JP2000194279A - Integrated driving circuit chip and image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To actualize high reliability and low cost by improving the yield in case of a defect occurring to a driving circuit having been mounted. SOLUTION: The driver chip 47 is formed on a glass substrate 49 and directly mounted on a lower glass substrate by thermocompression bonding with an ACF(anisotropic conductive film). Further, driving circuit areas 50 are provided successively in the glass substrate 49 and cutting margin lines 51 for cutting a defective circuit area 50 off are provided at the outer peripheries of the driving circuit areas 50. If the driving circuit element becomes defective after the driver chip 47 is mounted, the driver chip 47 is detached temporarily from the glass substrate and the driving circuit area 50 where the defective driving circuit element is mounted is cut off along the cutting margin lines 51 to remove the defective driving circuit element. Further, a good driving circuit area 50 is supplied. Therefore, high reliability and low cost are actualized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an integrated drive circuit chip for driving a matrix type display panel and an image display device equipped with the integrated drive circuit chip.

[0002]

2. Description of the Related Art Conventionally, as an image display device, there is a liquid crystal display device whose cross section is shown in FIG. In this liquid crystal display device, a liquid crystal panel 1 composed of an upper glass substrate 2 and a lower glass substrate 3 arranged to face each other with a liquid crystal (not shown) interposed therebetween, and a backlight 4 as a light source are mounted. Tape carrier package for connecting the semiconductor chip 5 for driving the liquid crystal to an electrode (not shown) on the lower glass substrate 3
(TCP) 6 and an input common printed circuit board 7 for connecting the TCPs 6 to each other. Then, the periphery of the liquid crystal panel 1 is covered with the vessel 8, and the backlight 4, the semiconductor chip 5,
The TCP 6 and the input common printed circuit board 7 are protected.

As a method for mounting a semiconductor chip in a liquid crystal display device, a COG (chip-on-glass) mounting method in which the semiconductor chip is mounted directly on a glass substrate of a liquid crystal panel, and as shown in FIG. TCP mounting semiconductor chip 5 supplied in a state on liquid crystal panel 1
The mounting method is generally well known. Further, as another mounting method, there is a CIG (circuit-in-glass) mounting method in which a drive circuit is formed (built-in) directly on the lower glass substrate without mounting a semiconductor chip on a liquid crystal panel. It has been put to practical use in products.

[0004] The COG mounting method described above refers to a metal projection.
This is a method in which a semiconductor chip having (bumps) is directly mounted face down on a wiring provided on a lower glass plate. There are the following two methods for the connection in that case. One is a method in which the semiconductor chip is directly connected by solder bumps, and then the gap between the semiconductor chip and the glass substrate is filled with a resin (for example, Japanese Patent Laid-Open No.
331). In addition, as shown in FIG. 11, the metal projections (bumps) of the semiconductor chip 15 are connected to the wiring (not shown) on the lower glass substrate 13 by the conductive particles 1.
ACF (Aniso) consisting of resin (binder) 16b containing 6a
tropic Conductive Film (anisotropic conductive film) 16 (for example, JP-A-4-76929, JP-A-4-71246, JP-A-4-317347, etc.). Here, in the case of the latter method, AC
The resin 16b of F16 functions as a substitute for the filling resin in the former method. Reference numeral 11 denotes a liquid crystal panel, and 12 denotes a liquid crystal panel.
Is an upper glass substrate; 14 is a backlight;
7 is a vessel.

Next, as shown in FIG. 10, an example of the TCP mounting method disclosed in Japanese Patent Application Laid-Open No. Hei 7-253591 is an electrode provided on the lower glass substrate 3 (see FIG. 10). (Not shown) and a conductor pattern (not shown) on the TCP 6 are thermocompression-bonded via the ACF, whereby a plurality of TCPs 6 are mounted side by side around the liquid crystal panel 1. In this case, a plurality of TCPs 6 mounted on the periphery of the liquid crystal panel 1 are connected to an input common printed circuit board 7 provided with printed wiring, and a power supply for displaying the liquid crystal and an IC in the semiconductor chip 5 are provided. A power supply for driving the (integrated circuit) and various signals are supplied to each TCP 6 by the input common printed circuit board 7. In addition, the semiconductor chip 5
Chip components such as chip capacitors that cannot be taken
It is mounted on the input common printed circuit board 7. The periphery of the liquid crystal panel 1 thus formed is covered with the vessel 8.

When assembling the liquid crystal display device by the TCP mounting method as described above, the conductor pattern for driving the liquid crystal on the TCP 6 is connected to the electrodes provided on the lower glass substrate 3 by the ACF, and thereafter the TCP 6 Are connected to the input common printed circuit board 7 by soldering or by the ACF.

[0007] Finally, as shown in FIG. 12, as an example of the CIG mounting method disclosed in Japanese Patent Application Laid-Open No. 6-75204, a liquid crystal is formed on a lower glass substrate 21 constituting a liquid crystal panel. A data electrode driver 23 and a scan electrode driver 24 for driving data electrodes and scan electrodes (both not shown) constituting the display section 22 are formed. An input terminal 25 of the electrode driver 23 and an input terminal 26 of the scanning electrode driver 24 are provided.

[0008]

However, each of the above-mentioned conventional liquid crystal display devices has the following problems. That is, in the TCP mounting method and the COG mounting method, as described above, the semiconductor chip for driving the liquid crystal panel is mounted around the lower glass substrate.
In recent liquid crystal displays, the terminal pitch of electrodes has become narrower with the increase in size and definition. Therefore, for example, in the TCP mounting method shown in FIG.
The AC having adhesiveness with the conductor pattern of CP6.
Since the electrodes are bonded through F, the width of the electrodes and the distance between the electrodes become narrower as the definition of the liquid crystal display becomes higher.
When the resin is heated and cured in the above, a positional shift between the electrode and the conductive pattern occurs due to a difference in thermal expansion between the TCP 6 and the lower glass substrate 3. Then, for example, the contact resistance due to the displacement increases, and a sufficient voltage cannot be applied. The accuracy of alignment by current technology is at most 60μ
In the case of a high-definition display having a pixel pitch of about m or less, there is a problem that the TCP mounting method cannot be applied.

Also, in the COG mounting method, as in the case of the TCP mounting method, positional fluctuation occurs due to a difference in thermal expansion between the silicon substrate of the semiconductor chip 15 and the lower glass substrate 13. Therefore, there is a problem that the fine pitch of the liquid crystal display cannot be dealt with.
It is desired to develop a new material having a low coefficient of thermal expansion and a new mounting method capable of reducing the coefficient of thermal expansion.

In contrast to the above-mentioned TCP mounting method and COG mounting method, in the above-mentioned CIG mounting method, since the data electrode driver 23 and the scanning electrode driver 24 are formed on the same glass substrate 21, the thermal expansion coefficient is increased. The problem caused by the difference does not occur. However, as described above, since the drivers 23 and 24 are formed directly on the glass substrate of the liquid crystal panel, if the drivers 23 and 24 are defective, repair becomes difficult, and the normal However, there is a problem that the waste rate is reduced to 100%. Therefore, a liquid crystal display device that eliminates the above-described problem of thermal expansion and improves the yield is disclosed in Japanese Patent Application Laid-Open No. 7-14880.

FIG. 13 shows a partial configuration diagram of this liquid crystal display device. In FIG. 13, an elongated rod-shaped glass substrate having approximately the same length as one side of the lower glass substrate 33 is provided on the lower glass substrate 33 of the liquid crystal panel 31 composed of the upper glass substrate 32 and the lower glass substrate 33. A chip (commonly called a stick crystal) 34 on which a drive circuit is formed is mounted. The liquid crystal display is driven by the stick crystal.
According to this method, since the lower glass substrate 33 and the stick crystal 34 are made of the same glass, there is no difference in the thermal expansion coefficient of the connection (bonding) portion between the two, and there is no problem due to misalignment. Thus, it is possible to cope with the fine pitch and to improve the reliability against the temperature environment change.

Further, the stick crystal 34 which has been tested for the driving circuit is placed on the lower glass substrate 3.
3, the problem of a decrease in yield related to the failure of the drive circuit in the CIG mounting method is improved. However, after the stick crystal 34 is mounted on the lower glass substrate 33, if the drive circuit on the stick crystal 34 becomes defective, it is difficult to repair it. Therefore, each time the stick crystal 34 is replaced with a new one, there is a problem that the cost is increased.

It is conceivable to provide a redundant circuit in the stick crystal 34 to cope with defective chip rescue. However, the incorporation of the redundant circuit in the stick crystal 34 causes another problem that the area of the drive circuit is increased and the cost is increased.

SUMMARY OF THE INVENTION An object of the present invention is to provide an integrated drive circuit chip capable of improving the yield when a drive circuit pattern is defective after being mounted on a display panel.
Another object of the present invention is to provide an image display device capable of re-mounting an integrated drive circuit chip to achieve high reliability and low cost.

[0015]

In order to achieve the above object, an integrated drive circuit chip according to the first aspect of the present invention comprises a plurality of drive circuit patterns for driving a display panel formed on a glass substrate. In the integrated drive circuit chip, each of the drive circuit patterns is formed so as to be arranged in one direction, and between each of the drive circuit patterns, there are provided cutting lines for individually dividing the drive circuit patterns. It is characterized by being.

According to the above arrangement, when one of the plurality of drive circuit patterns arranged and arranged in one direction on the integrated drive circuit chip becomes defective, a cut margin around the defective drive circuit pattern is obtained. The line separates the defective drive circuit pattern. Thus, it is relieved that the entire integrated drive circuit chip is discarded when a part of the drive circuit pattern becomes defective.

According to a second aspect of the present invention, in the integrated drive circuit chip according to the first aspect of the present invention, the integrated drive circuit chips oppose each other along the cutting line in the driving circuit pattern forming region sandwiched between adjacent cutting lines. An input electrode and a power supply electrode are provided on the two sides, and an output electrode for driving a display panel is provided on another side in the drive circuit pattern formation area, and the output electrode is opposed to the one side in the drive circuit pattern formation area. It is characterized in that a dummy electrode is provided on the side of the dummy.

According to the above configuration, the electrodes are formed on each of the four sides of the rectangular drive circuit pattern formation region sandwiched between adjacent cutting lines. Therefore, high connection reliability can be obtained by connecting all the electrodes including the dummy electrodes to the wiring on the display panel side. Further, the parallelism between the integrated drive circuit chip and the glass substrate of the display panel is improved, and the electrical connection between the integrated drive circuit chip and the display panel is facilitated.

According to a third aspect of the present invention, in the integrated drive circuit chip according to the second aspect of the present invention, a common electrode among the input electrode and the power supply electrode provided in the entire drive circuit pattern formation region is It is characterized by being electrically connected by metal wiring.

According to the above configuration, the wiring resistance of the wiring for supplying an input signal or power to the input electrode and the power supply electrode provided in the entire drive circuit pattern formation region is small. Therefore, even in the case of a large-sized integrated drive circuit chip, a normal signal or power of a predetermined voltage is supplied to each drive circuit pattern.

According to a fourth aspect of the present invention, there is provided an image display device, wherein the electrodes of the integrated drive circuit chip according to the first or second aspect of the invention are connected to a common input signal line formed on a glass substrate of a display panel. And electrically connected to a common power supply line.

According to the above configuration, when the integrated drive circuit chip is mounted on the glass substrate of the display panel, the electrical connection between the electrodes of the integrated drive circuit chip and the signal lines and power supply lines on the glass substrate is made. By making the connection to the common input signal line and the common power supply line, the above-described electrical connection is easily performed. Further, when any of the drive circuit patterns becomes defective, the defective drive circuit pattern is cut off by the cut-off line, so that the entire integrated drive circuit chip is discarded, thereby improving the yield and improving the cost. Down is achieved.

Further, when the integrated driving circuit chip mounted is the integrated driving circuit chip according to the second aspect of the present invention, all the electrodes including the dummy electrodes are connected to the wiring on the display panel side. High connection reliability is obtained. Further, the parallelism between the integrated drive circuit chip and the glass substrate of the display panel is improved, and the electrical connection between the integrated drive circuit chip and the display panel is facilitated.

According to a fifth aspect of the present invention, there is provided an image display apparatus comprising the electrodes of the integrated drive circuit chip according to the third aspect of the present invention, wherein the electrodes are electrically connected to conductor wiring formed on a glass substrate of a display panel. The device, wherein the conductor electrode is formed at a mounting location of the integrated drive circuit chip on the glass substrate, and the input electrode is connected by the metal wire across the cutting line in the integrated drive circuit chip. It is an auxiliary conductor wiring for connecting the power supply electrodes to each other and the power supply electrodes on the glass substrate side.

According to the above configuration, the wiring resistance of the wiring for supplying the input signal and the power to the input electrode and the power supply electrode provided in the entire drive circuit pattern formation region is reduced regardless of the size of the display panel. Therefore, a large-sized display panel with high reliability can be formed. Further, when the defective drive circuit pattern in the integrated drive circuit chip is separated by a cutting line and replaced with a new drive circuit pattern, the defective drive circuit pattern is connected to the display panel via the auxiliary conductor wiring on the glass substrate side. Input signals and power are supplied to the new drive circuit pattern.

According to a sixth aspect of the present invention, in the image display device according to the fifth aspect of the present invention, the number of the auxiliary conductor wirings is such that the input electrodes and the power supply electrodes are connected across the cutting line. It is characterized in that the number is equal to or more than the number of the connected metal wirings.

According to the above configuration, when the number of auxiliary conductor wirings is larger than the number of metal wirings, the dummy electrodes in the integrated drive circuit chip are used as new electrodes or new electrodes are added. In this case, the glass substrate of the display panel is used as it is. Thus, it is possible to easily cope with the change of the drive circuit pattern.

According to a seventh aspect of the present invention, in the image display device according to the fourth or fifth aspect, the electrical connection is made via an ACF.

According to the above configuration, the mounting of the integrated drive circuit chip on the glass substrate of the display panel and the replacement of the defective drive circuit pattern with a new drive circuit pattern can be performed very easily.

According to an eighth aspect of the present invention, in the image display device of the fourth or fifth aspect, the integrated drive circuit chip mounted on the glass substrate of the display panel includes a plurality of parts. It is characterized in that it is divided and mounted on an integrated drive circuit chip.

According to the above configuration, the integrated drive circuit chip for driving the display panel is composed of a plurality of partial integrated drive circuit chips, and each of the partial integrated drive circuit chips can be repaired for each drive circuit pattern. It has become.
Therefore, the yield of the integrated drive circuit chip is further improved, and the mounting of the integrated drive circuit chip is more easily performed.

[0032]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments. FIG. 1 is a partial configuration diagram of a liquid crystal display device as an image display device according to the present embodiment. The lower glass substrate 42 and the upper glass substrate 43 constitute the liquid crystal panel 41.

The liquid crystal panel 41 is a simple matrix type liquid crystal panel as shown in FIG.
A plurality of data electrodes 44 made of transparent electrodes are arranged in parallel on 2. On the upper glass substrate 43, a plurality of scanning electrodes 45 made of transparent electrodes are arranged in parallel. The two glass substrates 42 and 43 are connected to the data electrodes 4.
4 and the scanning electrode 45 are opposed to each other and arranged at a predetermined interval to be orthogonal to each other. A liquid crystal layer 46 is sandwiched between the glass substrates 42 and 43.
In FIG. 2, the distance between the two glass substrates 42 and 43 is exaggerated to be considerably wider than the actual one.

In FIG. 1, on the lower glass substrate 42, an integrated drive circuit chip formed on another glass substrate
(Hereinafter referred to as a driver chip) 47 is directly mounted.
Reference numeral 48 denotes a conductor pattern (input common wiring) for supplying a signal to the driver chip 47, and the lower glass substrate 4
2 is formed. FIG. 3 is an enlarged plan view of an edge of the lower glass substrate 42 on the side where the conductor pattern 48 is formed. As shown in FIG.
Is an input common wiring including a power supply which is arranged in a plurality in parallel, and supplies a power supply potential, a control signal, and the like to individual circuit cells formed on a driver chip 47 disposed immediately above.

FIG. 4 shows the structure of the driver chip 47. The driver chip 47 is provided with a plurality of drive circuit areas 50, 50,... Continuously in a glass substrate 49, and a cutting line 51 for separating the defective drive circuit area 50 on the outer periphery of each drive circuit area 50. Is provided.

FIG. 5 shows a detailed structure in one drive circuit area 50 constituting the driver chip 47. The drive circuit area 50 is separated from the other drive circuit area 50 from the cutting line 51 as described above. Then, in each drive circuit region 50, a drive circuit element 52 for driving the liquid crystal display device is formed by a low-temperature process using polycrystalline silicon, single crystal silicon, or the like. The outer peripheral portion on the surface of the drive circuit region 50
A large number of electrode pads are formed (that is, around the drive circuit element 52), and are later allocated to the input electrode 53, the output electrode 54, and the dummy electrode 55. By the way, the electrode pad is formed by plating. The height and size of the gold bumps constituting the electrode pad vary depending on the bump pitch.
0 μm to 90 μm, and the height of the bump is 10 μm to 20 μm
And The electrode pads on one long side of the drive circuit area 50 are assigned to output electrodes 54 for outputting drive signals to the data electrodes 44 and the scan electrodes 45.
The electrode pad on the other long side is assigned to the dummy electrode 55. The electrode pads on both short sides are provided with a plurality of input electrodes (including power supply electrodes) 53.
It is assigned to The driving circuit element 52 is
Each is composed of a plurality of circuit cells (not shown).

FIG. 6 shows an example in which the driver chip 47 on which the electrode pads 56 are formed is directly mounted by a face-down method in which the electrode pads 56 are connected to wirings 57 provided on the lower glass plate 42. The electrode pads 56 on the driver chip 47 are made of a wiring 57 (ITO (indium tin oxide) or the like) provided on the lower glass plate 42 via an ACF 60 made of a resin (binder) 59 containing conductive particles 58. (To form the conductor pattern 48 in FIG. 3) by thermocompression bonding.

In this case, as described above, by assigning a part of the electrode pad 56 to the dummy electrode 55, the number of connection portions between the driver chip 47 and the lower glass substrate 42 via the ACF 60 increases, so that the reliability is increased. The performance is improved. In addition, the presence of the dummy electrodes 55 improves the parallelism between the driver chip 47 and the lower glass substrate 42, thereby facilitating connection between the electrode pads 56 of the driver chip 47 and the wiring 57 on the lower glass substrate 42. There is also an effect. Note that the dummy electrode 55 is not always necessary, and it does not matter even if it is not provided.

As described above, according to the present embodiment, the driver chip 47 formed on the glass substrate is
0 is directly connected to the conductor pattern 48 on the lower glass substrate 42 by thermocompression bonding. The driver chip 47 is provided with a plurality of drive circuit regions 50, 50,... Continuously in a glass substrate 49 as shown in FIG. Area 50
Is provided with a cutting margin line 51 for cutting off.

Therefore, even if a failure occurs in the drive circuit element 52 after the driver chip 47 is mounted on the liquid crystal panel 41, the driver chip 47 is once removed from the lower glass substrate 42 by heating the ACF 60 or the like, and the failure in the driver chip 47 The defective drive circuit element 52 can be removed by cutting the defective drive circuit area 50 along a cutting line 51 around the drive circuit area (defective drive circuit area) 50 in which the drive circuit elements 52 are mounted. further,
Separately, non-defective drive circuit elements 52 can be freely supplied.

That is, according to the liquid crystal display device of the present embodiment, after the driver chip 47 is mounted on the liquid crystal panel 41, even if a defect occurs in the drive circuit element 52, it can be easily repaired. Thus, all the expensive driver chips 47 are not required, so that the yield can be improved and the cost can be reduced. Also, the drive circuit element 52 can be remounted, and high reliability can be achieved.

Further, in the present embodiment, a conductor pattern 48 composed of a common power supply line and various common signal lines is arranged on the lower glass substrate 42. Therefore, the mounting of the driver chip 47 or the defective driving circuit element 52
When replacing the driver chip 47 at the time of replacement of
It can be easily implemented via the ACF 60.

Further, in the present embodiment, the electrode pads 56 formed around the driver chip 47 are formed.
Are assigned to the output electrode 54 and the input electrode 53, and are also assigned to the dummy electrode 55. Therefore,
The parallelism between the driver chip 47 and the lower glass substrate 42 increases, and the number of connection points increases, leading to improvement in reliability and ease of mounting the driver chip 47.

As described above, according to the present embodiment, it is possible to improve the reliability and reduce the cost of the liquid crystal panel module.

FIG. 7 is a partial configuration diagram of a liquid crystal display device according to an embodiment in which the driver chip is divided into a plurality of parts and mounted on a lower glass substrate. Lower glass substrate 62
Two driver chips 64 and 65 formed on another glass substrate and functioning as one driver are directly mounted thereon, and are directly connected to the conductor pattern 66 via the ACF 60. The driver chips 64, 65
Has the same configuration as the driver chip 47 in FIG. Reference numeral 61 denotes a liquid crystal panel, and reference numeral 63 denotes an upper glass substrate.

As described above, the present embodiment has a configuration in which one driver chip 47 in FIG. 1 is divided and mounted on two driver chips 64 and 65. As described above, by dividing the driver chip into a plurality of parts and reducing the size of the driver chip, the yield of the driver chips 64 and 65 can be improved and the cost can be reduced.

By the way, in the liquid crystal display device shown in FIGS. 1 and 7, the conductor patterns 48 and 66 formed on the lower glass substrates 42 and 62 are formed by transparent electrodes such as IT. For this reason, in a large-sized liquid crystal panel of 10 inches or more, which is currently the mainstream, since the sheet resistance of the wiring material is high, as shown in FIG. Is formed on the lower glass substrates 42 and 62, there is a problem that the wiring resistance cannot be suppressed low. In the case of a small liquid crystal panel, the wiring resistance does not hinder much because the lengths of the wiring patterns 48 and 66 are short. However, as the size of the liquid crystal panel becomes larger, the wiring resistance increases, causing a voltage drop in the wiring patterns 48 and 66, and it is impossible to supply a normal signal or a normal voltage power to the driver chips 47, 64 and 65. is there.

Therefore, in the following embodiment, a liquid crystal display device capable of coping with an increase in the wiring resistance of the wiring pattern will be described. FIG. 8 shows a detailed circuit configuration of the driver chip in the present embodiment.

In the present driver chip 81, similarly to the driver chip 47 shown in FIG. 5, the drive circuit area 82 can be separated from the cutting line 83, and the drive circuit element 84 is formed in the drive circuit area 82. Have been. An input electrode 85 including a power electrode, an output electrode 86, and a dummy electrode 87 are provided on the outer peripheral portion of the surface of the drive circuit region 82.
Are formed.

In this embodiment, the input electrode 8
5 in order to reduce the wiring resistance to the input electrodes 85 including the power supply electrodes in the respective drive circuit regions 82, 82,. The input electrodes 85 related to the same voltage or the same signal are electrically connected in advance by a metal wiring 88 made of, for example, aluminum. By doing so, each drive circuit area 82, 8
The wiring resistance between the input electrodes 85 related to the same voltage or the same signal in 2,... Can be suppressed low, and a normal power supply and signal can be input to the driver chip 81. Therefore, according to the present embodiment, high reliability can be obtained even with a large-screen liquid crystal panel.

In the case of the liquid crystal display device according to the present embodiment, a defect occurred in the drive circuit element 84 in the drive circuit area 82 before or after the driver chip 81 was mounted on the liquid crystal panel. In this case, the defective drive circuit area 82 can be removed by cutting along the cutting margin line 83 around the corresponding drive circuit area 82. However, as described above, in the present embodiment, the input electrodes 85 related to the same voltage or the same signal in each of the drive circuit regions 82, 82,.
8 are connected. Therefore, the cutting line 83
When the defective drive circuit region 82 is cut along the line, the metal wiring 88 between the input electrodes 85 of the adjacent drive circuit regions 82 is also cut.

Therefore, in the present embodiment, as shown in FIG. 9, a conductor pattern as shown in FIG. 3 is not formed on lower glass substrate 91. Then, the position where the input electrode 85 at the input end in the drive circuit region 82 located at the input end is located and the position where the input electrode 85 connected by the metal wiring 88 in the adjacent drive circuit region 82 is located ( (A cutting line position 83 'between adjacent drive circuit regions 82)
In addition, the auxiliary conductor pattern 92,
93, 93, ... are formed. Then, the driver chip 81
Is mounted on the lower glass plate 91 by a face-down method, the input electrodes 85 on the driver chip 81 and the auxiliary conductor patterns 92 and 93 on the lower glass plate 91 are directly connected via the ACF, and , And fix both.

The ACF is a film made of an anisotropic conductive material in which conductive particles such as nickel or gold are dispersed in an adhesive such as phenol resin or polysulfone resin. Then, after the film-like ACF is pasted on the lower glass substrate 91, the input electrode 85 including the power supply electrode and the desired auxiliary conductor patterns 92 and 93 are aligned and thermocompression-bonded.
A good electrical connection is made by the conductive particles. Further, both are fixed by the resin being hardened. The conditions of the thermocompression bonding in that case are as follows:
The heating temperature is preferably 100 ° C. to 250 DEG ° C., applied pressure is preferably ^{10kgf / cm 2 ~60kgf / cm 2} .

As described above, according to the present embodiment, the common input electrodes 85 among the input electrodes 85 provided in the entire drive circuit area 82 of the driver chip 81 are connected to each other by the metal wiring 88. . Then, the lower glass substrate 9
On 1, auxiliary conductor patterns 92 and 93 for connecting the input electrodes 85 connected by the metal wiring 88 across the cutting line 83 in the driver chip 81 on the lower glass substrate 91 side are formed. . Therefore, the input electrode 8
5 can be reduced.

That is, according to the present embodiment, a voltage drop due to wiring resistance can be prevented even for a large-sized liquid crystal panel, and a normal signal can be input to the driver chip 81, so that the reliability is high. A liquid crystal display device can be provided. Further, even if the wiring width of the lower glass substrate 91 is reduced due to the increase of the input electrodes 85 of the driver chip 81, the metal wiring 88 on the driver chip 81 side is reduced.
As a result, it is possible to transmit a highly reliable input signal and power supply with a smaller voltage drop. Further, by reducing the wiring resistance as described above, it is possible to provide a liquid crystal panel resistant to noise.

As described above, the lower glass substrate 9
Only the auxiliary conductor patterns 92 and 93 are formed at the cutting line position 83 ′ on 1. Therefore, FIG.
As shown in FIG.
In comparison with the case of forming the driver chip 81, the width of the short side of the driver chip 81 can be further reduced, and the size can be reduced. Further, as described above, the cutting margin position 8 on the lower glass substrate 91
By forming the auxiliary conductor patterns 92 and 93 only on the 3 ', the length of the ITO wiring is reduced and the wiring capacity is reduced. Therefore, the waveform of a clock signal or the like has a small accent, and can be applied to a high frequency.

The number of auxiliary conductor patterns 92 and 93 formed on the lower glass substrate 91 per one cutting line position 83 ′ is equal to the number of metal pieces per one cutting line 83 on the driver chip 81 side. The number may be larger than the number of the wirings 88. In that case, the driver chip 8
Even if the dummy electrode 87 is used as a normal electrode by changing the configuration of No. 1 or a new electrode is added, the lower glass substrate 91 can be used as it is, and the ease of design change is improved and cost reduction is achieved. You can do it.

As described above, according to each of the above embodiments, it is possible to improve the reliability of the liquid crystal display device and reduce the cost, and to provide a product that accurately captures user needs. .

In each of the above embodiments, a simple matrix type liquid crystal panel has been described as an example. However, an active matrix type liquid crystal panel is also applicable. Needless to say, the present invention is applicable not only to the liquid crystal display device but also to other image display devices.

[0060]

As is apparent from the above description, the integrated drive circuit chip according to the first aspect of the present invention is formed by arranging each of the drive circuit patterns in one direction. Since a cutting line is provided for individually dividing the driving circuit pattern, if any of the driving circuit patterns becomes defective, the defective driving circuit pattern is separated by the cutting line to remove the normal driving circuit pattern. Can be exchanged for Therefore, it is possible to prevent the entire integrated drive circuit chip from being destroyed when a part of the drive circuit pattern becomes defective, and to improve the yield.

According to a second aspect of the present invention, there is provided an integrated drive circuit chip, wherein an input electrode and an input electrode are provided on two sides of the drive circuit pattern forming region sandwiched between adjacent cut lines along the cut lines. Since the power supply electrode is provided, the output electrode for driving the display panel is provided on the other side, and the dummy electrode is provided on the other side, all the electrodes including the dummy electrode must be connected to the wiring on the display panel side. Thereby, high connection reliability can be obtained. Further, parallelism between the integrated drive circuit chip and the glass substrate of the display panel is improved, and electrical connection between the integrated drive circuit chip and the display panel can be facilitated.

In the integrated drive circuit chip according to the third aspect of the present invention, the common electrode among the input electrode and the power supply electrode provided in the entire drive circuit pattern formation region is electrically connected by metal wiring. Therefore, the wiring resistance of the wiring for supplying an input signal or power to the input electrode and the power supply electrode can be reduced. Therefore, even a large-sized integrated driving circuit chip can supply a normal signal and a power of a predetermined voltage to each driving circuit pattern.

According to a fourth aspect of the present invention, there is provided an image display device, wherein the electrodes of the integrated drive circuit chip according to the first or second aspect of the invention are connected to a common input signal line formed on a glass substrate of a display panel. In addition, since the integrated drive circuit chip is electrically connected to the common power supply line, the electrical connection when the integrated drive circuit chip is mounted on the glass substrate of the display panel can be easily performed. Further, when any of the drive circuit patterns becomes defective, the entire integrated drive circuit chip is discarded by separating the defective drive circuit pattern from the cutting line and replacing it with a normal drive circuit pattern. Can be prevented. Therefore, the yield can be improved and the cost can be reduced.

Further, when the integrated drive circuit chip according to the second aspect of the present invention is mounted, high connection reliability can be obtained by connecting all the electrodes including the dummy electrodes to the wiring on the display panel side. . Further, the parallelism between the integrated drive circuit chip and the glass substrate of the display panel can be improved, and electrical connection between the two can be facilitated.

According to a fifth aspect of the present invention, there is provided an image display device wherein the electrodes of the integrated drive circuit chip according to the third aspect of the present invention are electrically connected to conductor wiring formed on a glass substrate of the display panel. Since the conductor wiring is an auxiliary conductor wiring for connecting the input electrodes and the power supply electrodes connected by metal wiring across the cutting line in the integrated drive circuit chip on the glass substrate side. In addition, the wiring resistance of the input electrode and the power supply electrode can be reduced irrespective of the size of the display panel, and a large-sized display panel with high reliability can be formed.

Further, when the defective drive circuit pattern in the integrated drive circuit chip is separated by a cutting line and replaced with a new drive circuit pattern, the cut metal wiring is replaced by the auxiliary conductor wiring. Thus, an input signal and power can be supplied to the new drive circuit pattern.

Further, even if the wiring width of the glass substrate of the display panel becomes narrow due to an increase in the number of input electrodes of the integrated drive circuit chip, a highly reliable signal or power supply with a small voltage drop can be input. Further, since only the auxiliary conductor wiring is formed on the glass substrate, the size of the integrated drive circuit chip can be reduced, and the length of the ITO wiring can be shortened to reduce the wiring capacity, and the clock can be reduced. Etc. can be reduced.

The number of the auxiliary conductor wirings in the image display device of the invention according to the sixth aspect is the number of the metal wirings connecting the input electrodes and the power supply electrodes across the cutting line. As described above, when the dummy electrode is used as a new electrode or a new electrode is added, the glass substrate of the display panel can be used as it is. Therefore, it is possible to easily cope with the change of the driving circuit pattern, and it is possible to reduce the cost.

Further, since the electrical connection in the image display device of the invention according to claim 7 is made via an ACF, the mounting of the integrated drive circuit chip on the glass substrate of the display panel, and The replacement of a defective drive circuit pattern with a new drive circuit pattern can be performed very easily.

In the image display device according to the present invention, a plurality of partial integrated drive circuit chips obtained by dividing one integrated drive circuit chip are mounted on the glass substrate of the display panel. The yield of the driving circuit chip can be further improved, and the mounting of the integrated driving circuit chip can be performed more easily.

[Brief description of the drawings]

FIG. 1 is a partial configuration diagram of a liquid crystal display device as an image display device of the present invention.

FIG. 2 is a diagram illustrating a configuration example of a liquid crystal panel in FIG. 1;

FIG. 3 is an explanatory diagram of a conductor pattern in FIG. 1;

FIG. 4 is a diagram illustrating a configuration of a driver chip in FIG. 1;

FIG. 5 is a diagram showing a configuration in a drive circuit area in FIG. 4;

FIG. 6 is a diagram showing an example in which the driver chip in FIG. 1 is mounted on a lower glass substrate by a face-down method.

FIG. 7 is a partial configuration diagram of a liquid crystal display device different from FIG.

FIG. 8 is a diagram showing a configuration in a drive circuit area different from that in FIG. 5;

9 is an explanatory diagram of an auxiliary conductor pattern applied to the driver chip shown in FIG.

FIG. 10 is a sectional view of a liquid crystal display device using a TCP mounting method.

FIG. 11 is a sectional view of a liquid crystal display device according to a COG mounting method using an ACF.

FIG. 12 is a plan view of a liquid crystal display device using a CIG mounting method.

FIG. 13 is a partial configuration diagram of a liquid crystal display device based on a mounting method using a stick crystal.

[Explanation of symbols]

41, 61: liquid crystal panel, 42, 62, 91: lower glass substrate, 43, 63: upper glass substrate, 47, 64, 65,
81: driver chip, 48, 66: conductor pattern,
49: glass substrate, 50, 82: drive circuit area, 51, 83: cutting line, 52, 84: drive circuit element, 53, 85: input electrode, 54,
86: output electrode, 55, 87: dummy electrode, 56: electrode pad, 60: AC
F, 88: metal wiring, 92, 93
... Auxiliary conductor pattern.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // H01L 21/60 311 H01L 21/60 311S

Claims (8)

[Claims] 1. An integrated drive circuit chip comprising a plurality of drive circuit patterns for driving a display panel formed on a glass substrate, wherein each of the drive circuit patterns is formed to be arranged in one direction. An integrated drive circuit chip, wherein a cut line for dividing the drive circuit pattern is provided between each drive circuit pattern. 2. The integrated drive circuit chip according to claim 1, wherein two sides of the drive circuit pattern formation region sandwiched between adjacent cut lines are opposed to each other along the cut lines. A power supply electrode is provided, an output electrode for driving a display panel is provided on another side of the drive circuit pattern formation region, and a dummy electrode is provided on a side opposite to the one side of the drive circuit pattern formation region. An integrated drive circuit chip characterized in that: 3. The integrated drive circuit chip according to claim 2, wherein a common electrode among the input electrode and the power supply electrode provided in the entire drive circuit pattern formation region is electrically connected by metal wiring. Integrated drive circuit chip. 4. The integrated drive circuit chip according to claim 1, wherein the electrodes are electrically connected to a common input signal line and a common power supply line formed on a glass substrate of the display panel. An image display device characterized by the above-mentioned. 5. An image display device comprising an electrode of the integrated drive circuit chip according to claim 3 and electrically connected to a conductor wire formed on a glass substrate of a display panel, wherein the conductor wire is The input electrodes and the power supply electrodes formed at the mounting position of the integrated drive circuit chip on the glass substrate and connected by the metal wirings across the cutting line in the integrated drive circuit chip. An image display device comprising auxiliary conductor wiring for connection on the side. 6. The image display device according to claim 5, wherein the number of the auxiliary conductor wirings is the number of the metal wirings connecting the input electrodes and the power supply electrodes across the cutting line. An image display device characterized by the above. 7. The image display device according to claim 4, wherein the electrical connection is made via an anisotropic conductive film. 8. The image display device according to claim 4, wherein the integrated drive circuit chip mounted on the glass substrate of the display panel is divided into a plurality of partial integrated drive circuit chips and mounted. An image display device, comprising: