JPH11329069A - Anisotropic conductive adhesive film - Google Patents
Anisotropic conductive adhesive filmInfo
- Publication number
- JPH11329069A JPH11329069A JP12839798A JP12839798A JPH11329069A JP H11329069 A JPH11329069 A JP H11329069A JP 12839798 A JP12839798 A JP 12839798A JP 12839798 A JP12839798 A JP 12839798A JP H11329069 A JPH11329069 A JP H11329069A
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- adhesive film
- stress
- particles
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば、液晶表示
装置（ＬＣＤ）と回路基板との間の電気的な接続に用い
られる異方導電性接着フィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive adhesive film used for electrical connection between, for example, a liquid crystal display (LCD) and a circuit board.
【０００２】[0002]
【従来の技術】従来より、例えば、液晶表示装置と集積
回路基板等を接続する手段として、異方導電性接着フィ
ルムが用いられている。この異方導電性接着フィルム
は、例えば、ＴＣＰ(Tape Carieer Package)やＩＣチッ
プの接続電極と、ＬＣＤパネルのガラス基板上に形成さ
れたＩＴＯ(Indium Tin Oxide)電極とを接続する場合を
始めとして、種々の端子間を接着するとともに電気的に
接続する場合に用いられている。2. Description of the Related Art Conventionally, for example, an anisotropic conductive adhesive film has been used as means for connecting a liquid crystal display device to an integrated circuit substrate or the like. This anisotropic conductive adhesive film includes, for example, a case where a connection electrode of a TCP (Tape Carieer Package) or an IC chip is connected to an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel. Are used for bonding and electrically connecting various terminals.
【０００３】従来、異方導電性接着フィルムの絶縁性接
着剤（バインダー）には、例えば、ビスフェノールＡ型
エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、フェ
ノキシ樹脂、ナフタレン型エポキシ樹脂、ノボラック型
エポキシ樹脂等のエポキシ樹脂を、イミダゾール系の硬
化剤で熱硬化させる熱硬化性樹脂が広く用いられてい
る。Conventionally, insulating adhesives (binders) for anisotropic conductive adhesive films include, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenoxy resin, naphthalene type epoxy resin, novolak type epoxy resin and the like. Thermosetting resins, which are used to cure epoxy resins with an imidazole-based curing agent, are widely used.
【０００４】[0004]
【発明が解決しようとする課題】ところで、上述した従
来のバインダーの場合、高温時における信頼性及び被着
体との間の接着強度を確保するため、ガラス転移温度
(Ｔｇ)が高く、しかも硬化時の弾性率が大きい材料が用
いられている。However, in the case of the above-mentioned conventional binder, the glass transition temperature is required to ensure the reliability at high temperatures and the adhesive strength between the binder and the adherend.
A material having a high (Tg) and a large elastic modulus at the time of curing is used.
【０００５】しかしながら、このような従来の異方導電
性接着フィルムにおいて外部応力に起因する力がバイン
ダーに加わった場合には、バインダーの被着体との界面
部分に大きな内部応力が発生し、これにより異方導電性
接着フィルムの見かけ上の接着強度（実効接着力）が低
下するという問題があった。[0005] However, when a force due to external stress is applied to the binder in such a conventional anisotropic conductive adhesive film, a large internal stress is generated at the interface between the binder and the adherend. Accordingly, there is a problem that the apparent adhesive strength (effective adhesive strength) of the anisotropic conductive adhesive film is reduced.
【０００６】本発明は、このような従来の技術の課題を
解決するためになされたもので、バインダーについてガ
ラス転移温度を低下させることなく接着剤としての実効
接着力を向上しうる異方導電性接着フィルムを提供する
ことを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve such problems of the prior art, and an anisotropic conductive material capable of improving an effective adhesive force as an adhesive without lowering a glass transition temperature of a binder. It is intended to provide an adhesive film.
【０００７】[0007]
【課題を解決するための手段】本発明者等は、上記目的
を達成するために鋭意研究を重ねた結果、バインダー中
に特定のゴム系の弾性粒子を添加することによって当該
バインダーに生ずる内部応力を低減しうることを見い出
し、本発明を完成するに至った。Means for Solving the Problems The present inventors have made intensive studies to achieve the above object, and as a result, the internal stress generated in the binder by adding specific rubber-based elastic particles to the binder. It has been found that the present invention can be reduced, and the present invention has been completed.
【０００８】かかる知見に基づいてなされた請求項１記
載の発明は、絶縁性接着剤中に導電粒子を分散してなる
異方導電性接着フィルムであって、上記絶縁性接着剤中
にゴム系の弾性材料からなる応力吸収粒子が分散されて
いることを特徴とする。The invention according to claim 1 made based on such knowledge is an anisotropic conductive adhesive film obtained by dispersing conductive particles in an insulating adhesive, wherein the insulating adhesive contains a rubber-based adhesive film. Wherein the stress absorbing particles made of the elastic material are dispersed.
【０００９】請求項１記載の発明にあっては、外部応力
に起因する力が絶縁性接着剤に加わった場合に、この応
力吸収粒子が大きく弾性変形することによって、絶縁性
接着剤の被着体との界面部分に生ずる内部応力が吸収さ
れ、絶縁性接着剤全体としての弾性率が低下する。その
結果、本発明によれば、絶縁性接着剤のガラス転移温度
を下げることなく、接着剤としての実効接着力を向上さ
せることが可能になる。According to the first aspect of the present invention, when a force caused by an external stress is applied to the insulating adhesive, the stress absorbing particles are largely elastically deformed, so that the insulating adhesive is adhered. The internal stress generated at the interface with the body is absorbed, and the elastic modulus of the insulating adhesive as a whole decreases. As a result, according to the present invention, it is possible to improve the effective adhesive force as an adhesive without lowering the glass transition temperature of the insulating adhesive.
【００１０】一方、請求項２記載の発明は、請求項１記
載の発明において、応力吸収粒子の弾性率が、硬化後の
絶縁性接着剤の弾性率より小さいことを特徴とする。On the other hand, the invention according to claim 2 is characterized in that, in the invention according to claim 1, the elastic modulus of the stress absorbing particles is smaller than the elastic modulus of the cured insulating adhesive.
【００１１】また、請求項３記載の発明は、請求項１又
は２のいずれか１項記載の発明において、応力吸収粒子
の平均粒径が、導電粒子の平均粒径より小さいことを特
徴とする。According to a third aspect of the present invention, in the first aspect of the present invention, the average particle size of the stress absorbing particles is smaller than the average particle size of the conductive particles. .
【００１２】請求項３記載の発明によれば、異方導電性
接着フィルムを圧着する際に、接続電極に対して導電粒
子をより確実に接続させることが可能になる。According to the third aspect of the invention, when the anisotropic conductive adhesive film is pressed, the conductive particles can be more reliably connected to the connection electrode.
【００１３】さらに、請求項４記載の発明は、請求項１
乃至３のいずれか１項記載の発明において、絶縁性接着
剤中への応力吸収粒子の添加量が０．５〜３０重量％で
あることを特徴とする。Further, the invention according to claim 4 is the invention according to claim 1.
4. The invention according to any one of items 3 to 3, wherein the amount of the stress absorbing particles added to the insulating adhesive is 0.5 to 30% by weight.
【００１４】さらにまた、請求項５記載の発明は、請求
項１乃至４のいずれか１項記載の発明において、応力吸
収粒子が架橋ポリブタジエンを主体とする材料からなる
ものであることを特徴とする。According to a fifth aspect of the present invention, in the first aspect of the present invention, the stress absorbing particles are made of a material mainly composed of crosslinked polybutadiene. .
【００１５】加えて、請求項６記載の発明は、請求項１
乃至５のいずれか１項記載の発明において、応力吸収粒
子が、低ガラス転移温度の核材の表面に高ガラス転移温
度の表面層を形成したものであることを特徴とする。[0015] In addition, the invention according to claim 6 is the invention according to claim 1.
6. The invention according to any one of Items 5 to 5, wherein the stress-absorbing particles are formed by forming a surface layer having a high glass transition temperature on a surface of a core material having a low glass transition temperature.
【００１６】請求項５又は６記載の発明によれば、応力
吸収粒子の弾性率を容易に小さくすることができるた
め、絶縁性接着剤樹脂の内部応力を一層小さくすること
ができ、接着剤としての実効接着力をより向上させるこ
とができる。According to the fifth or sixth aspect of the present invention, since the elastic modulus of the stress absorbing particles can be easily reduced, the internal stress of the insulating adhesive resin can be further reduced, and Can be further improved.
【００１７】特に、請求項６記載の発明のように、応力
吸収粒子として低ガラス転移温度の核材の表面に高ガラ
ス転移温度の表面層を形成したものを用いれば、表面層
のガラス転移温度が絶縁性接着剤樹脂のガラス転移温度
に近くなり絶縁性接着剤樹脂との密着性が向上する。In particular, when the stress absorbing particles having a core layer having a low glass transition temperature and a surface layer having a high glass transition temperature formed thereon are used as the stress absorbing particles, the glass transition temperature of the surface layer can be improved. Is close to the glass transition temperature of the insulating adhesive resin, and the adhesion to the insulating adhesive resin is improved.
【００１８】一方、応力吸収粒子の内部は低ガラス転移
温度のもので弾性率がより小さいため、絶縁性接着剤樹
脂の内部応力を確実に吸収してこれを一層小さくするこ
とができる。しかも、本発明によれば、環境変化によっ
て生ずる応力をも吸収することができるため、長期にわ
たって導通信頼性及び接続信頼性を確保することが可能
になる。On the other hand, since the inside of the stress absorbing particles has a low glass transition temperature and a small elastic modulus, the internal stress of the insulating adhesive resin can be surely absorbed to further reduce the stress. Moreover, according to the present invention, since the stress caused by the environmental change can be absorbed, the conduction reliability and the connection reliability can be ensured for a long time.
【００１９】[0019]
【発明の実施の形態】以下、本発明に係る異方導電性接
着フィルムの実施の形態を図面を参照して詳細に説明す
る。図１（ａ）〜（ｃ）は、本発明に係る異方導電性接
着フィルムの好ましい実施の形態を示すもので、図１
（ａ）は、熱圧着前の状態を示す構成図、図１（ｂ）
は、熱圧着後の状態を示す構成図、図１（ｃ）は、図１
（ｂ）の一点鎖線Ａで示す部分の作用を示す説明図であ
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the anisotropic conductive adhesive film according to the present invention will be described below in detail with reference to the drawings. FIGS. 1A to 1C show a preferred embodiment of the anisotropic conductive adhesive film according to the present invention.
FIG. 1A is a configuration diagram showing a state before thermocompression bonding, and FIG.
1 is a configuration diagram showing a state after thermocompression bonding, and FIG.
It is explanatory drawing which shows the effect | action of the part shown by the dashed-dotted line A of (b).
【００２０】図１に示すように、本発明の異方導電性接
着フィルム１は、例えばＬＣＤパネル２のＩＴＯ電極３
とＬＳＩチップ４のバンプ５とを接続する際に用いられ
るもので、フィルム状の絶縁性接着剤樹脂（絶縁性接着
剤）６中に導電粒子７が分散されて構成される。As shown in FIG. 1, an anisotropic conductive adhesive film 1 according to the present invention is, for example, an ITO electrode 3 of an LCD panel 2.
And a bump 5 of the LSI chip 4. The conductive particles 7 are dispersed in a film-like insulating adhesive resin (insulating adhesive) 6.
【００２１】この場合、絶縁性接着剤樹脂６としては、
例えば、ビスフェノールＡ型エポキシ樹脂、ビスフェノ
ールＦ型エポキシ樹脂、フェノキシ樹脂、ナフタレン型
エポキシ樹脂、ノボラック型エポキシ樹脂等のエポキシ
樹脂を主成分として、カップリング剤、硬化剤等を含む
ものなどを用いることができる。In this case, as the insulating adhesive resin 6,
For example, an epoxy resin such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenoxy resin, a naphthalene type epoxy resin, a novolak type epoxy resin or the like as a main component, and a material containing a coupling agent, a curing agent, or the like may be used. it can.
【００２２】ここで、絶縁性接着剤樹脂６の厚さは、Ｌ
ＳＩチップのバンプの高さ及び異方導電性接着フィルム
の充填性の観点から、１０〜６０μｍとすることが好ま
しい。Here, the thickness of the insulating adhesive resin 6 is L
From the viewpoint of the height of the bumps of the SI chip and the filling property of the anisotropic conductive adhesive film, the thickness is preferably 10 to 60 μm.
【００２３】また、絶縁性接着剤樹脂６は、硬化後の弾
性率が、後述する応力吸収粒子８の弾性率より大きいも
のを用いるとよい。The insulating adhesive resin 6 preferably has a modulus of elasticity after curing greater than the modulus of elasticity of the stress absorbing particles 8 described later.
【００２４】好ましい絶縁性接着剤樹脂６の弾性率は、
常温時において、１×１０9〜１×１０12dyn/cm2であ
り、さらに好ましくは１×１０10〜１×１０11dyn/cm2
である。A preferable elastic modulus of the insulating adhesive resin 6 is as follows:
At room temperature, it is 1 × 10 9 to 1 × 10 12 dyn / cm 2 , and more preferably 1 × 10 10 to 1 × 10 11 dyn / cm 2.
It is.
【００２５】絶縁性接着剤樹脂６の弾性率が１×１０9d
yn/cm2より小さいと、保持力が低下するという不都合が
あり、１×１０12dyn/cm2より大きいと、絶縁性接着剤樹
脂６の内部応力を十分に小さくすることができないとい
う不都合がある。The elastic modulus of the insulating adhesive resin 6 is 1 × 10 9 d
If it is smaller than yn / cm 2 , there is a disadvantage that the holding power is reduced, and if it is larger than 1 × 10 12 dyn / cm 2 , there is a disadvantage that the internal stress of the insulating adhesive resin 6 cannot be sufficiently reduced. is there.
【００２６】また、絶縁性接着剤樹脂６のガラス転移温
度（Ｔｇ）は、８０〜２００℃であることが好ましく、
さらに好ましくは１００〜１５０℃である。The glass transition temperature (Tg) of the insulating adhesive resin 6 is preferably 80 to 200 ° C.
More preferably, it is 100 to 150 ° C.
【００２７】絶縁性接着剤樹脂６のガラス転移温度が８
０℃より小さいと、異方導電性接着フィルム１の耐熱性
が低下するという不都合があり、２００℃より大きい
と、絶縁性接着剤樹脂６に生ずる内部応力を十分に小さ
くすることが困難になるという不都合がある。The glass transition temperature of the insulating adhesive resin 6 is 8
If the temperature is lower than 0 ° C., there is a disadvantage that the heat resistance of the anisotropic conductive adhesive film 1 is reduced. If the temperature is higher than 200 ° C., it becomes difficult to sufficiently reduce the internal stress generated in the insulating adhesive resin 6. There is an inconvenience.
【００２８】一方、導電粒子７としては、例えば、ニッ
ケル、金、銅等の金属粒子、樹脂粒子に金めっき等を施
したもの、また、樹脂粒子に金めっきを施した粒子の最
外層に絶縁被覆を施したもの等を用いることができる。On the other hand, the conductive particles 7 include, for example, metal particles of nickel, gold, copper, etc., resin particles obtained by applying gold plating, and resin particles obtained by applying gold plating to the outermost layer. A coated product or the like can be used.
【００２９】ここで、導電粒子７の平均粒径は、導通信
頼性の観点から、１〜２０μｍとすることが好ましい。Here, the average particle size of the conductive particles 7 is preferably 1 to 20 μm from the viewpoint of conduction reliability.
【００３０】また、絶縁性接着剤樹脂６中への導電粒子
７の分散量は、導通信頼性及び絶縁信頼性の観点から、
２〜５０重量％とすることが好ましい。The amount of the conductive particles 7 dispersed in the insulating adhesive resin 6 is determined from the viewpoints of conduction reliability and insulation reliability.
It is preferable that the content be 2 to 50% by weight.
【００３１】また、図示はしないが、この異方導電性接
着フィルム１は、剥離用の例えば剥離処理を施したポリ
エチレンテレフタレート（ＰＥＴ）フィルム上に形成さ
れており、また、異方導電性接着フィルム１の表面は必
要に応じてカバーフィルムによって覆われている。Although not shown, the anisotropic conductive adhesive film 1 is formed on a peeled polyethylene terephthalate (PET) film, for example, which has been subjected to a release treatment. The surface of 1 is covered with a cover film as needed.
【００３２】一方、本発明においては、絶縁性接着剤樹
脂６中に、ゴム系の弾性材料からなる応力吸収粒子８が
分散されている。On the other hand, in the present invention, in the insulating adhesive resin 6, stress absorbing particles 8 made of a rubber-based elastic material are dispersed.
【００３３】ここで、応力吸収粒子８としては、その弾
性率が硬化後の絶縁性接着剤樹脂６の弾性率より小さい
ものを用いるとよい。Here, as the stress absorbing particles 8, those having an elastic modulus smaller than that of the cured insulating adhesive resin 6 may be used.
【００３４】好ましい応力吸収粒子８の弾性率は、１×
１０8〜１×１０10dyn/cm2であり、さらに好ましくは１
×１０9〜１×１０10dyn/cm2である。The elastic modulus of the preferred stress absorbing particles 8 is 1 ×
10 8 to 1 × 10 10 dyn / cm 2 , more preferably 1
× 10 9 to 1 × 10 10 dyn / cm 2 .
【００３５】応力吸収粒子８の弾性率が１×１０8dyn/c
m2より小さいと、保持力が低下するという不都合があ
り、１×１０10dyn/cm2より大きいと、絶縁性接着剤樹脂
６の内部応力を十分に小さくすることができないという
不都合がある。The elastic modulus of the stress absorbing particles 8 is 1 × 10 8 dyn / c
If it is smaller than m 2 , there is a disadvantage that the holding power is reduced. If it is larger than 1 × 10 10 dyn / cm 2 , there is a disadvantage that the internal stress of the insulating adhesive resin 6 cannot be sufficiently reduced.
【００３６】また、応力吸収粒子８のガラス転移温度
は、８０〜１２０℃であることが好ましく、さらに好ま
しくは８０〜１００℃である。The glass transition temperature of the stress absorbing particles 8 is preferably from 80 to 120 ° C., more preferably from 80 to 100 ° C.
【００３７】応力吸収粒子８のガラス転移温度が８０℃
より小さいと、異方導電性接着フィルム１の耐熱性が低
下するという不都合があり、１２０℃より大きいと、絶
縁性接着剤樹脂６に生ずる内部応力を十分に小さくする
ことが困難になるという不都合がある。The glass transition temperature of the stress absorbing particles 8 is 80 ° C.
If it is smaller, there is a disadvantage that the heat resistance of the anisotropic conductive adhesive film 1 is reduced. If it is larger than 120 ° C., it is difficult to sufficiently reduce the internal stress generated in the insulating adhesive resin 6. There is.
【００３８】さらに、応力吸収粒子８としては、核材に
低ガラス転移温度（−８０〜−３０℃、より好ましくは
−７０〜−４０℃）の材料を用い、この核材の表面を上
記高ガラス転移温度（８０〜１２０℃、より好ましくは
８０〜１００℃）の樹脂で被覆したものがより好まし
い。Further, as the stress absorbing particles 8, a material having a low glass transition temperature (-80 to -30.degree. C., more preferably -70 to -40.degree. C.) is used for the core material, and the surface of the core material is made to have a high Those coated with a resin having a glass transition temperature (80 to 120 ° C, more preferably 80 to 100 ° C) are more preferable.
【００３９】この場合、低ガラス転移温度の核材の表面
に高ガラス転移温度の表面層を形成するには、例えば、
核材の表面にエポキシ樹脂等の樹脂をグラフト重合する
とよい。In this case, to form a surface layer having a high glass transition temperature on the surface of a core material having a low glass transition temperature, for example,
It is preferable to graft-polymerize a resin such as an epoxy resin on the surface of the core material.
【００４０】本発明において使用可能な応力吸収粒子８
としては、例えば、架橋アクリロニトリル−ブタジエン
ゴム、架橋アクリルゴム、カルボン酸変性アクリロニト
リル−ブタジエンゴム、シリコーンゴム、架橋ポリブタ
ジエンゴムからなるものがあげられる。The stress absorbing particles 8 usable in the present invention
Examples thereof include those made of crosslinked acrylonitrile-butadiene rubber, crosslinked acrylic rubber, carboxylic acid-modified acrylonitrile-butadiene rubber, silicone rubber, and crosslinked polybutadiene rubber.
【００４１】また、核材としてこれらのゴムを用い、核
材の表面にエポキシ樹脂等の樹脂をグラフト重合して表
面層を形成した応力吸収粒子６は、絶縁性接着剤樹脂６
に生ずる内部応力を一層小さくする観点から、より好ま
しいものである。The stress-absorbing particles 6 formed by using these rubbers as the core material and forming a surface layer by graft-polymerizing a resin such as an epoxy resin on the surface of the core material are used as the insulating adhesive resin 6.
This is more preferable from the viewpoint of further reducing the internal stress generated in the above.
【００４２】また、導電粒子７と接続電極間の電気的な
接続を十分に確保するためには、応力吸収粒子８の平均
粒径は、導電粒子７の平均粒径より小さいことが好まし
い。In order to ensure a sufficient electrical connection between the conductive particles 7 and the connection electrodes, the average particle size of the stress absorbing particles 8 is preferably smaller than the average particle size of the conductive particles 7.
【００４３】好ましい応力吸収粒子８の平均粒径は、１
０ｎｍ〜２μｍであり、さらに好ましくは３０〜１００
０ｎｍである。The preferred average particle size of the stress absorbing particles 8 is 1
0 nm to 2 μm, and more preferably 30 to 100 μm.
0 nm.
【００４４】絶縁性接着剤樹脂６の内部応力を小さくす
るためには添加する応力吸収粒子８の粒径が小さくその
表面積が大きい方が望ましいが、応力吸収粒子８の平均
粒径が１０ｎｍより小さいと、応力を吸収しきれないと
いう不都合がある。In order to reduce the internal stress of the insulating adhesive resin 6, it is desirable that the particle size of the stress absorbing particles 8 to be added is small and the surface area thereof is large, but the average particle size of the stress absorbing particles 8 is smaller than 10 nm. Then, there is a disadvantage that the stress cannot be completely absorbed.
【００４５】他方、応力吸収粒子８の平均粒径が２μｍ
より大きいと、導電粒子７と接続電極間の電気的な接続
が低下するおそれがある。On the other hand, the average particle size of the stress absorbing particles 8 is 2 μm.
If it is larger, the electrical connection between the conductive particles 7 and the connection electrodes may be reduced.
【００４６】一方、絶縁性接着剤中への応力吸収粒子８
の添加量は、０．５〜３０重量％であることが好まし
く、さらに好ましくは１．０〜２０重量％である。On the other hand, the stress absorbing particles 8 in the insulating adhesive
Is preferably 0.5 to 30% by weight, more preferably 1.0 to 20% by weight.
【００４７】絶縁性接着剤中への応力吸収粒子８の添加
量が０．５重量％より小さいと、絶縁性接着剤樹脂６に
生ずる内部応力を十分に小さくすることができず、３０
重量％より大きいと、フィルムになりにくく、また耐熱
性が低下するという不都合がある。If the amount of the stress-absorbing particles 8 added to the insulating adhesive is less than 0.5% by weight, the internal stress generated in the insulating adhesive resin 6 cannot be sufficiently reduced.
If it is larger than the weight%, there is a disadvantage that the film is hardly formed and the heat resistance is lowered.
【００４８】本発明の異方導電性接着フィルム１を作成
するには、まず、所定のエポキシ樹脂を溶解させた溶液
に、ゴム系の弾性材料からなる応力吸収粒子８と硬化剤
等を所定量加えて混合し、溶剤に分散させた導電粒子７
をこの溶液に加えて混合してバインダーを調製する。To prepare the anisotropic conductive adhesive film 1 of the present invention, first, a predetermined amount of a stress-absorbing particle 8 made of a rubber-based elastic material and a hardener are added to a solution in which a predetermined epoxy resin is dissolved. In addition, the conductive particles 7 mixed and dispersed in a solvent
Is added to this solution and mixed to prepare a binder.
【００４９】このバインダーを例えばポリエステルフィ
ルム等の剥離フィルム上にコーティングし、乾燥後、カ
バーフィルムをラミネートして異方導電性接着フィルム
１を得る。The binder is coated on a release film such as a polyester film, dried, and then a cover film is laminated to obtain an anisotropic conductive adhesive film 1.
【００５０】本発明の異方導電性接着フィルム１を用い
て電極間の接続を行う場合には、図１（ａ）（ｂ）に示
すように、例えばＬＣＤパネル２側に異方導電性接着フ
ィルム１を貼付し、ＬＳＩチップ４の位置合わせ（仮接
続）を行った後に、所定の温度及び圧力で熱圧着を行う
ことにより、ＬＳＩチップ４の電極５とＬＣＤパネル２
の電極３とを電気的に接続させた状態で絶縁性接着剤樹
脂６を硬化させる。When connection between electrodes is performed using the anisotropic conductive adhesive film 1 of the present invention, as shown in FIGS. 1A and 1B, for example, the anisotropic conductive adhesive film is attached to the LCD panel 2 side. After attaching the film 1 and performing alignment (temporary connection) of the LSI chip 4, thermocompression bonding is performed at a predetermined temperature and pressure, so that the electrode 5 of the LSI chip 4 and the LCD panel 2 are bonded.
The insulating adhesive resin 6 is cured while the electrodes 3 are electrically connected.
【００５１】ところで、一般に、異方導電性接着フィル
ムの接着界面に発生する内部応力σは、次の式(１)によ
って算出しうることが知られている。Incidentally, it is generally known that the internal stress σ generated at the bonding interface of the anisotropic conductive adhesive film can be calculated by the following equation (1).
【００５２】[0052]
【数１】 (Equation 1)
【００５３】本発明の異方導電性接着フィルム１におい
て、異方導電性接着フィルム１に対して外部応力に起因
する力Ｆが加わった場合には、例えば、図１（ｃ）に示
すように、絶縁性接着剤樹脂６より弾性率の小さい各応
力吸収粒子８が絶縁性接着剤樹脂６の各部分より大きく
変形することによってこれらの部分においていわば応力
が吸収された状態となるため、異方導電性接着フィルム
１全体としての弾性率は絶縁性接着剤樹脂６のみの場合
に比べて小さくなる。In the anisotropic conductive adhesive film 1 of the present invention, when a force F due to external stress is applied to the anisotropic conductive adhesive film 1, for example, as shown in FIG. Since each of the stress absorbing particles 8 having a smaller elastic modulus than the insulating adhesive resin 6 is deformed to a greater extent than each part of the insulating adhesive resin 6, it becomes a state in which stress is absorbed in these parts. The elastic modulus of the entire conductive adhesive film 1 is smaller than that of the case where only the insulating adhesive resin 6 is used.
【００５４】その結果、本発明によれば、式(１)から明
らかなように、従来技術に比べて異方導電性接着フィル
ム１の絶縁性接着剤樹脂６中に生ずる内部応力σを小さ
くすることができる。その一方、絶縁性接着剤樹脂６は
従来と同様のものを用いることができることから、本発
明によれば、ガラス転移温度を低下させることなく接着
剤としての実効接着力を向上させることが可能になる。As a result, according to the present invention, as is apparent from the equation (1), the internal stress σ generated in the insulating adhesive resin 6 of the anisotropic conductive adhesive film 1 is reduced as compared with the prior art. be able to. On the other hand, since the same insulating adhesive resin as that of the conventional adhesive can be used, according to the present invention, it is possible to improve the effective adhesive force as an adhesive without lowering the glass transition temperature. Become.
【００５５】この場合、応力吸収粒子８としてより弾性
率の小さいものを用いれば、絶縁性接着剤樹脂６の内部
応力を一層小さくすることができ、接着剤としての実効
接着力をより向上させることができる。In this case, if the stress absorbing particles 8 having a smaller elastic modulus are used, the internal stress of the insulating adhesive resin 6 can be further reduced, and the effective adhesive force as an adhesive can be further improved. Can be.
【００５６】特に、応力吸収粒子８として低ガラス転移
温度の核材の表面に高ガラス転移温度の表面層を形成し
たものを用いれば、表面層のガラス転移温度が絶縁性接
着剤樹脂のガラス転移温度に近くなり絶縁性接着剤樹脂
との密着性が向上する。In particular, if the stress absorbing particles 8 are formed by forming a surface layer having a high glass transition temperature on the surface of a core material having a low glass transition temperature, the glass transition temperature of the surface layer can be reduced by the glass transition of the insulating adhesive resin. As the temperature approaches, the adhesion with the insulating adhesive resin is improved.
【００５７】特に、グラフト重合によって核材の表面に
エポキシ樹脂による表面層を形成すれば、絶縁性接着剤
樹脂６と同種の材質となるため、絶縁性接着剤樹脂６と
の密着性がより向上し、熱圧着の際に絶縁性接着剤樹脂
６と応力吸収粒子８との界面において剥離することがな
く、エージングの際において内部応力が吸収されること
によって高い接続信頼性が得られるようになる。In particular, if a surface layer made of an epoxy resin is formed on the surface of the core material by graft polymerization, the same material as that of the insulating adhesive resin 6 is used, so that the adhesion to the insulating adhesive resin 6 is further improved. However, the connection between the insulating adhesive resin 6 and the stress absorbing particles 8 does not peel off at the time of thermocompression bonding, and internal connection is absorbed at the time of aging, so that high connection reliability can be obtained. .
【００５８】一方、応力吸収粒子の内部は低ガラス転移
温度のもので弾性率がより小さいため、絶縁性接着剤樹
脂の内部応力を確実に吸収してこれを一層小さくするこ
とができる。しかも、本発明によれば、高い初期接着力
が得られることに加え、環境変化によって生ずる応力を
も吸収することができるため、長期にわたって導通信頼
性及び接続信頼性を確保することが可能になる。On the other hand, since the inside of the stress-absorbing particles has a low glass transition temperature and a small elastic modulus, the internal stress of the insulating adhesive resin can be reliably absorbed and further reduced. Moreover, according to the present invention, in addition to obtaining a high initial adhesive force, it is also possible to absorb stress caused by an environmental change, so that it is possible to secure conduction reliability and connection reliability for a long time. .
【００５９】[0059]
【実施例】以下、本発明に係る異方導電性接着フィルム
の実施例を比較例とともに詳細に説明する。 〔実施例１〕まず、フェノキシ樹脂（東都化成社製 Ｙ
Ｐ５０）５０重量部、エポキシ樹脂（油化シェル社製
８２８）、イミダゾール系硬化剤（旭化成社製 ＨＸ３
９４１ＨＰ）１００重量部、シランカップリング剤（日
本ユニカー社製 Ａ１８７）３．２重量部、平均粒径１
００ｎｍの架橋ポリブタジエン粒子０．５重量部を、溶
剤トルエンに溶解して絶縁性接着剤樹脂、すなわち、バ
インダー溶液を調製する。EXAMPLES Examples of the anisotropic conductive adhesive film according to the present invention will be described below in detail along with comparative examples. [Example 1] First, a phenoxy resin (Y, manufactured by Toto Kasei Co., Ltd.)
P50) 50 parts by weight, epoxy resin (manufactured by Yuka Shell Co., Ltd.)
828), imidazole-based curing agent (HX3 manufactured by Asahi Kasei Corporation)
941HP) 100 parts by weight, 3.2 parts by weight of silane coupling agent (A187 manufactured by Nippon Unicar), average particle size 1
0.5 parts by weight of 00 nm crosslinked polybutadiene particles are dissolved in a solvent of toluene to prepare an insulating adhesive resin, that is, a binder solution.
【００６０】そして、このバインダー溶液１００重量部
に、導電粒子として、平均粒径５μｍのベンゾグアナミ
ン粒子にニッケル−金めっきを施したものを３．５重量
部加えてバインダーとする。Then, 3.5 parts by weight of nickel-gold plating on benzoguanamine particles having an average particle diameter of 5 μm are added as conductive particles to 100 parts by weight of the binder solution to obtain a binder.
【００６１】さらに、このバインダーを剥離用のＰＥＴ
フィルム上に乾燥後の厚みが２５μｍになるようにコー
ティングし、異方導電性接着フィルムを得る。この異方
導電性接着フィルムを幅２ｍｍのスリット状に切断し、
実施例１のサンプルとした。Further, this binder is used for peeling PET.
The film is coated so as to have a thickness of 25 μm after drying to obtain an anisotropic conductive adhesive film. This anisotropic conductive adhesive film is cut into a slit having a width of 2 mm,
The sample of Example 1 was used.
【００６２】〔実施例２〕架橋ポリブタジエン粒子の添
加量を１重量部とした以外は実施例１と同様の方法によ
って異方導電性接着フィルムのサンプルを作成した。Example 2 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Example 1 except that the amount of the crosslinked polybutadiene particles was changed to 1 part by weight.
【００６３】〔実施例３〕架橋ポリブタジエン粒子の添
加量を５重量部とした以外は実施例１と同様の方法によ
って異方導電性接着フィルムのサンプルを作成した。Example 3 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Example 1 except that the amount of the crosslinked polybutadiene particles was changed to 5 parts by weight.
【００６４】〔実施例４〕架橋ポリブタジエン粒子の添
加量を１０重量部とした以外は実施例１と同様の方法に
よって異方導電性接着フィルムのサンプルを作成した。Example 4 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Example 1 except that the amount of the crosslinked polybutadiene particles was changed to 10 parts by weight.
【００６５】〔実施例５〕架橋ポリブタジエン粒子の添
加量を３０重量部とした以外は実施例１と同様の方法に
よって異方導電性接着フィルムのサンプルを作成した。Example 5 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Example 1 except that the amount of the crosslinked polybutadiene particles was changed to 30 parts by weight.
【００６６】〔比較例１〕架橋ポリブタジエン粒子を添
加せずにバインダー溶液を調製した以外は実施例１と同
様の方法によって異方導電性接着フィルムのサンプルを
作成した。Comparative Example 1 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Example 1 except that a binder solution was prepared without adding crosslinked polybutadiene particles.
【００６７】〔比較例２〕架橋ポリブタジエン粒子の添
加量を３５重量部とした以外は実施例１と同様の方法に
よって異方導電性接着フィルムのサンプルを作成した。Comparative Example 2 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Example 1 except that the amount of the crosslinked polybutadiene particles was changed to 35 parts by weight.
【００６８】〔比較例３〕架橋ポリブタジエン粒子の添
加量を４０重量部とした以外は実施例１と同様の方法に
よって異方導電性接着フィルムのサンプルを作成した。Comparative Example 3 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Example 1 except that the amount of the crosslinked polybutadiene particles was changed to 40 parts by weight.
【００６９】〔実施例６〕平均粒径１０ｎｍの架橋ポリ
ブタジエン粒子を５重量部添加した以外は実施例１と同
様の方法によって異方導電性接着フィルムのサンプルを
作成した。Example 6 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Example 1 except that 5 parts by weight of crosslinked polybutadiene particles having an average particle diameter of 10 nm was added.
【００７０】〔実施例７〕架橋ポリブタジエン粒子の平
均粒径を１μｍとした以外は実施例６と同様の方法によ
って異方導電性接着フィルムのサンプルを作成した。Example 7 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Example 6, except that the average particle size of the crosslinked polybutadiene particles was 1 μm.
【００７１】〔実施例８〕架橋ポリブタジエン粒子の平
均粒径を２μｍとした以外は実施例６と同様の方法によ
って異方導電性接着フィルムのサンプルを作成した。Example 8 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Example 6, except that the average particle size of the crosslinked polybutadiene particles was 2 μm.
【００７２】〔比較例４〕架橋ポリブタジエン粒子の平
均粒径を５μｍとした以外は実施例６と同様の方法によ
って異方導電性接着フィルムのサンプルを作成した。Comparative Example 4 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Example 6, except that the average particle size of the crosslinked polybutadiene particles was 5 μm.
【００７３】〔比較例５〕架橋ポリブタジエン粒子を添
加せずに液状ゴム（日本ゼオン社製 ＤＮ−６０１）を
５重量部添加した以外は実施例１と同様の方法によって
異方導電性接着フィルムのサンプルを作成した。Comparative Example 5 An anisotropic conductive adhesive film was prepared in the same manner as in Example 1 except that 5 parts by weight of a liquid rubber (DN-601 manufactured by Zeon Corporation) was added without adding crosslinked polybutadiene particles. Made a sample.
【００７４】〔比較例６〕液状ゴムの添加量を１０重量
部とした以外は比較例５と同様の方法によって異方導電
性接着フィルムのサンプルを作成した。Comparative Example 6 A sample of an anisotropic conductive adhesive film was prepared in the same manner as in Comparative Example 5, except that the amount of the liquid rubber was changed to 10 parts by weight.
【００７５】〔比較例７〕液状ゴムの添加量を３０重量
部とした以外は比較例５と同様の方法によって異方導電
性接着フィルムのサンプルを作成した。Comparative Example 7 An anisotropic conductive adhesive film sample was prepared in the same manner as in Comparative Example 5, except that the amount of the liquid rubber was changed to 30 parts by weight.
【００７６】＜評価結果＞次に、上述のサンプルを用
い、プリント基板とガラス基板との圧着を行った。この
場合、プリント基板としては、厚みが７５μｍのポリイ
ミドからなる基材上に、厚み３５μｍの銅箔にすずめっ
きを施したパターンを２００μｍのピッチで形成したも
のを用いた。一方、ガラス基板としては、全面にＩＴＯ
による電極が形成されたもので、その表面抵抗が１０Ω
／□となるものを用いた。そして、このようにして作成
した各サンプルについて、導通抵抗値、接着強度、フィ
ルム性の測定を行った。その結果を表１に示す。<Evaluation Results> Next, using the above-mentioned sample, the printed board and the glass board were pressed. In this case, as the printed circuit board, a pattern in which a tin-plated copper foil having a thickness of 35 μm was formed at a pitch of 200 μm on a base material made of polyimide having a thickness of 75 μm was used. On the other hand, as a glass substrate, ITO
The surface resistance is 10Ω.
/ □ was used. Then, the conductive resistance value, the adhesive strength, and the film property of each sample thus prepared were measured. Table 1 shows the results.
【００７７】[0077]
【表１】 [Table 1]
【００７８】この場合、導通抵抗の判定は、３Ω以下の
ものを良好（○）、３〜２０Ωのものをやや不良
（△）、２０Ωより大きくなったものを不良（×）とし
た。In this case, the conduction resistance was judged as good (○) when it was 3 Ω or less, slightly poor (△) when it was 3 to 20 Ω, and poor (×) when it was larger than 20 Ω.
【００７９】一方、接着強度については、温度８５℃、
相対湿度８５％〜温度４５℃、相対湿度９０％の条件下
で１０００時間エージング後において、引張り速度が５
０ｍｍ／分で、ガラス基板からプリント基板を９０°方
向に引き剥がすときの接着力を測定した。On the other hand, regarding the adhesive strength, a temperature of 85 ° C.
After aging for 1000 hours under the conditions of a relative humidity of 85% to a temperature of 45 ° C. and a relative humidity of 90%, the tensile speed becomes 5%.
At 0 mm / min, the adhesive strength when peeling the printed circuit board from the glass substrate in the 90 ° direction was measured.
【００８０】そして、接着強度が６００ｇ／ｃｍ以上の
ものをきわめて良好（◎）、３００ｇ／ｃｍより大きく
６００ｇ／ｃｍ未満のものを良好（○）、３００ｇ／ｃ
ｍ以下のものを不良（×）とした。Those having an adhesive strength of 600 g / cm or more are very good (）), those having an adhesive strength of more than 300 g / cm and less than 600 g / cm are good (）), 300 g / c
m or less were evaluated as defective (x).
【００８１】さらに、フィルム性については、容易にフ
ィルム化したものを良好（○）、フィルムになりにくい
ものをやや不良（△）、フィルムにならなかったものを
不良（×）とした。Further, with respect to the film properties, those easily formed into a film were evaluated as good (、), those hardly formed into a film were evaluated as slightly poor (△), and those not formed as a film were evaluated as poor (×).
【００８２】表１に示すように、ゴム系の弾性材料から
なる応力吸収粒子を添加した実施例１〜５は、応力吸収
粒子を添加しない比較例１に比べて接着強度が向上し
た。この場合、応力吸収粒子の添加量が多いほど接着強
度が向上したが、３５重量％以上添加すると、フィルム
になりにくく（比較例２）、４０重量％以上添加した場
合にはフィルム化することができなかった（比較例
３）。As shown in Table 1, in Examples 1 to 5 in which the stress-absorbing particles made of a rubber-based elastic material were added, the adhesive strength was improved as compared with Comparative Example 1 in which no stress-absorbing particles were added. In this case, the larger the amount of the stress-absorbing particles added, the higher the adhesive strength. However, when 35% by weight or more is added, it is difficult to form a film (Comparative Example 2). No (Comparative Example 3).
【００８３】以上の結果から、応力吸収粒子の添加量
は、０．５〜３０重量％が効果的であると考えられる。From the above results, it is considered that the effective amount of the stress absorbing particles is 0.5 to 30% by weight.
【００８４】実施例６〜８及び比較例４において応力吸
収粒子の粒径を変えて評価を行ったが、応力吸収粒子の
粒径が２μｍを超えると導通抵抗値がやや大きくなり
（実施例８、実用可能なレベルである）、応力吸収粒子
の粒径が導電粒子の粒径より大きい５μｍの場合には、
接続電極間の導通がとれなくなった（比較例４）。一
方、接着強度については、応力吸収粒子の粒径による差
はみられなかった。In Examples 6 to 8 and Comparative Example 4, the evaluation was carried out by changing the particle size of the stress absorbing particles. When the particle size of the stress absorbing particles exceeded 2 μm, the conduction resistance slightly increased (Example 8). When the particle size of the stress absorbing particles is 5 μm larger than the particle size of the conductive particles,
The conduction between the connection electrodes could not be obtained (Comparative Example 4). On the other hand, there was no difference in the adhesive strength depending on the particle size of the stress absorbing particles.
【００８５】さらに、応力吸収粒子の代わりに液状ゴム
評価を添加した比較例５〜７は、応力吸収粒子を添加し
ない比較例１に比べて接着強度の向上はみられなかっ
た。Further, in Comparative Examples 5 to 7 in which the liquid rubber evaluation was added instead of the stress absorbing particles, no improvement in the adhesive strength was observed as compared with Comparative Example 1 in which the stress absorbing particles were not added.
【００８６】[0086]
【発明の効果】以上述べたように本発明によれば、異方
導電性接着フィルムにおいて、バインダーのガラス転移
温度を低下させることなく接着剤としての実効接着力を
向上させることができる。As described above, according to the present invention, in the anisotropic conductive adhesive film, the effective adhesive strength as an adhesive can be improved without lowering the glass transition temperature of the binder.
【図１】図１（ａ）〜（ｃ）は、本発明に係る異方導電
性接着フィルムの好ましい実施の形態を示すもので、図
１（ａ）は、熱圧着前の状態を示す構成図、図１（ｂ）
は、熱圧着後の状態を示す構成図、図１（ｃ）は、図１
（ｂ）の一点鎖線Ａで示す部分の作用を示す説明図であ
る。1 (a) to 1 (c) show a preferred embodiment of an anisotropic conductive adhesive film according to the present invention, and FIG. 1 (a) shows a state before thermocompression bonding. FIG. 1 (b)
1 is a configuration diagram showing a state after thermocompression bonding, and FIG.
It is explanatory drawing which shows the effect | action of the part shown by the dashed-dotted line A of (b).
１ 異方導電性接着フィルム ２ ＬＣＤパネル ３ ＩＴＯ電極 ４ ＬＳＩチップ ５ バンプ ６ 絶縁性接着剤樹脂（絶縁性接着剤） ７ 導電粒子 ８ 応力吸収粒子 DESCRIPTION OF SYMBOLS 1 Anisotropic conductive adhesive film 2 LCD panel 3 ITO electrode 4 LSI chip 5 Bump 6 Insulating adhesive resin (insulating adhesive) 7 Conductive particles 8 Stress absorption particles
Claims (6)
異方導電性接着フィルムであって、 上記絶縁性接着剤中にゴム系の弾性材料からなる応力吸
収粒子が分散されていることを特徴とする異方導電性接
着フィルム。1. An anisotropic conductive adhesive film in which conductive particles are dispersed in an insulating adhesive, wherein stress-absorbing particles made of a rubber-based elastic material are dispersed in the insulating adhesive. An anisotropic conductive adhesive film, characterized in that:
接着剤の弾性率より小さいことを特徴とする請求項１記
載の異方導電性接着フィルム。2. The anisotropic conductive adhesive film according to claim 1, wherein the elastic modulus of the stress absorbing particles is smaller than the elastic modulus of the insulating adhesive after curing.
均粒径より小さいことを特徴とする請求項１又は２のい
ずれか１項記載の異方導電性接着フィルム。3. The anisotropic conductive adhesive film according to claim 1, wherein the average particle size of the stress absorbing particles is smaller than the average particle size of the conductive particles.
が０．５〜３０重量％であることを特徴とする請求項１
乃至３のいずれか１項記載の異方導電性接着フィルム。4. The method according to claim 1, wherein the amount of the stress absorbing particles added to the insulating adhesive is 0.5 to 30% by weight.
4. The anisotropic conductive adhesive film according to any one of items 3 to 3.
体とする材料からなることを特徴とする請求項１乃至４
のいずれか１項記載の異方導電性接着フィルム。5. The stress-absorbing particles are made of a material mainly composed of cross-linked polybutadiene.
The anisotropic conductive adhesive film according to any one of the above items.
の表面に高ガラス転移温度の表面層を形成したものであ
ることを特徴とする請求項１乃至５のいずれか１項記載
の異方導電性接着フィルム。6. The method according to claim 1, wherein the stress-absorbing particles are formed by forming a surface layer having a high glass transition temperature on a surface of a core material having a low glass transition temperature. Anisotropic conductive adhesive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12839798A JP3477367B2 (en) | 1998-05-12 | 1998-05-12 | Anisotropic conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12839798A JP3477367B2 (en) | 1998-05-12 | 1998-05-12 | Anisotropic conductive adhesive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11329069A true JPH11329069A (en) | 1999-11-30 |
| JP3477367B2 JP3477367B2 (en) | 2003-12-10 |
Family
ID=14983801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12839798A Expired - Lifetime JP3477367B2 (en) | 1998-05-12 | 1998-05-12 | Anisotropic conductive adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3477367B2 (en) |
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