JP2001267713A - Tape carrier package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tape carrier package(TCP) having an external connection terminal structure which enhances connection reliability. SOLUTION: This tape carrier package(TCP) is constituted by mounting a semiconductor device on a TCP tape substrate 1 (carrier tape) in which a wiring pattern 2a coated with a solder resist 3 and a TCP terminal 2 (external connecting terminal) connected to the wiring pattern are arranged. A region (peel-off part) of the TCP terminal 2 which is adjacent to the wiring pattern 2a and is not used in thermal composition bonding is coated with a thermoplastic resin 4 so as to a overlap on the solder resist 3. As a result, after the TCP terminal is thermal compression bonded via an anisotropic conductive film, it is possible to prevent a conductive contaminant from adhering to the peel-off part of the TCP terminal 2, and enhance sealing property of a TCP terminal connection part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier package (hereinafter referred to as TCP: Tape Carrier P) having an external connection terminal and mounting an integrated circuit device (hereinafter referred to as IC).
In particular, the present invention relates to a TCP having an external connection terminal structure that can improve connection reliability when thermocompression bonding is performed between a substrate terminal and a liquid crystal panel or the like via an anisotropic conductive film.

[0002]

2. Description of the Related Art In recent years, a method of mounting on a TCP has been widely used as an IC mounting method.

At present, TCP has a liquid crystal panel (LCD panel) because of its flexibility and ability to cope with a narrow pitch.
The mainstream of the mounting method of the IC which supplies the drive signal of the above.

FIG. 4 is a schematic diagram for explaining a method of mounting TCP on an LCD panel. FIG. 4A shows T before mounting.
FIG. 4B is a cross-sectional view of a main part of the CP and the LCD panel, and FIG. 4B is a cross-sectional view after mounting.

A conventional TCP 200 is composed of a wiring pattern 2a and a TCP terminal 2 connected to the pattern on a highly flexible TCP tape base material 1 such as a polyimide resin.
(External connection terminals) are provided, and IC
(Not shown) is implemented and configured. When this is connected to an LCD panel 5 constituted by mounting an LCD element 5b on a transparent substrate 5a such as a glass substrate, as shown in FIG. 4A, a thermosetting resin or a thermoplastic resin is used. After the anisotropic conductive film 7 including the conductive particles of metal particles such as Au, Au-Ni, and Cu is disposed on the LCD panel terminal 6, the TCP terminal 2 is disposed on the anisotropic conductive film 7. Then, heat is applied and pressed to thermocompress the LCD panel terminals 6 (FIG. 4B).

[0006]

However, in the above prior art, the TCP terminal 2 is provided with a region (exposed portion) adjacent to the wiring pattern 2a and not thermocompression-bonded, and the solder resist 3 is also provided in this portion. Not coated. This is for preventing the anisotropic conductive film from being blocked by the solder resist when the anisotropic conductive film is thermally melted, and to prevent the conductive particles in the anisotropic conductive resin from aggregating and shorting between the TCP terminals.

After connecting the LCD panel terminals 6 with the anisotropic conductive film 7, solder scraps, SUS scraps, and other conductive foreign substances 8 (see FIG. 4B) are exposed at the exposed portions of the TCP terminals 2 at the connection portions. There is a case that it enters and shorts between terminals. This phenomenon must be prevented because it has loose contact properties and leads to quality accidents in the market.

As a method for solving the above-mentioned problem, a technique of applying an insulating material to a bare portion of a TCP terminal after mounting has been proposed.
It is disclosed in Japanese Patent Application Laid-Open No. 8-320500. FIG.
FIG. 1 is a cross-sectional view of main parts such as a TCP and a mounting board for explaining this technology.

[0009] As shown in FIG.
0a TCP terminal 2 through anisotropic conductive film 7
After the connection to the CD panel 5, the exposed portion of the TCP terminal 2 is coated with an insulating material 9 made of a fluid resin such as silicone. Reference numeral 14 in FIG. 5 indicates a printed circuit board.

In this method, since the resin application operation must be performed manually, there are problems that the number of steps is increased and that the application position and the application amount are likely to vary.

Further, as another method for solving the above-mentioned problem of the conventional TCP mounting, a technique of coating a connection portion with a resin having two different characteristics after mounting has been proposed in Japanese Patent No. 2847831 or the like.

In this technique, as shown in FIG. 6, after connecting the electrode terminal 13 of the flat display panel 12 and the flexible cable 300 with the anisotropic conductive film 7, a gap formed in the overlapping edge portion is formed of a low-viscosity silicone resin. The resin is filled with a resin having a high fluidity (fluid resin 11), and further covered with a resin 10 such as an epoxy resin having a low fluidity.

In this technique, since the connection portion is covered with the double resin, the airtightness of the connection portion is improved, and the effect of preventing the adhesion of the conductive foreign matter and the improvement of the migration resistance is obtained. In addition, two resin coating steps are required after mounting, and there is a problem that the number of steps is increased and the manufacturing cost is increased.

In addition, a method has been proposed in which, after the TCP terminal is connected to the LCD panel, an adhesive tape is applied to the area around the TCP terminal to prevent foreign matter from entering, and a method of reducing the distance between the solder resist end of the TCP and the LCD panel end. However, in the former case, it takes a lot of man-hours to stick the adhesive tape by hand, and there is a problem that the accuracy of the tape sticking position varies widely.

In the latter case, since the accuracy of the resist formation position varies, the edge of the solder resist may overlap with the LCD panel in some cases. in this case,
In many cases, the conductive particles in the anisotropic conductive film flowing out during the thermocompression bonding are dammed, and the conductive particles aggregate at the solder resist ends, thereby causing a short between terminals. Therefore, it is necessary to design the solder resist end away from the LCD panel to some extent.

An object of the present invention is to provide a TCP having a connection-reliable TCP terminal structure which solves the above-mentioned problems of the prior art.
Is to provide.

[0017]

According to the present invention, an integrated circuit device is mounted on a carrier tape having a wiring pattern covered with a first insulating resin and terminals for external connection connected to the wiring pattern. In the tape carrier package (TCP) configured as described above, the external connection terminal is thermocompression-bonded to a terminal of a mounting board via an anisotropic conductive film, and the external connection terminal is connected to the wiring pattern. It is characterized by having a region adjacent to the connection portion that is not thermocompression-bonded to the terminal of the mounting board, and that the non-compression-bonded region is covered with a second insulating resin.

In the above configuration, the second insulating resin can be formed so as to overlap the first insulating resin. By forming the second insulating resin so as to be superimposed on the first insulating resin, it is possible to prevent peeling of the solder resist end portion during mounting.

Further, in the above configuration, the pattern of the second insulating resin can be formed at predetermined intervals between the external connection terminals. The pattern of the second insulating resin may be a linear regular pattern or a staggered pattern.

By providing the pattern of the second insulating resin between the external connection terminals, the sealing property between the electrodes of the liquid crystal panel or the like and the external connection terminals of the TCP by the anisotropic conductive resin is improved and the adhesion is improved. Can be improved.

As the second insulating resin, polyethylene resin, polybutylene resin, polybutadiene resin, polystyrene resin, polycarbonate resin, polyurethane resin, ionomer resin, polyacetal rule resin, polyamide resin, polyester resin, polyimide resin, polypropylene resin, A thermoplastic resin of a single resin such as polyvinyl acetate resin and polymethyl methacrylate resin or a resin obtained by mixing two or more of these resins is used, and an inorganic filler such as silica is added to the thermoplastic resin to cause thermal expansion. Rate can be reduced.

In the present invention, by using a thermoplastic resin as the second insulating resin, the thermoplastic resin is melted and adhered to the anisotropic conductive film during the TCP thermocompression bonding, and the heat of the external connection terminals of the TCP is reduced. The part that does not contribute to pressure bonding (bare part) is kept covered. As a result,
It is possible to improve the sealing property of the TCP connection portion and to prevent the adhesion of conductive foreign substances to the exposed portion of the external connection terminal of the TCP.
The connection reliability of the CP can be improved.

[0023]

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIGS. 1A to 1C show the TC of the present invention.
It is a top view showing the structure of the TCP terminal part for explaining embodiment of P.

FIG. 1A is a plan view of a TCP according to a first embodiment of the present invention. TCP 100 has a TCP terminal 2 for external connection on a flexible TCP tape base material 1 such as polyimide. And a wiring pattern 2a connected thereto and covered with a solder resist 3 (insulating resin). An IC (not shown) is mounted on the wiring pattern 2a to form the TCP 100.

In FIG. 1A, a thermoplastic resin 4 as an insulating resin is formed adjacent to the solder resist 3 in a region adjacent to the wiring pattern 2a of the TCP terminal 2 and not used for crimping. FIG. 2 is a sectional view taken along line AA ′ of FIG.

The thermoplastic resin 4 is solid at normal temperature,
When thermocompression-bonded to a TCP terminal and a terminal of an LCD panel or the like with an anisotropic conductive film, a material that becomes gel or liquid depending on the temperature is used.
Polycarbonate resin, polyurethane resin, ionomer resin, polyacetal rule resin, polyamide resin, polyester resin, polyimide resin, polypropylene resin,
A thermoplastic resin such as a single resin such as a polyvinyl acetate resin or a polymethyl methacrylate resin, or a resin obtained by mixing two or more of these resins can be used. The thermoplastic resin is TCP
It can be formed by applying a liquid resin on the tape base material or by thermocompression bonding a resin sheet.

The coating amount of the thermoplastic resin 4 should not be too large, for example, the thickness should be suppressed to about 10 μm. This is because the thermoplastic resin has fluidity due to the heat generated during thermocompression bonding.If the amount is too large, it flows along the side of the LCD panel,
This is because there is a possibility that an adverse effect such as adhesion to a tool holder of the crimping device may occur.

FIG. 1B is a plan view of a TCP according to a second embodiment of the present invention, in which the thermoplastic resin 4 is formed so as to overlap the solder resist in the TCP of FIG. . By providing the thermoplastic resin 4 to be formed on the exposed portion of the TCP terminal so as to overlap the solder resist, there is an effect that peeling of the end of the solder resist can be prevented.

FIG. 1C is a plan view of a TCP according to a third embodiment of the present invention. In the TCP of FIG. 1, a thermoplastic resin 4 is further formed with a predetermined width between TCP terminals 2. ing. The thickness of the thermoplastic resin 4 between the TCP terminals is TC
The thickness is about the thickness of the P terminal 2. By forming the thermoplastic resin 4 also between the TCP terminals, the adhesion between the TCP terminal 2 and the LCD panel is improved and the TC is improved as compared with the TCP of FIG.
There is an effect that the sealing property between the P terminal and the LCD panel can be improved.

Further, as the fourth embodiment of the present invention, the above-described second and third embodiments can be combined to form a TCP having more excellent sealing properties.

Next, an example of using the TCP of the present invention will be described with reference to FIG.

FIG. 3 is a cross-sectional view for explaining a method of thermocompression bonding the TCP of FIG. 1B to an LCD panel via an anisotropic conductive film, and FIG. 3A is a cross-sectional view before connection. FIG. 3B shows a cross-sectional view after connection.

First, as shown in FIG. 3A, an anisotropic conductive film 7 is arranged on the LCD panel terminal 6 of the LCD panel 5. On this anisotropic conductive film 7, the T
The two surfaces of the CP terminal are aligned.

Next, as shown in FIG. 3B, the TCP terminals 2 are thermocompression-bonded to the LCD panel terminals 6 via the anisotropic conductive film 7 by applying heat and pressure. The anisotropic conductive film 7 flows toward both outer sides of the TCP terminal during thermocompression bonding. At this time, the thermoplastic resin 4 also has fluidity due to heat. It is pushed out.

When the thermocompression bonding is completed, the temperature drops and the thermoplastic resin 4 solidifies again, and the surface of the TCP terminal 2 is sealed with the anisotropic conductive film 7 and the thermoplastic resin 4. T
Since the exposed portion of the CP terminal 2 is eliminated, there is no risk of short-circuiting between the TCP terminals 2 even when conductive foreign matter adheres. Note that the TCP according to the other embodiments can be connected to the LCD panel in a similar manner.

As described above, in the embodiment of the present invention, T
Although the connection between the CP and the LCD panel has been described, the TCP of the present invention can perform the same connection for the PDP. Needless to say, the terminal structure of the TCP of the present invention can be applied to an external connection terminal of a normal flexible substrate.

[0038]

As described above, according to the present invention, the following effects can be obtained. (1) Since the exposed portion of the TCP terminal (the portion adjacent to the portion to be thermocompression-bonded but not thermocompression-bonded) formed when the TCP terminal and the LCD panel terminal are connected is covered in advance with a thermoplastic resin, the conductive foreign matter may enter. Short circuit between terminals can be prevented. (2) When the connection between the TCP terminal and the LCD panel terminal is completed, the exposed portion of the TCP terminal is previously coated with a thermoplastic resin, so that it is not necessary to newly coat this portion, and the mounting process can be simplified.

[Brief description of the drawings]

FIG. 1 is a plan view of a terminal portion of a TCP according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line A-A 'in FIG.

FIG. 3 is a schematic cross-sectional view for explaining a method of mounting the TCP of the present invention on an LCD panel.

FIG. 4 is a schematic cross-sectional view for explaining a method of mounting a conventional TCP on an LCD panel.

FIG. 5 is a schematic cross-sectional view for explaining a method of mounting a conventional TCP on an LCD panel.

FIG. 6 is a schematic cross-sectional view for explaining a conventional method of connecting a flat display panel and a flexible cable.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 TCP tape base material 2 TCP terminal 2a Wiring pattern 3 Solder resist 4 Thermoplastic resin 5 LCD panel 5a substrate 5b LCD element 6 LCD panel terminal 7 Anisotropic conductive film 8 Conductive foreign material 9 Insulating material 10 Resin 11 Fluid resin 12 Flat display panel 13 Electrode terminal 14 Printed circuit board 100, 200, 200a TCP 300 Flexible cable

Continued on the front page F-term (reference) 2H092 GA51 HA26 HA28 MA32 NA16 NA27 4J002 BB021 BB031 BB121 BB171 BB231 BC031 BF021 BG061 BL011 CB001 CF001 CG001 CK021 CL001 CM041 DJ016 FD016 GQ01 GQ05 5E344 BB043NN0413A0202

Claims (6)

[Claims] 1. A tape carrier package comprising an integrated circuit device mounted on a carrier tape provided with a wiring pattern covered with a first insulating resin and external connection terminals connected to the wiring pattern. Wherein the external connection terminal is thermocompression-bonded to a terminal of a mounting board via an anisotropic conductive film, and the external connection terminal is adjacent to a connection portion with the wiring pattern. A tape carrier package having a region that is not thermocompression-bonded to a terminal, and wherein the region that is not crimped is covered with a second insulating resin. 2. The tape carrier package according to claim 1, wherein said second insulating resin is formed so as to overlap with said first insulating resin. 3. A pattern of the second insulating resin is further formed between the external connection terminals.
The described tape carrier package. 4. The tape carrier package according to claim 1, wherein the second insulating resin is a resin containing a thermoplastic resin as a main component. 5. The tape carrier package according to claim 1, wherein the second insulating resin contains a thermoplastic resin as a main component and further contains an inorganic filler. 6. The thermoplastic resin is a polyethylene resin,
Selected from polybutylene resin, polybutadiene resin, polystyrene resin, polycarbonate resin, polyurethane resin, ionomer resin, polyacetal rule resin, polyamide resin, polyester resin, polyimide resin, polypropylene resin, polyvinyl acetate resin, and polymethyl methacrylate resin 6. The tape carrier package according to claim 4, wherein the tape carrier package is one resin or a mixed resin of two or more of these resins.