JP2002026540A - Manufacturing method of electronic component and electronic component manufactured by the manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component which is made thin at a low manufacturing cost. SOLUTION: The manufacturing method of an electronic component has a first process to a third process. In the first process, an FFC 3 with a wiring pattern 11 up is mounted on an anvil 23, a covered electric wire 5 is mounted on an upper part pf the wiring pattern 11, an upper cover 7 formed of an insulation material with a recessed groove 25 is mounted on an upper part of the covered electric wire 5 and the covered electric wire 5 is brought into contact with an inside of the recessed groove 25. In the second process, a horn 27 of an ultrasonic wave generator device 21 is moved down and the upper cover 7 is pressed, and the covered electric wire 5 is held inside the recessed groove 25. In the third process, ultrasonic vibration is applied to the pressed upper cover 7, the covered electric wire 5 and the FFC 3, a core 15 and the wiring pattern 11 are adhered, an inner wall surface of the recessed groove 25 and an upper surface of the covered film 17 age welded, a lower surface of the upper cover 7 and a base 9 are welded, and an integral electronic component is completed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component and an electronic component manufactured by the method. More specifically, the present invention relates to a method of manufacturing a flat flexible electric wire covered with a coating film made of an insulating material. The present invention relates to a method of manufacturing an electronic component formed by adhering to a thin conductor formed on a wiring member, and an electronic component manufactured by the manufacturing method.

[0002]

2. Description of the Related Art In recent years, electronic devices tend to be miniaturized. Generally, electrical connections of electronic components built in the miniaturized electronic devices are made by connecting lead wires to connection terminals provided on the electronic components. Are connected by soldering, and a cover made of an insulating material is attached to the connection portion. In this case, since the electric wire is coated with a coating film made of an insulating material, the coating film is removed when connecting the electric wire to the connection terminal.

[0003]

However, in the connection operation for connecting the electric wire to the electronic component, it is necessary to remove the coating film for removing the coating film of the electric wire, and the production of the electronic component formed by connecting the electric wire is required. There is a problem that the process is increased and the manufacturing cost of the electronic component is increased.

The present invention has been made in view of such a problem, and a method of manufacturing an electronic component for reducing the manufacturing cost of a connecting operation for connecting an electric wire to the electronic component and an electronic component manufactured by the manufacturing method are provided. The purpose is to provide.

[0005]

In order to solve the above-mentioned problems, a method of manufacturing an electronic component according to the present invention is directed to a flat flexible wiring member provided with a thin conductor and an electric wire having a coating on a center conductor. (E.g., the covered electric wire 5 in the embodiment) is disposed in an overlapping manner, and these are sandwiched while being pressed by a horn and an anvil of an ultrasonic wave applying means (e.g., the ultrasonic wave generator 21 in the embodiment). A method of manufacturing an electric wire assembly for producing an electric wire assembly in which vibration is imparted and a center conductor of the electric wire is bonded to a thin conductor, wherein a flexible wiring member and an electric wire are superposed and arranged on an anvil, Further, an upper cover member made of an insulating material having a concave groove (for example, the upper cover 7 in the embodiment) is disposed so as to overlap the electric wire, and the first step in which the electric wire is positioned in the concave groove, Push the member to the wire side A second step of holding the electric wire in the groove and holding the upper cover member, the electric wire and the flexible wiring member between the horn and the anvil while pressing the upper cover member, the electric wire and the flexible wiring member. Ultrasonic vibration is applied to the upper cover member, the electric wire and the flexible wiring member by the ultrasonic wave applying means in a state where the upper cover member is melted to adhere the center conductor to the thin conductor, A third step of welding the upper cover member and the flexible wiring member.

According to the method of manufacturing an electronic component having the above structure,
In the first step, the flexible wiring member and the electric wire are arranged in an overlapping manner, and an upper cover member made of an insulating material having a concave groove is arranged in an overlapping manner on the electric wire, and the electric wire is positioned in the concave groove.
Then, in the second step, the upper cover member is pressed toward the electric wire by the horn to hold the electric wire in the concave groove, and the upper cover member, the electric wire, and the flexible wiring member are sandwiched between the horn and the anvil while being pressed. Further, in the third step, ultrasonic vibration is applied to the upper cover member, the electric wire and the flexible wiring member in a state where the upper cover member, the electric wire and the flexible wiring member are pressed by the horn and the anvil, so that the coating is melted to form the central conductor. Is bonded to the thin conductor, and the upper cover member and the covering and the upper cover member and the flexible wiring member are welded.

[0007] As described above, the flexible wiring member and the electric wire covered with the coating made of the insulating material are superposed and arranged, and the electric wire is placed in the groove of the upper cover member made of the insulating material provided with the groove. By positioning and applying ultrasonic vibration to the flexible wiring member and the wire while pressing them, the center conductor can be connected to the thin conductor without removing the coating in advance, and the coating removal work becomes unnecessary. The manufacturing cost of parts can be reduced. Further, since the upper cover member and the electric wire, and the upper cover member and the flexible wiring member are welded and fixed, the bonding portion between the center conductor and the thin conductor is bonded and fixed without using solder. In comparison with the present invention, it is possible to eliminate the raised portion of solder, to reduce the thickness of electronic components to be manufactured, and to facilitate electrical connection of electronic components housed in miniaturized electronic devices. Can be.

Further, in the method of manufacturing an electronic component according to the present invention, a flat flexible wiring member having a thin conductor disposed thereon and an electric wire having a coating on a central conductor are superposed and disposed. A method for manufacturing an electric wire assembly, comprising: applying an ultrasonic vibration while sandwiching the horn and the anvil of a sound wave applying means while pressing the horn and an anvil, and bonding a central conductor of the electric wire to the thin conductor. The lower cover member (for example, the lower cover 35 in the embodiment) is placed on the anvil, the flexible wiring member and the electric wire are arranged on the lower cover member so as to be overlapped, and furthermore, the lower cover member is made of an insulating material having a concave groove. A first step of disposing the upper cover member on the electric wire so that the electric wire is located in the concave groove; and pressing the upper cover member toward the electric wire side by the horn to hold the electric wire in the concave groove, and the horn and the anvil. Between upper cover member, electric wire, flexible A second step of holding the wiring member and the lower cover member while pressing the upper cover member, the electric wire, the flexible wiring member and the lower cover member while the upper cover member, the electric wire, and the flexible wiring member are pressed by the ultrasonic wave applying means; Applying ultrasonic vibration to the member and the lower cover member, melting the coating and bonding the center conductor to the thin conductor,
And a third step of welding the upper cover member and the cover, the upper cover member and the flexible wiring member, and the flexible wiring member and the lower cover member.

According to the method of manufacturing an electronic component having the above structure,
By the first step, the lower cover member is placed on the anvil,
The flexible wiring member and the electric wire are superposed on the lower cover member, and an upper cover member made of an insulating material having a concave groove is superposed on the electric wire, and the electric wire is positioned in the concave groove.
In the second step, the horn presses the upper cover member toward the electric wire to hold the electric wire in the groove, and presses the upper cover member, the electric wire, the flexible wiring member, and the lower cover member between the horn and the anvil. With a pinch. Furthermore, the third
In the process, the upper cover member, the electric wire, the flexible wiring member, and the lower cover member are subjected to ultrasonic vibration by the ultrasonic applying means in a state where the upper cover member, the electric wire, the flexible wiring member, and the lower cover member are pressed, and the coating is melted. Then, the center conductor is bonded to the thin conductor, and the upper cover member and the cover are welded, and the upper cover member and the flexible wiring member, and the flexible wiring member and the lower cover member are welded.

As described above, the flexible wiring member is placed on the lower cover member, and the flexible wiring member and the electric wire covered with the coating made of the insulating material are superposed and arranged, and the electric wire is provided with the concave groove. The upper cover member, the electric wire, the flexible wiring member, and the upper cover member, the electric wire, the flexible wiring member, and the lower cover member are pressed by the ultrasonic wave applying means while being positioned in the concave groove of the insulating material upper cover member. By applying ultrasonic vibration to the lower cover member, in the manufacture of an electric wire assembly having a lower cover member below the flexible wiring member, the center conductor can be connected to the thin conductor without previously removing the coating, The coating removing operation is not required, and the manufacturing cost of the electronic component can be reduced.

Further, the electronic component of the present invention is provided by superposing a flexible wiring member and an electric wire between a horn and an anvil of an ultrasonic wave applying means having a horn and an anvil, and further comprising an insulating material having a concave groove. The upper cover member is arranged so that the electric wire is located in the concave groove, the upper cover member is pressed toward the electric wire side by the horn to hold the electric wire in the concave groove, and the upper cover member between the horn and the anvil, Ultrasonic vibration is applied to the upper cover member, the electric wire and the flexible wiring member by the ultrasonic wave applying means in a state where the electric wire and the flexible wiring member are pressed, the coating is melted, and the center conductor is bonded to the thin conductor,
The upper cover member and the cover, and the upper cover member and the flexible wiring member are welded and integrated.

According to the electronic component having the above-described structure, the flexible wiring member and the electric wire are overlapped and arranged, and the electric wire is positioned in the concave groove of the insulating material upper cover member provided with the concave groove. Ultrasonic vibration is applied to the wiring member and the electric wire while pressing them, the coating is melted, the center conductor is adhered to the thin conductor, and the upper cover member and the coating, and the upper cover member and the flexible wiring member are welded and integrated. The electric wire assembly is manufactured by the changing manufacturing method.

As described above, by welding the electric wire to the flexible wiring member using the ultrasonic vibration, the center conductor can be connected to the thin conductor without previously removing the coating, and the manufacturing cost is reduced. The cost of electronic components can be reduced. Further, since the upper cover member and the electric wire, and the upper cover member and the flexible wiring member are welded and fixed, the bonding portion between the center conductor and the thin conductor is bonded and fixed without using solder. In comparison with the present invention, it is possible to eliminate the raised portion of solder, to reduce the thickness of electronic components to be manufactured, and to facilitate electrical connection of electronic components housed in miniaturized electronic devices. Can be.

In the electronic component of the present invention, the lower cover member is placed on the anvil of the ultrasonic wave applying means having the horn and the anvil, and the flexible wiring member and the electric wire are arranged on the lower cover member so as to overlap each other. Further, an upper cover member made of an insulating material having a concave groove is disposed so that the electric wire is located in the concave groove, and the horn presses the upper cover member toward the electric wire to hold the electric wire in the concave groove, Ultrasonic vibration is applied to the upper cover member, the electric wire, the flexible wiring member, and the lower cover member by an ultrasonic applying means in a state where the upper cover member, the electric wire, the flexible wiring member, and the lower cover member are pressed between the horn and the anvil, and the coating is performed. The central conductor is bonded to the thin conductor by melting, and the upper cover member and the cover, the upper cover member and the flexible wiring member, and the flexible wiring member and the lower cover member are welded and integrated.

According to the electronic component having the above-described structure, the flexible wiring member and the electric wire are disposed so as to overlap with each other, and the electric wire is positioned in the concave groove of the insulating material-made upper cover member provided with the concave groove. Ultrasonic vibration is applied to the cover member, the electric wire, the flexible wiring member and the lower cover member in a state where they are pressed, the coating is melted, and the center conductor is bonded to the thin conductor,
An electronic component is manufactured by a manufacturing method in which the upper cover member and the cover, the upper cover member and the flexible wiring member, and the flexible wiring member and the lower cover member are welded and integrated.

As described above, by disposing the lower cover member below the flexible wiring member and bonding the electric wire to the flexible wiring member by ultrasonic vibration, the center conductor can be formed into a thin conductor without previously removing the coating. The connection can be made and the connection portion is reinforced, so that the manufacturing cost of the electronic component having the lower cover member is reduced, the cost of the electronic component is reduced, and a stable connection state can be maintained.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to FIGS. In the present embodiment, a flat flexible wiring member (hereinafter, “FFC”) on which a thin conductor (hereinafter, referred to as “wiring pattern”) is disposed.
It is written. 2) shows an embodiment of an electronic component formed by welding an electric wire covered with a coating film made of an insulating material (hereinafter referred to as “coated electric wire”).

[0018]

First Embodiment A first embodiment of a method for manufacturing an electronic component according to the present invention will be described with reference to FIGS. First, before describing a method of manufacturing an electronic component according to the present invention, an electronic component manufactured by this manufacturing method will be described. As shown in FIG. 1, the electronic component 1 has an FFC 3, a covered electric wire 5, and an upper cover from the bottom side to the upper side.
7. The FFC 3 has a flexible and plate-shaped base 9 made of an insulating material, and a wiring pattern 11 is formed on the base 9. The rear end side (the right side in FIG. 1) of the wiring pattern 11 is covered with a coating film 13 made of an insulating material, and the front end side of the wiring pattern 11 (the left side in FIG. 1).
Is in a state without the coat film 13. A rod-shaped central conductor (hereinafter, referred to as a “core wire”) 15 made of a conductive material and extending in the left-right direction is welded to an upper portion of the wiring pattern 11 on the tip side of the base 9. The core wire 15 is obtained by twisting a plurality of fine wires 15a. Core wire 1 welded to wiring pattern 11
A coating film 17 made of an insulating material is welded around 5.
An upper cover 7 extending in the left-right direction in a sectional view is welded to an upper portion of the coating film 17 on the front end side of the base 9. The upper cover 7, the covered electric wire 5, and the FFC 3 form the electronic component 1 integrally.

Next, a method of manufacturing the electronic component 1 according to the first embodiment of the present invention will be described. This manufacturing method is the first
It is configured to have a third to third steps. In the first step, as shown in FIG. 2A, the FFC in which the wiring pattern 11 is directed upward on the anvil 23 of the ultrasonic generator 21 is used.
3, the covered electric wire 5 is placed on the wiring pattern 11 exposed to the outside, and the upper cover 7 made of an insulating material having a concave groove 25 is placed on the covered electric wire 5. The covered wire 5 is positioned by bringing the top of the wire 5 into contact with the top of the groove 25.

In the second step, as shown in FIG. 2 (b), the horn 27 of the ultrasonic generator 21 is moved downward so that its lower end surface is brought into contact with the upper surface of the upper cover 7 so as to be pressed. Groove 2
5 holds the covered electric wire 5. As a result, horn 27
Cover 7, insulated wire 5 and FFC between
3 is held in a pressed state.

In the third step, as shown in FIG. 2C and FIG. 2D, the ultrasonic wave generator 2 is operated in a state where the upper cover 7, the covered electric wire 5 and the FFC 3 are pressed by the horn 27.
Activate the ultrasonic generator 29 provided in the horn 2
Ultrasonic vibration is applied to the upper cover 27, the covered electric wire 5, and the FFC 3 via the. When the ultrasonic vibration is transmitted to the covered electric wire 5 and the FFC 3 as shown in FIG.
The coating film 17 of the covered electric wire 5 in contact with 1 is melted, deformed so as to be crushed by the pressing force from the horn 27, and the core wire 15 and the wiring pattern 11 come into contact.

Then, as shown in FIG. 2D, the covered electric wire 5 is further deformed into a flat plate shape, and the thin wires 15a of the core wire 15 are brought into contact with the upper part of the wiring pattern 11 in a state of being arranged horizontally. At the same time, the upper cover 7 moves downward, and its lower end portion contacts the upper surface of the base 9 of the FFC 3. In such a state, the ultrasonic vibration is applied to the core wire 15 and the wiring pattern 1.
1, the lower part of the core wire 15 and the upper part of the wiring pattern 11 are melted and adhered. When the ultrasonic vibration is transmitted to the upper cover 7 and the coated electric wire 5, the inner wall surface of the concave groove 25 in contact with the coating film 17 and the upper surface of the coating film 17 are melted and deformed, and these are adhered. . Further, when the ultrasonic vibration is transmitted to the upper cover 7 and the base 9, the lower surface of the upper cover 7 and the FFC
The bases 9 of 3 melt and they are welded. And
The upper cover 7, the covered electric wire 5, and the FFC 3 are integrated, and the electronic component 1 shown in FIG. 1 is completed.

When the ultrasonic vibration is applied to the FFC 3 and the coated electric wire 5 in a state where they are pressed, the coating film 17
The core wire 15 can be connected to the wiring pattern 11 without previously removing the wiring. In addition, since connection can be achieved without using solder, there is no increase in the thickness of the connection portion due to the swelling of the solder, and the thickness of the manufactured electronic component 1 can be reduced.

[0024]

Second Embodiment Next, a second embodiment of the method for manufacturing an electric wire assembly according to the present invention will be described with reference to FIGS. In the second embodiment, only differences from the first embodiment will be described, and the same parts as those in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted. First, before describing a method for manufacturing an electronic component according to the second embodiment, an electric wire assembly (hereinafter, referred to as “electronic component”) manufactured by this manufacturing method will be described. As shown in FIG. 3, the electronic component 33 has a plate-shaped lower cover 35 made of an insulating material welded to a lower portion of the base 9 of the FFC 3, and the upper cover 7, the covered electric wire 5, the FFC 3 and the lower cover 35 are integrated. Thus, the electronic component 33 is formed.

Next, a method of manufacturing the electronic component 33 according to the second embodiment of the present invention will be described. This manufacturing method includes a first step to a third step. In the first step, as shown in FIG. 4A, the lower cover 35 is placed on the anvil 23 of the ultrasonic generator 21 and the FFC 3 with the wiring pattern 11 facing upward is placed on the lower cover 35. And
The covered electric wire 5 is placed on the upper part of the wiring pattern 11 exposed to the outside, and the upper cover 7 made of an insulating material having the concave groove 25 is placed on the upper part of the covered electric wire 5 so that the top of the covered electric wire 5 is concave. Groove 2
The insulated wire 5 is positioned in contact with the top of the wire 5.

In the second step, as shown in FIG. 4 (b), the horn 27 of the ultrasonic generator 21 is moved downward so that its lower end surface is brought into contact with the upper surface of the upper cover 7 to be pressed, and Groove 2
5 holds the covered electric wire 5. As a result, horn 27
Cover 7, covered wire 5, FFC 3 between
The lower cover 35 is held in a pressed state.

In the third step, as shown in FIGS. 4C and 4D, the upper cover 27, the covered electric wire 5, the FFC 3 and the lower cover 35 are pressed by the horn 27 and the anvil 23, and The ultrasonic generator 29 provided in the sound wave generator 21 is operated to apply ultrasonic vibration to the upper cover 7, the covered electric wire 5, the FFC 3 and the lower cover 35 via the horn 27. As shown in FIG. 3C, when the ultrasonic vibration is transmitted to the upper cover 7, the covered electric wire 5, the FFC 3, and the lower cover 35, the covering film 17 which is in contact with the wiring pattern 11 is melted and the core wire 15 is formed. The wiring pattern 11 comes into contact with the
Is deformed, and the fine wires 15a of the core wire 15 contact the upper portion of the wiring pattern 11 in a state of being arranged in a horizontal direction, and the core wire 15 and the upper portion of the wiring pattern 11 are melted and adhered. Further, the upper cover 7 moves downward, and its lower end portion abuts on the upper surface of the base 9 of the FFC 3, and these are melted and bonded. Further, the inner wall surface of the groove 25 in contact with the coating film 17 of the coated electric wire 5 and the upper surface of the coating film 17 are melted and deformed, and these are adhered. When the ultrasonic vibration is transmitted to the FFC 3 and the lower cover 35, the lower surface of the FFC 3 and the lower
The top surfaces of 5 melt and they adhere. Then, the upper cover 7, the covered electric wire 5, the FFC 3, and the lower cover 35 are integrated, and the electronic component 33 shown in FIG. 3 is completed.

As described above, the lower cover 3 is provided below the FFC 3.
In the electronic component 33 having the 5, by applying ultrasonic vibration to the FFC 3 and the coated electric wire 5 while pressing them, the core wire 15 can be connected to the wiring pattern 11 without previously removing the coating film 17. .

In the first embodiment described above,
The upper cover 7 shown in FIG. 2A has a concave groove 25, and the lower cover 35 shown in FIG. 4A has a flat upper surface in the second embodiment. The present invention is not limited to this. As shown in FIGS. 5A and 5B, a recess 42 is provided in the protrusion 41 between the grooves 25 of the upper cover 7, and the lower cover 35 is opposed to the protrusion 41 of the upper cover 7. The lower concave groove 43 is provided to face the lower concave groove 43, and the lower concave groove 43 can be provided with a step portion 45 disposed to face the concave portion 42 of the upper cover 7. FIG. 5B is a cross-sectional view of a portion corresponding to the arrows AA and BB in FIG. 5A. The recess 42 and the step 45
5B and 5C, when the insulated wire 5 and the FFC 3 are sandwiched between the upper cover 7 and the lower cover 35 while being pressed, as shown in FIGS. The covered electric wire 5 sandwiched between the and the step portion 45 can be bonded to the wiring pattern 11, and the bonded portion is formed in a step shape.

As described above, by sandwiching the insulated wire 5 and the FFC 3 between the concave portion 42 and the step portion 45, it is possible to increase the bonding area of the bonding portion, thereby increasing the bonding strength.

In the above-described embodiment, the FF
C3 shows an example in which the wiring pattern 11 is exposed,
The present invention is not limited to this, and a thin conductor covered with a cover film may be used. Even in this case, the cover film and the coating film 17 are in contact with each other by the ultrasonic vibration, and
And the thin conductor can be bonded to each other. Also FFC3
May be a flexible printed circuit board (generally called an FPC).

[0032]

According to the method of manufacturing an electronic component according to the present invention, a flexible wiring member and an electric wire having a coating on a central conductor are overlapped on a flat wiring pattern on which a thin conductor is provided, and Is positioned in the groove of the upper cover member made of an insulating material provided with the groove, and by applying ultrasonic vibration to the flexible wiring member and the wire in a state where the wire is pressed, without removing the coating in advance. Since the center conductor can be connected to the thin conductor, the operation of removing the coating film becomes unnecessary, and the manufacturing cost of the electronic component can be reduced. Also,
Since the connection portion is bonded and fixed without using solder, there is no swelling of the solder, the thickness of the manufactured electronic component can be reduced, and the electronic component accommodated in the miniaturized electronic device can be manufactured. Electrical connection can be facilitated.

According to the electronic component manufacturing method of the present invention, the lower cover member and the flexible wiring member provided with the thin conductor are overlapped, and the flexible wiring member and the electric wire are further overlapped and provided. An electric wire is positioned in the groove of the upper cover member made of an insulating material provided with the groove, and the upper cover member, the electric wire, the flexible wiring member, and the upper cover are pressed by the ultrasonic wave applying means in a state where the lower cover member is pressed. By applying ultrasonic vibration to the member, the electric wire, the flexible wiring member, and the lower cover member, in manufacturing an electric wire assembly having a lower cover member below the flexible wiring member, the center conductor is thinned without removing the coating in advance. Since it can be connected to a conductor, the work of removing the coating film becomes unnecessary, and the manufacturing cost of the electronic component can be reduced.

Further, according to the electronic component of the present invention, since the electric wire having the coating is bonded to the flexible wiring member by ultrasonic vibration, the electric wire can be electrically connected to the flexible wiring member without previously removing the coating. Thus, the manufacturing cost can be reduced and the cost of the electronic component can be reduced. Further, since no solder is used in the connection, the thickness of the manufactured electronic component can be reduced, and the electrical connection of the electronic component housed in the miniaturized electronic device can be facilitated. it can.

Further, according to the electronic component of the present invention, since the lower cover member is provided below the flexible wiring member and the electric wire is bonded to the flexible wiring member by ultrasonic vibration, the covering film is formed. The electric wire can be electrically connected to the flexible wiring member without being removed in advance, and the connection portion is reinforced, so that the manufacturing cost of the electronic component having the lower cover member is reduced, the cost of the electronic component is reduced, and the electronic component is stabilized. The connection state can be maintained.

[Brief description of the drawings]

FIG. 1 is a sectional view of a manufactured electronic component according to a first embodiment of the present invention.

FIG. 2 shows a method for manufacturing an electronic component according to the first embodiment of the present invention.

FIG. 3 shows a sectional view of a manufactured electronic component according to a second embodiment of the present invention.

FIG. 4 shows a method for manufacturing an electronic component according to a second embodiment of the present invention.

FIG. 5 shows a method of manufacturing an electronic component according to the first and second embodiments of the present invention.

[Explanation of symbols]

 1,33 Electronic component 3 FFC (flexible wiring member) 5 Insulated wire (electric wire) 7 Upper cover (upper cover member) 9 Base 11 Wiring pattern (thin conductor) 15 Core wire (center conductor) 17 Coating film 21 Ultrasonic wave generation Apparatus (ultrasonic applying means) 23 Anvil 25 Groove 27 Horn 35 Lower cover (lower cover member)

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // B23K 101: 38 H01R 9/07 Z F term (Reference) 4E067 BF00 EA04 EB09 EC13 4E352 AA02 AA03 BB04 DD04 DR02 DR14 EE10 EE11 5E051 LA04 LB04 5E077 BB03 BB05 BB38 DD03 HH02 HH07 JJ20 5E085 BB01 BB05 CC03 DD04 FF08 HH11 JJ38

Claims (4)

[Claims] An ultrasonic vibration is applied by sandwiching a flat flexible wiring member on which a thin conductor is disposed and an electric wire having a coating on a center conductor between a horn and an anvil, and An electronic component manufacturing method for manufacturing an electronic component by bonding a conductor to the thin conductor, wherein the flexible wiring member and the electric wire are disposed on the anvil in an overlapping manner, and further have a concave groove. A first step of disposing an upper cover member made of an insulating material on the electric wire so that the electric wire is located in the concave groove; and pressing the upper cover member toward the electric wire side by the horn to form the concave portion. A second step of holding the electric wire in the groove and holding the upper cover member, the electric wire and the flexible wiring member in a pressed state between the horn and the anvil; and the upper cover member, the electric wire and the flexible member. Arrangement While the wire member is pressed by the horn and the anvil, ultrasonic vibration is applied to the upper cover member, the electric wire and the flexible wiring member to melt the coating and bond the center conductor to the thin conductor. And a third step of welding the upper cover member and the cover and the upper cover member and the flexible wiring member. 2. An ultrasonic vibration is applied by sandwiching a flat flexible wiring member provided with a thin conductor and an electric wire having a coating on a center conductor between a horn and an anvil, and applying the ultrasonic vibration to the center. An electronic component manufacturing method for manufacturing an electronic component by bonding a conductor to the thin conductor, wherein a lower cover member is placed on the anvil, and the flexible wiring member and the electric wire are mounted on the lower cover member. A first step in which an upper cover member made of an insulating material having a concave groove is further disposed on the electric wire so that the electric wire is positioned in the concave groove; and The upper cover member was pressed toward the electric wire side to hold the electric wire in the concave groove, and the upper cover member, the electric wire, the flexible wiring member, and the lower cover member were pressed between the horn and the anvil. Pinch in state Two strokes, applying ultrasonic vibration to the upper cover member, the electric wire, the flexible wiring member, and the lower cover member in a state where the upper cover member, the electric wire, the flexible wiring member, and the lower cover member are pressed. Melting the coating and bonding the center conductor to the thin conductor,
A method of manufacturing an electronic component, comprising: a third step of welding the upper cover member and the cover, the upper cover member and the flexible wiring member, and the flexible wiring member and the lower cover member. 3. An electronic component formed by bonding a flat flexible wiring member provided with a thin conductor and an electric wire having a coating on a center conductor, wherein the ultrasonic component has a horn and an anvil. The flexible wiring member and the electric wire are overlapped and disposed between the horn and the anvil of the means, and an upper cover member made of an insulating material having a concave groove is further disposed on the electric wire in the concave groove. Arranged so that the horn presses the upper cover member toward the electric wire to hold the electric wire in the concave groove, and the upper cover member, the electric wire, and the flexible wiring member between the horn and the anvil. In the state where is pressed, the ultrasonic applying means applies ultrasonic vibration to the upper cover member, the electric wire and the flexible wiring member to melt the coating, thereby changing the center conductor to the thin conductor. Adhered, the electronic component formed by integrating the upper cover member and the cover and the upper cover member and the flexible wiring member by welding. 4. An electronic component formed by bonding a flat flexible wiring member provided with a thin conductor and an electric wire having a coating on a center conductor, wherein the ultrasonic component has a horn and an anvil. A lower cover member is placed on the anvil of the means, and the flexible wiring member and the electric wire are disposed on the lower cover member so as to overlap with each other,
Further, an upper cover member made of an insulating material having a concave groove is disposed so that the electric wire is located in the concave groove, and the upper cover member is pressed toward the electric wire side by the horn to enter the concave groove. Holding the electric wire, the upper cover member, the electric wire, and the ultrasonic applying means in a state where the upper cover member, the electric wire, the flexible wiring member and the lower cover member are pressed between the horn and the anvil. Ultrasonic vibration is applied to the flexible wiring member and the lower cover member to melt the coating and adhere the center conductor to the thin conductor, and the upper cover member and the coating, the upper cover member and the flexible wiring member And an electronic component formed by welding and integrating the flexible wiring member and the lower cover member.