JPH0237669B2 - FUIRUMUJODENKYOKUKONEKUTANOSEIZOHOHO - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a film-like electrode connector, and its purpose is to manufacture a film-like electrode connector with a fine conductive circuit pattern on a flexible insulating substrate film surface with precision. The object of the present invention is to provide a method of manufacturing the invention efficiently and at low cost.

Conventionally, methods for manufacturing this kind of film-like electrode connector include, for example: (1) laminating a large number of conductive rubber thin plates and insulating rubber thin plates while alternately adhering them in a direction that intersects the surface of the thin plates; (2) Cutting thin conductor wires into a flexible polymer insulating material to obtain a film-like electrode connector (3) A method of mixing conductor particles such as metal powder with an insulating elastic material such as silicone rubber and forming the mixture into a sheet to obtain a flexible film-like electrode connector; (4)
An electrode circuit pattern is printed on the insulating substrate film by screen printing using a conductive paste, and a heat-melt adhesive layer is printed in registration on the areas other than the circuit pattern by screen printing. There are methods of obtaining a film-like electrode connector.

However, although methods (1) and (2) above can form fine patterns with high precision, the manufacturing process is complicated and costly, and method (3) has problems with conductivity due to irregularities in the conductor particles. In method (4), it is difficult to obtain fine precision patterns with high precision because the film is formed by registering two colors of ink in screen printing. Both of the above methods had their own drawbacks.

The present inventor conducted various research and improvements in view of the above-mentioned drawbacks of the prior art. First, as a first improvement measure, a carbon conductor layer was screen printed on a polyester film to form a fine pattern layer, and after drying, a hot melt adhesive layer was formed on the entire surface including the carbon conductor layer. Although it is easy to form a fine pattern of carbon conductor on a film substrate, since the entire surface of the fine pattern of the conductor is covered with an adhesive layer, it is difficult to bond when bonding to a mating electrode. The insulating film of the adhesive layer is interposed between the electrode to be used and the electrode of the fine pattern of the conductor, resulting in a problem of poor conductivity.

Therefore, as a second improvement measure, a hot melt adhesive was applied to the entire surface of the same polyester film in advance, and then a fine pattern of carbon conductor was formed on it. In addition to problems with uneven thickness of the adhesive layer and printability of carbon paste,
Problems also arose in that the dimensional stability of the carbon conductor layer was poor when it was thermocompression bonded to a mating electrode.

Therefore, as a third improvement means, a fine pattern of carbon paste is precisely printed on a polyester film using a screen printing method and dried.
Silicon or a fluorine compound was blended into the carbon paste in advance so that the surface of the carbon conductor layer formed at this time had a low surface energy. Next, when a hot melt adhesive was applied to the entire surface of the carbon conductor layer including the fine pattern formed on the polyester film, the hot melt adhesive was repelled from the surface of the carbon conductor layer and did not adhere. It was discovered that hot melt adhesive is applied only to areas other than the carbon conductor layer, and the present invention was completed based on this knowledge.

That is, the present invention provides a conductive connector circuit pattern layer on a flexible insulating substrate film, the surface of which has a property of repelling a hot melt adhesive solution or melt, and a low surface energy forming agent. It is provided by printing a conductive paste containing kneaded and
Next, a solution or melt of a hot-melt adhesive is printed or applied on the entire surface of the surface and dried, so that hot-melt adhesive is applied only to the portion where the conductive connector circuit pattern layer is not provided. This is a method of manufacturing a film-like electrode connector, which is characterized by forming a layer of agent.

Next, the present invention will be explained in detail based on the drawings.

As shown in FIG. 1, examples of the flexible insulating base film 1 include paper, synthetic paper, coated paper, cellophane, polyester film, polypropylene film, polyethylene film, nylon film, acetate film, vinyl chloride film, Polycarbonate film, polystyrene film, polyvinylidene chloride film, etc., single film or composite film, etc., which are flexible and have electrical insulating properties, can be treated as they are or their surfaces can be subjected to corona discharge treatment, flame treatment, The film is activated by surface treatment such as chemical treatment, or a polymer solution such as polyester resin, epoxy resin, acrylic resin, urethane resin, etc. is used on the back side of the film to prevent the film from curling or stretching. print,
A back coat layer 4 made of a thermoplastic or thermosetting polymer film is provided by coating or the like (see Figure 2), and a conductive paste is applied on top of this by, for example, screen printing or gravure printing. The conductive connector circuit pattern layer 2 having an arbitrary shape is formed by various printing methods such as a printing method, a letterpress printing method, a planographic printing method, a flexo printing method, etc. Since the formed conductive connector circuit pattern layer 2 needs to have at least the property of repelling the solution or melt of the hot-melt adhesive on its surface, the conductive paste may be, for example, a conductive carbon paste. It is necessary to use a material in which a low surface energy forming agent such as silicon or a fluorine compound is kneaded into a silver paste or the like. Further, the shape of the conductive connector circuit pattern layer 2 formed here may be selected to have an appropriate shape and size corresponding to the shape of the electrodes to be connected, but as described above, the surface of the conductive connector circuit pattern layer 2 may be In order to have a sufficient effect of repelling the hot-melt adhesive provided on the wire, it is preferable to use a thin wire with a wire width of 1 mm or less, for example. This is because if the line width becomes too large, the surface area for wetting increases and the repelling effect weakens.

Next, the entire surface of the insulating substrate film 1 including the conductive connector circuit pattern layer 2 thus formed is coated with a solution or melt of a hot-melt adhesive by various printing means, coating means, etc. and dried. Since the surface of the conductive connector circuit pattern layer 2 has low surface energy, the coating liquid is repelled and exposed, so that heat is applied only to the areas other than the conductive connector circuit pattern layer 2, as shown in FIG. A meltable adhesive layer 3 can be formed.

The line width in this case is 0.1 when confirmed by experiment.
A line with a fine line width on the order of mm could be formed with the highest accuracy and favorable results were obtained.

The above hot melt adhesive used here is:
For example, general hot melt adhesives such as vinyl acetate-ethylene copolymer resin, polyolefin resin, polyamide resin, and synthetic rubber can be used.
Among them, those that form a solidified film with high electrical insulation properties are preferably selected and used.

A suitable solvent may be used to make these hot-melt adhesives into a solution, and a general hot-melt coater equipped with a heatable ink pan may be used to make them into a melt.

Regarding the method of forming a hot melt adhesive layer only on the area other than the area where the conductive connector circuit pattern layer is provided, in addition to the above, for example, oleophilic conductive paste and hydrophilic hot melt adhesive may be used. A method using an agent is also possible, and a similar structure can also be easily obtained using this method.

When using the film-like electrode connector obtained as described above, the conductive connector circuit pattern layer 2 is placed on the transparent electrode 5 provided on the glass substrate 6, for example, as shown in FIG. By stacking them facing each other in corresponding positions and applying heat press from above, the upper insulating substrate film 1 and the lower glass substrate 6 are bonded by melting the hot-melt adhesive layer 3, as shown in FIG. The conductive connector circuit pattern layer 2 and the transparent electrode 5 are easily bonded by the action of the adhesive, thereby connecting the conductive connector circuit pattern layer 2 and the transparent electrode 5, thereby obtaining the effect of a connector.

The present invention has the above-described configuration, and utilizes a printing means on a flexible insulating substrate film, a conductive paste, and a repelling action of a hot-melt adhesive on the surface of the conductive paste. Since the circuit pattern of the connector is formed by using the printer, there is no need for registration at the time of printing, and extremely fine patterns can be formed with high precision.
It is a simple and extremely economical method, and has great practical value.

Examples of the present invention will be described below.

Example 1 A conductive paste having the composition shown below was printed on a polyester film with a thickness of 70 μm using a screen printing machine with a line width of 0.1 mm and a pitch of 50 mm with a pitch of 0.2 mm.
A conductive connector circuit pattern in the form of vertical stripes with the size of the corners was printed and dried.

Conductor paste Carbon black/graphite mixture 60 parts Acrylic resin 40 parts Polyhydric alcohol derivative 20 parts Daifree MS743 (Mold release agent for Daikin products)
After that, a solution composition consisting of 150 parts of polyamide resin, 10 parts of nitrocellulose resin, and 40 parts of petroleum solvent was prepared as a hot melt adhesive, and this was printed using a screen printing machine to form the above-mentioned conductive connector. A film-like electrode in which conductive connector circuit pattern layers and hot-melt adhesive layers are alternately formed on the film with high precision as a result of solid printing and drying on the entire surface of the film on which the circuit pattern layer has been formed. I got the connector.

Example 2 A 25 μm polyester film whose back surface was resin-coated with a transparent ink composition containing melamine resin as the main component was coated with a conductive paste having the following composition on the surface using a screen printing machine. Line width 0.125mm, pitch 0.25mm 50mm
A conductive connector circuit pattern in the form of vertical stripes was printed on the corner and dried.

After that, a hot melt adhesive (vinyl acetate-ethylene copolymer resin) was heated and coated on the entire surface with a coater. As a result, a conductive connector circuit pattern layer with particularly excellent pitch accuracy and a hot melt adhesive layer were formed on the film. , a film-like electrode connector formed alternately was obtained.

conductive paste Carbon black graphite 50 copies Rubber resin 30 parts Petroleum solvent 40 parts Hexafluoropropylene trimer 5 parts

[Brief explanation of drawings]

Figures 1, 2, and 3 are enlarged cross-sectional views of the manufacturing process of the present invention, Figure 2 is an enlarged cross-sectional view of the case where a back coating is applied, and Figure 3 is a hot-melt adhesive. An enlarged cross-sectional view of the applied layer is shown.
FIGS. 4 and 5 are enlarged cross-sectional views when using the film-shaped electrode connector obtained by the present invention. In the figure, 1... Insulating substrate film, 2... Conductive connector circuit pattern layer, 3... Hot melt adhesive layer, 4... Back coating layer, 5... Transparent electrode, 6
...Glass substrate.

Claims (1)

[Claims] 1. A conductive connector circuit pattern layer having a surface that repels a hot-melt adhesive solution or melt is formed on a flexible insulating substrate film with low surface energy. The conductive connector circuit is formed by printing a conductive paste containing a kneaded adhesive, and then printing or applying a solution or melt of a hot-melt adhesive over the entire surface and drying it. A method for manufacturing a film-like electrode connector, characterized in that a hot-melt adhesive layer is formed only on a portion where a pattern layer is not provided. 2. A method of manufacturing a film-shaped electrode connector according to claim 1, characterized in that a plastic film whose surface has been activated is used as the flexible insulating substrate film. 3. The film-shaped electrode according to claim 1 or 2, characterized in that a conductive carbon paste containing silicon or a fluorine compound is used as the conductive paste kneaded and containing a low surface energy forming agent. How to manufacture connectors. 4. Claim 1, characterized in that the conductive connector circuit pattern layer is formed of a vertical striped pattern with a line width of 1 mm or less.
A method for manufacturing a film-like electrode connector according to items 3 to 3. 5. A method for manufacturing a film-shaped electrode connector according to claims 1 to 4, characterized in that the hot-melt adhesive is one that forms a solidified film with high electrical insulation. 6. Claims 1 to 5, wherein the insulating substrate film is provided with a back coating layer made of a thermoplastic or thermosetting polymer film as a curl and expansion prevention layer on the back surface thereof. A method of manufacturing the film-like electrode connector described above.