JPH0775177B2 - Junction structure - Google Patents
Junction structureInfo
- Publication number
- JPH0775177B2 JPH0775177B2 JP4139626A JP13962692A JPH0775177B2 JP H0775177 B2 JPH0775177 B2 JP H0775177B2 JP 4139626 A JP4139626 A JP 4139626A JP 13962692 A JP13962692 A JP 13962692A JP H0775177 B2 JPH0775177 B2 JP H0775177B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode terminals
- metal particles
- insulating coating
- insulating
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は一対の基板に形成され
た一方の電極端子と他方の電極端子とを接合する接合構
造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joining structure for joining one electrode terminal and the other electrode terminal formed on a pair of substrates.
【０００２】[0002]
【従来の技術】従来、文字、図形、画像等の情報を表示
する表示装置として、例えば、図４に示す液晶表示装置
が知られている。この液晶表示装置は液晶表示パネル１
に半導体ユニット２を接合し、この半導体ユニット２で
液晶表示パネル１を駆動し、所要の情報を表示する。そ
して、液晶表示パネル１は上下一対の透明ガラス基板３
ａ、３ｂの対向面にＩＴＯ（Indium Tin Oxide ）等よ
りなる透明な電極を形成し、その間に液晶を封入すると
ともに、透明ガラス基板３ａ、３ｂの各端部が側方へ突
出し、この突出部に多数の接続用の電極端子４が形成さ
れている。また、半導体ユニット２はポリイミド等より
なる可撓性を有するフィルム基板５にＩＣ、ＬＳＩ等の
半導体チップ６を搭載しこのフィルム基板５の周縁に多
数の接続用の電極端子７がパターン形成されている。そ
して、液晶表示パネル１と半導体ユニット２とは、図５
に示すように接合されている。即ち、フィルム基板５に
形成されている電極端子７と透明ガラス基板３ｂに形成
されている電極端子４とが重なるように対向させ、その
間に異方性コネクター８を介在させて、接合している。
この異方性コネクター８は絶縁性を有する接着剤９に金
属粒子１０を混入したものである。したがって、接合時
には、対向する電極端４と７との間に、金属粒子１０が
挾まれ、この金属粒子１０を介して、対向する電極端子
４と７とが導通するが、隣接する電極端子４、４及び
７、７間では導通せず、絶縁性が保持される。2. Description of the Related Art Conventionally, for example, a liquid crystal display device shown in FIG. 4 has been known as a display device for displaying information such as characters, figures and images. This liquid crystal display device has a liquid crystal display panel 1.
The semiconductor unit 2 is bonded to the semiconductor unit 2 and the liquid crystal display panel 1 is driven by this semiconductor unit 2 to display the required information. The liquid crystal display panel 1 includes a pair of upper and lower transparent glass substrates 3
A transparent electrode made of ITO (Indium Tin Oxide) or the like is formed on the opposing surfaces of a and 3b, liquid crystal is enclosed between them, and each end of the transparent glass substrates 3a and 3b is projected laterally. A large number of electrode terminals 4 for connection are formed on. The semiconductor unit 2 has a flexible film substrate 5 made of polyimide or the like on which a semiconductor chip 6 such as an IC or LSI is mounted, and a large number of electrode terminals 7 for connection are patterned on the periphery of the film substrate 5. There is. The liquid crystal display panel 1 and the semiconductor unit 2 are shown in FIG.
It is joined as shown in. That is, the electrode terminals 7 formed on the film substrate 5 and the electrode terminals 4 formed on the transparent glass substrate 3b are opposed to each other so as to overlap with each other, and the anisotropic connector 8 is interposed therebetween to join them. .
The anisotropic connector 8 is a mixture of an insulating adhesive 9 and metal particles 10. Therefore, at the time of bonding, the metal particles 10 are sandwiched between the opposing electrode ends 4 and 7, and the opposing electrode terminals 4 and 7 are electrically connected through the metal particles 10, but the adjacent electrode terminals 4 are connected. There is no conduction between 4 and 7 and 7 and the insulating property is maintained.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記の
ような接合構造において、隣接する電極端子７、７及び
４、４をファインピッチ化（細密度化）するのに対応さ
せるため、異方性コネクター８の金属粒子１０の数を多
くすると、対向する電極端子７と４の間の導通性は保た
れるが、隣接する電極端子７、７及び４、４間の絶縁性
が悪くなり、逆に、金属粒子１０の数を少なくすると、
隣接する電極端子７、７及び４、４間の絶縁性はよくな
るが、対向する電極端子７と４との間の導通性が悪くな
る。そのため、このような接合構造では、隣接する電極
端子７、７及び４、４をファインピッチ化することが困
難であるという欠点があった。この発明は前記した事情
に鑑みてなされたもので、その目的とする処は、互いに
対向する電極端子間に確実かつ良好に導通させることが
できるとともに、電極端子のファインピッチ化を可能に
する接合構造を提供することにある。However, in the above-mentioned joining structure, in order to cope with the fine pitch (fine density) of the adjacent electrode terminals 7, 7 and 4, 4, the anisotropic connector is used. When the number of the metal particles 10 of 8 is increased, the electrical conductivity between the opposing electrode terminals 7 and 4 is maintained, but the insulating property between the adjacent electrode terminals 7, 7 and 4, 4 deteriorates, and conversely. , When the number of metal particles 10 is reduced,
The insulating property between the adjacent electrode terminals 7, 7 and 4, 4 is improved, but the electrical conductivity between the opposing electrode terminals 7 and 4 is deteriorated. Therefore, such a joint structure has a drawback that it is difficult to make the adjacent electrode terminals 7, 7 and 4, 4 fine pitched. The present invention has been made in view of the above-mentioned circumstances, and a purpose of the present invention is to provide a joint that can reliably and satisfactorily conduct electricity between electrode terminals that face each other and that enables a fine pitch of the electrode terminals. To provide the structure.
【０００４】[0004]
【課題を解決するための手段】本願の発明は、熱溶融型
の絶縁性接着剤中に導電粒子を混入してなる異方性コネ
クターを、対向配置された電極端子間に介在させて接合
する接合構造において、少なくとも一方の前記電極端子
の表面を絶縁被膜で覆い、熱圧着時に前記異方性コネク
ターの導電粒子が前記絶縁被膜を突き破って、前記電極
端子を導通させることを特徴とする。According to the invention of the present application, an anisotropic connector formed by mixing conductive particles in a heat-melting type insulating adhesive is joined between electrode terminals arranged facing each other. In the joint structure, at least one of the electrode terminals has a surface covered with an insulating coating, and the conductive particles of the anisotropic connector break through the insulating coating during thermocompression bonding to make the electrode terminals conductive.
【０００５】[0005]
【実施例】以下、図１及び図２を参照して、この発明の
第１実施例を説明する。従来技術の項で示した図４及び
図５に記した部材と同構成及び作用を有する部材には同
符号を付すとともに、説明の重複を省く。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. Members having the same configurations and functions as the members shown in FIGS. 4 and 5 shown in the section of the prior art are denoted by the same reference numerals, and duplicate description is omitted.
【０００６】液晶表示パネル１の電極端子４は前記した
従来例と同様にＩＴＯ等よりなり、その厚さが極めて薄
く形成されている。The electrode terminal 4 of the liquid crystal display panel 1 is made of ITO or the like as in the above-mentioned conventional example, and is formed to be extremely thin.
【０００７】また、半導体ユニット２の電極端子７は銅
箔等をエッチングすることにより形成され、その厚さは
上述した液晶表示パネル１の電極端子４よりも極めて厚
く形成されており、その表面にディップ方式等によっ
て、熱硬化エポキシ樹脂等の絶縁被膜１１が１０μｍ程
度の厚さに形成されている。The electrode terminals 7 of the semiconductor unit 2 are formed by etching copper foil or the like, and the thickness thereof is much thicker than that of the electrode terminals 4 of the liquid crystal display panel 1 described above. An insulating coating 11 of thermosetting epoxy resin or the like is formed to a thickness of about 10 μm by a dip method or the like.
【０００８】また、この電極端子４、７間に介在する異
方性コネクター１２は絶縁性被膜１１の厚さよりも大き
い直径のＮｉ等よりなる硬い金属粒子１０を絶縁性を有
する接着剤９に混入したものである。そして、電極端子
７、４とは、その間に異方性コネクター１２を介して熱
圧着により接合されている。Further, the anisotropic connector 12 interposed between the electrode terminals 4 and 7 mixes hard metal particles 10 made of Ni or the like having a diameter larger than the thickness of the insulating film 11 into the adhesive 9 having an insulating property. It was done. The electrode terminals 7 and 4 are joined by thermocompression bonding via the anisotropic connector 12 therebetween.
【０００９】かくして、電極端子４、７が熱圧着によっ
て接合される際、電極端子４、７に挾まれた硬い金属粒
子１０が電極端子７の表面の絶縁被膜１１を突き破っ
て、電極端子４、７に夫々圧接し、電極端子４と７とを
導通する。一方、隣接する電極端子７、７間において
は、熱圧着の際に、金属粒子１０が電極端子７の側面の
絶縁被膜１１を突き破ることがないので、仮に隣接する
電極端子７、７間において、金属粒子１０が相互に接触
し合って、金属粒子１０同士が導通したとしても、隣接
する電極端子７、７間の絶縁性は確保される。このた
め、電極端子４、７のファインピッチ化が可能となる。
この場合、液晶表示パネル１の電極端子４はその厚さが
極めて薄いので、異方性コネクター１２の金属粒子１０
により隣接する電極端子４、４は導通することはない
が、この電極端子４、４の厚さが厚くなった場合には、
この表面にも上述した半導体ユニット２の電極端子７と
同様に絶縁被膜を施してもよい。Thus, when the electrode terminals 4, 7 are joined by thermocompression bonding, the hard metal particles 10 sandwiched between the electrode terminals 4, 7 break through the insulating coating 11 on the surface of the electrode terminals 7, 7 are pressed against each other to electrically connect the electrode terminals 4 and 7. On the other hand, between the adjacent electrode terminals 7 and 7, since the metal particles 10 do not break through the insulating coating 11 on the side surface of the electrode terminal 7 during thermocompression bonding, between the adjacent electrode terminals 7 and 7, Even if the metal particles 10 are in contact with each other and the metal particles 10 are electrically connected to each other, the insulating property between the adjacent electrode terminals 7 is ensured. Therefore, the fine pitch of the electrode terminals 4 and 7 can be achieved.
In this case, since the electrode terminal 4 of the liquid crystal display panel 1 is extremely thin, the metal particles 10 of the anisotropic connector 12 are
Therefore, the adjacent electrode terminals 4 and 4 do not become conductive, but when the thickness of the electrode terminals 4 and 4 increases,
An insulating coating may be applied to this surface similarly to the electrode terminal 7 of the semiconductor unit 2 described above.
【００１０】次に、図３を参照して、この発明の第２実
施例を説明する。図中、同じ構成・作用を有する部材に
は同符号を付し、説明の重複を省く。この実施例におい
ては、異方性コネクター１３が絶縁性を有する接着剤９
とこの接着剤９内に混入された表面に絶縁被膜１４を施
した金属粒子１０とにより構成されている。Next, a second embodiment of the present invention will be described with reference to FIG. In the drawings, members having the same configuration and action are designated by the same reference numerals, and duplicate description will be omitted. In this embodiment, the anisotropic connector 13 has an insulating adhesive 9
And the metal particles 10 having the surface coated with the insulating coating 14 mixed in the adhesive 9.
【００１１】この金属粒子１０は半田粒子よりなり、こ
の金属粒子１０の表面に酸化被膜よりなる絶縁被膜１４
が施されている。The metal particles 10 are solder particles, and the surface of the metal particles 10 is an insulating film 14 made of an oxide film.
Has been applied.
【００１２】そして、透明ガラス基板３ｂの上面及びこ
の上面に形成された電極端子４の表面に薄くフラックス
（界面活性剤）を塗布したものと、フィルム基板５及び
この裏面に形成された電極端子７とを絶縁被膜１４を施
した金属粒子１０を混入した接着剤９を介して、アライ
メントし、フィルム基板５の上面をヒータチップで押圧
することによって、透明ガラス基板３ｂの電極端子４と
フィルム基板５の電極端子７とが接合される。A thin flux (surfactant) is applied to the upper surface of the transparent glass substrate 3b and the surface of the electrode terminals 4 formed on the upper surface, and the film substrate 5 and the electrode terminals 7 formed on the back surface thereof. Are aligned through an adhesive 9 mixed with metal particles 10 coated with an insulating coating 14, and the upper surface of the film substrate 5 is pressed by a heater chip, whereby the electrode terminals 4 of the transparent glass substrate 3b and the film substrate 5 are aligned. And the electrode terminal 7 of are joined.
【００１３】かくして、対向する電極端子４と７との間
において、酸化被膜からなる絶縁被膜１４が温度とフラ
ックスとの効果で、破られて、金属粒子１０が電極端子
４、７に接するとともに融着し、電極端子４と７とが導
通する。一方、隣接する電極端子４及び７は夫々の間に
おいては、熱圧着の際に、絶縁被膜１４が破れないの
で、絶縁性が確保できる。Thus, between the opposing electrode terminals 4 and 7, the insulating coating 14 made of an oxide coating is broken by the effect of temperature and flux, and the metal particles 10 come into contact with the electrode terminals 4 and 7 and melt. Then, the electrode terminals 4 and 7 are electrically connected. On the other hand, between the adjacent electrode terminals 4 and 7, since the insulating coating 14 is not broken during thermocompression bonding, the insulating property can be secured.
【００１４】従って、電極端子４、７のファインピッチ
化が可能になる効果がある。なお、金属粒子１０の表面
にディップ方式等により熱可塑性樹脂等よりなる絶縁被
膜１４を形成してもよい。Therefore, there is an effect that the fine pitch of the electrode terminals 4 and 7 can be realized. The insulating coating 14 made of a thermoplastic resin or the like may be formed on the surface of the metal particles 10 by a dip method or the like.
【００１５】[0015]
【発明の効果】以上詳細に説明したように、本願の発明
によれば、対向する一対の電極端子を確実かつ良好に導
通させることができるとともに、隣接する電極端子間に
おいては、それ等の間の導通を確実に防止することがで
き、これにより、電極端子間のファインピッチ化ができ
る効果がある。As described in detail above, according to the invention of the present application, a pair of electrode terminals facing each other can be surely and satisfactorily conducted, and the space between adjacent electrode terminals can be improved. Can be surely prevented from being conducted, which has an effect that a fine pitch can be achieved between the electrode terminals.
【図１】この発明の第１実施例の縦断面図FIG. 1 is a vertical sectional view of a first embodiment of the present invention.
【図２】半導体ユニットの電極端子部分の縦断面図FIG. 2 is a vertical sectional view of an electrode terminal portion of a semiconductor unit.
【図３】第２実施例の縦断面図FIG. 3 is a vertical sectional view of a second embodiment.
【図４】従来の接合構造の平面図FIG. 4 is a plan view of a conventional joining structure.
【図５】その接合部の縦断面図FIG. 5 is a vertical sectional view of the joint portion.
３ｂ、５ 基板 ４、７ 電極端子 ８、１２、１３ 異方性コネクター ９ 接着剤 １０ 金属粒子（導電粒子） １１、１４ 絶縁被膜 3b, 5 substrate 4, 7 electrode terminal 8, 12, 13 anisotropic connector 9 adhesive 10 metal particle (conductive particle) 11, 14 insulating film
Claims (1)
混入してなる異方性コネクターを、対向配置された電極
端子間に介在させて接合する接合構造において、 少なくとも一方の前記電極端子の表面を絶縁被膜で覆
い、熱圧着時に前記異方性コネクターの導電粒子が前記
絶縁被膜を突き破って、前記電極端子を導通させること
を特徴とする接合構造。1. A joint structure in which an anisotropic connector made by mixing conductive particles in a heat-melting type insulating adhesive is interposed between electrode terminals arranged opposite to each other, and at least one of the electrodes is bonded. A joining structure, characterized in that the surface of the terminal is covered with an insulating coating, and the conductive particles of the anisotropic connector break through the insulating coating during thermocompression bonding to conduct the electrode terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4139626A JPH0775177B2 (en) | 1992-05-06 | 1992-05-06 | Junction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4139626A JPH0775177B2 (en) | 1992-05-06 | 1992-05-06 | Junction structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05174890A JPH05174890A (en) | 1993-07-13 |
| JPH0775177B2 true JPH0775177B2 (en) | 1995-08-09 |
Family
ID=15249665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4139626A Expired - Lifetime JPH0775177B2 (en) | 1992-05-06 | 1992-05-06 | Junction structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0775177B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW451532B (en) * | 1999-03-31 | 2001-08-21 | Seiko Epson Corp | Connector for small spacing, changing apparatus of spacing, micro machine, piezoelectric actuator, electrostatic actuator, inkjet head, inkjet printer, liquid crystal apparatus, electronic machine |
| JP4023089B2 (en) | 1999-03-31 | 2007-12-19 | セイコーエプソン株式会社 | Narrow-pitch connectors, electrostatic actuators, piezoelectric actuators, inkjet heads, inkjet printers, micromachines, liquid crystal devices, electronic devices |
| JP2002116455A (en) * | 2000-08-01 | 2002-04-19 | Kyodo Printing Co Ltd | Liquid crystal display device, electrode substrate for the same device and method of manufacturing the same device |
| JP4019328B2 (en) * | 2006-06-08 | 2007-12-12 | 日立化成工業株式会社 | Electrode connection method |
| JP2008147181A (en) * | 2007-11-19 | 2008-06-26 | Hitachi Chem Co Ltd | Connection structure of electrode |
| JP5676944B2 (en) * | 2010-07-08 | 2015-02-25 | デクセリアルズ株式会社 | Solar cell module and method for manufacturing solar cell module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5545159U (en) * | 1978-09-20 | 1980-03-24 | ||
| JPS61195568A (en) * | 1985-02-25 | 1986-08-29 | 松下電器産業株式会社 | Film connector |
| JP2501100B2 (en) * | 1985-08-15 | 1996-05-29 | ソニー株式会社 | Connection sheet |
-
1992
- 1992-05-06 JP JP4139626A patent/JPH0775177B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05174890A (en) | 1993-07-13 |
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