminals 3. The distance d3 between the blocks is 200 μm, which is substantially equal to the terminal width w, and can be extremely narrower than the distance between the blocks 3 of the circuit board 1c of the first embodiment. In FIG. 6B, for ease of explanation, the number of terminals is reduced, but the same terminals as the conventional circuit board 1f shown in FIG. 14 with the size shown in FIG. The number can be formed at the long edge 2 of the substrate.

=== Third embodiment ===
The circuit board according to the third embodiment of the present invention has a structure in which the terminal and the internal wiring connected to the terminal are not in the same plane, and the terminal and the internal wiring are connected to each other on the front and back of the board using a through hole, or The terminal formed on the outermost layer of the substrate is connected to the internal wiring formed on the inner layer via an IVH (Interstitial Via Hole).

  FIG. 7 shows an embodiment in which connection is made through a through hole. The figure shows a plan view of the front surface of the circuit board 1c, and also shows the external wiring 21 connected to the terminal 3. FIG. FIG. 8 shows a cross-sectional view taken along the line cc of FIG. As in the first and second embodiments, each terminal 3 has a horizontally long, substantially rectangular shape, and is arranged in parallel so as to form a comb-like shape in each block 5. However, in the circuit board 1c, the internal wiring 8 is not formed on the front surface 11, and each terminal 3 is an independent island having a flat rectangular shape. The internal wiring 8 is formed on the back surface 12 of the substrate 1c.

  The internal wiring 8 on the back surface 12 of the circuit board 1 c and the terminal 3 on the front surface 11 are connected through a through hole 9 formed in the base end 7 of the terminal 3. The position of the through hole 9 is not limited to the example shown in FIGS. 7 and 8, but for example, as in the circuit board 1d shown in the plan view of FIG. 9A and the cross-sectional view of FIG. 3 may be formed so as to be in continuous contact with the base end 7. Of course, the through hole 9 does not have to be on the end 7 side of the terminal 3, and may be on the tip side or the center. In the form of connection through IVH, the internal wiring 8 formed in the inner layer of the multilayer substrate is formed on the front surface 11 of the substrate 1e as in the circuit substrate 1e shown as a cross-sectional view in FIG. The terminal 3 is connected via the IVH 10. Of course, there is a form in which the internal wiring 8 and the terminal 3 in the inner layer are connected via the through hole 9.

  In the circuit boards 1 c to 1 e in the third embodiment, it is not necessary to form the internal wiring 8 between the adjacent blocks 5. That is, it is not necessary to secure a space for connecting the internal wiring 8 to the base end 7 of the terminal 3 on the front surface 11 on which the terminal 3 is formed. Furthermore, if the tip 6 of the terminal 3 is stepped as in the second embodiment, the distance between adjacent blocks 5 can be reduced, and more terminals 3 can be formed on the long edge 2. Can do. Thereby, for example, even with the same screen size, connection with an LCD having a larger number of pixels becomes possible.

It is a figure which shows the connection structure of the circuit board in 1st Example of this invention. It is a figure which shows the shape and arrangement | positioning of the terminal in the circuit board of the said 1st Example, and the wiring of FPC connected to the said terminal. It is a figure which shows the connection state of the terminal of a circuit board and external wiring in the said 1st Example. It is a figure which shows the shape and arrangement | positioning of the terminal of the circuit board in the modification of the said 1st Example, and the wiring of FPC connected to the said terminal. It is a figure which shows the connection state of the terminal of a circuit board and external wiring in 2nd Example of this invention. It is a figure which shows the size of the circuit board of the said 2nd Example, and the terminal in the said board | substrate. It is a figure which shows the shape and arrangement | positioning of the terminal in the circuit board of the 3rd Example of this invention, and the wiring of FPC connected to the said terminal. It is sectional drawing of the circuit board of the said 3rd Example. It is a figure which shows the terminal structure of the circuit board in the modification of the said 3rd Example. It is a figure which shows the terminal structure of the circuit board in other embodiment of the said 3rd Example. It is a figure which shows the connection structure of the circuit board in the prior art example of this invention. It is a figure which shows the shape and arrangement | positioning of the terminal in the circuit board of the said prior art example, the terminal of a liquid crystal display, and the wiring of FPC connected to these terminals. It is sectional drawing of the connection structure of the circuit board in the said prior art example, FPC, and a liquid crystal display. It is a figure which shows the size of the terminal in the circuit board of the said prior art example, and the said board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a-1f Circuit board 2 Edge of circuit board 3 Terminal of circuit board 4 Set of terminal of circuit board 5 Block of terminal of circuit board 8 Internal wiring 9 Through hole 10 IVH
20 FPC
21 External wiring 30 Liquid crystal display

Claims (5)

A circuit board having a large number of terminals that are conductively connected in a state of being stacked with each of a large number of external wirings formed on a flexible substrate,
The circuit board has a substantially rectangular planar shape that is flat in the vertical direction and wide on the left and right.
The plurality of terminals are grouped into a plurality of blocks by forming a block for each predetermined number, and the plurality of blocks are arranged side by side along the edge of the substantially rectangular long side. ,
A predetermined number of terminals included in one block have a distal end and a proximal end on the left and right sides and are arranged in a comb-like shape in the vertical direction, and an internal wiring formed on the circuit board is disposed at the proximal end. A circuit board characterized by being connected.   2. The plurality of terminals according to claim 1, wherein the plurality of terminals have the same shape, and the predetermined number of terminals included in the one block has a stepped shape in which the distal end rises toward the edge, and the proximal end Is arranged so as to be stepped down toward the edge of the long side.   3. The circuit board according to claim 1, wherein the terminal is formed in a rectangular island shape on the front surface of the circuit board, the internal wiring is formed on the back surface of the circuit board, and the internal wiring and the terminal are connected through a through hole. A circuit board characterized by being made.   3. The circuit board according to claim 1, wherein the circuit board is formed of a multilayer board in which a plurality of boards are stacked, and the terminals are formed in a rectangular island shape on the top surface of the multilayer board, and the inner layer of the multilayer board has the internal A circuit board, wherein wiring is formed, and the internal wiring and the terminal are connected through a through hole or IVH. A flexible substrate on which a large number of external wirings connected to a large number of terminals of the circuit board according to claim 1 are formed,
A large number of the external wirings are grouped for each predetermined number corresponding to the predetermined number of terminals included in the one block,
The predetermined number of external wirings in each set extends in the vertical direction in a stripe shape, and the front end side connected to the terminal is bent toward one of the left and right so as to face the terminal, and A flexible substrate characterized in that a region laminated and connected to the terminal is formed in a line segment region from the tip of each external wiring to the bending point.

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