KR0183896B1 - Acf attach method and its instrument to lcd panel electrode - Google Patents

Abstract

The present invention discloses a method and apparatus for attaching an anisotropic conductive film interposed therebetween for mechanically and electrically connecting a signal input terminal formed on a panel of an LCD and an output terminal of a substrate on which a drive drive chip is mounted.

The method for attaching an anisotropic conductive film according to the present invention includes a step of attaching an anisotropic conductive film to an outer lead in a subsequent manner after bonding an inner lead of a substrate on which a unit electrode pattern is continuously formed in parallel on a film. The effect of minimizing the loss of the conductive film can be obtained. The device of the present invention proposed to apply the method of the present invention has a module for attaching an anisotropic conductive film to an internal lead bonding device of a substrate for connecting an existing LCD panel electrode, thereby reducing process size and size reduction. To get it.

Description

Method for attaching anisotropic conductive film for electrode connection of LCD panel and its device

1 is a schematic cross-sectional view showing the electrode connection structure of the LCD panel.

2 is a manufacturing process diagram of a substrate to which an anisotropic conductive film attaching method for electrode connection of an LCD panel according to the present invention is applied.

3 is a schematic configuration diagram showing an internal lead bonding apparatus for an electrode connection substrate of an LCD panel according to the present invention.

* Explanation of symbols for main parts of the drawings

30 substrate 31 first reel

32: second reel 33: internal lead bonding

34: resin encapsulation 100: module with anisotropic conductive film

101: anisotropic conductive film 102: protective paper

110: supply reel 120: winding reel

130: support 140: crimping head

The present invention relates to an anisotropic conductive film attaching method and apparatus for connecting a panel electrode of a liquid crystal display, and more particularly, to a signal input terminal formed on a panel of an LCD and an output terminal of a substrate on which a drive drive chip is mounted. The present invention relates to a method for attaching an anisotropic conductive film interposed therebetween and an apparatus therefor.

In general, as shown in FIG. 1, the liquid crystal display (hereinafter, LCD) has a predetermined pattern of electrode portions, that is, signal input terminals 12, formed on the panel 11, and the driving drive IC chip 23 An outer lead of the mounted substrate 21, that is, the output terminal 22 is mechanically and electrically connected to the signal input terminal 12. The electrode connection of the LCD panel, as shown in the drawing, an anisotropic conductive film (ACF) 10 in which conductive particles are dispersed in a thermoplastic resin, is typically disposed between the input terminal 12 and the output terminal 22. It is made by thermocompression bonding in the interposed state.

As described above, a method for attaching an anisotropic conductive film to interconnect the signal input / output terminals of the LCD panel, which is conventionally anisotropic conductive film (directly connected to the signal input terminal 12 of the LCD panel 11 using a separate device). 10) was attached by thermocompression bonding. In this state, after the inner lead and the IC chip 23 are bonded, the outer lead bonding operation in the state where the outer lead of the resin-encapsulated substrate 21, that is, the output terminal 22 is aligned on the anisotropic conductive film 10, is performed. The electrode connection of the LCD panel is made by this.

However, in the conventional method for attaching an anisotropic conductive film for electrode connection of a conventional LCD panel as described above, a separate device for attaching an anisotropic conductive film must be provided, thereby increasing manufacturing cost and manufacturing by adding a process and an apparatus. There were disadvantages such as increased lead time. In addition, since the anisotropic conductive film is directly attached to the electrode of the LCD panel, the anisotropic conductive film is also attached to the portions other than the actual signal input / output terminal connections, so that the loss is large, and when an error occurs at the attachment position, it is difficult to recover or correct it. .

Therefore, the present invention was created in view of the problems of the anisotropic conductive film attachment method for the electrode connection of the conventional LCD panel as described above to improve this, the present invention can shorten the process, minimize the loss of the anisotropic conductive film An object of the present invention is to provide a method for attaching an anisotropic conductive film for connecting electrodes of LCD panels.

In order to achieve the above object, an anisotropic conductive film attaching method for electrode connection of an LCD panel according to the present invention,

Supplying a substrate in which unit electrode patterns are continuously formed in parallel on the film, and simultaneously bonding the inner leads and the driving drive chips of the unit electrode patterns to resin encapsulation;

And attaching an anisotropic conductive film to the outer lead of each unit electrode pattern.

In addition, another object of the present invention is to provide a device suitable for achieving the above object, the device according to the present invention is provided with a module for attaching an anisotropic conductive film to the outer lead of the substrate connected to the electrode portion of the LCD panel It is to provide an internal lead bonding device for a substrate for electrode connection of an LCD panel.

In order to achieve the above another object, the internal lead bonding apparatus of the substrate for electrode connection of the LCD panel according to the present invention,

A first reel for winding the substrate on the film, in which the unit electrode pattern formation is continuously performed in parallel, in a roll state and continuously feeding it to a predetermined position; and a second reel for winding the substrate on the film continuously fed from the supply roll. An internal lead bonding apparatus for a substrate for electrode connection of an LCD panel, wherein the internal lead bonding and resin encapsulation of the substrate are performed between the first reel and the second reel.

A module for attaching an anisotropic conductive film to an outer lead of each unit electrode pattern of the substrate is provided between the first reel and the second reel.

In the internal lead bonding apparatus of the substrate for electrode connection of the LCD panel according to the present invention, in particular, the module with the anisotropic conductive film is attached to the protective paper driven to supply the continuous anisotropic conductive film wound in a roll state onto the substrate continuously And a winding reel driven to wind the protective paper in which the anisotropic conductive film is separated, a bed supporting the substrate between the supply reel and the winding reel, and the anisotropic conductive film directly above the bed. It is preferable that a compression head for thermal compression is included.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a manufacturing process diagram of a substrate to which an anisotropic conductive film attaching method for electrode connection of an LCD panel according to the present invention is applied.

In the method of attaching the anisotropic conductive film for the electrode connection of the LCD panel according to the present invention, unlike the conventional method of attaching the anisotropic conductive film directly to the LCD panel, the electrode pattern is completed film by the manufacturing process shown in FIG. The anisotropic conductive film is attached directly to the drive of the substrate on the substrate.

Referring to FIG. 2, the process of manufacturing a substrate on a film for applying the anisotropic conductive film attachment method according to the present invention will be described as follows.

First, a separation hole etc. are formed in the base film 1, such as polyamide, through the punching operation | work 2, and copper foil lamination 3 is performed. Subsequently, the copper foil of the portion made in the exposure 4a and the development process 4b through the etching process 5 through the exposure 4a and the development process 4b so as to form the electrode wire of a desired shape by pretreatment and the photoresist coating. Remove the laminating part. Next, a stripping process of removing the applied photoresist film is carried out to obtain a copper foil laminated portion made of a desired electrode pattern. Thereafter, in order to increase the electrical conductivity of the electrode pattern line formed of the copper foil, plating (6) is performed using gold, silver, solder, or the like, and the unit electrode patterns are successively completed in parallel on the substrate on the film.

As described above, the driving drive chip is placed on each of the unit electrode patterns while the substrate on the film in which the unit electrode patterns are continuously and parallelly wound is rolled on the reel, and the bonding with the inner lead is carried out. And the vertical encapsulation 8 work.

The above substrate manufacturing process (dotted region in the drawing) is the same as the conventional substrate manufacturing process, the method of attaching the anisotropic conductive film for electrode connection of the LCD panel according to the present invention is the internal lead bonding operation following the above process The anisotropic conductive film is attached to the outer lead of the substrate on the completed film. That is, the method of attaching the anisotropic conductive film for the electrode connection of the LCD panel according to the present invention is performed in sequence with the existing substrate internal lead bonding process, and is easily performed by the apparatus as shown in FIG. can do.

3 is a schematic configuration diagram showing an internal lead bonding apparatus for an electrode connection substrate of an LCD panel according to the present invention.

Referring to FIG. 3, the internal lead bonding apparatus of the substrate for electrode connection of the LCD panel according to the present invention, as shown, the substrate 30 on the film on which the unit electrode patterns are continuously formed in parallel and in a roll state A first reel 31 for supporting and continuously feeding to a predetermined position, a second reel 32 for winding the substrate 30 on the film that is continuously supplied from the first reel 31, and the first An anisotropic conductive film attachment module 100 provided between the reel 31 and the second reel 32 to attach the anisotropic conductive film 101 to an outer lead of each unit electrode pattern of the substrate 30. It is composed.

In the above configuration, the internal lead bonding operation 33 and the resin encapsulation operation 34 of the substrate 30 which are usually performed between the first reel 31 and the module 100 with anisotropic conductive film are performed. It is to be done.

On the other hand, the anisotropic conductive film attachment module 100 is a component that characterizes the present invention, continuous supply of the anisotropic conductive film 101 attached to the protective paper 102 wound in a rolled state over a predetermined section of the substrate 30 The supply reel 110 is driven to the winding, the winding reel 120 is driven to wind the protective paper 102 separated from the anisotropic conductive film 101, the supply reel 110 and the winding reel 120 A support member 130 provided below the substrate 30 so as to be able to move up and down between the support member 130 and the support paper 130 at a position corresponding to the support member 130. It comprises a compression head 140 for thermocompression bonding to the outer lead of the substrate 30.

The internal lead bonding apparatus of the electrode connection board | substrate of the LCD panel by this invention of the said structure is provided to the said 1st reel 31 by the drive of the said 1st reel 31 and the said 2nd reel 32. FIG. The substrate 30 on the film wound in the rolled state is continuously transferred to the second reel 32. At this time, the substrate 30 is transferred by step driving to repeat the stop and move after moving a predetermined pitch, for example, through a transfer position sensing operation by a sensor. As described above, the bonding operation 33 and resin encapsulation of a conventional inner lead are performed between the first reel 31 and the anisotropic conductive film attachment module 100 while the substrate 30 is transferred by step driving. Operation 34 is made. In the drawings, reference numeral 30a denotes a substrate in which internal lead bonding and resin encapsulation are completed on the substrate 30 on the film on which the electrode pattern is completed.

As described above, the substrate 30a in which the inner lead bonding and the resin encapsulation are completed in a predetermined section passes through the anisotropic conductive film attaching module 100, and the anisotropic conductive film 101 is attached to the outer lead.

Here, look at the action of the anisotropic conductive film attachment module 100 as follows.

The anisotropic conductive film 101 is a structure detachable by being bonded to the protective paper 102, is wound in a roll state on the supply reel (110). In this rolled state, the anisotropic conductive film 101 is driven from the supply reel 110 to the winding reel 120 by being bonded to the protective paper 102 by driving the supply reel 110 and the winding reel 120. Conveyed continuously. At this time, the anisotropic conductive film 101 is conveyed by step driving to repeat the stop and advance after moving a predetermined pitch so as to be linked with the transfer operation of the substrate 30 through a transfer position sensing operation by a sensor, for example. . Therefore, when the anisotropic conductive film 101 is stopped along with the substrate 30 directly above, the crimping head 140 is lowered by, for example, a sensor or the like, so that the anisotropic conductive film 101 and the anisotropic conductive film 101 are lowered. A certain section of the protective paper 102 is thermocompressed with respect to a certain section of the substrate 30. Thus, the anisotropic conductive film 101 is separated from the protective paper 102 and attached to the outer lead of the substrate 101. At this time, the support 130 is raised in conjunction with the downward movement of the compression head 140, thereby supporting the substrate 30 in the upward direction. The operation of the support 130 is to prevent the substrate 30 from bending due to the thermocompression of the crimping head 140, and at the same time, the thermocompression can be efficiently performed. After the anisotropic conductive film 101 is attached to the outer lead of the substrate 30 as described above, the protective paper 102 separated therefrom is wound in the rolled state again on the winding reel 120. In the drawing, reference numeral 30b denotes a substrate in which an anisotropic conductive film 101 is attached to an outer lead of the substrate 30a, and is wound again in a roll state by the second reel 32.

As described above, the method for attaching the anisotropic conductive film according to the present invention includes sequentially attaching the anisotropic conductive film to the outer lead following the inner lead bonding process of the substrate on which the unit electrode patterns are continuously formed in parallel on the film. By doing so, the effect of shortening the process and minimizing the loss of the anisotropic conductive film can be obtained. The device of the present invention proposed to apply the method of the present invention has a module for attaching an anisotropic conductive film to an internal lead bonding device of a substrate for connecting an existing LCD panel electrode, thereby reducing process size and size reduction. To get it.

Claims (3)

Supplying a substrate in which unit electrode patterns are continuously formed in parallel on the film, and simultaneously bonding the inner leads and the driving drive chips of the unit electrode patterns to resin encapsulation; Attaching an anisotropic conductive film to the outer lead of each unit electrode pattern; and sequentially attaching the anisotropic conductive film for the electrode connection of the LCD panel. A first reel for winding the substrate on the film in which the unit electrode pattern formation is successively completed in parallel in a roll state and continuously supplying it to a predetermined position; and a second reel for winding the substrate on the film continuously supplied from the first reel An internal lead bonding apparatus for an electrode connecting substrate of an LCD panel, wherein the internal lead bonding and resin encapsulation of the substrate are performed between the first reel and the second reel. An anisotropic conductive film attachment module 100 for attaching an anisotropic conductive film to an outer lead of each unit electrode pattern of the substrate 30 is provided between the two reels 32. Internal lead bonding device. The method of claim 2, wherein the anisotropic conductive film attaching module 100, the supply reel is driven to continuously supply the anisotropic conductive film 101 attached to the protective paper 102 rolled in a rolled state over the substrate (30) 110, a winding reel 120 driven to wind the protective paper 102 from which the anisotropic conductive film 101 is separated, and below the substrate between the supply reel 110 and the winding reel 120. A support 130 provided to be movable up and down, and a pressing head 14 provided to be capable of lifting up and down on the anisotropic conductive film at a position corresponding to the support to thermo-compress the anisotropic conductive film to an outer lead of the substrate. The internal lead bonding apparatus of the board | substrate for electrode connection of an LCD panel characterized by the above-mentioned.