JPH06152192A - Mounting method for semiconductor chip - Google Patents

Abstract

PURPOSE:To make a semiconductor chip mounting equipment small-sized. CONSTITUTION:When a board 3 is bonded to the surface of a board 2, electrode terminals are formed on the surface of a protruding part of the board 2 which part protrudes from the board 3. When a semiconductor chip 5 to be connected with the electrode terminals is mounted, input leads 24 and output leads 23 are formed on a flexible wiring film 21. Inner end potions of the input leads 24 and the output leads 23 are connected with an I/O pad of the semiconductor chip 5. After the outer end portions of the output leads 23 are connected with the electrode terminals, the wiring film 21 is so bent that the section is U-shaped. Thereby the semiconductor chip 5 is positioned on the surface of the protruding part of the board 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a semiconductor chip, and more particularly to a method for mounting a semiconductor chip on the middle surface of a stepped substrate.

For example, in a liquid crystal display device, in a display panel in which liquid crystal is filled in a gap formed by stacking a pair of glass substrates, part of the other glass substrate protrudes from one glass substrate, and the other surface of the glass substrate is aligned with the other. A terminal for mounting or connecting a driving IC chip is formed on a portion protruding from the glass substrate.

[0003]

2. Description of the Related Art As a main method of connecting a driving semiconductor chip to a display panel, a method of mounting on a display panel by using COG (Chipon Glass) technology and a method of mounting TAB (Tape Au
There is a method to connect using tomatid Bonding) technology.

FIG. 6 is an explanatory view of a conventional display panel in which semiconductor chips are mounted by COG, and FIG. 7 is an explanatory view of a conventional display panel in which semiconductor chips are connected by TAB. Liquid crystal display panels 1 and 11 are a pair of glass substrates. 2 and 3 are joined with a sealing material 4, liquid crystal is filled in a gap between the glass substrates 2 and 3 surrounded by the sealing material 4, and the driving semiconductor chip 5 is attached to the surface of the glass substrate 2 to which the glass substrate 3 is joined. A terminal 6 to be connected is formed.

In FIG. 6, on the surface of the glass substrate 2 of the display panel 1, a terminal 6 connected to the output pad 8 of the semiconductor chip 5 and a terminal 7 connected to the input pad 9 of the semiconductor chip 5 are connected to the display area. To form an electrical connection between the output pad 8 and the connection terminal 6 and the input pad 9 and the connection terminal 7.
The electrical connection with the is maintained by the adhesive 10 filled between the glass substrate 2 and the semiconductor chip 5.

In FIG. 7, a lead 13 for connecting the output pad 8 of the semiconductor chip 5 and a lead 14 for connecting the input pad 9 of the semiconductor chip 5 are formed on the flexible wiring film 12 generally made of polyimide. After bonding the chip 5 and the wiring film 12 with the resin 15, the lead 13 to which the output pad 8 is connected is connected to the terminal 6 formed on the surface of the glass substrate 2.

[0007]

In the liquid crystal display panel, a method of mounting the semiconductor chip 5 on the glass substrate 2 by the COG method is a semiconductor chip mounting area of the semiconductor chip 5 and a semiconductor chip mounting around the area of, for example, about 3 mm. A conductive pattern forming area is required for extension of the display area, the glass substrate 2 becomes large in size, and the semiconductor chip 5 to be mounted has no leads connected to it, so electrical check before mounting cannot be performed. There was a problem.

On the other hand, in the mounting method of the semiconductor chip 5 in which the flexible wiring film 12 is used to utilize the TAB technology and the electrical check can be performed before mounting, the wiring film 12 is projected to the side of the display panel 1, Even if the wiring film 12 is bent in a U-shape for downsizing, the bent portion protrudes from the display panel, so that the display panel housing is enlarged and the output leads formed on the wiring film 12 have a fine pitch. Therefore, there is a problem that the mounted semiconductor chip 5 cannot be electrically checked using the lead.

[0009]

According to the method of the present invention for solving the above-mentioned problems, according to FIG. 1 showing the main steps, when the substrate 3 is bonded to the surface of the substrate 2, it projects from the substrate 3. When an electrode terminal is formed on the surface of the protruding portion of the substrate 2 and the semiconductor chip 5 connected to the electrode terminal is mounted, an input lead 24 and an output lead 23 connected to the semiconductor chip 5 are formed on the flexible wiring film 21. Then, the inner ends of the input / output leads 23, 24 are connected to the input / output pads of the semiconductor chip 5, the outer ends of the output leads 23 are connected to the electrode terminals, and then the wiring film 21 is bent into a U-shaped cross section. The semiconductor chip 5 is arranged on the surface of the protruding portion of the substrate 2.

Further, the wiring film 21 is provided with a test terminal to be connected to the input / output lead thereof, so that the mounted semiconductor chip 5 can be electrically tested. By disconnecting such a terminal after the electrical test is completed, wiring is performed. Film 21 on substrate 3
Do not become an obstacle when connecting to.

[0011]

According to the above means, the wiring film 21 on which the semiconductor chip 5 is mounted is bent and the semiconductor chip 5 is housed in the step portion between the substrates 2 and 3.

In the conventional liquid crystal display device, the stepped portion of the display panel is simply an empty area, and the semiconductor chip 5 is accommodated in the empty area in the method of the present invention. Therefore, the protrusion amount of the substrate 2 with respect to the substrate 3 depends on the wiring film 21.
The size required for connection (for example, about 5 mm) or the thickness of the semiconductor chip 5 is sufficient, and the value is equal to or less than that of the mounting method using the wiring film in the conventional method.

Therefore, the substrate 2 is smaller than that in which the semiconductor chip 5 is mounted by the COG method, and the semiconductor chip 5 does not protrude from the substrate 2 as compared with the conventional one using the wiring film, and thus the liquid crystal display panel is accommodated. It enables downsizing of the housing.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a main process diagram of a semiconductor chip mounting method according to the present invention, FIG. 2 is an explanatory view of a first wiring film for mounting a semiconductor chip according to the present invention method, and FIG. 3 is a semiconductor according to the present invention method. FIG. 4 is an explanatory view of a second wiring film for mounting a chip, FIG. 4 is an explanatory view of a third wiring film for mounting a semiconductor chip according to the method of the present invention, and FIG. 5 is a fourth drawing for mounting a semiconductor chip according to the method of the present invention. It is explanatory drawing of the wiring film of.

In FIG. 1 (a), the semiconductor chip 5 is mounted on a flexible wiring film 21 having input / output leads formed thereon, and then the wiring film 21 is connected to the glass substrate 2 as shown in FIG. 1 (b).

Next, as shown in FIG. 1C, the wiring film 21 is bent so as to enclose the semiconductor chip 5, and the tip end thereof is adhered to the upper surface of the glass substrate 3 with an adhesive or an adhesive tape 22. In the figure, reference numeral 23 is a lead connected to the output pad of the semiconductor chip 5, 24 is a lead connected to the input pad of the semiconductor chip 5, 25 is a lead for connecting a common lead 24, and 26 is a side surface of the semiconductor chip 5. Wiring film 21
It is an adhesive that adheres to.

In FIG. 1D, 27 is a U-shaped cross-section frame made of, for example, a spring metal plate.
The frame 27 that protects the wiring film 21 and the connecting portions thereof is clamped to the end portion of the display device 1 by the spring elasticity of itself.

Generally, the thickness t of the glass substrate 3 is about 1.1 mm, and the glass substrate 2 is used for connecting the wiring film 21.
The amount a protruding from the glass substrate 3 is about 2 to 3 mm. Therefore, when the semiconductor chip 5 having a width w of about 1 mm (the height h at that time is about 0.5 mm) is used, the semiconductor chip 5 has a rectangular cross-sectional area formed by the steps between the glass substrates 2 and 3. It does not protrude beyond the end surface of the glass substrate 2 and the upper surface of the glass substrate 3 within the inside.

In FIG. 2, (a) is a plan view and (b) is a lateral side view. The surface of a wiring film 31 corresponding to the wiring film 21 of FIG. A plurality of output leads 32 for connecting to the semiconductor chip 5
And a plurality of input leads 33 for connecting the input pads of.

The inner ends of the leads 32 and 33 are connected to the wiring film 31.
Then, it projects into the inside of the square through hole 34 that has been opened, and the output pad or the input pad of the semiconductor chip 5 is pressure bonded. On the back surface of the wiring film 31, one end is connected to the lead 32 through the via hole 35, and the other end is connected to the electrode terminal of the glass substrate 2 at the other end. The lead 33 is connected and one end of the lead 25 is connected to the drive circuit device.

The wiring film 31 is used for the semiconductor chip 5
After mounting the lead 32 and connecting the lead 32 to the electrode terminal of the liquid crystal display panel 1, the semiconductor chip 5 is formed in the same manner as the wiring film 21.
Can be accommodated without protruding from the end surface of the glass substrate 2 and the upper surface of the glass substrate 3.

In FIG. 3, (a) is a plan view, (b) is a lateral side view, and the surface of the wiring film 41 corresponding to the wiring film 21 of FIG. A plurality of output leads 32 for connecting to the semiconductor chip 5
A plurality of input leads 33 for connecting the input pads are formed, and terminals 42 and 43 for connecting the input / output pads of the semiconductor chip 5 are formed on the inner ends of the leads 32 and 33.

On the back surface of the wiring film 41, one end is connected to the lead 32 through the via hole 35, and the other end is connected to the electrode terminal of the glass substrate 2 at the other end. The lead 33 is connected to the intermediate portion and one end is formed with the lead 25 connected to the drive circuit device.

The wiring film 41 is used for the semiconductor chip 5
After mounting the lead 32 and connecting the lead 32 to the electrode terminal of the liquid crystal display panel 1, the semiconductor chip 5 is formed in the same manner as the wiring film 21.
Can be accommodated without protruding from the end surface of the glass substrate 2 and the upper surface of the glass substrate 3.

FIG. 4 is a plan view showing the wiring film of FIG.
On the surface of the wiring film 51 corresponding to 21, the output lead 3
2, input lead 33, pad connection terminals 42 and 43 are formed, and leads 23 and 25 are formed on the back surface.

The wiring film 51 on which a plurality of (five in the figure) semiconductor chips 5 are mounted is provided with notches 52 and 53 on the end face in the lengthwise direction, and from the lower side is the boundary of the mounted semiconductor chips 5. Correspondingly, a notch 54 for dividing the leads 23, 32 is provided. However, in the notch 54, a bulge 55 is formed at a portion overlapping with a straight line connecting the pair of recesses 52.

The wiring film 51 is provided with the notches 52 and 53, the notch 54 and the bulge 55 to facilitate bending of the U-shaped cross section as shown in FIG.
Reference numeral 54 prevents stress in the peeling direction from being applied to the connection between the lead 23 and the electrode terminal of the glass substrate 2 when the wiring film 51 is bent in a U-shaped cross section.

In FIG. 5, (a) is a plan view and (b) is an enlarged back view showing only a part. On the surface of the wiring film 61 corresponding to the wiring film 21 of FIG. 1, the output pad of the semiconductor chip 5 is formed. A plurality of terminals 42 for connecting the input pads of the semiconductor chip 5 and a plurality of terminals 43 and 43 for connecting the input pads of the semiconductor chip 5.
Forming a lead 33 connected to the.

On the other hand, on the back surface of the wiring film 61, the lead 23 having one end connected to the terminal 42 via the via hole 35, the first test terminal 62 connected to the other end of the lead 23, and the via hole 36 are provided. Lead 25 to connect to lead 33, and lead 25
A mark 64 for disconnecting the second test terminal 63 to which the outer end of the second test terminal 63 is connected and the test terminal 62 is formed.

The wiring film 61 is used for the semiconductor chip 5
When equipped with, the electrical test (for example continuity test)
The terminals 62, 63 can be brought into contact with a probe for inspection, and the terminals 62 that interfere with the connection of the semiconductor chip 5 to the electrode terminals of the glass substrate 2 are formed at the end portions in the length direction of the wiring film 61. The wiring film 61 is cut and separated along a straight line connecting the pair of marks 64.

Further, when the terminal 63 is also in the way, a mark 64
Is formed at a position necessary for that purpose, for example, the mark 64 is appropriately shifted to the left side from the illustrated position, the terminal 62 is cut off, and it is cut in the direction perpendicular to the cutting line and according to the mark 64.

[0032]

As described above, according to the method of the present invention, the semiconductor chip can be accommodated in the conventional air space, and when the method of the present invention is applied to the liquid crystal display device, the housing for the display panel can be miniaturized. .

Further, by connecting and forming a test terminal to the lead of the wiring film, an electric test of the semiconductor chip mounted on the wiring film becomes possible, and such a terminal is cut off after the electric test of the mounted semiconductor chip is completed, so that the wiring is wired. It can be an obstacle when connecting the film to the substrate.

[Brief description of drawings]

FIG. 1 is a main process diagram of a semiconductor chip mounting method according to the present invention.

FIG. 2 is an explanatory view of a first wiring film for mounting a semiconductor chip according to the method of the present invention.

FIG. 3 is an explanatory view of a second wiring film for mounting a semiconductor chip according to the method of the present invention.

FIG. 4 is an explanatory view of a third wiring film for mounting a semiconductor chip according to the method of the present invention.

FIG. 5 is an explanatory view of a fourth wiring film for mounting a semiconductor chip according to the method of the present invention.

FIG. 6 is an explanatory view of a conventional display panel in which a semiconductor chip is COG-mounted.

FIG. 7 is an explanatory diagram of a conventional display panel in which semiconductor chips are connected by TAB.

[Explanation of symbols]

 2 is a glass substrate (one substrate) 3 is a glass substrate (the other substrate) 5 is a semiconductor chip 6 is a glass substrate electrode terminal 21,31,41,51,61 is a flexible wiring film 23,32 is an output lead 24, 25 and 33 are input leads 27 are protective members 35 and 36 are via holes 62 and 63 are inspection probe contact test terminals

Claims (3)

[Claims] 1. A substrate (3) on the surface of one substrate (2)
When the semiconductor chip (5) connected to the electrode terminal is mounted on the surface of the protruding portion of the one substrate protruding from the other substrate when the flexible wiring film (21 , 31, 41, 51, 61) are formed with input leads (24, 33) and output leads (23, 32) connected to the semiconductor chip, and the inner ends of the input / output leads are connected to the semiconductor chip. After connecting to the input / output pad and connecting the outer end of the output lead to the electrode terminal, the wiring film is bent into a U-shaped cross section, and the semiconductor chip is located on the surface of the protruding portion of the one substrate. A method for mounting a semiconductor chip, comprising: 2. The surface of the wiring film (61) has an input lead (3) connected to an input pad of the semiconductor chip (5).
3) and an output lead connected to the output pad of the semiconductor chip
(32) is formed, and the rear surface of the wiring film has a first test terminal (62), one end of which is connected to the output lead through the via hole (35) and the other end of which is in contact with the inspection probe. The lead (23) and the lead (25) having the second test terminal (63) connected to the input lead through the via hole (36) and contacting the inspection probe at the outer end portion are formed in the middle, An electrical test of the semiconductor chip is performed using the first and second test terminals, the wiring film is cut so as to disconnect at least the first test terminal, and then the output lead of the wiring film is connected to the electrode. The method for mounting a semiconductor chip according to claim 1, wherein the method is to connect to a terminal. 3. The wiring film (21, 31, 41, 51, 6) bent in a U-shaped cross section so as to wrap the semiconductor chip (5).
A cross section covering the wiring film after the bent tip of (1) is bonded to the other substrate (3), and the opening sandwiches the one substrate (2) and the other substrate bonded to the one substrate. The semiconductor chip mounting method according to claim 1, wherein a U-shaped protection member (27) is inserted.