JPH07297541A - Method for mounting circuit on board - Google Patents
Method for mounting circuit on boardInfo
- Publication number
- JPH07297541A JPH07297541A JP10914794A JP10914794A JPH07297541A JP H07297541 A JPH07297541 A JP H07297541A JP 10914794 A JP10914794 A JP 10914794A JP 10914794 A JP10914794 A JP 10914794A JP H07297541 A JPH07297541 A JP H07297541A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- comb
- board
- substrate
- teeth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、各種フラットパネルデ
ィスプレイ、液晶センサあるいは液晶シャッタ等に使用
される基板に駆動回路等の実装、その他マルチチップモ
ジュールの高密度実装する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting a driving circuit or the like on a substrate used for various flat panel displays, liquid crystal sensors, liquid crystal shutters, etc., and other high density mounting.
【0002】[0002]
【従来の技術】従来、各種表示装置として、液晶表示、
プラズマ表示、エレクトロルミネッセンス(EL)表
示、あるいは発光ダイオード(LED)表示等のフラッ
トパネル・ディスプレイが知られている。これらのディ
スプレイパネルには、通常透明なガラス基板にマトリッ
クス状に配列された多くの表示ドット(画素)を構成す
る透明電極が高精度にパターン形成されており、その基
板周縁のくし歯状の電極に駆動回路等が接続される。2. Description of the Related Art Conventionally, liquid crystal displays have been used as various display devices.
Flat panel displays such as plasma display, electroluminescence (EL) display, and light emitting diode (LED) display are known. In these display panels, transparent electrodes that form a large number of display dots (pixels) normally arranged in a matrix on a transparent glass substrate are patterned with high precision, and the comb-teeth-shaped electrodes on the periphery of the substrate are formed. A drive circuit or the like is connected to.
【0003】近年、表示パネルの表示用基板への駆動回
路等の実装方法としては、例えば、ポリイミドやポリエ
ステル等の材質からなるフィルムキャリア上に銅をラミ
ネートして電極をパターニングしたテープに、半導体集
積回路(IC)等の駆動用素子(チップ)をボンディン
グし、それを表示用基板周縁の電極部分にハンダや熱圧
着により接続するTAB(Tape Automated Bonding)方
式、あるいは裸の回路素子(ベアチップ)を表示用基板
周縁に直接搭載するCOG(Chip On Glass )方式等が
使用されるようになっている。In recent years, as a method of mounting a drive circuit or the like on a display substrate of a display panel, for example, a semiconductor integrated on a tape obtained by laminating copper on a film carrier made of a material such as polyimide or polyester and patterning electrodes. A TAB (Tape Automated Bonding) method in which a driving element (chip) such as a circuit (IC) is bonded and is connected to an electrode portion around the display substrate by soldering or thermocompression bonding, or a bare circuit element (bare chip) is used. A COG (Chip On Glass) method or the like, which is directly mounted on the peripheral edge of the display substrate, has been used.
【0004】ところが、TAB方式では、テープにポリ
イミドやポリエステル等の樹脂フィルムを使用している
ため、表示用基板との間の熱膨張係数の違いから広い面
積のものでは、チップ間隔に違いが生じて接続が困難に
なり、また接続後には誤動作を生じ、100μmピッチ
程度が限界とされている。また、COG方式では、表示
用のガラス基板に直接素子を搭載するため、不良集積回
路の検査、交換あるいは修正(リペア)が困難となり、
また集積回路の設計に応じて表示用のガラス基板側の回
路パターンを種々変更する必要があり、広い面積のガラ
ス基板の一部分の不良が、全体の不良になり歩留りが悪
くコスト高になり、商品化が困難になる問題点があっ
た。However, in the TAB method, since a resin film such as polyimide or polyester is used for the tape, a difference in the coefficient of thermal expansion between the tape and the display substrate causes a difference in the chip interval in a wide area. Connection becomes difficult, and a malfunction occurs after connection, and the pitch is about 100 μm. Further, in the COG method, since the element is directly mounted on the glass substrate for display, it becomes difficult to inspect, replace or repair (repair) the defective integrated circuit.
In addition, it is necessary to change the circuit pattern on the glass substrate side for display in accordance with the design of the integrated circuit, and a part of the glass substrate having a large area becomes defective, resulting in poor yield and poor cost. There was a problem that it became difficult to make it.
【0005】これに対して、米国特許第5,084,9
61号には、基板と同じ熱膨張係数を有する細長いガラ
ス基板に、基板のくし歯状周縁電極と同じピッチ間隔の
くし歯状接続電極を有する回路パターンを形成し、必要
な回路を直接搭載した後、基板のくし歯状周縁電極と回
路基板の対応するくし歯状接続電極との間に金属粒子等
を含む異方性導電性接着剤を塗布するとともに圧着し加
熱処理して両者間を電気的に接続する基板の回路実装方
法に関する技術が開示されている。In contrast, US Pat. No. 5,084,9
In No. 61, a circuit pattern having comb-teeth connecting electrodes having the same pitch interval as the comb-teeth peripheral electrodes of the substrate was formed on an elongated glass substrate having the same coefficient of thermal expansion as that of the substrate, and the necessary circuits were directly mounted. After that, an anisotropic conductive adhesive containing metal particles and the like is applied between the comb-teeth peripheral electrode of the substrate and the corresponding comb-teeth connection electrode of the circuit board. A technique relating to a circuit mounting method of substrates to be electrically connected is disclosed.
【0006】[0006]
【発明が解決しようとする課題】しかしながら、このよ
うなくし歯状接続電極を有する回路パターンを形成した
細長いガラス基板による回路実装方法では、基板とガラ
ス基板の対応する電極の接続に、長時間の加熱処理が必
要になるため、基板に悪影響を与える欠点があった。ま
た、異方性導電性接着剤を使用して電極を接続する方法
では、金属粒子を圧着することで多数の電極を同時に電
気的に接続させるため、接続不良が発生するおそれがあ
った。However, in the circuit mounting method using the elongated glass substrate on which the circuit pattern having the comb-teeth-shaped connection electrodes is formed, heating for a long time is required to connect the corresponding electrodes on the substrate and the glass substrate. Since the treatment is required, there is a drawback that the substrate is adversely affected. Further, in the method of connecting electrodes using an anisotropic conductive adhesive, a large number of electrodes are electrically connected at the same time by pressure-bonding metal particles, which may cause connection failure.
【0007】そこで本発明は、基板に対して熱による悪
影響を与えることなく、かつ電気的接続の信頼性を高め
ることができる基板の回路実装方法を提供することを目
的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a circuit mounting method for a substrate, which can improve the reliability of electrical connection without adversely affecting the substrate by heat.
【0008】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明の基板の回路実装方法は、くし歯状周縁電極
を有する電極パターンを形成した基板の周囲に回路を実
装する方法において、前記基板周囲の横方向または縦方
向に沿った細長い板状で同じ熱膨張係数を有するガラス
基板に、前記基板のくし歯状周縁電極と同じピッチ間隔
のくし歯状接続電極を有する回路パターンを形成する工
程と、前記ガラス基板のくし歯状接続電極上にそれぞれ
ハンダバンプを形成する工程と、前記基板のくし歯状周
縁電極とガラス基板の対応するくし歯状接続電極上に形
成したハンダバンプとを当接させ、両基板間に圧着力を
加え該ハンダバンプの頂部をつぶして両電極間を接続す
る工程と、前記接続する工程後に前記基板とガラス基板
との間を硬化剤で固定する工程とを備えるものである。In order to achieve the above object, a circuit mounting method for a substrate of the present invention is a method for mounting a circuit around a substrate on which an electrode pattern having a comb-shaped peripheral electrode is formed. A circuit pattern having comb-teeth connection electrodes with the same pitch interval as the comb-teeth peripheral electrode of the substrate is formed on a glass substrate having a long and narrow plate shape having the same coefficient of thermal expansion along the horizontal direction or the longitudinal direction around the substrate. The step of forming solder bumps on each of the comb-shaped connecting electrodes of the glass substrate, the comb-shaped peripheral electrodes of the substrate and the solder bumps formed on the corresponding comb-shaped connecting electrodes of the glass substrate. And a step of applying a pressing force between the two substrates to crush the top of the solder bump to connect the two electrodes, and a curing agent between the substrate and the glass substrate after the connecting step. Those comprising the step of constant.
【0009】前記ハンダバンプは、くし歯状接続電極上
に沿って複数個形成することが好ましく。また、ハンダ
バンプは、くし歯状接続電極上に沿って隣接するくし歯
状接続電極に対して互いに重ならないようちどり状に形
成することが好ましい。It is preferable that a plurality of the solder bumps be formed along the comb-teeth-shaped connection electrode. Further, it is preferable that the solder bumps are formed in a comb shape so as not to overlap with the adjacent comb-teeth connection electrodes along the comb-teeth connection electrodes.
【0010】[0010]
【作用】本発明では、ガラス基板に形成した回路パター
ンのくし歯状接続電極上にハンダバンプを形成し、基板
のくし歯状周縁電極とガラス基板の対応するハンダバン
プを当接させ、圧着力を加えてハンダバンプの頂部をつ
ぶし、対応する電極を電気的に接続し、その後硬化剤で
基板とガラス基板との間を固定するため、基板に対して
熱による悪影響を与えることなく、かつ電気的接続の信
頼性が高まる。In the present invention, solder bumps are formed on the comb-teeth connecting electrodes of the circuit pattern formed on the glass substrate, and the comb-teeth peripheral electrodes of the substrate and the corresponding solder bumps of the glass substrate are brought into contact with each other, and a crimping force is applied. The top of the solder bump is crushed, the corresponding electrodes are electrically connected, and then the substrate and glass substrate are fixed with a curing agent, so that the substrate is not adversely affected by heat and the electrical connection is maintained. Reliability is increased.
【0011】前記ハンダバンプは、くし歯状接続電極上
に沿って複数個形成することで接続がさらに確実にな
り、また、くし歯状接続電極上に沿って隣接するくし歯
状接続電極に対して互いに重ならないようちどり状に形
成することで、隣接の電極間で導通する危険がなくな
る。By forming a plurality of the solder bumps along the comb-teeth connection electrodes, the connection is further ensured. Further, the solder bumps are connected to the comb-teeth connection electrodes adjacent to each other along the comb-teeth connection electrodes. By forming the chips so that they do not overlap each other, there is no risk of electrical conduction between adjacent electrodes.
【0012】[0012]
【実施例】以下、本発明を図示の一実施例により具体的
に説明する。図2は本発明実施例のガラス回路基板の斜
視図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to an embodiment shown in the drawings. FIG. 2 is a perspective view of the glass circuit board according to the embodiment of the present invention.
【0013】同図において、本発明実施例のガラス回路
基板10は、例えば、液晶表示パネルの駆動回路等を搭
載するための基板であり、液晶表示パネルと同じ熱膨張
係数を有し、そのパネル周縁の縦または横方向と同程度
の長さの細長い板状(スティック状)に形成された透明
なガラス基板11の表面に形成される。すなわち、この
ガラス基板11の表面には、液晶駆動用の半導体ベアチ
ップを直接搭載するための回路パターンが形成されてお
り、その表面の一方側には長手方向に沿って液晶表示パ
ネル周縁に形成された走査電極やデータ電極と同じピッ
チで同じ出力側のくし歯状接続電極12が形成され、他
方側には長手方向に沿って例えばプリント基板に設けら
れた制御回路等に接続される入力側のくし歯状接続電極
13が形成されている。In FIG. 1, a glass circuit board 10 of the embodiment of the present invention is a board for mounting a drive circuit of a liquid crystal display panel, for example, and has the same coefficient of thermal expansion as that of the liquid crystal display panel. It is formed on the surface of a transparent glass substrate 11 formed in an elongated plate shape (stick shape) having a length approximately equal to the longitudinal or lateral direction of the peripheral edge. That is, a circuit pattern for directly mounting a semiconductor bare chip for driving a liquid crystal is formed on the surface of the glass substrate 11, and is formed on one side of the surface along the longitudinal direction at the periphery of the liquid crystal display panel. The same comb-teeth connection electrodes 12 on the output side are formed with the same pitch as the scanning electrodes and the data electrodes, and on the other side, the comb-shaped connection electrodes 12 on the input side are connected along the longitudinal direction to, for example, a control circuit provided on a printed circuit board. A comb-shaped connection electrode 13 is formed.
【0014】図3は本発明実施例のガラス回路基板の製
造工程を説明する図である。FIG. 3 is a diagram for explaining the manufacturing process of the glass circuit board of the embodiment of the present invention.
【0015】同図(a)に示すように、液晶パネルと同
じ熱膨張係数を有する広い面積のガラス基板30上に、
ガラス回路基板10用の図2に示すような回路パターン
を連続して多数個分形成しておく。As shown in FIG. 1A, a glass substrate 30 having a large area having the same coefficient of thermal expansion as that of the liquid crystal panel is provided on the glass substrate 30.
A large number of circuit patterns as shown in FIG. 2 for the glass circuit board 10 are continuously formed.
【0016】次に、同図(b)に示すように、ガラス基
板30を細長い板状(スティック状)に切断して、図2
に示すような複数個のガラス回路基板10を形成する。Next, as shown in FIG. 2B, the glass substrate 30 is cut into an elongated plate shape (stick shape), and the glass substrate 30 shown in FIG.
A plurality of glass circuit boards 10 as shown in FIG.
【0017】図1は本発明実施例の回路実装方法を示す
工程図である。なお、図2に対応する部分は同一の符号
を記す。FIG. 1 is a process diagram showing a circuit mounting method according to an embodiment of the present invention. The parts corresponding to those in FIG. 2 are designated by the same reference numerals.
【0018】まず、同図(a)に示すように、図2のよ
うに形成されたガラス回路基板10の回路パターン上
に、周知の技術により、絶縁膜14を形成し、搭載する
液晶駆動用の半導体ベアチップ及び出力側のくし歯状接
続電極12等の対応する部分にスルーホールを形成し、
このスルーホール内にハンダダムにより突起状の接続用
のハンダバンプ15を形成する。なお、図において、入
力側のくし歯状接続電極13への接続用のハンダバンプ
は、図示を省略している。First, as shown in FIG. 1A, an insulating film 14 is formed by a known technique on the circuit pattern of the glass circuit board 10 formed as shown in FIG. Through holes are formed in corresponding portions of the semiconductor bare chip and the comb-shaped connection electrode 12 on the output side,
Protrusion-shaped solder bumps 15 for connection are formed by solder dams in the through holes. In the figure, the solder bumps for connection to the comb-teeth-shaped connection electrode 13 on the input side are not shown.
【0019】次に、同図(b)に示すように、ガラス回
路基板10に必要な数の液晶駆動回路用の半導体チップ
16が搭載される。このチップ16の搭載方法として
は、例えば、半導体チップ16に形成された突起電極1
7を対応するハンダバンプ15に当接して加熱接着した
後、液状封止剤18を滴下して半導体チップ16を封止
する。なお、半導体チップ16のその他の搭載方法とし
ては、例えば、ワイヤボンディング等の方法がある。Next, as shown in FIG. 1B, the required number of semiconductor chips 16 for liquid crystal drive circuits are mounted on the glass circuit board 10. As a method of mounting the chip 16, for example, the protruding electrode 1 formed on the semiconductor chip 16 is used.
7 is brought into contact with the corresponding solder bump 15 and heat-bonded, and then the liquid sealing agent 18 is dropped to seal the semiconductor chip 16. Note that as another mounting method of the semiconductor chip 16, there is a method such as wire bonding.
【0020】次に、同図(c)に示すように、ガラス回
路基板10の半導体チップ16を搭載した側を下側に向
ける。そして、上部ガラス基板21と下部ガラス基板2
2とからなる液晶パネル20周縁の下部ガラス基板22
上に駆動回路を実装するための領域を形成し、下部ガラ
ス基板22のくし歯状周縁電極23端部上に、ガラス基
板11の出力側のくし歯状接続電極12に形成された、
対応するハンダバンプ15の位置を合わせて当接させ、
次いで、油圧等を用いた所定のプレス手段により上下方
向から圧着力Pを加え、ハンダバンプ15の頂部をつぶ
してくし歯状周縁電極23と接続する。Next, as shown in FIG. 1C, the side of the glass circuit board 10 on which the semiconductor chip 16 is mounted is turned downward. Then, the upper glass substrate 21 and the lower glass substrate 2
Lower glass substrate 22 around the periphery of the liquid crystal panel 20
A region for mounting a drive circuit is formed on the comb-shaped peripheral electrode 23 of the lower glass substrate 22, and the comb-shaped connection electrode 12 on the output side of the glass substrate 11 is formed on the end of the comb-shaped peripheral electrode 23.
Align and contact the corresponding solder bumps 15,
Then, a pressing force P is applied from above and below by a predetermined pressing means using hydraulic pressure or the like to crush the top of the solder bump 15 and connect it to the comb-teeth peripheral electrode 23.
【0021】次に、同図(d)に示すように、つぶされ
たハンダバンプ15周囲のガラス基板11の絶縁膜14
と下部ガラス基板22との間に、液状の紫外線硬化型の
接着剤24を流し込み、透明な下部ガラス基板22側か
ら紫外光25を照射して接着剤を固化する。なお、接着
剤24は、前の工程で予め塗布しておき、後にプレス手
段でハンダバンプ15の頂部をつぶすようにしてもよ
い。その後、必要により下部ガラス基板22とガラス基
板11との間の隙間に液状封止剤24を滴下して封止す
る。Next, as shown in FIG. 3D, the insulating film 14 of the glass substrate 11 around the crushed solder bumps 15 is formed.
A liquid ultraviolet curable adhesive 24 is poured between the lower glass substrate 22 and the lower glass substrate 22, and ultraviolet light 25 is irradiated from the transparent lower glass substrate 22 side to solidify the adhesive. The adhesive 24 may be applied in advance in the previous step, and the top of the solder bump 15 may be crushed later by a pressing means. Thereafter, if necessary, the liquid sealing agent 24 is dropped into the gap between the lower glass substrate 22 and the glass substrate 11 to seal the liquid.
【0022】図4乃至図6は本発明実施例の電極に形成
するハンダバンプの具体例を説明する図であり、図4は
ハンダバンプを形成した電極部分の平面図、図5はハン
ダバンプ部分の拡大断面図、図6はハンダバンプの高さ
を測定した図である。なお、図1に対応する部分は同一
の符号を記す。FIGS. 4 to 6 are views for explaining specific examples of solder bumps formed on the electrodes of the present invention. FIG. 4 is a plan view of an electrode portion on which the solder bumps are formed, and FIG. 5 is an enlarged sectional view of the solder bump portion. 6 and 6 are views in which the height of the solder bump is measured. The parts corresponding to those in FIG. 1 are designated by the same reference numerals.
【0023】入力側のくし歯状接続電極12が形成され
たガラス基板11の表面は、例えば、ポリイミド、各種
レジスト、酸化膜等からなる厚さが1μm程度の絶縁膜
14が形成され、そのくし歯状接続電極12上の絶縁膜
14には、複数の40μm程度の円形のスルーホールを
一定間隔で隣接するくし歯状接続電極12間で互いに隣
接するよう形成し、次に溶融したハンダ中に浸す。これ
により、スルーホール内には、ハンダバンプ15が絶縁
膜14の表面から所定の高さ(h)になるよう突起状に
形成される。このような入力側のくし歯状接続電極12
は、ハンダに接着する銅、ニッケル、金等の材質が使用
されており、例えば、幅が60μm、ピッチが80μm
であり、厚さが0.5μm程度のNi(ニッケル)膜
と、厚さが0.05μm程度のAu(金)膜とを順次積
層して形成される。ハンダの種類としては、例えば、P
b(鉛)40%、Sn(スズ)60%程度のものが使用
される。以上のような条件で形成されたハンダバンプ1
5の高さは、図6に示すように、4μm〜8μm程度で
あった。図6は入力側のくし歯状接続電極12上に沿っ
て約150μmの間隔(図6の横軸方向の山の間隔)で
形成されたハンダバンプ15の高さ(図6の縦軸方向の
山の高さ)を実測したものである。ハンダバンプの高さ
は、一般的にスルーホールの大きさ(面積)によりほぼ
決まり、小さくなるほど低くなることが確認された。な
お、ハンダバンプは、接続電極の幅やピッチに応じた大
きさのものが使用されるが、直径が20μm以下の大き
さにできることが確認され、接続電極の幅が30μm以
下、ピッチが50μm以下のものに適用することができ
る。On the surface of the glass substrate 11 on which the comb-teeth-shaped connection electrode 12 on the input side is formed, an insulating film 14 made of, for example, polyimide, various resists, an oxide film or the like and having a thickness of about 1 μm is formed. In the insulating film 14 on the tooth-shaped connecting electrode 12, a plurality of circular through holes of about 40 μm are formed so as to be adjacent to each other between the comb-shaped tooth-shaped connecting electrodes 12 which are adjacent to each other at regular intervals. Soak. As a result, the solder bumps 15 are formed in the through holes so as to have a predetermined height (h) above the surface of the insulating film 14. Such an input-side comb-shaped connecting electrode 12
Is made of a material such as copper, nickel, or gold that adheres to solder. For example, the width is 60 μm and the pitch is 80 μm.
The Ni (nickel) film having a thickness of about 0.5 μm and the Au (gold) film having a thickness of about 0.05 μm are sequentially laminated. As the type of solder, for example, P
b (lead) 40% and Sn (tin) 60% are used. Solder bump 1 formed under the above conditions
The height of No. 5 was about 4 μm to 8 μm as shown in FIG. FIG. 6 shows the height of the solder bumps 15 formed along the input-side comb-teeth-shaped connection electrode 12 at intervals of approximately 150 μm (interval of peaks in the horizontal axis of FIG. 6) (peaks in the vertical axis of FIG. 6). Height) is actually measured. It was confirmed that the height of the solder bump is generally determined by the size (area) of the through hole, and becomes smaller as it becomes smaller. It should be noted that although solder bumps having a size corresponding to the width and pitch of the connection electrodes are used, it has been confirmed that the diameter can be 20 μm or less, and the width of the connection electrodes is 30 μm or less and the pitch is 50 μm or less. Can be applied to things.
【0024】上記構成の基板の回路実装方法によれば、
ガラス基板11に形成した回路パターンのくし歯状接続
電極12に突起状の接続用ハンダバンプ15を形成し、
基板20のくし歯状周縁電極23とガラス基板11の対
応するハンダバンプ15とを当接させ、圧着力を加えて
ハンダバンプ15の頂部をつぶして対応する電極12,
23間を接続し、予め塗布した接着剤またはハンダバン
プ15の頂部をつぶした後に流し込んだ紫外線硬化型等
の接着剤24で固定している。したがって、電極の接続
工程中には加熱が一切行われず、基板20への熱的悪影
響がなくなり、かつハンダバンプ15の頂部をつぶすこ
とでその部分が平坦になり、その頂部を介してくし歯状
周縁電極23に当接する面積が大きくなり電気的接続が
確実に行われる。また、図4に示すように、ハンダバン
プ15をくし歯状接続電極12に沿って一定間隔で複数
個形成すれば、1か所のハンダバンプ15を形成した場
合よりも、電気的接続不良を生じる機会が少なくなり、
接続の信頼性も向上できる。本実施例では、紫外線硬化
型の接着剤24を使用することで、接着作業が簡単にな
り機械的固定も確実に行われる。なお、ガラス基板11
が液晶パネル20と同じ熱膨張係数を有するため、広い
面積で多数の電極を一度に接続しても、電極の接続後に
おいてTAB方式のような熱膨張による問題がなく、高
精度で良好な接続状態を維持できることは従来と同様で
ある。According to the circuit mounting method of the board having the above structure,
A protrusion-shaped connection solder bump 15 is formed on the comb-shaped connection electrode 12 of the circuit pattern formed on the glass substrate 11,
The comb-teeth-shaped peripheral electrode 23 of the substrate 20 and the corresponding solder bump 15 of the glass substrate 11 are brought into contact with each other, and a pressing force is applied to crush the top of the solder bump 15 so that the corresponding electrode 12,
23 are connected to each other, and the adhesive is applied in advance or fixed by an adhesive 24 such as an ultraviolet curing type which is poured after crushing the top of the solder bump 15. Therefore, heating is not performed at all during the electrode connecting step, the thermal adverse effect on the substrate 20 is eliminated, and the top portion of the solder bump 15 is flattened to flatten the portion. The area in contact with the electrode 23 is increased, and electrical connection is ensured. Further, as shown in FIG. 4, when a plurality of solder bumps 15 are formed along the comb-teeth-shaped connection electrode 12 at regular intervals, an electrical connection failure is more likely to occur than when one solder bump 15 is formed. Less,
The connection reliability can also be improved. In this embodiment, by using the ultraviolet curing adhesive 24, the bonding work is simplified and the mechanical fixing is surely performed. The glass substrate 11
Has the same coefficient of thermal expansion as the liquid crystal panel 20, so that even if a large number of electrodes are connected at once in a large area, there is no problem due to thermal expansion as in the TAB method after the electrodes are connected, and high-accuracy and good connection is possible. The state can be maintained as in the past.
【0025】図7及び図8は本発明の他の実施例のハン
ダバンプを説明する図である。7 and 8 are views for explaining solder bumps of another embodiment of the present invention.
【0026】図7に示すように、入力側のくし歯状接続
電極12上に、円形の複数個のハンダバンプ41が一定
の間隔で互いに隣接する電極12,12間で重ならない
ように交互に(ちどり状に)形成されている。また、図
8に示すように、入力側のくし歯状接続電極12上に、
その電極12に沿った方向に長い楕円形のハンダバンプ
51がちどり状に形成されている。As shown in FIG. 7, a plurality of circular solder bumps 41 are alternately arranged on the input-side comb-teeth-shaped connecting electrode 12 at regular intervals so as not to overlap between adjacent electrodes 12 and 12. It is formed in the shape of a bird. In addition, as shown in FIG. 8, on the input-side comb-teeth-shaped connection electrode 12,
Elliptical solder bumps 51 that are long in the direction along the electrode 12 are formed in a striped shape.
【0027】このようなハンダバンプ41,51を形成
したガラス回路基板では、ちどり状に形成されているた
めに、ハンダバンプ41,51の頂部が大きくつぶれて
も隣接するくし歯状接続電極12間のハンダバンプ4
1,51同志が接続して短絡する危険がなくなる。ま
た、ハンダバンプ41,51が大きくつぶれて隣のくし
歯状接続電極12上に重なるばあいでも、絶縁膜がある
ため互いに導通するおそれがない。さらに、楕円のハン
ダバンプ51では、接触面積を大きくして接続を確実に
することができる。Since the glass circuit board on which the solder bumps 41 and 51 are formed is formed in a striped shape, even if the tops of the solder bumps 41 and 51 are largely crushed, the solder bumps between the adjacent comb-teeth connecting electrodes 12 are formed. Four
There is no danger of short-circuiting between 1,51 comrades. Even when the solder bumps 41 and 51 are largely crushed and overlapped on the adjacent comb-teeth-shaped connection electrode 12, there is no possibility of conduction with each other because of the insulating film. Further, the elliptical solder bump 51 can increase the contact area to ensure the connection.
【0028】なお、上記実施例において、ハンダバンプ
を円形や楕円形にした例を説明したが、くし歯状接続電
極12に応じて任意の形状、大きさ、位置、個数にでき
る。ハンダバンプをつぶして接続するための圧着力は、
それらハンダバンプの全体の個数や形状などに依存し、
少なくとも頂部がつぶれて平坦になる程度であればよ
く、適切な値は実験的に決められる。Although the solder bump has a circular shape or an elliptical shape in the above embodiment, the shape, size, position and number of the comb-shaped connecting electrode 12 can be arbitrarily set. The crimping force for crushing and connecting the solder bumps is
Depending on the total number and shape of these solder bumps,
It is sufficient that at least the top is flattened and flattened, and an appropriate value is experimentally determined.
【0029】また、ハンダバンプ周囲のガラス基板11
と下部ガラス基板22との間に、液状の紫外線硬化型の
接着剤24を流し込み、紫外光25を照射して固定して
いるが、ハンダバンプの頂部をつぶす前に予め接着剤2
4を塗布しておき、その後にプレス手段で圧着力を加え
て接続するようにしてもよく、少なくとも、ガラス回路
基板11と下部ガラス基板22とを熱を加えることなく
機械的に固定できる任意の瞬間接着剤等が使用できる。The glass substrate 11 around the solder bumps
A liquid ultraviolet curable adhesive 24 is poured between the lower glass substrate 22 and the lower glass substrate 22 and is fixed by irradiating with ultraviolet light 25. However, before the top of the solder bump is crushed, the adhesive 2
4 may be applied and then pressure-bonding force may be applied by a pressing means to connect, and at least the glass circuit board 11 and the lower glass substrate 22 may be mechanically fixed to each other without applying heat. Instant adhesive etc. can be used.
【0030】さらに、ガラス回路基板10には、液晶パ
ネルの走査電極やデータ電極の数に応じた数の出力電極
等のくし歯状周縁電極を有する任意の回路パターンが形
成されていればよく、表示用パネルの面積が広いとき
は、一度に接続する電極数を部分的に分割して複数個の
ガラス回路基板10を用いるようにすれば、半導体チッ
プ16や回路パターンに不良がある場合には、その部分
のガラス基板11のみを交換することでリペア性が向上
する。Further, the glass circuit board 10 may be formed with any circuit pattern having comb-teeth peripheral electrodes such as output electrodes in a number corresponding to the number of scan electrodes and data electrodes of the liquid crystal panel. When the area of the display panel is large, the number of electrodes to be connected at one time is partially divided so that a plurality of glass circuit boards 10 are used. The repairability is improved by replacing only that portion of the glass substrate 11.
【0031】上記実施例では、液晶表示パネルを例とし
て説明したが、液晶テレビあるいはその他のプラズマ表
示、EL表示、LED表示等のフラットパネル、さらに
は表示用パネル以外のものとして液晶センサや液晶シャ
ッタ等の多数のくし歯状電極を接続するものに適用する
ことができる。In the above embodiments, the liquid crystal display panel has been described as an example, but a flat panel such as a liquid crystal television or other plasma display, EL display, LED display, etc., and a liquid crystal sensor or a liquid crystal shutter other than the display panel. Etc. can be applied to those connecting a large number of comb-shaped electrodes.
【0032】なお、本実施例において、電極同士を接続
したが、半導体チップと電極との接続、あるいは高密度
実装におけるチップの接続技術に適用することができ
る。Although the electrodes are connected to each other in the present embodiment, the present invention can be applied to the connection technique of the semiconductor chip and the electrodes or the chip connection technique in high-density mounting.
【0033】[0033]
【発明の効果】以上説明したように本発明では、ガラス
基板に形成した回路パターンのくし歯状接続電極上にハ
ンダバンプを形成し、基板のくし歯状周縁電極とガラス
基板の対応するハンダバンプを当接させ、圧着力を加え
てハンダバンプの頂部をつぶし、対応する電極を電気的
に接続し、その後硬化剤で基板とガラス基板との間を固
定することで、基板に対して熱による悪影響を与えるこ
となく、かつ電気的接続の信頼性を高めることができる
効果がある。As described above, according to the present invention, the solder bumps are formed on the comb-shaped connecting electrodes of the circuit pattern formed on the glass substrate, and the comb-shaped peripheral electrodes of the substrate and the corresponding solder bumps of the glass substrate are applied. Contact and squeeze the top of the solder bumps by applying pressure to electrically connect the corresponding electrodes, and then fix the substrate and glass substrate with a curing agent, which adversely affects the substrate due to heat. There is an effect that the reliability of the electrical connection can be improved without the need.
【図1】本発明実施例の回路実装方法を示す工程図であ
る。FIG. 1 is a process diagram showing a circuit mounting method according to an embodiment of the present invention.
【図2】本発明実施例のガラス回路基板の斜視図であ
る。FIG. 2 is a perspective view of a glass circuit board according to an embodiment of the present invention.
【図3】本発明実施例のガラス回路基板の製造工程を説
明する図である。FIG. 3 is a diagram illustrating a manufacturing process of the glass circuit board according to the embodiment of the present invention.
【図4】本発明実施例のハンダバンプを形成した電極部
分の平面図である。FIG. 4 is a plan view of an electrode portion having a solder bump according to an embodiment of the present invention.
【図5】本発明実施例のハンダバンプ部分の拡大断面図
である。FIG. 5 is an enlarged cross-sectional view of a solder bump portion of the embodiment of the present invention.
【図6】本発明実施例のハンダバンプの高さを測定した
結果を示す図である。FIG. 6 is a diagram showing a result of measuring the height of a solder bump according to an example of the present invention.
【図7】本発明の他の実施例の円形のハンダバンプを説
明する図である。FIG. 7 is a diagram illustrating a circular solder bump according to another embodiment of the present invention.
【図8】本発明の他の実施例の楕円形のハンダバンプを
説明する図である。FIG. 8 is a diagram illustrating an elliptical solder bump according to another embodiment of the present invention.
10 ガラス回路基板 11 ガラス基板 12,13 くし歯状接続電極 14 絶縁膜 15 ハンダバンプ 16 半導体チップ 17 突起電極 18 液状封止剤 20 液晶パネル 21 上部ガラス基板 22 下部ガラス基板 23 くし歯状周縁電極 24 接着剤 25 紫外光 26 液状封止剤 30 ガラス基板 41,51 ハンダバンプ 10 Glass Circuit Board 11 Glass Substrate 12, 13 Comb-Shaped Connection Electrode 14 Insulating Film 15 Solder Bump 16 Semiconductor Chip 17 Projection Electrode 18 Liquid Sealant 20 Liquid Crystal Panel 21 Upper Glass Substrate 22 Lower Glass Substrate 23 Comb-shaped Perimeter Electrode 24 Adhesion Agent 25 ultraviolet light 26 liquid encapsulant 30 glass substrate 41,51 solder bump
Claims (3)
を形成した基板の周囲に回路を実装する方法において、 前記基板周囲の横方向または縦方向に沿った細長い板状
で同じ熱膨張係数を有するガラス基板に、前記基板のく
し歯状周縁電極と同じピッチ間隔のくし歯状接続電極を
有する回路パターンを形成する工程と、前記ガラス基板
のくし歯状接続電極上にそれぞれハンダバンプを形成す
る工程と、前記基板のくし歯状周縁電極とガラス基板の
対応するくし歯状接続電極上に形成したハンダバンプと
を当接させ、両基板間に圧着力を加え該ハンダバンプの
頂部をつぶして両電極間を接続する工程と、前記接続す
る工程後に前記基板とガラス基板との間を硬化剤で固定
する工程とを備える基板の回路実装方法。1. A method of mounting a circuit around a substrate on which an electrode pattern having a comb-teeth peripheral electrode is formed, wherein the substrate has an elongated plate shape along the horizontal direction or the vertical direction and has the same coefficient of thermal expansion. A step of forming a circuit pattern on a glass substrate having a comb-shaped connecting electrode having the same pitch interval as the comb-shaped peripheral electrode of the substrate; and a step of forming solder bumps on the comb-shaped connecting electrodes of the glass substrate, respectively. , The comb-shaped peripheral electrodes of the substrate and the solder bumps formed on the corresponding comb-shaped connecting electrodes of the glass substrate are brought into contact with each other, and a crimping force is applied between the substrates to crush the tops of the solder bumps so that the distance between the electrodes is reduced. A circuit mounting method for a substrate, comprising a step of connecting and a step of fixing the substrate and the glass substrate with a curing agent after the step of connecting.
上に沿って複数個形成する請求項1記載の基板の回路実
装方法。2. The circuit mounting method for a substrate according to claim 1, wherein a plurality of the solder bumps are formed along the comb-teeth-shaped connection electrode.
上に沿って隣接するくし歯状接続電極に対して互いに重
ならないようちどり状に形成する請求項1または2記載
の基板の回路実装方法。3. The circuit mounting method for a substrate according to claim 1, wherein the solder bumps are formed in a crimp shape so as not to overlap with the adjacent comb-teeth connecting electrodes along the comb-teeth connecting electrodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10914794A JPH07297541A (en) | 1994-04-26 | 1994-04-26 | Method for mounting circuit on board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10914794A JPH07297541A (en) | 1994-04-26 | 1994-04-26 | Method for mounting circuit on board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07297541A true JPH07297541A (en) | 1995-11-10 |
Family
ID=14502812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10914794A Pending JPH07297541A (en) | 1994-04-26 | 1994-04-26 | Method for mounting circuit on board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07297541A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001056339A1 (en) * | 1998-08-13 | 2001-08-02 | Sony Chemicals Corp. | Flexible printed wiring board and its production method |
US6809267B1 (en) | 1998-08-13 | 2004-10-26 | Sony Chemicals Corporation | Flexible printed wiring board and its production method |
JP2007335477A (en) * | 2006-06-12 | 2007-12-27 | Fujitsu Ltd | Method of adhering flexible wiring board and wiring board |
JP2014235124A (en) * | 2013-06-04 | 2014-12-15 | 日本精機株式会社 | Liquid level detector |
JPWO2021235263A1 (en) * | 2020-05-21 | 2021-11-25 |
-
1994
- 1994-04-26 JP JP10914794A patent/JPH07297541A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001056339A1 (en) * | 1998-08-13 | 2001-08-02 | Sony Chemicals Corp. | Flexible printed wiring board and its production method |
US6809267B1 (en) | 1998-08-13 | 2004-10-26 | Sony Chemicals Corporation | Flexible printed wiring board and its production method |
EP1173051A1 (en) * | 2000-01-25 | 2002-01-16 | Sony Chemicals Corporation | Flexible printed wiring board and its production method |
JP2007335477A (en) * | 2006-06-12 | 2007-12-27 | Fujitsu Ltd | Method of adhering flexible wiring board and wiring board |
JP2014235124A (en) * | 2013-06-04 | 2014-12-15 | 日本精機株式会社 | Liquid level detector |
JPWO2021235263A1 (en) * | 2020-05-21 | 2021-11-25 | ||
WO2021235263A1 (en) * | 2020-05-21 | 2021-11-25 | 株式会社村田製作所 | Signal transmission line |
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