JP2000137239A - Liquid crystal display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform efficiently an intermediate functional inspection by a pin probe system which is performed prior to the mounting of a chip as for a COG(chip-on-glass) type liquid crystal display panel. SOLUTION: In a COG type liquid crystal display panel in which end parts of respective leader electrodes 20 are arranged as bump connection parts A at which they are connected to bumps of an IC chip in a chip mounting area MA which is provided on a terminal part 121. Extension parts B which are extended inner sides of the area MA than the bump connection parts A are provided in respective leader electrodes 20 and widened-width lands R having width wider than line width of the bump connection parts A are formed at terminals of the extension parts B.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a COG (Chip)
More specifically, the present invention relates to a liquid crystal display panel that can easily perform an intermediate function test by a pin probe method before mounting an IC chip.

[0002]

2. Description of the Related Art In a COG type liquid crystal display panel, an IC (or LSI) chip for driving a liquid crystal is directly mounted in a flip chip state on a terminal portion provided continuously on one transparent substrate side.

For this reason, a chip mounting region is provided in the terminal portion, and within the chip mounting region, an end portion of each extraction electrode connected to the transparent display electrode is connected to a bump connection portion connected to a bump of an IC chip. Is arranged as.

[0004]

Before mounting an IC chip, an intermediate function test such as a short / open test or a lighting test of each electrode is essentially performed. Generally, in this inspection, a pin probe method in which a conductive contact pin (probe) is brought into contact with a bump connection portion of an extraction electrode to apply a test signal is employed, but this has the following problems. Was.

That is, in recent years, the electrode pattern has been increasingly finer, and its pitch dimension has been reduced to about 50 μm. In addition, since a large number of extraction electrodes are gathered in the chip mounting area, even if the conductive contact pins are alternately brought into contact with, for example, the bump connection portion, the alignment accuracy of the conductive contact pins and the like are not guaranteed. Due to the relationship, the workability was poor, and it sometimes took several minutes to several tens of minutes for one probe operation. In particular, in the case where a plurality of IC chips are mounted, a longer time is required, and improvement in this respect has been demanded.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an object of the present invention is to easily and surely contact a conductive contact pin even with a high-definition electrode pattern. It is another object of the present invention to provide a liquid crystal display panel that can perform the above-described operations.

According to the present invention, the above object is achieved by laminating a pair of transparent substrates on which a transparent display electrode is formed via a peripheral sealing material, and forming the transparent substrate on a terminal portion formed on the one transparent substrate side. And IC (or LSI) for driving liquid crystal
A chip mounting area on which the chip is mounted is provided, and an end of each extraction electrode connected to the transparent display electrode is arranged as a bump connection part connected to a bump of the IC chip in the chip mounting area. In the COG type liquid crystal display panel described above, each of the extraction electrodes is provided with an extension that extends further into the chip mounting region than the bump connection, and the extension of the bump connection is provided at the end of the extension. This is achieved by forming a widened land having a width larger than the line width.

According to this, even if the intermediate function test is performed by the pin probe method, the conductive contact pins need only be brought into contact with the wide wide lands at the end portions of the respective lead electrodes. Can be widely taken.

In the present invention, it is preferable that the extension portions of the respective extraction electrodes are alternately formed as a first extension portion having a longer length and a second extension portion having a shorter length.
It is possible to cope with a case where the arrangement pitch of the extraction electrodes is narrow.

In this case, it is possible to cope with a narrower pitch by making the first extension portion narrower than the line width of the soldering portion and wiring it between the widened lands of the second extension portion. Become.

Further, as a countermeasure against a narrow pitch, the length of each of the extension portions of each of the extraction electrodes may be gradually increased or decreased as a predetermined number of groups. In any case, the shape of the widened land can be appropriately selected, such as a polygon represented by a quadrangle, a circle, or a flag.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS The invention will now be described in more detail with reference to an embodiment shown in the drawings.

First, the structure of the liquid crystal display panel 10 will be schematically described with reference to the plan view of FIG. 1 and FIG. 2 which is a sectional view thereof. The liquid crystal display panel 10 is composed of a front glass substrate 11 and a rear glass substrate 12. Have. Although not shown, an IT surface is provided on the opposing surface side of each of the substrates 11 and 12.
A transparent display electrode made of O (Indium Tin Oxide) is formed.

The substrates 11 and 12 are bonded together through a peripheral sealing material 13 so as to generate a predetermined cell gap in which liquid crystal is sealed therebetween. In this embodiment, the substrates 11 and 12 are attached to the rear glass substrate 12 side. Terminal portions 121 are provided continuously.

On the terminal portion 121, an extraction electrode of a transparent display electrode is also formed of ITO, and
A liquid crystal driving IC (or L
SI) The chip 14 is mounted in a flip chip state.

Incidentally, on the rear glass substrate 12 side,
The extraction electrode is formed in series with the transparent display electrode. The transparent display electrode on the front glass substrate 11 side is connected to the terminal portion 121 via a transfer material such as a conductive bead included in the peripheral sealing material 13. Is connected to a predetermined extraction electrode. Further, the polarizing plate 1 is provided on each of the substrates 11 and 12.
5 and 15 are respectively stuck.

FIG. 3 is an enlarged plan view of a main part of the terminal portion 121 before the IC chip 14 is mounted. A rectangular frame shown in FIG. 3 is a chip mounting area MA. Terminal 1
On the wiring 21, the extraction electrodes 20 are wired so as to be concentrated in the chip mounting area MA.

In this embodiment, the ends of the extraction electrodes 20 are drawn into the chip mounting area MA from three sides. Since the extraction electrodes 20 on each side have the same configuration, the configuration will be described here on behalf of the connection terminal 20 on the right side.

On the right side of the chip mounting area MA, nine lead-out electrodes 21 to 29 are provided on the peripheral sealing material 1 from the transparent display electrode side.
It is pulled out in a strip shape under 3. Each extraction electrode 21
The reference numerals 29 to 29 denote a bump connection portion A in which a predetermined length after entering the chip mounting area MA is connected to a bump of the IC chip 14. For convenience of description, the bump connection portion A is hatched. Is attached. In addition, each bump connection part A has the same width.

Each of the bump connection portions A of the extraction electrodes 21 to 29 is provided with an extension portion B extending in a direction opposite to the peripheral seal material 13, that is, further extending toward the chip mounting area MA. A rectangular wide land R having a width larger than the width of the bump connection part A is formed at the end part (tip part) of each extension part B. The extended portion B, including the wide land R, is not used for bump connection of the IC chip 14.

In this embodiment, the lengths of the extending portions B are alternately different, and are arranged in a so-called staggered manner. That is, the odd-numbered extraction electrodes 21, 23, 23
Each of the extension portions (second extension portions) B of 25, 27, and 29 has a short length, whereas the even-numbered extraction electrodes 22, 2
Each of the extension portions (first extension portions) B of 4, 26, and 28 has a length exceeding the odd-numbered widened land R.

As described above, since the widened land R is formed at the end of each of the extraction electrodes 21 to 29, the IC chip 1
In the case where the intermediate function test is performed by the pin probe method before the mounting of the semiconductor device 4, the conductive contact pins are brought into contact with the wide lands R as shown by black circles in FIG. Strict positioning accuracy is not required as compared with the case where the conductive contact pin is brought into contact with the connection portion A. By the way, according to the present invention, the time required for one probe operation could be made within 10 seconds.

Next, a first modification of FIG. 4 will be described. In this first modified example, each extension B of the even-numbered extraction electrodes 22, 24, 26, 28 having a longer length is
Each of the widened lands R of the odd-numbered extraction electrodes 21, 23, 25, 27, 29 has a width smaller than the width of the bump connection portion A.
It extends toward the inside of the chip mounting area MA through the space. Thereby, as a countermeasure against a narrow pitch, the extraction electrodes 21 to
The pitch between the 29 bump connection portions A can be made narrower in correspondence with the pitch between the bumps of the IC chip 14.

In the above embodiment and the first modification,
Although the widened land R provided at the end of the extraction electrode 20 has a rectangular shape, the widened land R may have a circular so-called bulb shape as shown in FIG. 5 as a second modification.

As shown in FIG. 6 as a third modification, the extension B of the extraction electrode 20 is extended to have the same width as the bump connection A, and a flag-like wide land R is provided at the end. You may. In this case, a predetermined number of extraction electrodes 20
As a group, the length of the extended portions B is gradually increased or decreased, so that the width between the extended portions B is not reduced every other as in the above-described embodiment. The pitch can be reduced.

In the third modification shown in FIG. 6, five extraction electrodes 2 are provided.
0a to 20e as one group, and a leftmost extraction electrode 20a.
From the center extraction electrode 20c to the rightmost extraction electrode 20e, the extension B is shortened by approximately the width of the extension land R. Therefore, the overall shape is a mountain shape with the central extraction electrode 20c as the apex.

This concept can also be applied to the above-described embodiment of FIG. 3, which is a fourth modification of FIG. For example, with the three extraction electrodes 20p, 20q, and 20r as a group of repeating units, the extension B of the leftmost first extraction electrode 20p has the same width as the bump connection part A and has the shortest length. Then, a quadrangular wide land R is formed at the terminal end.

With respect to the next second extraction electrode 20q, the extended portion B has a width smaller than the width of the bump connection portion A and exceeds the widened land R of the first extracted electrode 20p. Form R. As for the third third extraction electrode 20r, the extension B is made narrower than the bump connection part A, the length is further beyond the widened land R of the second extraction electrode 20q, and a square is formed at the end. Is formed.

As described above, various modifications can be presented as measures to reduce the pitch. In any case, the extension B is connected to the bump connecting portion A of the extraction electrode 20. Since the widened land R is formed at the end portion, even if the pitch of the bump connection portion A is narrowed, the positioning accuracy of the conductive contact pins (probes) is not required to be strict and the IC chip 14 is not required. Intermediate function inspection can be performed efficiently before mounting.

[0030]

As described above, according to the present invention,
In a COG type liquid crystal display panel in which an end portion of each extraction electrode is arranged as a bump connection portion where an end portion of each extraction electrode is connected to a bump of an IC chip in a chip mounting area provided on a terminal portion, each extraction electrode has a bump. Each extension electrode is provided by providing an extended portion extending further in the chip mounting area than the connection portion, and forming an enlarged land having a width larger than the line width of the bump connection portion at the end of the extension portion. However, even if the pattern is a high-definition pattern, the conductive contact pins need only be brought into contact with the wide lands, so that the intermediate function test by the pin probe method before mounting the IC chip can be efficiently performed.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing a configuration of a COG type liquid crystal display panel according to the present invention.

FIG. 2 is a cross-sectional view of the liquid crystal display panel.

FIG. 3 is an enlarged plan view of an essential part showing an embodiment of an extraction electrode formed on a terminal portion of the liquid crystal display panel.

FIG. 4 is an enlarged plan view of a main part showing a first modification of the embodiment.

FIG. 5 is an enlarged plan view of a main part showing a second modification of the embodiment.

FIG. 6 is an enlarged plan view of a main part showing a third modification of the embodiment.

FIG. 7 is an enlarged plan view of a main part showing a fourth modification of the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Liquid crystal display panel 11 Front glass substrate 12 Rear glass substrate 121 Terminal part 13 Peripheral sealing material 14 IC chip 20 Leader electrode A Bump connection part B Extension part R Widening land MA Chip mounting area

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H092 GA32 GA40 GA60 MA34 MA57 NA30 PA01 PA03 4M106 AA02 AA04 AA20 BA01 BA14 DD13 5E336 AA04 BB01 BC34 CC32 DD01 EE01 GG30 5G435 AA17 BB12 EE33 EE37 EE41 FF00 FF05

Claims (4)

[Claims] 1. A pair of transparent substrates having transparent display electrodes formed thereon are bonded together via a peripheral sealing material, and a liquid crystal driving IC (IC) is mounted on a terminal portion formed on the one transparent substrate side. Or a chip mounting area on which a chip is mounted, and a bump connection in which an end of each extraction electrode connected to the transparent display electrode is connected to a bump of the IC chip in the chip mounting area. In the COG type liquid crystal display panel arranged as a portion, each of the extraction electrodes has an extension portion further extended into the chip mounting region than the bump connection portion, and the extension electrode is provided at an end of the extension portion. A liquid crystal display panel having a widened land having a width larger than a line width of a bump connection portion. 2. The extension according to claim 1, wherein the extension of each of the extraction electrodes alternately comprises a first extension having a longer length and a second extension having a shorter length. Liquid crystal display panel as described. 3. The device according to claim 2, wherein the first extension portion has a width smaller than a line width of the bump connection portion and is wired between the widened lands of the second extension portion. Liquid crystal display panel. 4. The liquid crystal display panel according to claim 1, wherein the length of each of the extension portions of each of the extraction electrodes is gradually increased or decreased as a predetermined number of groups.