JP3336531B2 - Anisotropic conductive member - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive member for electrically connecting connection terminals which are separated and opposed to each other.

[0002]

2. Description of the Related Art For example, a liquid crystal display device in which a semiconductor chip for a driving circuit for driving a liquid crystal display panel is mounted on the liquid crystal display panel is an electronic component to which a large number of connection terminals facing each other are electrically connected. There is. 3 and 4
Shows an example of such a liquid crystal display device. In this liquid crystal display device, two semiconductor chips 2 and 3 are mounted on the front side of the liquid crystal display panel 1, and one semiconductor chip 4 is mounted on the back side. In the liquid crystal display panel 1, the liquid crystal is sealed between the upper and lower transparent substrates 5, 6 made of glass, synthetic resin, or the like, and one end of the lower transparent substrate 6 protrudes outside the upper transparent substrate 5, A plurality of transparent electrodes 7 are provided in two sets on the upper surface of one end of the protruding lower transparent substrate 6, and a plurality of connecting electrodes are provided corresponding to each set of transparent electrodes 7. Wirings 8 and 9 are provided in parallel, and one end of the upper transparent substrate 5 protrudes outside the lower transparent substrate 6, and a plurality of wires are provided on the lower surface of one end of the protruding upper transparent substrate 5. And a plurality of connection wirings 11 are provided corresponding to the plurality of transparent electrodes 10. The two predetermined semiconductor chips 2 and 3 are mounted in parallel on the upper surface of one end of the lower transparent substrate 6,
The remaining one semiconductor chip 4 is mounted on the lower surface of one end of the upper transparent substrate 5. The connection wirings 7, 8,
Although not shown, 11 is electrically connected to a control circuit board for controlling the semiconductor chips 2, 3, and 4 via a flexible wiring board.

In this case, for example, as shown in FIG. 5, an anisotropic conductive adhesive sheet 12 is interposed between the lower surface of the semiconductor chip 2 and the upper surface of one end of the lower transparent substrate 6.
The anisotropic conductive adhesive sheet 12 is obtained by dispersing and mixing conductive particles 14 in an insulating adhesive 13 so as not to conduct each other. Therefore, when the anisotropic conductive adhesive sheet 12 is interposed between the lower surface of the semiconductor chip 2 and the upper surface of one end of the lower transparent substrate 6 and thermocompression-bonded, the lower surface of the semiconductor chip 2 is insulated by the insulating adhesive 13. An output-side electrode (bump) 15 and a plurality of input-side electrodes that are bonded to the upper surface of one end of the lower transparent substrate 6 and provided around the lower surface of the semiconductor chip 2 by conductive particles 14 in the insulating adhesive 13. The electrode (bump) 16 is electrically connected to the transparent electrode 7 and the connection wiring 8 respectively.

A conventional anisotropic conductive member 17 having such an anisotropic conductive adhesive sheet 12 is difficult to handle if the anisotropic conductive adhesive sheet 12 is bare, as shown in FIG. The first protective sheet 18 is releasably attached to the upper surface of the anisotropic conductive adhesive sheet 12, and the second protective sheet 19 is releasably attached to the lower surface of the anisotropic conductive adhesive sheet 12. When the semiconductor chip 2 is joined to the upper surface of one end of the lower transparent electrode 6 using the anisotropic conductive member 17, for example, the first protective sheet 18 is peeled off and the peeled anisotropic conductive member 17 is peeled off. The anisotropic conductive adhesive sheet 12 is placed on the transparent electrode 7 and the connection wiring 8 on the upper surface of one end of the lower transparent substrate 6 with the upper surface of the conductive conductive adhesive sheet 12 facing down. , Second
Of the anisotropic conductive adhesive sheet 12
The semiconductor chip 2 is arranged on the anisotropic conductive adhesive sheet 12 and bonded by thermocompression bonding, leaving only the anisotropic conductive adhesive sheet 12.

[0005]

However, in such a conventional anisotropic conductive member 17, the first protective sheet 18 is peeled off and the peeled surface of the anisotropic conductive adhesive sheet 12 is placed on the lower transparent substrate. 6 is temporarily pressure-bonded on the transparent electrode 7 and the connection wiring 8 on the upper surface of one end of the second protection sheet 19 in this state.
When peeling is performed, static electricity is generated at this time, and there is a problem that the display portion (the portion where the liquid crystal is sealed) of the liquid crystal display panel 1 may be broken by the static electricity. The present invention has been made in view of the above circumstances, and an object of the present invention is to minimize generation of static electricity when a protective sheet is peeled off while being temporarily bonded to an electronic component such as a liquid crystal display device. An object of the present invention is to provide an anisotropic conductive member.

[0006]

In order to achieve the above object, the present invention provides an anisotropic conductive adhesive sheet in which conductive particles are dispersed and mixed in an insulating adhesive, and an anisotropic conductive adhesive sheet. consists of a first protective sheet to be adhered peelably to the upper surface, and a second protective sheet to be adhered peelably to the lower surface of the anisotropic conductive adhesive sheet,
The first, of the second protective sheet, at least one protective sheet, at least of the anisotropic conductive adhesive sheet
The surface to be attached to the upper surface or the lower surface is formed by a conductive member.

[0007]

According to the present invention, of the first and second protective sheets, at least the protective sheet on which the conductive member is not formed is peeled off, and the anisotropic conductive adhesive sheet from which the protective sheet has been peeled off is peeled off. For example, the surface is disposed on a transparent substrate of a liquid crystal display device and temporarily bonded, and in this state, when the other protective sheet on which the conductive member is formed is peeled, the conductive member peels from the surface of the anisotropic conductive adhesive sheet. Therefore, generation of static electricity can be suppressed as much as possible by this conductive film.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The same parts as those in the conventional example shown in FIGS. 3 to 5 are denoted by the same reference numerals, and description thereof will be omitted as appropriate. FIG. 1 is a sectional view of the anisotropic conductive member. The anisotropic conductive member 20 includes an anisotropic conductive adhesive sheet 12 having the same structure as the conventional example. On the upper surface of the anisotropic conductive adhesive sheet 12, the same first protective sheet 18 as in the conventional example is releasably attached. On the other hand, on the lower surface of the anisotropic conductive adhesive sheet 12, a second protective sheet 21 is releasably attached. The second protective sheet 21 includes a protective film 22 made of a resin film or the like and a conductive film 23 made of a conductive material. The conductive film 23 is integrally formed by depositing ITO (Indium Tin Oxide) as a conductive material on the upper surface (opposing surface) of the protective film 22 facing the lower surface of the anisotropic conductive adhesive sheet 12.

FIG. 2 shows a state in which the anisotropic conductive adhesive sheet 12 of the anisotropic conductive member 20 is temporarily pressed to the transparent substrate 6. In this anisotropic conductive member 20, the first protective sheet 18 on which the conductive film 23 is not provided is peeled off, and the upper surface of the anisotropic conductive adhesive sheet 12 from which the first protective sheet 18 has been peeled is turned down. Then, the liquid crystal display panel 1 is disposed on the transparent electrode 7 and the connection wiring 8 on the upper surface of one end of the transparent substrate 6, and the anisotropic conductive adhesive sheet 12 is temporarily compressed. In this state, the second protective sheet 21 is peeled from the anisotropic conductive adhesive sheet 12. At this time, since the conductive film 23 of the second protective sheet 21 and the protective film 22 are peeled off from the anisotropic conductive adhesive sheet 12, the conductive film 23 can minimize the generation of static electricity. Therefore, it is possible to prevent the display section of the liquid crystal display panel 1 from being destroyed by static electricity.
In this case, since the conductive film 23 is integrally formed on the upper surface of the protective film 22 facing the anisotropic conductive adhesive sheet 12,
Protective film 22 and conductive film 2 when peeling protective sheet 21
3 can be simultaneously peeled off, and the peeling operation can be easily performed. Further, in a state where the anisotropic conductive adhesive sheet 12 is temporarily pressed on the transparent electrode 7 and the connection wiring 8 on the upper surface of one end of the transparent substrate 6, static electricity from outside is caused by the conductive film 23 of the second protective sheet 21. Can also be prevented from entering.

In the above-described embodiment, only the second protective sheet 21 is formed of the protective film 22 and the conductive film 23. However, the present invention is not limited to this, and the first protective sheet 18 may be formed of a protective film and this protective film. And a conductive film formed on the surface facing the anisotropic conductive adhesive sheet 12. in this way,
If both of the protection sheets 18 and 21 have the conductive film 23, either of the first and second protection sheets 18 and 21 may be peeled off first. Can be simplified. In the above-described embodiment, ITO is used as the conductive material, and the ITO is deposited on the protective film 22 to form the conductive film 23 on the protective film 22. However, the present invention is not limited to this. May be used, and the metal may be deposited on the protective film 22.
Need not be formed, and a metal foil such as copper laminated on the protective film 22 may be used. Further, in the above-described embodiment, the second protective sheet 21 is formed in a two-layer structure of the protective film 22 and the conductive film 23. However, the present invention is not limited to this. It may be. Further, in the above-described embodiment, the CO 2 in which the semiconductor chips 2, 3, 4 are directly mounted on the transparent substrates 5, 6 of the liquid crystal display panel 1 is used.
Although the case of the G (Chip On Glass) method has been described, the present invention is not limited to this, and a COF (Chip On Film) type unit having a semiconductor chip mounted on an inner lead terminal portion of a carrier tape is connected to the transparent substrates 5 and 6. The case can also be applied.

[0011]

As described above, according to the present invention, at least one of the first and second protective sheets, which are releasably attached to both surfaces of the anisotropic conductive adhesive sheet, respectively. Since at least the surface to be stuck to the anisotropic conductive adhesive sheet was formed of a conductive member, the protective sheet without the conductive member was peeled off, and the anisotropic conductive adhesive sheet from which the protective sheet was peeled off For example, the peeled surface of the conductive sheet is disposed on an electrode substrate of a liquid crystal display device and temporarily bonded, and in this state, the other protective sheet provided with the conductive member is peeled off. Since the conductive member is peeled off from the conductive adhesive sheet, the generation of static electricity can be suppressed as much as possible by this conductive member, and the display portion of the liquid crystal display panel can be prevented from being destroyed by static electricity. Can.

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view of a main part of an anisotropic conductive member according to the present invention.

FIG. 2 is a cross-sectional view of a state where the anisotropic conductive adhesive sheet of FIG. 1 is temporarily pressure-bonded to a transparent substrate.

FIG. 3 is a plan view illustrating an example of a liquid crystal display device.

FIG. 4 is an enlarged plan view of a main part in a state where a semiconductor chip is removed from the liquid crystal display device of FIG. 3;

FIG. 5 is an enlarged sectional view taken along line AA of FIG. 3;

FIG. 6 is an enlarged sectional view of a main part of a conventional anisotropic conductive member.

[Explanation of symbols]

 12 Anisotropic conductive adhesive sheet 13 Insulating adhesive 14 Conductive particles 18 First protective sheet 20 Anisotropic conductive member 21 Second protective sheet 22 Protective film 23 Conductive film

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-357690 (JP, A) JP-A-5-2059 (JP, A) JP-A-5-27251 (JP, A) JP-A-61- 264604 (JP, A) JP-A-63-310581 (JP, A) JP-A-61-224283 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 11/01

Claims (3)

(57) [Claims] 1. A first protective sheet to be adhered peelably against the anisotropic conductive adhesive sheet of conductive particles in an insulating adhesive is dispersed mixture, the upper surface of the anisotropic conductive adhesive sheet If consists of a second protective sheet to be adhered peelably to the lower surface of the anisotropic conductive adhesive sheet,
The first, of the second protective sheet, at least one protective sheet, at least of the anisotropic conductive adhesive sheet
An anisotropic conductive member, wherein a surface to be stuck to an upper surface or a lower surface is formed of a conductive member. 2. The one protective sheet comprises a protective film and a conductive film made of the conductive member, and the conductive film is integrally formed on a surface of the protective film facing the anisotropic conductive adhesive sheet. The anisotropic conductive member according to claim 1, wherein the member is provided. 3. The one protective sheet includes a protective film and a conductive film made of the conductive member, and the conductive film is peelable on a surface of the protective film facing the anisotropic conductive adhesive sheet. 2. The device according to claim 1, wherein
The anisotropic conductive member as described in the above.