CN100339881C - Driving IC sealing assembly of liquid-crystal displaying device - Google Patents
Driving IC sealing assembly of liquid-crystal displaying device Download PDFInfo
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- CN100339881C CN100339881C CNB031427065A CN03142706A CN100339881C CN 100339881 C CN100339881 C CN 100339881C CN B031427065 A CNB031427065 A CN B031427065A CN 03142706 A CN03142706 A CN 03142706A CN 100339881 C CN100339881 C CN 100339881C
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Abstract
The present invention relates to a drive IC sealing assembly of a liquid crystal display. The present invention aims to provide a display device part for compensating offset errors, preventing a broken circuit and a short circuit, and improving the quality of products. The present invention comprises a drive IC, a soft carrier plate and a display panel, wherein the surface of the drive IC is provided with a plurality of projections; a plurality of IC pins are distributed on the soft carrier plate; the circumference of the display panel is provided with a plurality of electrode pins; each IC pin is provided with an inner pin and an outer pin which are coupled with the projections of the drive IC. The outer pins extend to the circumference of the soft carrier plate, the outer pins are arranged in a linear mode, and one outer pin is used as an outer contraposition pin. The electrode pins correspond to the outer pins, and one electrode pin corresponding to the outer contraposition pin is used as a contraposition electrode pin. The soft carrier plate and the display panel use the outer contraposition pin and the contraposition electrode pin as a contraposition center, the area of each outer pin and the area of each electrode pin are outwards and gradually increased from the contraposition center, and the distance between the two adjacent outer pins and the distance between the two adjacent electrode pins are outwards and gradually increased from the contraposition center.
Description
Technical field
The invention belongs to the display device parts, particularly a kind of liquid crystal display-driving IC package assembling.
Background technology
Along with the quick progress of membrane transistor (TFT-LCD) manufacturing technology and possess advantages such as light, thin, power saving, radiationless line, make LCD be widely used in the various electronic products such as personal digital assistant device (PDA), notebook computer, digital camera, Video Camera, walking circuit.Add the positive input research and development of industry and adopt the production equipment that maximizes, make the continuous lifting of quality and the price of LCD continue to descend, therefore make the application of LCD enlarge rapidly.
As shown in Figure 1, known LCD module 10 comprises display pannel 11, module backlight 12, soft carrier plate 13, circuit board 14 and framework 15.
In addition, as Fig. 2, shown in Figure 3, soft carrier plate 13 surfaces are provided with several IC pins, one end of IC pin is interior pin, the other end is outer pin 21, and wherein, interior pin is to combine with the projection of drive IC 16,21 of outer pins are to extend to around the soft carrier plate 13, and are connected with the electrode pin 22 of display pannel 11 respectively or are connected with circuit board 14.
15 of frameworks are the outsides that is installed on LCD module 10, and use its inner member of protection and avoid suffering external force and destroy.
As Fig. 2, shown in Figure 3, the outer pin 21 that combines with the electrode pin 22 of display pannel 11 on the known soft carrier plate 13 be with linear array around soft carrier plate 13, wherein the area of each outer pin 21 is all identical, and the spacing between any two adjacent outer pins 21 is all identical.Similarly, electrode pin 22 also is to be arranged at around the display pannel 11 with linear array, and wherein the area of each electrode pin 22 is all identical, and the spacing of any two adjacent electrode pins 22 is all identical.The area of the area of each outer pin 21 and each electrode pin 22 can be identical or inequality, and the spacing between the spacing between any two adjacent outer pins 21 and any two adjacent electrode pins 22 must be identical, to guarantee that each outer pin 21 can both be corresponding with an electrode pin 22, so that carry out hot pressing.
When carrying out hot pressing between outer pin 21 and the electrode pin 22, between soft carrier plate 13 and display pannel 11, be provided with the Anisotropically conductive film (ACF) 23 that one deck inside has several Anisotropically conductive balls 24, Anisotropically conductive film 23 is behind the process hot pressing, its inner Anisotropically conductive ball 24 is to be connected with outer pin 21 and electrode pin 22 respectively, and the drive IC of soft carrier plate 13 and the pixel electrode formation of display pannel 11 are electrically conducted.
Yet known techniques must earlier be carried out contraposition with machine before hot pressing, can correctly be connected between outer pin 21 and the electrode pin 22 guaranteeing.Wherein the method for contraposition mainly be outside several in pin 21 a selected outer pin as pin 21a contraposition outside, and by selected in several electrode pins 22 and contraposition outward the corresponding electrode pin of pin 21a as contraposition electrode pin 22a.As shown in Figure 2, if with the outer pin of centre and electrode pin as outer pin 21a of contraposition and contraposition electrode pin 22a, then pressing place of outer pin 21a of contraposition and contraposition electrode pin 22a then is the contraposition center.After pin 21a and contraposition electrode pin 22a have finished contraposition outside the pressing machine is being determined contraposition, then will all outer pins 21 carry out hot pressing, the drive IC on the soft carrier plate 13 and the pixel electrode formation of display pannel 11 are electrically conducted with whole electrode pins 22.
Under ideal state, known techniques can make each outer pin 21 accurately combine with corresponding electrode pin 22 really, but in fact, because of outer pin 21 is to be arranged at respectively on soft carrier plate 13 and the glass substrate 11 with electrode pin 22, wherein the material of soft carrier plate 13 mainly is a polymeric membrane, it is a lot of that its thermal expansivity obviously exceeds glass substrate, therefore, also big than glass substrate for the variation of expanding with heat and contract with cold.But because known techniques is not considered the difference of unlike material thermal expansivity, therefore, pin 21a and contraposition electrode pin 22a are accurately outside the contraposition except contraposition, besides pin 21 and 22 of electrode pins can produce the phenomenon of contraposition skew because of influence of temperature variation for they, particularly far away more apart from the contraposition center, the phenomenon of its contraposition skew is obvious more, and its result will cause opening circuit or situation of short circuit between outer pin 21 and the electrode pin 22.
As Fig. 4, Fig. 5, Fig. 6, shown in Figure 7, in known techniques outside several in pin 21 and several electrode pin 22 hot pressing processes, because temperature variation, several outer pins 21 are expanded when being greater than or less than several electrode pins 22 expansions, outer pin 21 causes pressing bad with the skew of electrode pin 22 hot pressings, and far away more apart from the contraposition center, the trend that the skew that its pressing produced then is significantly increased.Do not contact if cause outer pin 21 and electrode pin 22 to stagger, or can't capture Anisotropically conductive ball 24 to form conducting, then can produce the situation that opens circuit because the outer pin 21 and the contact area of electrode pin 22 are too small because skew is too many.In addition, if outer pin 21 contacts with both sides electrode pin 22 respectively because of offset causes it, or electrode pin 22 the outer pin 21 in both sides contacts because of offset causes respectively, the edge phenomenon that can be short-circuited then.
In view of the manufacturing technology of present LCD internal electronic element more and more accurate, relatively when designing, can't overcome the offset error of contraposition that hot pressing causes for the IC pin, not only make the yield of product to promote effectively, more make the design of IC pin can't move towards sophistication, and then have influence on the quality of product.
Summary of the invention
The purpose of this invention is to provide a kind of compensating offset error, prevent to open circuit, the liquid crystal display-driving IC package assembling of short circuit, raising product yield and quality.
The present invention includes the surface be provided with several projections drive IC, lay several IC pins soft carrier plate and around be provided with the display pannel of several electrode pins; Each IC pin all has interior pin and outer pin, wherein interior pin and lug of drive IC coupling, and several outer pins extend to around the soft carrier plate and with linear mode and arrange, and one of them outer pin is as the outer pin of contraposition; Several electrode pins are corresponding to several outer pins, and itself and the outer corresponding electrode pin of pin of contraposition are the contraposition electrode pin, between soft carrier plate and the display pannel with the outer pin of contraposition and contraposition electrode pin as the contraposition center; The area of each outer pin and each electrode pin is outwards increased gradually by the contraposition center; And the spacing system that reaches between the adjacent two outer pins between adjacent two electrode pins is outwards increased gradually by the contraposition center, also compensates outer pin and electrode pin with correspondence and is offset because of the contraposition that temperature change was produced.
Wherein:
Be provided with the Anisotropically conductive film that one deck inside has several Anisotropically conductive balls between soft carrier plate and the display pannel; The Anisotropically conductive ball system of Anisotropically conductive film inside is connected with outer pin and electrode pin respectively.
The area of outer pin of soft carrier plate contraposition and display pannel contraposition electrode pin is to be enough to catch the required minimum area of Anisotropically conductive ball.
The material of soft carrier plate mainly is a polymeric membrane; Display pannel is a glass substrate, which is provided with several pixel electrodes.
Drive IC is gate control wafer or source electrode control wafer, and controls the pixel electrode switch or signal is provided with active mode.
Outer pin of the contraposition of contraposition center and contraposition electrode pin are to be positioned at the outer pin of the middle IC pin of soft carrier plate and to be positioned at the middle electrode pin of display pannel.
Drive IC is packaged on the soft carrier plate with the automatic joining technique of winding.
Drive IC is packaged on the soft carrier plate with crystal grain mantle joining technique.
Since the present invention includes the surface be provided with several projections drive IC, lay several IC pins soft carrier plate and around be provided with the display pannel of several electrode pins; Each IC pin all has interior pin and outer pin, wherein interior pin and lug of drive IC coupling, and several outer pins extend to around the soft carrier plate and with linear mode and arrange, and one of them outer pin is as the outer pin of contraposition; Several electrode pins are corresponding to several outer pins, and itself and the outer corresponding electrode pin of pin of contraposition are the contraposition electrode pin, between soft carrier plate and the display pannel with the outer pin of contraposition and contraposition electrode pin as the contraposition center; The area of each outer pin and each electrode pin is outwards increased gradually by the contraposition center; And the spacing system that reaches between the adjacent two outer pins between adjacent two electrode pins is outwards increased gradually by the contraposition center, also compensates outer pin and electrode pin with correspondence and is offset because of the contraposition that temperature change was produced.Outwards increase gradually by the contraposition center by each the outer pin of soft carrier plate and the area of each electrode pin of display pannel, be located at the contact area of the outside outer pin and electrode pin with increase, breaking phenomena take place because of contact area is too small with outer pin and electrode pin outside avoiding; Spacing system between adjacent two outer pins and adjacent two electrode pins is outwards increased gradually by the contraposition center, be located at spacing between the outside adjacent two outer pins and adjacent two electrode pins with increase, avoid outer pin to contact with the side electrode pin because of the contraposition skew or electrode pin is offset because of contraposition and side outward pin 422 contact the phenomenon that is short-circuited.Not only the compensating offset error, prevent to open circuit, short circuit, and improve product yield and quality, thereby reach purpose of the present invention.
Description of drawings
Fig. 1, be known LCD modular structure diagrammatic side view.
Fig. 2, be that the outer pin of known soft carrier plate combines synoptic diagram (under the ideal state) with display pannel top electrode pin.
Fig. 3, be A portion partial enlarged drawing among Fig. 2.
Fig. 4, be that the outer pin of known soft carrier plate combines synoptic diagram (several outer pins expansions are greater than several electrode pins expansions) with display pannel top electrode pin.
Fig. 5, be B portion partial enlarged drawing among Fig. 4.
Fig. 6, be that the outer pin of known soft carrier plate combines synoptic diagram (several outer pins expansions are less than several electrode pins expansions) with display pannel top electrode pin.
Fig. 7, be C portion partial enlarged drawing among Fig. 6.
Fig. 8, for structural representation cut-open view of the present invention.
Fig. 9, combine synoptic diagram (under the ideal state) with display pannel top electrode pin for the outer pin of soft carrier plate of the present invention.
Figure 10, combine synoptic diagram (several outer pins expansions are greater than several electrode pins expansions) with display pannel top electrode pin for the outer pin of soft carrier plate of the present invention.
Figure 11, combine synoptic diagram (several outer pins expansions are greater than several electrode pins expansions) with display pannel top electrode pin for the outer pin of soft carrier plate of the present invention.
Embodiment
The present invention is applicable to that winding engages the technical field of (TAB), crystal grain mantle joint (COF) or flexible circuit board (FPC) automatically.
As shown in Figure 8, it is example that the present invention engages (TAB) automatically with winding, the present invention includes drive IC 41, soft carrier plate (Tape) 42 and display pannel 43.
Drive IC 41 can be gate control wafer or source electrode control wafer, and controls the pixel electrode switch or signal is provided with active mode.
The surface of drive IC 41 is provided with several projections (bumps) 411.Drive IC 41 is packaged on the soft carrier plate 42 with the automatic joining technique of winding (Tape Automated Bonding is called for short TAB).Drive IC can also be packaged on the soft carrier plate by crystal grain mantle (COF) joining technique.
The material of soft carrier plate 42 mainly is a polymeric membrane, is laid with several IC pins (Lead) 44 on it, pin 441 and the outer pin 442 that extends to around the soft carrier plate 42 and arrange with linear mode in each IC pin 44 includes.
As shown in Figure 9, in soft carrier plate 42 several outer pins 442 usually system with the pin centre outside as the outer pin 422a of contraposition, and the spacing between the area of each outer pin 422 and each the adjacent two outer pin 422 is the outwards increase gradually of contraposition center by pin 422a outside the contraposition.
Drive IC 41 binds integrator with soft carrier plate 42, in several of soft carrier plate 41 pin 441 respectively with drive IC 41 on several projections 411 couplings, several outer pins 442 that soft carrier plate 42 is arranged with linear mode are convenient to carry out hot pressing with display pannel 43.
As shown in Figure 9, display pannel 43 is to be made up of glass substrate, which is provided with several liquid crystal born of the same parents (cell), all has a pixel electrode on each liquid crystal born of the same parents, and utilize an electrode pin 45 extend to display pannel 43 around; Several electrode pins 45 are to arrange and corresponding with several outer pins 422 with linear mode, so that can be connected to each other with soft carrier plate 42 IC pin 44 on every side.
Corresponding also outer pin 422 of compensation of the area that each outer pin 422 and electrode pin 45 increase and electrode pin 45 are principle because of the contraposition skew that temperature change produced.
Corresponding also outer pin 422 of compensation of the spacing that increases between spacing that increases between the adjacent two outer pins 422 and adjacent two electrode pins 45 and electrode pin 45 are principle because of the contraposition skew that temperature change produced.
Between soft carrier plate 42 and display pannel 43, be provided with the Anisotropically conductive film (ACF) 46 that one deck inside has several Anisotropically conductive balls 461, Anisotropically conductive film 46 is behind the process hot pressing, its inner Anisotropically conductive ball 461 is to be connected with outer pin 422 and electrode pin 45 respectively, and the electrode pin 45 of outer pin 422 and display pannel 43 of the IC pin 44 of soft carrier plate 42 is formed electrically conduct.
As Figure 10, shown in Figure 11, the present invention when carrying out hot pressing with machine, be junction with outer pin 422a of contraposition and contraposition electrode pin 45a as the contraposition center, and earlier outer pin 422a of contraposition and contraposition electrode pin 45a are carried out contraposition; Then, again each outer pin 422 and each electrode pin 45 are carried out pressing.
By the explanation of prior art as can be known, in the process of hot pressing, be subjected to the influence of temperature change, the expansion of outer pin 422 is greater than or less than the expansion of electrode pin 45, outside pin 422a and contraposition electrode pin 45 can accurately be aimed at except contraposition, other outer pins 422 and electrode pin 45 all can produce the contraposition skew, and particularly apart from the contraposition center more at a distance, the contraposition side-play amount that it produced is high more.
But, the present invention outwards increases gradually by the contraposition center because being each the outer pin 422 of soft carrier plate 42 and the area of display pannel 43 each electrode pin 45, using increases the contact area of being located at outer pin 422 in the outside and electrode pin 45, with outer pin 422 and the electrode pin 45 of avoiding the outside breaking phenomena takes place because of contact area is too small; Spacing system between adjacent two outer pins 422 and adjacent two electrode pins 45 is outwards increased gradually by the contraposition center, using increases the spacing be located between the outside adjacent two outer pins 422 and adjacent two electrode pins 45, with avoid outer pin 422 to contact with side electrode pin 45 because of the contraposition skew or electrode pin 45 is offset because of contraposition and side outside pin 422 contact the phenomenon that is short-circuited.
Though the area that increases the spacing of two adjacent outer pins 422 and outer pin 422 may increase the entire area of soft carrier plate 42, but because the present invention is as contraposition reference with the contraposition center, in theory, outer pin 422a of contraposition and contraposition electrode pin 45a are the most accurate in the contraposition of center contraposition place, the side-play amount minimum, therefore, the area of outer pin 422a of contraposition and contraposition electrode pin 45a can be contracted to and be enough to catch Anisotropically conductive ball 24 required minimum areas and get final product, therefore, the present invention can be by the outer pin 422a of the contraposition of dwindling the contraposition center, the area of contraposition electrode pin 45a and dwindle contraposition center adjacent two outer pins 422, spacing between adjacent two electrode pins 45, and increase the outer pin 422 in the contraposition center outside simultaneously, the adjacent two outer pins 422 in the area of electrode pin 45 and the outside, contraposition center, spacing between adjacent two electrode pins 45, and then, make the area of soft carrier plate 42 integral body be unlikely to have too big change.
In sum, the present invention can make the design of pin more accurate, and can promote the fiduciary level of pin pressing.Certainly, the present invention is not limited to liquid crystal display-driving IC, and it is applicable to the hot pressing technology of two different material electronic component pins.
Claims (8)
1, a kind of liquid crystal display-driving IC package assembling, it comprise the surface be provided with the drive IC of several projections, lay several IC pins soft carrier plate and around be provided with the display pannel of several electrode pins; Each IC pin all has interior pin and outer pin, wherein interior pin and lug of drive IC coupling, and several outer pins extend to around the soft carrier plate and with linear mode and arrange, and one of them outer pin is as the outer pin of contraposition; Several electrode pins are corresponding to several outer pins, and itself and the outer corresponding electrode pin of pin of contraposition are the contraposition electrode pin, between soft carrier plate and the display pannel with the outer pin of contraposition and contraposition electrode pin as the contraposition center; The area that it is characterized in that described each outer pin and each electrode pin is outwards increased gradually by the contraposition center, and the spacing system that reaches between the adjacent two outer pins between adjacent two electrode pins is outwards increased gradually by the contraposition center, also compensates outer pin and electrode pin with correspondence and is offset because of the contraposition that temperature change was produced.
2, liquid crystal display-driving IC package assembling according to claim 1 is characterized in that being provided with between described soft carrier plate and the display pannel Anisotropically conductive film that one deck inside has several Anisotropically conductive balls; The Anisotropically conductive ball system of Anisotropically conductive film inside is connected with outer pin and electrode pin respectively.
3, liquid crystal display-driving IC package assembling according to claim 2 is characterized in that the area of outer pin of described soft carrier plate contraposition and display pannel contraposition electrode pin is to be enough to catch the required minimum area of Anisotropically conductive ball.
4, liquid crystal display-driving IC package assembling according to claim 1, the material that it is characterized in that described soft carrier plate mainly is a polymeric membrane; Display pannel is a glass substrate, which is provided with several pixel electrodes.
5, liquid crystal display-driving IC package assembling according to claim 1 is characterized in that described drive IC is gate control wafer or source electrode control wafer, and controls the pixel electrode switch or signal is provided with active mode.
6, liquid crystal display-driving IC package assembling according to claim 1 is characterized in that the outer pin of contraposition of described contraposition center and contraposition electrode pin are to be positioned at the outer pin of the middle IC pin of soft carrier plate and to be positioned at the middle electrode pin of display pannel.
7, liquid crystal display-driving IC package assembling according to claim 1 is characterized in that described drive IC is packaged on the soft carrier plate with the automatic joining technique of winding.
8, liquid crystal display-driving IC package assembling according to claim 1 is characterized in that described drive IC is packaged on the soft carrier plate with crystal grain mantle joining technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031427065A CN100339881C (en) | 2003-06-04 | 2003-06-04 | Driving IC sealing assembly of liquid-crystal displaying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031427065A CN100339881C (en) | 2003-06-04 | 2003-06-04 | Driving IC sealing assembly of liquid-crystal displaying device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1553430A CN1553430A (en) | 2004-12-08 |
| CN100339881C true CN100339881C (en) | 2007-09-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031427065A Expired - Lifetime CN100339881C (en) | 2003-06-04 | 2003-06-04 | Driving IC sealing assembly of liquid-crystal displaying device |
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| CN (1) | CN100339881C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102208382A (en) * | 2010-03-29 | 2011-10-05 | 广达电脑股份有限公司 | Integrated circuit package component provided with side-edge pins |
Families Citing this family (8)
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|---|---|---|---|---|
| TWI365428B (en) | 2007-03-08 | 2012-06-01 | Chunghwa Picture Tubes Ltd | Display panel |
| CN101510383B (en) * | 2009-03-26 | 2011-12-07 | 友达光电股份有限公司 | Flat display panel |
| CN103762204B (en) * | 2013-12-25 | 2017-02-15 | 深圳市华星光电技术有限公司 | Chip-on-film module, display panel and display |
| CN105493015B (en) * | 2015-02-06 | 2019-04-30 | 深圳市柔宇科技有限公司 | Capacitance touch screen |
| CN105632382B (en) * | 2016-01-04 | 2018-05-18 | 京东方科技集团股份有限公司 | The method of display device and its detection binding region binding situation |
| CN108205215B (en) * | 2017-12-26 | 2021-06-22 | 张家港康得新光电材料有限公司 | Method for connecting display panel and circuit board |
| CN108198808A (en) * | 2017-12-27 | 2018-06-22 | 武汉华星光电半导体显示技术有限公司 | A kind of pressing piece arrangement architecture and OLED display screen |
| CN113075824B (en) * | 2021-04-06 | 2022-12-13 | 天马微电子股份有限公司 | Display module, manufacturing method thereof and display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10214935A (en) * | 1997-01-30 | 1998-08-11 | Mitsubishi Electric Corp | Semiconductor ic package and its mounting board |
| JP2000137239A (en) * | 1998-10-30 | 2000-05-16 | Optrex Corp | Liquid crystal display panel |
| JP2000171820A (en) * | 1998-12-07 | 2000-06-23 | Matsushita Electric Ind Co Ltd | Liquid crystal display panel |
| JP2000312070A (en) * | 1999-04-27 | 2000-11-07 | Optrex Corp | Method of connecting electrode terminal |
| US20020080316A1 (en) * | 2000-12-26 | 2002-06-27 | Ming-Cheng Tsai | Liquid crystal display apparatus and method for checking the joining accuracy thereof |
| JP2003043517A (en) * | 2001-07-31 | 2003-02-13 | Optrex Corp | Liquid crystal display panel and lighting inspection method therefor |
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2003
- 2003-06-04 CN CNB031427065A patent/CN100339881C/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10214935A (en) * | 1997-01-30 | 1998-08-11 | Mitsubishi Electric Corp | Semiconductor ic package and its mounting board |
| JP2000137239A (en) * | 1998-10-30 | 2000-05-16 | Optrex Corp | Liquid crystal display panel |
| JP2000171820A (en) * | 1998-12-07 | 2000-06-23 | Matsushita Electric Ind Co Ltd | Liquid crystal display panel |
| JP2000312070A (en) * | 1999-04-27 | 2000-11-07 | Optrex Corp | Method of connecting electrode terminal |
| US20020080316A1 (en) * | 2000-12-26 | 2002-06-27 | Ming-Cheng Tsai | Liquid crystal display apparatus and method for checking the joining accuracy thereof |
| JP2003043517A (en) * | 2001-07-31 | 2003-02-13 | Optrex Corp | Liquid crystal display panel and lighting inspection method therefor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102208382A (en) * | 2010-03-29 | 2011-10-05 | 广达电脑股份有限公司 | Integrated circuit package component provided with side-edge pins |
| CN102208382B (en) * | 2010-03-29 | 2013-05-22 | 广达电脑股份有限公司 | Integrated circuit package component provided with side-edge pins |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1553430A (en) | 2004-12-08 |
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