JP2501100B2 - Connection sheet - Google Patents
Connection sheetInfo
- Publication number
- JP2501100B2 JP2501100B2 JP60179947A JP17994785A JP2501100B2 JP 2501100 B2 JP2501100 B2 JP 2501100B2 JP 60179947 A JP60179947 A JP 60179947A JP 17994785 A JP17994785 A JP 17994785A JP 2501100 B2 JP2501100 B2 JP 2501100B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- resin
- parts
- wiring patterns
- metal particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29399—Coating material
Landscapes
- Combinations Of Printed Boards (AREA)
- Non-Insulated Conductors (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は例えばフレキシブル基板に設けられた配線パ
ターンと他の基板に設けられた配線パターン同士の接続
に使用して好適な連結シートに関する。TECHNICAL FIELD The present invention relates to a connecting sheet suitable for use in connecting a wiring pattern provided on a flexible substrate and a wiring pattern provided on another substrate, for example.
本発明は例えばフレキシブル基板に設けられた配線パ
ターンと他の基板に設けられた配線パターン同士の接続
に使用される熱溶融型絶縁性接着剤に導電性粒子を分散
させたものであって、異なる基板に設けられた配線パタ
ーン同士を熱圧着により接続する連結シートにおいて、
この導電性粒子をこの接着剤に不溶な絶縁性樹脂で被覆
したことにより、導通、絶縁の信頼性の向上を図り、狭
いピツチで多数配された配線パターン（以下、フアイン
ピツチパターンという）同士の接続にも充分使用するこ
とができるようにしたものである。The present invention is, for example, one in which conductive particles are dispersed in a hot-melt insulating adhesive used for connecting a wiring pattern provided on a flexible substrate and a wiring pattern provided on another substrate. In a connecting sheet that connects the wiring patterns provided on the board by thermocompression bonding,
By coating the conductive particles with an insulating resin that is insoluble in the adhesive, the reliability of conduction and insulation is improved, and wiring patterns arranged in a large number of narrow pitches (hereinafter referred to as "fine pitch patterns") It is designed so that it can be used to connect to any of the above.
従来、例えばフレキシブル基板に設けられた配線パタ
ーンと他の基板に設けられた配線パターン同士の接続に
使用される熱溶融型絶縁性接着剤に導電性粒子を分散さ
せた連結シートとして第４図に示す如きものが提案され
ている。Conventionally, for example, as a connecting sheet in which conductive particles are dispersed in a heat-melting type insulating adhesive used for connecting wiring patterns provided on a flexible substrate and wiring patterns provided on another substrate, as shown in FIG. The ones shown are proposed.
この第４図において（１）はホツトメルトタイプの絶
縁性接着剤を示し、具体的には次の組成で構成されてい
る。In FIG. 4, (1) shows a hot-melt type insulating adhesive, which is specifically composed of the following composition.
また（２）は低融点半田金属粒子を示し、絶縁性接着
剤（１）に、これの固形分100容量部に対して10容量部
の割合で分散されている。この金属粒子（２）はPb−Sn
合金にSbとBiとを添加してその融点が140℃とされた平
均粒径20μｍの半田金属粒子（２）である。 Further, (2) shows low melting point solder metal particles, which are dispersed in the insulating adhesive (1) at a ratio of 10 parts by volume to 100 parts by volume of the solid content thereof. This metal particle (2) is Pb-Sn
Solder metal particles (2) having an average particle size of 20 μm, the melting point of which is 140 ° C. when Sb and Bi are added to the alloy.
この様に半田金属粒子（２）が分散された接着剤
（１）は乾燥後の厚さが20μｍとなるように剥離シート
上にコータによつて塗布され、連結シート（３）が構成
されている。Thus, the adhesive (1) in which the solder metal particles (2) are dispersed is applied by a coater on the release sheet so that the thickness after drying becomes 20 μm, and the connecting sheet (3) is formed. There is.
そこで例えばポリイミド基板に設けられた配線パター
ンとガラスエポキシ基板に設けられた配線パターンとを
接続する場合には、第５図に示す如く剥離シートを剥離
してポリイミド基板（４）上の配線パターン（５）上の
少なくともガラスエポキシ基板（６）の配線パターン
（７）と接続すべき部分に差し渡つて連結シート（３）
を載せ、これの上にガラスエポキシ基板（６）をその配
線パターン（７）が対応するポリイミド基板（４）上の
配線パターン（５）上に、互いに接続すべき部分が連結
シート（３）を介して重なり合うように載せ、両者を18
0℃下で40kg/cm2で30秒間加圧圧着した。このようにす
ると連結シート（３）中の接着剤（１）が加熱によつて
流動性を呈するので、特にポリイミド基板（４）及びガ
ラスエポキシ基板（６）の互いの対向面より実質的に突
出しているために圧力が掛けられる配線パターン（５）
及び（７）との間に介在する絶縁性接着剤（１）の多く
が側方に押し出され、これら配線パターン（５）及び
（７）とが金属粒子（２）を介して電気的に接続される
と共に他の部分が機械的に接続され、隣接する配線パタ
ーン（５）（５），（７）（７）間の絶縁性が確保され
ている。Therefore, for example, when connecting the wiring pattern provided on the polyimide substrate and the wiring pattern provided on the glass epoxy substrate, the release sheet is peeled off as shown in FIG. 5 to remove the wiring pattern () on the polyimide substrate (4). 5) At least a portion of the glass epoxy substrate (6) to be connected to the wiring pattern (7), and the connecting sheet (3).
And the glass epoxy substrate (6) on the wiring pattern (7) corresponds to the wiring pattern (5) on the polyimide substrate (4). Put them on top of each other and
It was pressure bonded at 40 kg / cm 2 for 30 seconds at 0 ° C. By doing so, the adhesive (1) in the connecting sheet (3) exhibits fluidity due to heating, so that the adhesive (1) substantially protrudes from the mutually opposing surfaces of the polyimide substrate (4) and the glass epoxy substrate (6). Wiring pattern (5) where pressure is applied due to
Most of the insulating adhesive (1) interposed between the wiring patterns (7) and (7) is extruded to the side, and these wiring patterns (5) and (7) are electrically connected via the metal particles (2). At the same time, the other parts are mechanically connected, and the insulation between adjacent wiring patterns (5), (5), (7) and (7) is secured.
しかしながら、斯る従来の連結シート（３）において
は、フアインピツチパターン同士を接続する場合、隣接
する配線パターン（５）（５），（７）（７）間で接着
剤（１）中に分散させた半田金属粒子（２）の接触によ
るリークの発生が生じ、絶縁性が確保できない場合があ
るという不都合があつた。However, in such a conventional connecting sheet (3), when the fine pitch patterns are connected to each other, the adjacent wiring patterns (5), (5), (7) and (7) are not bonded to each other in the adhesive (1). There is a disadvantage that leakage may occur due to the contact of the dispersed solder metal particles (2), and the insulating property may not be secured.
本発明は、斯る点に鑑み、フアインピツチパターン同
士の接続にも充分に使用しうる導通，絶縁の信頼性の高
い連結シートを提供することを目的とする。The present invention has been made in view of the above problems, and an object thereof is to provide a highly reliable connecting sheet having electrical continuity and insulation that can be sufficiently used for connecting fine pitch patterns.
本発明は、第１図〜第３図に示す如く、熱溶融型絶縁
性接着剤（１）に導電性粒子（２）を分散させたもので
あって、異なる基板に設けられた配線パターン同士を熱
圧着により接続する連結シート（３）において、この導
電性粒子（２）をこの接着剤（１）に不溶な絶縁性樹脂
（８）で被覆したものである。As shown in FIGS. 1 to 3, the present invention is one in which conductive particles (2) are dispersed in a heat-melting type insulating adhesive (1) and wiring patterns provided on different substrates. In a connecting sheet (3) for connecting by thermocompression bonding, the conductive particles (2) are coated with an insulating resin (8) insoluble in the adhesive (1).
斯る本発明に依れば、絶縁性接着剤（１）中に分散さ
せる導電性粒子（２）を接着剤（１）に不溶な絶縁性樹
脂（８）で被覆したものとしているので、第３図に示す
如く基板（４）（６）同士を熱圧着した場合、対向する
配線パターン（５）（７）間では導電性粒子（２）の被
覆樹脂層（８）は圧着力で破壊され導電性粒子（２）の
直接的な接触により対向する配線パターン（５）（７）
間の電気的接続が確保されると共に、隣接する配線パタ
ーン（５）（５），（７）（７）間では樹脂に被覆され
た導電性粒子（９）に加わる圧力が小さいため、被覆樹
脂層（８）は破壊されず、接触した場合にも導電性粒子
（２）の接触によるリークを発生させず、隣接配線パタ
ーン（５）（５），（７）（７）間の絶縁性が確保され
る。According to the present invention, the conductive particles (2) dispersed in the insulating adhesive (1) are covered with the insulating resin (8) insoluble in the adhesive (1). When the substrates (4) and (6) are thermocompression bonded to each other as shown in FIG. 3, the coating resin layer (8) of the conductive particles (2) is destroyed by the pressure bonding force between the opposing wiring patterns (5) and (7). Wiring patterns (5) and (7) facing each other by direct contact of the conductive particles (2)
Since the electrical connection between them is secured and the pressure applied to the conductive particles (9) coated with the resin is small between the adjacent wiring patterns (5), (5), (7) and (7), the coating resin The layer (8) is not destroyed, and even if it comes into contact with the conductive particles (2), the leakage due to the contact of the conductive particles (2) does not occur, and the insulation between the adjacent wiring patterns (5) (5), (7) and (7) is improved. Reserved.
以下、第１図〜第３図を参照して本発明の連結シート
の一実施例につき説明しよう。この第１図〜第３図にお
いて第４図〜第６図に対応する部分には同一符号を付
し、その詳細説明は省略する。An embodiment of the connecting sheet of the present invention will be described below with reference to FIGS. 1 to 3. In FIGS. 1 to 3, parts corresponding to those in FIGS. 4 to 6 are designated by the same reference numerals, and detailed description thereof will be omitted.
この第１図において（２）は半田金属粒子を示し、本
例では、この半田金属粒子（２）をエポキシ樹脂とアミ
ノエチルピペラジンとからなる配合系樹脂（８）で被覆
した。即ち、エポキシ樹脂100重量部とアミノエチルピ
ペラジン23重量部とからなる配合系樹脂（８）100gに半
田金属粒子（２）（融点183℃，粒径５〜20μｍ）を300
g混合し80℃で硬化させ、その後粉砕機で粉砕し、樹脂
層（８）で被覆した半田金属粒子（９）を得た。In FIG. 1, (2) shows solder metal particles, and in this example, the solder metal particles (2) were coated with a compounding resin (8) composed of an epoxy resin and aminoethylpiperazine. That is, 300 g of solder metal particles (2) (melting point 183 ° C., particle size 5 to 20 μm) were added to 100 g of a compounding resin (8) consisting of 100 parts by weight of epoxy resin and 23 parts by weight of aminoethylpiperazine.
g, mixed and cured at 80 ° C., and then ground with a grinder to obtain solder metal particles (9) coated with a resin layer (8).
この様にして得た樹脂層を被覆した半田金属粒子
（９）をホツトメルトタイプの絶縁性接着剤にこの接着
剤100重量部に対し26.7重量部の割合で分散させた。こ
の接着剤は次の組成とした。The solder metal particles (9) coated with the resin layer thus obtained were dispersed in a hot-melt type insulating adhesive at a ratio of 26.7 parts by weight to 100 parts by weight of the adhesive. This adhesive had the following composition.
この様に樹脂（８）で被覆した半田金属粒子（９）を
分散させた接着剤（１）を乾燥後の厚みが30μｍになる
ように剥離シート上にコーターによつて塗布して連結シ
ート（３）を構成した。 The adhesive (1) in which the solder metal particles (9) coated with the resin (8) are dispersed in this manner is applied onto the release sheet with a coater so that the thickness after drying is 30 μm, and the connecting sheet ( 3) was constructed.
そこで第２図に示す如く、この連結シートの剥離シー
トを剥離してポリイミド基板（４）上の幅100μm,ピツ
チ200μｍの配線パターン（５）上に連結シート（３）
を載せ、これの上にガラスエポキシ基板（６）をその配
線パターン（７）が対応するポリイミド基板（４）の配
線パターン（５）上に互いに接続すべき部分が接着剤層
を介して重なるように載せ、両者を170℃下で10kg/cm2
で15秒間加圧圧着したところ、対向する配線パターン
（５）（７）同士は電気的に接続されると共に、隣接す
る配線パターン（５）（５），（７）（７）間にリーク
の発生は見られなかつた。また上述の接着剤100重量部
に対し樹脂で被覆した半田金属粒子（９）を夫々、53.3
重量部、106.7重量部、160重量部分散したものを使用し
て同様にポリイミド基板（４）とガラスエポキシ基板
（６）の接着固定を行つたが、同様に対向する配線パタ
ーン（５）（７）同士の電気的接続は確実であり、また
隣接する配線パターン（５）（５），（７）（７）間に
リークの発生は見られなかつた。尚、接着剤（１）に対
する樹脂で被覆された導電性粒子（２）の割合は１〜30
0重量部が適当である。Then, as shown in FIG. 2, the release sheet of the connecting sheet is peeled off to form the connecting sheet (3) on the wiring pattern (5) having a width of 100 μm and a pitch of 200 μm on the polyimide substrate (4).
The glass epoxy substrate (6) is placed on the wiring pattern (7) so that the portions to be connected to each other are overlapped on the wiring pattern (5) of the polyimide substrate (4) through the adhesive layer. And both at 10 ℃ / cm 2 at 170 ℃
After press-pressing for 15 seconds, the wiring patterns (5) and (7) facing each other are electrically connected to each other, and there is no leakage between the adjacent wiring patterns (5) (5), (7) and (7). No outbreak was seen. In addition, the solder metal particles (9) coated with resin were added to 53.3 parts by weight of 100 parts by weight of the above adhesive, respectively.
The polyimide substrate (4) and the glass epoxy substrate (6) were similarly adhered and fixed by using a mixture of 10 parts by weight, 106.7 parts by weight, and 160 parts by weight. ), The electrical connection between them was assured, and no leak was observed between the adjacent wiring patterns (5), (5), (7) and (7). The ratio of the resin-coated conductive particles (2) to the adhesive (1) is 1 to 30.
0 parts by weight is suitable.
ここで比較例として上述の接着剤100重量部に樹脂で
被覆しない半田金属粒子（融点183℃，粒径５〜20μ
ｍ）を夫々20重量部,40重量部,80重量部,120重量部分散
したもので実施例と同様にポリイミド基板（４）とガラ
スエポキシ基板（６）を接着固定したところ、対向する
配線パターン（５）（７）間の導通は確実であつたが、
40重量部、80重量部、120重量部分散したものについて
リークの発生を確認した。As a comparative example, 100 parts by weight of the above-mentioned adhesive is used for solder metal particles not covered with resin (melting point 183 ° C., particle size 5 to 20 μ
m) dispersed in 20 parts by weight, 40 parts by weight, 80 parts by weight, and 120 parts by weight, respectively, and the polyimide substrate (4) and the glass epoxy substrate (6) were adhered and fixed in the same manner as in the example, and the opposing wiring patterns were obtained. The conduction between (5) and (7) was reliable,
Occurrence of leak was confirmed in the dispersion of 40 parts by weight, 80 parts by weight, and 120 parts by weight.
斯る本実施例に依れば、絶縁性接着剤（１）中に分散
させる半田金属粒子（２）を接着剤（１）の溶剤に不溶
な樹脂（８）で被覆したものとしているので、この接着
剤を介して基板（４）（６）同士を熱圧着した場合、対
向する配線パターン（５）（７）間では第３図に示す如
く半田金属粒子（２）を被覆する樹脂層（８）は圧着力
で破壊され半田金属粒子（２）の直接的な接触により対
向する配線パターン（５）（７）間の電気的接続が確保
されると共に、隣接する配線パターン（５）（５），
（７）（７）間では樹脂に被覆された半田金属粒子
（９）に加わる圧力が小さいため被覆樹脂層（８）は破
壊されず、接触した場合にも半田金属粒子（２）の接触
によるリークを発生させず、隣接配線パターン（５）
（５），（７）（７）間の絶縁性が確保される。According to the present embodiment, the solder metal particles (2) dispersed in the insulating adhesive (1) are coated with the resin (8) insoluble in the solvent of the adhesive (1). When the substrates (4) and (6) are thermocompression-bonded to each other via this adhesive, a resin layer (which covers the solder metal particles (2) between the opposing wiring patterns (5) and (7) as shown in FIG. 8) is destroyed by crimping force, and the direct contact of the solder metal particles (2) ensures electrical connection between the opposing wiring patterns (5) and (7), and at the same time, the adjacent wiring patterns (5) and (5) ),
(7) Since the pressure applied to the solder metal particles (9) coated with the resin is small between (7) and (7), the coating resin layer (8) is not destroyed, and even when they are in contact, the solder metal particles (2) contact each other. Adjacent wiring pattern (5) without leak
The insulation between (5), (7) and (7) is secured.
従つて、本実施例に依れば、基板同士の接着固定にお
ける導通、絶縁の信頼性が向上し、フアインピツチパタ
ーンにも充分に使用しうるという利益がある。Therefore, according to the present embodiment, there is an advantage that the reliability of conduction and insulation in the adhesive fixing of the substrates to each other is improved, and it can be sufficiently used for the fine pitch pattern.
尚、上述実施例では半田金属粒子（２）の被覆樹脂
（８）としてエポキシ樹脂とアミノエチルピペラジンと
からなる配合系樹脂を使用した場合について述べたが、
この代りにフエノール，メラミン，不飽和ポリエステル
等硬化後にトルエン，ヘキサン，メチルエチルケトン等
の有機溶剤に不溶な樹脂を使用しても同様の作用効果を
得ることができる。Incidentally, in the above-mentioned examples, the case where the compounded resin composed of the epoxy resin and aminoethylpiperazine is used as the coating resin (8) for the solder metal particles (2) has been described.
Alternatively, the same effects can be obtained by using a resin insoluble in an organic solvent such as toluene, hexane or methyl ethyl ketone after curing phenol, melamine, unsaturated polyester or the like.
またポリアミドイミド，ポリエーテルイミド等特殊な
極性溶剤にしか溶解しないものは、接着剤の溶剤系を限
定することで使用することができ、同様の作用効果を得
ることができる。In addition, those which can be dissolved only in a special polar solvent such as polyamideimide and polyetherimide can be used by limiting the solvent system of the adhesive, and the same effect can be obtained.
更に本発明は上述実施例に限らず、本発明の要旨を逸
脱することなくその他種々の構成が取り得ることは勿論
である。Further, the present invention is not limited to the above-described embodiment, and it goes without saying that various other configurations can be adopted without departing from the gist of the present invention.
本発明に依れば、絶縁性接着剤中に分散させる導電性
粒子を接着剤の溶剤に不溶な樹脂で被覆したものとして
いるので、配線基板同士を熱圧着した場合、対向する配
線パターン間では導電性粒子の被覆樹脂層は圧着力で破
壊され導電性粒子の直接的接触により電気的接続が確保
されると共に隣接する配線パターン間では被覆樹脂層は
破壊されず導電性粒子の接触によるリークを発生させな
いので、隣接配線パターン間の絶縁性が確保され、従つ
て、フアインピツチパターン同士の接続にも使用しうる
導通、絶縁の信頼性の高いものとすることができるとい
う利益がある。According to the present invention, the conductive particles to be dispersed in the insulating adhesive are coated with a resin that is insoluble in the solvent of the adhesive. The coating resin layer of the conductive particles is destroyed by the pressure bonding force and the electrical connection is secured by the direct contact of the conductive particles, and the coating resin layer is not destroyed between the adjacent wiring patterns and the leakage due to the contact of the conductive particles is caused. Since it is not generated, there is an advantage that the insulation between adjacent wiring patterns is secured, and accordingly, the reliability of conduction and insulation that can be used for connecting the fine pitch patterns can be made high.
第１図は本発明連結シートの一実施例に使用する樹脂で
被覆した導電性粒子の断面図、第２図及び第３図は夫々
本発明の説明に供する線図、第４図は従来例を示す断面
図、第５図及び第６図は夫々従来例の説明に供する線図
である。 （１）は絶縁性接着剤、（２）は半田金属粒子、（３）
は連結シート、（４）はポリイミド基板、（５）はポリ
イミド基板上の配線パターン、（６）はガラスエポキシ
基板、（７）はガラスエポキシ基板上の配線パターン、
（８）は樹脂、（９）は樹脂で被覆された半田金属粒子
である。FIG. 1 is a cross-sectional view of conductive particles coated with a resin used in one embodiment of the connecting sheet of the present invention, FIGS. 2 and 3 are diagrams for explaining the present invention, and FIG. 4 is a conventional example. And FIG. 5 and FIG. 6 are diagrams for explaining the conventional example, respectively. (1) is an insulating adhesive, (2) is solder metal particles, (3)
Is a connection sheet, (4) is a polyimide substrate, (5) is a wiring pattern on the polyimide substrate, (6) is a glass epoxy substrate, (7) is a wiring pattern on the glass epoxy substrate,
(8) is a resin, and (9) is a solder metal particle coated with the resin.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−107210（ＪＰ，Ａ) 特開 昭59−198680（ＪＰ，Ａ) 特開 昭60−115678（ＪＰ，Ａ) 実開 昭62−35410（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-60-107210 (JP, A) JP-A-59-198680 (JP, A) JP-A-60-115678 (JP, A) Actual development Sho-62- 35410 (JP, U)
Claims (1)
させたものであって、異なる基板に設けられた配線パタ
ーン同士を熱圧着により接続する連結シートにおいて、 上記導電性粒子を上記接着剤に不溶な絶縁性樹脂で被覆
したことを特徴とする連結シート。1. A connection sheet comprising conductive particles dispersed in a heat-melting type insulating adhesive, wherein wiring patterns provided on different substrates are connected to each other by thermocompression bonding. A connecting sheet coated with an insulating resin that is insoluble in an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60179947A JP2501100B2 (en) | 1985-08-15 | 1985-08-15 | Connection sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60179947A JP2501100B2 (en) | 1985-08-15 | 1985-08-15 | Connection sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6240183A JPS6240183A (en) | 1987-02-21 |
| JP2501100B2 true JP2501100B2 (en) | 1996-05-29 |
Family
ID=16074724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60179947A Expired - Lifetime JP2501100B2 (en) | 1985-08-15 | 1985-08-15 | Connection sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2501100B2 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0618082B2 (en) * | 1985-09-30 | 1994-03-09 | 富士ゼロックス株式会社 | Anisotropically conductive material for electrical connection |
| JP2546262B2 (en) * | 1987-03-25 | 1996-10-23 | 日立化成工業株式会社 | Circuit connecting member and method of manufacturing the same |
| JP2648712B2 (en) * | 1989-07-12 | 1997-09-03 | 触媒化成工業 株式会社 | Anisotropic conductive adhesive, method for electrically connecting electrodes using the anisotropic conductive adhesive, and electric circuit board formed by the method |
| JPH04115407A (en) * | 1990-09-03 | 1992-04-16 | Soken Kagaku Kk | Anisotropic conductive adhesive composite |
| JPH0775177B2 (en) * | 1992-05-06 | 1995-08-09 | カシオ計算機株式会社 | Junction structure |
| JP2737723B2 (en) * | 1995-10-31 | 1998-04-08 | 日立化成工業株式会社 | Circuit connection structure |
| JP2794009B2 (en) * | 1996-01-29 | 1998-09-03 | 富士ゼロックス株式会社 | Method for producing anisotropically conductive particles for electrical connection and method for producing anisotropically conductive material for electrical connection |
| JP3678547B2 (en) * | 1997-07-24 | 2005-08-03 | ソニーケミカル株式会社 | Multilayer anisotropic conductive adhesive and method for producing the same |
| WO2002035555A1 (en) | 2000-10-23 | 2002-05-02 | Sekisui Chemical Co., Ltd. | Coated particle |
| TW557237B (en) | 2001-09-14 | 2003-10-11 | Sekisui Chemical Co Ltd | Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure |
| TWI232467B (en) | 2001-11-30 | 2005-05-11 | Mitsui Chemicals Inc | Paste for circuit connection, anisotropic conductive paste and uses thereof |
| KR100597391B1 (en) | 2004-05-12 | 2006-07-06 | 제일모직주식회사 | Insulated Conductive Particles and an Anisotropic Conductive Adhesive Film containing the Particles |
| KR100635053B1 (en) | 2005-06-21 | 2006-10-16 | 도레이새한 주식회사 | Adhesive tape for electronic components |
| KR100722493B1 (en) | 2005-09-02 | 2007-05-28 | 제일모직주식회사 | Insulated Conductive Particles and an Anisotropic Conductive Adhesive Film Using the Same |
| KR100844383B1 (en) | 2007-03-13 | 2008-07-07 | 도레이새한 주식회사 | Adhesive film for stacking semiconductor chip |
| KR100882735B1 (en) | 2007-03-19 | 2009-02-06 | 도레이새한 주식회사 | Anisotropic Conductive Film and Adhesion Method Thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0237669B2 (en) * | 1983-04-23 | 1990-08-27 | Nissha Printing | FUIRUMUJODENKYOKUKONEKUTANOSEIZOHOHO |
| JPS60107210A (en) * | 1983-11-15 | 1985-06-12 | 松下電器産業株式会社 | Anisotropic conductor |
-
1985
- 1985-08-15 JP JP60179947A patent/JP2501100B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6240183A (en) | 1987-02-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2501100B2 (en) | Connection sheet | |
| JP2001052778A (en) | Anisotropic conductive adhesive film and its manufacture | |
| JPH08148213A (en) | Connection member and structure and method for connecting electrode using the same | |
| JPH11329069A (en) | Anisotropic conductive adhesive film | |
| JP3622792B2 (en) | Connection member and electrode connection structure and connection method using the connection member | |
| JPS61231066A (en) | Anisotropically conductive hot-melt adhesive | |
| JPH07197001A (en) | Anisotropically conductive thermosetting adhesive | |
| JP3004042B2 (en) | Metal-containing resin particles and uses thereof | |
| JPS6127089Y2 (en) | ||
| JP3003952B2 (en) | Connection structure using anisotropic conductive agent | |
| JP4282097B2 (en) | Circuit board connection method, connection structure, and adhesive film used therefor | |
| KR940001260B1 (en) | Conductive connecting structure | |
| JPS63110506A (en) | Anisotropic conducting sheet | |
| JPH08148210A (en) | Connection member | |
| JPH09147928A (en) | Connecting member | |
| JPS60178690A (en) | Circuit board | |
| JP3129218B2 (en) | Fine pitch connector members | |
| JPH0521157B2 (en) | ||
| JPS61277179A (en) | Conductive anisotropic adhesive sheet | |
| JP2551123Y2 (en) | Flexible circuit board | |
| JPH0576797B2 (en) | ||
| JP4155470B2 (en) | Electrode connection method using connecting members | |
| JPS627195A (en) | Anisotropic conducting sticky adhesive layer | |
| JPH0440277Y2 (en) | ||
| JPH06203640A (en) | Anisotropic electric conductive bonding agent and electric conductive connection structure |