JP2002141660A - Method for connecting flexible printed board to each other - Google Patents

Method for connecting flexible printed board to each other

Info

Publication number
JP2002141660A
JP2002141660A JP2000332820A JP2000332820A JP2002141660A JP 2002141660 A JP2002141660 A JP 2002141660A JP 2000332820 A JP2000332820 A JP 2000332820A JP 2000332820 A JP2000332820 A JP 2000332820A JP 2002141660 A JP2002141660 A JP 2002141660A
Authority
JP
Japan
Prior art keywords
flexible printed
conductive material
printed circuit
fpc
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000332820A
Other languages
Japanese (ja)
Inventor
Ichiro Terunuma
一郎 照沼
Kazuya Akashi
一弥 明石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP2000332820A priority Critical patent/JP2002141660A/en
Publication of JP2002141660A publication Critical patent/JP2002141660A/en
Pending legal-status Critical Current

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  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for mutual connection between flexible printed boards which can reduce the manufacture cost by securely connecting terminals of the flexible printed boards to each other at low cost and suppressing a rise in the cost regarding the connection between the flexible printed boards. SOLUTION: Sheets, etc., constituting insulating films 15 and 25 as the bases of FPC's 10 and 20 are prepared and processed into a desired shape, etc. On the processed insulating films 15 and 25, wires 16 and 26 are formed and cover lays 17 and 27 are formed on the insulating films 17 and 27 and FPC's 10 and 20 except parts which become the terminal parts 11 and 21 to manufacture the FPC's 10 and 20. End surfaces 12 and 22 of the terminal parts 11 and 21 of the FPC's 10 and 20 thus manufactured are made to abut against each other to bring the wires 16 and 26 into contact with each other, and a conductive material 50 of copper foil is mounted across over those wires 16 and 26. Then electrodes 9a and 9b of a series welding device are made to abut against the top of the conductive material 50 on the terminals 11 and 21 in order, and series welding is carried out to join the conductive material 50 to the wires 16 and 26, so that the FPC's 10 and 20 are electrically and mechanically connected to each other.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、可撓性プリント
基板同士の接続方法に関し、特に、可撓性プリント基板
の端末同士を安価に、且つ確実に接続することができる
可撓性プリント基板同士の接続方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting flexible printed circuit boards, and more particularly, to a method of connecting terminals of flexible printed circuit boards inexpensively and reliably. Connection method.

【0002】[0002]

【従来の技術】近年、自動車等に用いられているワイヤ
ハーネスをできるだけ可撓性プリント基板(Flexible P
rinted Circuits:FPC)に代替しようとする動きが
活発になってきている。このような動きにより、例え
ば、図7に示すように、自動車等のダッシュボード30
0の内側に搭載された電子制御ユニット301や、ヒュ
ーズボックス302等を電気的に接続するためには、従
来の回路接続用ワイヤハーネス500に代えて、FPC
400をより多く使用することとなる。
2. Description of the Related Art In recent years, wire harnesses used in automobiles and the like have been used as much as
There is a growing movement to substitute rinted circuits (FPC). By such a movement, for example, as shown in FIG.
In order to electrically connect the electronic control unit 301, the fuse box 302, and the like mounted inside the FPC 0, instead of the conventional circuit connection wire harness 500, an FPC is used.
400 will be used more.

【0003】このような用途でFPCを使用する場合、
一般的には、例えば家電製品で用いられるFPCよりも
遥かにサイズの大きなFPCを使用することになる。通
常、FPCは金型で外形抜きをして製作されるため、そ
の大きさは所定のサイズに制約されているが、図7に示
すような従来の回路接続用ワイヤハーネス500に代え
て使用する場合は、現状の製造限界のFPCよりも更に
大きなサイズのFPCが必要となる。
When the FPC is used for such a purpose,
Generally, for example, an FPC that is much larger in size than an FPC used in home electric appliances will be used. Usually, the FPC is manufactured by punching out the outer shape with a die, and the size thereof is restricted to a predetermined size. However, the FPC is used instead of the conventional circuit connection wire harness 500 as shown in FIG. In such a case, an FPC having a size larger than the current production limit FPC is required.

【0004】この場合、図8に示すように、例えば、そ
れぞれ別々に製造したいくつかのFPC401〜404
やFPCハーネス405,406等をジョイントさせて
一つのFPC400を形成して使用するというような対
策が採られている。このように、FPC401〜404
同士やこれらFPC401〜404にFPCハーネス4
05,406等を接続するためには、専用の接続コネク
タ(図示せず)を使用してFPC401〜404及びF
PCハーネス405,406を接続する方法が一般的に
行われている。なお、専用のコネクタを用いずにFPC
同士を接続するために、例えば、FPCの端末同士をか
しめたり、はとめたりする方法も検討されてはいるが、
電気的接続信頼性や耐久性等の問題があり、未だ全面的
な実用化には時間がかかるようである。したがって、現
段階では、専用の接続コネクタによる接続に頼らざるを
得ない状況である。
In this case, as shown in FIG. 8, for example, several FPCs 401 to 404 manufactured separately are used.
And the FPC harnesses 405, 406 and the like are jointed to form one FPC 400 for use. Thus, the FPCs 401 to 404
FPC harness 4
05, 406, etc., using FPCs 401 to 404 and FPCs using a dedicated connector (not shown).
A method of connecting the PC harnesses 405 and 406 is generally performed. In addition, without using a special connector, FPC
In order to connect them, for example, a method of caulking or removing FPC terminals has been studied,
There are problems such as electrical connection reliability and durability, and it seems that it still takes time to put it into full practical use. Therefore, at this stage, it is necessary to rely on connection using a dedicated connection connector.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、このよ
うな専用の接続コネクタによるFPC同士の接続では、
図8に示すようなそれぞれのジョイント箇所毎に専用の
接続コネクタ(図示せず)がそれぞれ必要となるため、
FPC同士の接続に関するコストだけでも莫大なものと
なり、車載用FPC若しくはFPCハーネスの製造コス
トの増大を招くおそれがあるという問題がある。また、
仮にこのような専用の接続コネクタを用いない接続方法
を採用したとしても、未だに接続技術が確立されていな
いため、接続信頼性に欠けるおそれがあり、採用に踏み
切り難いという問題もある。
However, in connection between FPCs by such a dedicated connector,
Since a dedicated connection connector (not shown) is required for each joint as shown in FIG. 8,
There is a problem that the cost for connecting the FPCs alone becomes enormous, which may increase the manufacturing cost of the in-vehicle FPC or the FPC harness. Also,
Even if such a connection method that does not use the dedicated connection connector is adopted, there is a problem that the connection reliability may be lacked because the connection technology has not yet been established, and it is difficult to adopt the connection method.

【0006】この発明は、このような問題点に鑑みてな
されたもので、可撓性プリント基板の端末同士を安価
に、且つ確実に接続し、可撓性プリント基板同士の接続
に関するコストの上昇を抑え、製造コストを削減するこ
とができる可撓性プリント基板同士の接続方法を提供す
ることを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and inexpensively and securely connects terminals of a flexible printed circuit board, thereby increasing the cost of connecting the flexible printed circuit boards. It is an object of the present invention to provide a method for connecting flexible printed circuit boards, which can reduce the manufacturing cost.

【0007】[0007]

【課題を解決するための手段】この発明に係る可撓性プ
リント基板同士の接続方法は、絶縁フィルム上に導体配
線が形成されてなる可撓性プリント基板同士の接続方法
であって、一方の可撓性プリント基板の端末部の導体配
線と他方の可撓性プリント基板の端末部の導体配線とが
連続するように、それぞれの端末部の端面を衝合し、前
記両端末部の衝合部を跨ぐように前記両導体配線上に、
薄板又は箔状の導電材を載置し、それぞれの端末部の前
記載置した導電材の上側にプラス及びマイナス極性の電
極を当接させて前記可撓性プリント基板の膜厚方向に圧
力を加え、これら当接させた電極間に所定の電圧を印加
して前記両端末部の前記導電材と前記導体配線とを抵抗
溶接によりそれぞれ接合することを特徴とする。
A method for connecting flexible printed circuit boards according to the present invention is a method for connecting flexible printed circuit boards each having a conductor wiring formed on an insulating film. The end faces of the respective terminal portions are abutted so that the conductor wiring of the terminal portion of the flexible printed circuit board and the conductor wiring of the terminal portion of the other flexible printed circuit board are continuous, and the abutment of the two terminal portions is performed. On both conductor wiring so as to straddle the part,
A thin or foil-shaped conductive material is placed, and positive and negative electrodes are brought into contact with the upper side of the above-described conductive material at each end to apply pressure in the thickness direction of the flexible printed circuit board. In addition, a predetermined voltage is applied between the abutted electrodes, and the conductive material and the conductor wiring at the both end portions are respectively joined by resistance welding.

【0008】また、この発明に係る可撓性プリント基板
同士の接続方法は、絶縁フィルム上に導体配線が形成さ
れてなる可撓性プリント基板同士の接続方法であって、
一方の可撓性プリント基板の端末部の導体配線と他方の
可撓性プリント基板の端末部の導体配線とが連続するよ
うに、それぞれの端末部の端面を衝合し、前記両端末部
の衝合部を跨ぐように前記両導体配線上に半田を介して
薄板又は箔状の導電材を載置し、この載置した導電材の
上側に半田ごてを当接させ、この当接させた半田ごてを
加熱して前記半田を溶融し前記両端末部の前記導電材と
前記導体配線とを半田付けによりそれぞれ接合すること
を特徴とする。
Further, a method for connecting flexible printed boards according to the present invention is a method for connecting flexible printed boards formed by forming conductor wiring on an insulating film,
The end faces of the respective terminal portions are abutted so that the conductor wiring of the terminal portion of one flexible printed circuit board and the conductor wiring of the terminal portion of the other flexible printed circuit board are continuous with each other. A thin plate or foil-like conductive material is placed on the two conductor wirings via solder so as to straddle the abutting portion, and a soldering iron is brought into contact with the upper side of the placed conductive material, and this contact is made. The method is characterized in that the soldering iron is heated to melt the solder, and the conductive material at both ends and the conductor wiring are joined by soldering.

【0009】更に、この発明に係る可撓性プリント基板
同士の接続方法は、絶縁フィルム上に導体配線が形成さ
れてなる可撓性プリント基板同士の接続方法であって、
一方の可撓性プリント基板の端末部の導体配線と他方の
可撓性プリント基板の端末部の導体配線とが連続するよ
うに、それぞれの端末部の端面を衝合し、前記両端末部
の衝合部を跨ぐように前記両導体配線上に、薄板又は箔
状の導電材を載置し、それぞれの端末部の前記載置した
導電材の上側及び前記絶縁フィルムの下側のいずれか一
方にホーンを、他方にアンビルを当接させ、これら当接
させたホーン及びアンビル間に所定の周波数の超音波を
出力して前記両端末部の前記導電材と前記導体配線とを
超音波溶着によりそれぞれ接合することを特徴とする。
Further, the method for connecting flexible printed boards according to the present invention is a method for connecting flexible printed boards each having a conductor wiring formed on an insulating film,
The end faces of the respective terminal portions are abutted so that the conductor wiring of the terminal portion of one flexible printed circuit board and the conductor wiring of the terminal portion of the other flexible printed circuit board are continuous with each other. A thin plate or foil-shaped conductive material is placed on the two conductor wirings so as to straddle the abutting portion, and either one of the upper side of the conductive material described above and the lower side of the insulating film of each terminal portion. The horn and the anvil are abutted on the other, and an ultrasonic wave of a predetermined frequency is output between the abutted horn and the anvil to ultrasonically weld the conductive material and the conductor wiring of the both end portions. It is characterized by joining each.

【0010】前記導電材は、好ましくは厚さ18μm〜
70μmの銅箔である。
The conductive material preferably has a thickness of 18 μm or more.
70 μm copper foil.

【0011】この発明によれば、接続するそれぞれの可
撓性プリント基板(以下、この段落のみ「FPC」と呼
ぶ。)の端末部の端面を導体配線が連続するように衝合
し、これら両端末部の衝合部を跨ぐように両端末部に形
成されたそれぞれの導体配線上に薄板又は箔状の導電材
を載置し、それぞれの端末部の載置した導電材の上側に
プラス及びマイナス極性の電極を当接させて圧力を加
え、これら電極間に所定の電圧を印加して両端末部の導
電材と導体配線とを抵抗溶接(例えば、シリーズ溶接
等)によりそれぞれ接合してFPC同士を接続する。ま
た、この発明によれば、接続するそれぞれのFPCの端
末部の端面を導体配線が連続するように衝合し、これら
両端末部の衝合部を跨ぐように両端末部に形成されたそ
れぞれの導体配線上に半田を介して薄板又は薄状の導電
材を載置し、この載置した導電材の上側に半田ごてを当
接させ、当接させた半田ごてを加熱して半田を溶融し両
端末部の導電材と導体配線とを半田付けによりそれぞれ
接合してFPC同士を接続する。更に、この発明によれ
ば、接続するそれぞれのFPCの端末部の端面を導体配
線が連続するように衝合し、これら両端末部の衝合部を
跨ぐように両端末部に形成されたそれぞれの導体配線上
に薄板又は箔状の導電材を載置し、それぞれの端末部の
載置した導電材の上側及び絶縁フィルムの下側のいずれ
か一方にホーンを、他方にアンビルを当接させ、これら
ホーン及びアンビル間に所定の周波数の超音波を出力し
て両端末部の導電材と導体配線とを超音波溶着によりそ
れぞれ接合してFPC同士を接続する。これにより、従
来のFPC同士の電気的接続に必要であった専用の接続
コネクタ等の部品が不要となるため、接続に関するコス
トを大幅に削減することができる。また、FPCのそれ
ぞれの導体配線を、例えば抵抗溶接、半田付け又は超音
波溶着により接合するため、専用の接続コネクタ等によ
るFPC同士の接続に比べ、非常に高い接続信頼性を得
ることが可能となる。
According to the present invention, the end surfaces of the terminal portions of the respective flexible printed circuit boards to be connected (hereinafter referred to as "FPC" only in this paragraph) are abutted so that the conductor wiring is continuous, and both of them are joined. A thin plate or foil-shaped conductive material is placed on each conductor wiring formed on both terminal portions so as to straddle the abutting portion of the terminal portion, and plus and over the conductive material placed on each terminal portion. A negative electrode is brought into contact with the electrode to apply pressure, a predetermined voltage is applied between the electrodes, and the conductive material and the conductor wiring at both ends are joined by resistance welding (for example, series welding) to form an FPC. Connect each other. Further, according to the present invention, the end faces of the terminal portions of the respective FPCs to be connected are abutted so that the conductor wiring is continuous, and each of the FPCs is formed on both the terminal portions so as to straddle the abutting portion of the two terminal portions. A thin plate or thin conductive material is placed on the conductor wiring of the above via a solder, a soldering iron is brought into contact with the upper side of the placed conductive material, and the soldered iron is heated and soldered. Is melted, and the conductive material and the conductor wiring at both ends are joined by soldering to connect the FPCs. Further, according to the present invention, the end faces of the terminal portions of the respective FPCs to be connected are abutted so that the conductor wiring is continuous, and the respective end portions formed on both the terminal portions so as to straddle the abutting portions of the two terminal portions. A conductive material in the form of a thin plate or foil is placed on the conductive wiring, and the horn is brought into contact with one of the upper side of the placed conductive material and the lower side of the insulating film in each terminal portion, and the anvil is brought into contact with the other. Then, ultrasonic waves having a predetermined frequency are output between the horn and the anvil, and the conductive material and the conductor wiring at both ends are joined by ultrasonic welding to connect the FPCs. This eliminates the need for components such as dedicated connection connectors, which have been required for the conventional electrical connection between FPCs, so that the cost for connection can be significantly reduced. Further, since the respective conductor wirings of the FPC are joined by, for example, resistance welding, soldering or ultrasonic welding, it is possible to obtain extremely high connection reliability as compared with the connection between FPCs using a dedicated connector or the like. Become.

【0012】[0012]

【発明の実施の形態】以下、添付の図面を参照して、こ
の発明の実施例を説明する。図1は、この発明の一実施
例に係る可撓性プリント基板同士の接続方法を説明する
ための端末部の上方斜視図、図2及び図3は、可撓性プ
リント基板同士の接続方法を説明するための端末部の上
面及び断面を示す図、図4は、抵抗溶接を説明するため
の端末部の一部を断面で示す側面図、図5は、可撓性プ
リント基板同士の接続工程を示すフローチャートであ
る。
Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an upper perspective view of a terminal portion for explaining a method of connecting flexible printed boards according to an embodiment of the present invention, and FIGS. 2 and 3 show a method of connecting flexible printed boards. FIG. 4 shows a top view and a cross section of a terminal section for explaining. FIG. 4 is a side view showing a part of the terminal section for explaining resistance welding, and FIG. 5 is a process of connecting flexible printed circuit boards. It is a flowchart which shows.

【0013】図1に示すように、互いに接続されるべき
FPC10,20は、例えば、ポリエチレンテレフタレ
ート(PET)やポリエチレンナフタレート(PEN)
等からなる絶縁性を有する樹脂フィルム(以下、「絶縁
フィルム」と呼ぶ。)15,25の上に、銅箔による導
電パターンからなる配線16,26を形成し、これら絶
縁フィルム15,25及び配線16,26の上を電気的
絶縁性能を有する合成樹脂等からなるカバーレイ17,
27で覆った構造で形成されている。なお、FPC1
0,20の端末部11,21の絶縁フィルム15,25
上、及び配線16,26の上には、カバーレイ17,2
7は形成されておらず、それぞれの端末部11,21に
おいては本来カバーレイ17,27に覆われているはず
の配線16,26が剥き出しの露出した状態となってい
る。
As shown in FIG. 1, FPCs 10 and 20 to be connected to each other are made of, for example, polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).
Wirings 16 and 26 made of a conductive pattern made of copper foil are formed on resin films 15 and 25 having insulating properties (hereinafter referred to as “insulating films”) made of the same. A cover lay 17 made of a synthetic resin or the like having electrical insulation performance on
It is formed with a structure covered by 27. In addition, FPC1
Insulating films 15, 25 of terminal portions 11, 21 of 0, 20
The coverlays 17 and 2
7 are not formed, and the wires 16 and 26, which should have been originally covered by the coverlays 17 and 27, are exposed in the respective terminal portions 11 and 21.

【0014】以下に、このように形成されたFPC1
0,20同士の接続方法について説明する。まず、上記
PETやPEN等で構成されるFPC10,20の基体
となる絶縁フィルム15,25を構成するシート等を用
意し、所望の形状等に加工する(S1)。次に、加工し
た絶縁フィルム15,25上に、FPC10,20の回
路を構成するCu等を原材料とする導電パターンからな
る配線16,26を、例えばエッチング等の方法により
パターン形成し、端末部11,21となるべき部分を除
いた絶縁フィルム15,25及び配線16,26上にカ
バーレイ17,27を形成してFPC10,20を製造
する(S2)。このようにして製造されたFPC10,
20の端末部11,21の端面12,22を互いに衝合
し(S3)、配線16,26同士を接触させると、端末
部11,21は、図2に示すような状態になる。即ち、
同図(b)に示すように、端末部11,21の絶縁フィ
ルム15,25と配線16,26とが端面12,22を
介して互いに接触し、絶縁フィルム15,25の下面と
配線16,26の上面とが連続した同一面を形成するよ
うな状態である。次に、端末部11,21の接触させた
配線16,26上に跨るように銅箔の導電材50を載置
する(S4)。このときの端末部11,21は、図3に
示すような状態になる。即ち、同図(b)に示すよう
に、端末部11,21の配線16,26の上面と導電材
50の下面とが接触するような状態である。端末部1
1,21をこのような状態にした後、図4(a)に示す
ように、まず、例えばシリーズ溶接装置(図示せず)の
電極9a,9bを、配線16上に載置された導電材50
の上側に当接し、下方へ押圧しながら電極9a,9b間
にシリーズ溶接に用いられる容量の大電流を通電すべく
所定の電圧を印加する。そして、通電により発生した熱
エネルギーと電極9a,9bによる加圧力とにより配線
16及び導電材50の銅が他の層に相互に拡散すること
で(拡散溶接)、これら配線16及び導電材50を溶接
接合する(S5)。次に、同図(b)に示すように、電
極9a,9bを、配線26上に載置された導電材50の
上側に当接し、下方へ押圧しながら同様にシリーズ溶接
を施してFPC20の端末部21側の導電材50と配線
26とを溶接接合し(S5)、FPC10とFPC20
とを電気的且つ機械的に接続する。このようにしてFP
C10,20同士を接続することにより、専用の接続コ
ネクタ等の部品を必要としないFPC同士の接続が可能
となるため、FPC同士の接続に関するコストを大幅に
削減し、自動車等に用いられるFPCの製造コストの上
昇を抑えることが可能となる。
Hereinafter, the FPC 1 thus formed will be described.
A connection method between 0 and 20 will be described. First, sheets and the like constituting insulating films 15 and 25 serving as bases of FPCs 10 and 20 composed of PET or PEN are prepared and processed into a desired shape or the like (S1). Next, on the processed insulating films 15 and 25, wirings 16 and 26 made of a conductive pattern made of Cu or the like constituting the circuits of the FPCs 10 and 20 are formed by patterning, for example, by etching or the like. Then, coverlays 17 and 27 are formed on the insulating films 15 and 25 and the wirings 16 and 26 except for the portions that will become the FPCs 10 and 20 (S2). The FPC 10 manufactured in this manner,
When the end faces 12 and 22 of the 20 terminals 11 and 21 abut against each other (S3) and the wirings 16 and 26 are brought into contact with each other, the terminals 11 and 21 are in a state as shown in FIG. That is,
As shown in FIG. 2B, the insulating films 15 and 25 of the terminal portions 11 and 21 and the wirings 16 and 26 are in contact with each other via the end faces 12 and 22, and the lower surfaces of the insulating films 15 and 25 and the wirings 16 and 26. 26 is in a state of forming the same continuous surface. Next, the conductive material 50 made of copper foil is placed so as to straddle the wirings 16 and 26 in contact with the terminals 11 and 21 (S4). At this time, the terminal units 11 and 21 are in a state as shown in FIG. That is, as shown in FIG. 3B, the upper surfaces of the wirings 16 and 26 of the terminal portions 11 and 21 and the lower surface of the conductive material 50 are in contact with each other. Terminal 1
After setting the electrodes 1 and 21 in such a state, as shown in FIG. 4A, first, for example, the electrodes 9a and 9b of a series welding device (not shown) are connected to the conductive material placed on the wiring 16. 50
A predetermined voltage is applied between the electrodes 9a and 9b so as to apply a large current having a capacity used for series welding while pressing the electrode 9a and 9b downward. Then, the copper of the wiring 16 and the conductive material 50 is mutually diffused into other layers by the thermal energy generated by energization and the pressing force by the electrodes 9a and 9b (diffusion welding), so that the wiring 16 and the conductive material 50 are formed. Welding is performed (S5). Next, as shown in FIG. 2B, the electrodes 9a and 9b are brought into contact with the upper side of the conductive material 50 placed on the wiring 26, and are similarly subjected to series welding while being pressed downward, thereby forming the FPC 20. The conductive material 50 on the terminal 21 side and the wiring 26 are welded and joined (S5), and the FPC 10 and the FPC 20
Are electrically and mechanically connected to each other. In this way FP
By connecting the C10 and the C20, it is possible to connect the FPCs which do not require a component such as a dedicated connection connector. Therefore, the cost of the connection between the FPCs is greatly reduced, and the FPC used for an automobile or the like is reduced. It is possible to suppress an increase in manufacturing cost.

【0015】なお、上述した例では、FPC10,20
同士の接続に際して抵抗溶接による接続を用いて説明し
たが、例えば、図6(a)に示すような超音波溶着によ
る接続や、同図(b)に示すような半田付けによる接続
を行っても良い。以下、これら超音波溶着による接続方
法と、半田付けによる接続方法について説明する。な
お、上記抵抗溶接による接続方法で既に説明した部分は
割愛する。
In the above example, the FPCs 10, 20
Although the description has been made using the connection by resistance welding when connecting each other, for example, the connection by ultrasonic welding as shown in FIG. 6A or the connection by soldering as shown in FIG. good. Hereinafter, the connection method by ultrasonic welding and the connection method by soldering will be described. The parts already described in the connection method by resistance welding are omitted.

【0016】まず、超音波溶着によるFPC同士の接続
方法では、上記接続工程のステップS4までは同様であ
るが、それ以降の工程が異なっている。即ち、配線1
6,26の上に導電材50を載置した後、図6(a)に
示すように、例えば端末部11の導電材50の上に超音
波溶着装置(図示せず)のホーン40を当接し、絶縁フ
ィルム15の下面のこのホーン40と対向する位置にア
ンビル41を当接して、周波数60KHz〜120KH
z程度の超音波をこれらホーン40及びアンビル41間
に出力し、FPC10の端末部11側の導電材50と配
線16とを超音波溶着により接合する。同様にホーン4
0及びアンビル41を端末部21の導電材50と配線2
6とに当接し、超音波溶着の処理を行いFPC20の端
末部21側の導電材50と配線26とを超音波溶着によ
り接合してFPC10とFPC20とを電気的且つ機械
的に接続する。
First, in the method of connecting FPCs by ultrasonic welding, the steps up to step S4 of the connection step are the same, but the subsequent steps are different. That is, wiring 1
After the conductive material 50 is placed on the conductive materials 50 and 6, 26, a horn 40 of an ultrasonic welding device (not shown) is applied to the conductive material 50 of the terminal portion 11, for example, as shown in FIG. The anvil 41 is brought into contact with the lower surface of the insulating film 15 at a position facing the horn 40, and the frequency is 60 KHz to 120 KH.
An ultrasonic wave of about z is output between the horn 40 and the anvil 41, and the conductive material 50 on the terminal portion 11 side of the FPC 10 and the wiring 16 are joined by ultrasonic welding. Horn 4 as well
0 and the anvil 41 are connected to the conductive material 50 of the terminal 21 and the wiring 2.
6 and is subjected to an ultrasonic welding process, and the conductive material 50 on the terminal portion 21 side of the FPC 20 and the wiring 26 are joined by ultrasonic welding to electrically and mechanically connect the FPC 10 and the FPC 20.

【0017】一方、半田付けによるFPC同士の接続方
法では、上記接続工程のステップS3までは同様である
が、それ以降の工程が異なっている。即ち、端末部1
1,21の端面12,22を接触させた後、配線16,
26の上に、まず、半田51を載置し、次に載置した半
田51の上に導電材50を載置する。導電材50を載置
した後、図6(b)に示すように、例えば端末部11の
導電材50の上に半田ごて52の先端部53を当接し、
導電材50を介して半田51を加熱して溶融させ、半田
ごて52の先端部53を導電材50から離して溶融した
半田51を凝固させることにより、FPC10の端末部
11側の導電材50と配線16とを半田付けにより接合
する。同様に端末部21の導電材50の上に半田ごて5
2の先端部53を当接し、半田付けの処理を行いFPC
20の端末部21側の導電材50と配線26とを半田付
けにより接合してFPC10とFPC20とを電気的且
つ機械的に接続する。
On the other hand, in the method of connecting FPCs by soldering, the steps up to step S3 of the connection step are the same, but the subsequent steps are different. That is, the terminal unit 1
After contacting the end faces 12 and 22 of the wirings 1 and 21,
First, the solder 51 is placed on the solder 26, and then the conductive material 50 is placed on the placed solder 51. After placing the conductive material 50, as shown in FIG. 6B, for example, the tip 53 of the soldering iron 52 is brought into contact with the conductive material 50 of the terminal portion 11,
The solder 51 is heated and melted via the conductive material 50, and the tip 53 of the soldering iron 52 is separated from the conductive material 50 to solidify the melted solder 51, thereby forming the conductive material 50 on the terminal 11 side of the FPC 10. And the wiring 16 are joined by soldering. Similarly, a soldering iron 5 is placed on the conductive material 50 of the terminal 21.
2 abuts on the tip 53, performs soldering processing, and
The FPC 10 and the FPC 20 are electrically and mechanically connected by joining the conductive material 50 on the terminal 21 side of the 20 and the wiring 26 by soldering.

【0018】このような超音波溶着や半田付けによる接
続においても、上記抵抗溶接による接続の場合と同様に
高い接続信頼性を得ることができると共に、専用の接続
コネクタ等の部品を必要としないFPC同士の接続が可
能となり、FPC同士の接続に関するコストを大幅に削
減することができる。
In such a connection by ultrasonic welding or soldering, high connection reliability can be obtained as in the case of the connection by resistance welding, and an FPC that does not require components such as a dedicated connection connector. The connection between the FPCs can be performed, and the cost related to the connection between the FPCs can be significantly reduced.

【0019】[0019]

【発明の効果】以上述べたように、この発明によれば、
接続するそれぞれのFPCの端末部の端面を導体配線が
連続するように衝合し、これら両端末部の衝合部を跨ぐ
ように両端末部に形成されたそれぞれの導体配線上に薄
板又は箔状の導電材を載置し、それぞれの端末部の載置
した導電材の上側にプラス及びマイナス極性の電極を当
接させて圧力を加え、これら電極間に所定の電圧を印加
して両端末部の導電材と導体配線とを抵抗溶接(例え
ば、シリーズ溶接等)によりそれぞれ接合してFPC同
士を接続する。また、この発明によれば、接続するそれ
ぞれのFPCの端末部の端面を導体配線が連続するよう
に衝合し、これら両端末部の衝合部を跨ぐように両端末
部に形成されたそれぞれの導体配線上に半田を介して薄
板又は薄状の導電材を載置し、この載置した導電材の上
側に半田ごてを当接させ、当接させた半田ごてを加熱し
て半田を溶融し両端末部の導電材と導体配線とを半田付
けによりそれぞれ接合してFPC同士を接続する。更
に、この発明によれば、接続するそれぞれのFPCの端
末部の端面を導体配線が連続するように衝合し、これら
両端末部の衝合部を跨ぐように両端末部に形成されたそ
れぞれの導体配線上に薄板又は箔状の導電材を載置し、
それぞれの端末部の載置した導電材の上側及び絶縁フィ
ルムの下側のいずれか一方にホーンを、他方にアンビル
を当接させ、これらホーン及びアンビル間に所定の周波
数の超音波を出力して両端末部の導電材と導体配線とを
超音波溶着によりそれぞれ接合してFPC同士を接続す
る。これにより、従来のFPC同士の電気的接続に必要
であった専用の接続コネクタ等の部品が不要となるた
め、接続に関するコストを大幅に削減することができ
る。また、FPCのそれぞれの導体配線を、例えば抵抗
溶接、半田付け又は超音波溶着により接合するため、専
用の接続コネクタ等によるFPC同士の接続に比べ、非
常に高い接続信頼性を得ることが可能となるという効果
を奏する。
As described above, according to the present invention,
The end faces of the terminal portions of the respective FPCs to be connected are abutted so that the conductor wiring is continuous, and a thin plate or foil is placed on each conductor wiring formed on both the terminal portions so as to straddle the abutting portion of the two terminal portions. -Shaped conductive material is placed, positive and negative polarity electrodes are brought into contact with the upper side of the placed conductive material at the respective terminal portions, pressure is applied, and a predetermined voltage is applied between these electrodes to apply a voltage to both terminals. The FPCs are connected by joining the conductive material of the portion and the conductor wiring by resistance welding (for example, series welding). Further, according to the present invention, the end faces of the terminal portions of the respective FPCs to be connected are abutted so that the conductor wiring is continuous, and each of the FPCs is formed on both the terminal portions so as to straddle the abutting portion of the two terminal portions. A thin plate or thin conductive material is placed on the conductor wiring of the above via a solder, a soldering iron is brought into contact with the upper side of the placed conductive material, and the soldered iron is heated and soldered. Is melted, and the conductive material and the conductor wiring at both ends are joined by soldering to connect the FPCs. Further, according to the present invention, the end faces of the terminal portions of the respective FPCs to be connected are abutted so that the conductor wiring is continuous, and the respective end portions formed on both the terminal portions so as to straddle the abutting portions of the two terminal portions. Place a thin plate or foil conductive material on the conductor wiring of
A horn is brought into contact with one of the upper side of the conductive material placed on each terminal portion and the lower side of the insulating film, and an anvil is brought into contact with the other, and ultrasonic waves of a predetermined frequency are output between these horns and anvils. The FPCs are connected by joining the conductive material and the conductor wiring at both ends by ultrasonic welding. This eliminates the need for components such as dedicated connection connectors, which have been required for the conventional electrical connection between FPCs, so that the cost for connection can be significantly reduced. Further, since the respective conductor wirings of the FPC are joined by, for example, resistance welding, soldering or ultrasonic welding, it is possible to obtain extremely high connection reliability as compared with the connection between FPCs using a dedicated connector or the like. It has the effect of becoming.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 この発明の一実施例に係る可撓性プリント基
板同士の接続方法を説明するための端末部の上方斜視図
である。
FIG. 1 is a top perspective view of a terminal unit for explaining a method of connecting flexible printed circuit boards according to an embodiment of the present invention.

【図2】 同端末部の上面及び断面を示す図である。FIG. 2 is a diagram showing an upper surface and a cross section of the terminal unit.

【図3】 同端末部の上面及び断面を示す図である。FIG. 3 is a diagram showing an upper surface and a cross section of the terminal unit.

【図4】 抵抗溶接を説明するための端末部の断面図で
ある。
FIG. 4 is a sectional view of a terminal portion for explaining resistance welding.

【図5】 同可撓性プリント基板同士の接続工程を示す
フローチャートである。
FIG. 5 is a flowchart showing a connection process between the flexible printed circuit boards.

【図6】 この発明の他の実施例に係る可撓性プリント
基板同士の接続方法を説明するための端末部の断面図で
ある。
FIG. 6 is a cross-sectional view of a terminal for explaining a method of connecting flexible printed circuit boards according to another embodiment of the present invention.

【図7】 自動車等のダッシュボードに使用されるFP
Cとワイヤハーネスとを示す上方斜視図である。
FIG. 7: FP used for dashboards of automobiles and the like
It is an upper perspective view which shows C and a wire harness.

【図8】 FPCハーネスのジョイント構造を説明する
ための図である。
FIG. 8 is a diagram for explaining a joint structure of the FPC harness.

【符号の説明】[Explanation of symbols]

10,20…FPC、11,21…端末部、12,22
…端面、15,25…絶縁フィルム、16,26…配
線、17,27…カバーレイ。
10, 20,... FPC, 11, 21,.
... end faces, 15, 25 ... insulating films, 16, 26 ... wirings, 17, 27 ... coverlays.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01R 43/02 H01R 43/02 A H05K 1/14 H05K 1/14 H // B23K 101:38 B23K 101:38 101:42 101:42 Fターム(参考) 4E067 AA07 BF00 DA13 DA17 EA04 EB00 5E051 KA02 KB04 LA02 LA04 LB05 5E344 AA04 AA12 AA15 AA23 AA28 BB05 CC07 CD13 DD02 DD10 DD13 EE16 EE21 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01R 43/02 H01R 43/02 A H05K 1/14 H05K 1/14 H // B23K 101: 38 B23K 101: 38 101: 42 101: 42 F term (reference) 4E067 AA07 BF00 DA13 DA17 EA04 EB00 5E051 KA02 KB04 LA02 LA04 LB05 5E344 AA04 AA12 AA15 AA23 AA28 BB05 CC07 CD13 DD02 DD10 DD13 EE16 EE21

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 絶縁フィルム上に導体配線が形成されて
なる可撓性プリント基板同士の接続方法であって、 一方の可撓性プリント基板の端末部の導体配線と他方の
可撓性プリント基板の端末部の導体配線とが連続するよ
うに、それぞれの端末部の端面を衝合し、 前記両端末部の衝合部を跨ぐように前記両導体配線上
に、薄板又は箔状の導電材を載置し、 それぞれの端末部の前記載置した導電材の上側にプラス
及びマイナス極性の電極を当接させて前記可撓性プリン
ト基板の膜厚方向に圧力を加え、 これら当接させた電極間に所定の電圧を印加して前記両
端末部の前記導電材と前記導体配線とを抵抗溶接により
それぞれ接合することを特徴とする可撓性プリント基板
同士の接続方法。
1. A method for connecting flexible printed circuit boards, each having a conductive wiring formed on an insulating film, comprising: a conductive wiring at a terminal portion of one of the flexible printed boards; End surfaces of the respective terminal portions are abutted so that the conductor wires of the terminal portions are continuous with each other, and a thin plate or a foil-shaped conductive material is provided on the two conductor wires so as to straddle the abutted portions of the both terminal portions. The positive and negative polarity electrodes were brought into contact with the upper side of the above-described conductive material of each terminal portion, and pressure was applied in the film thickness direction of the flexible printed circuit board, and these were brought into contact with each other. A method of connecting flexible printed circuit boards, wherein a predetermined voltage is applied between electrodes to join the conductive material and the conductor wiring of the both end portions by resistance welding.
【請求項2】 絶縁フィルム上に導体配線が形成されて
なる可撓性プリント基板同士の接続方法であって、 一方の可撓性プリント基板の端末部の導体配線と他方の
可撓性プリント基板の端末部の導体配線とが連続するよ
うに、それぞれの端末部の端面を衝合し、 前記両端末部の衝合部を跨ぐように前記両導体配線上に
半田を介して薄板又は箔状の導電材を載置し、 この載置した導電材の上側に半田ごてを当接させ、 この当接させた半田ごてを加熱して前記半田を溶融し前
記両端末部の前記導電材と前記導体配線とを半田付けに
よりそれぞれ接合することを特徴とする可撓性プリント
基板同士の接続方法。
2. A method of connecting flexible printed circuit boards each having a conductive wiring formed on an insulating film, wherein the conductive wiring at a terminal portion of one flexible printed circuit board and the other flexible printed circuit board are connected. End surfaces of the respective terminal portions are abutted so that the conductor wires of the terminal portions are continuous, and a thin plate or a foil is formed on both the conductor wires via solder so as to straddle the abutted portions of the two terminal portions. The soldering iron is brought into contact with the upper side of the placed conductive material, the heated soldering iron is heated to melt the solder, and the conductive material at the both ends is placed. And connecting the conductive wiring to the flexible printed circuit boards by soldering.
【請求項3】 絶縁フィルム上に導体配線が形成されて
なる可撓性プリント基板同士の接続方法であって、 一方の可撓性プリント基板の端末部の導体配線と他方の
可撓性プリント基板の端末部の導体配線とが連続するよ
うに、それぞれの端末部の端面を衝合し、 前記両端末部の衝合部を跨ぐように前記両導体配線上
に、薄板又は箔状の導電材を載置し、 それぞれの端末部の前記載置した導電材の上側及び前記
絶縁フィルムの下側のいずれか一方にホーンを、他方に
アンビルを当接させ、 これら当接させたホーン及びアンビル間に所定の周波数
の超音波を出力して前記両端末部の前記導電材と前記導
体配線とを超音波溶着によりそれぞれ接合することを特
徴とする可撓性プリント基板同士の接続方法。
3. A method for connecting flexible printed circuit boards each having a conductive wiring formed on an insulating film, wherein the conductive wiring at a terminal portion of one flexible printed circuit board and the other flexible printed circuit board are provided. End surfaces of the respective terminal portions are abutted so that the conductor wires of the terminal portions are continuous with each other, and a thin plate or a foil-shaped conductive material is provided on the two conductor wires so as to straddle the abutted portions of the both terminal portions. The horn is brought into contact with one of the upper side of the conductive material and the lower side of the insulating film, and the anvil is brought into contact with the other, and the horn and the anvil are brought into contact with each other. A method for connecting flexible printed circuit boards, comprising: outputting ultrasonic waves of a predetermined frequency to the conductive members and joining the conductive material and the conductor wiring of the both end portions by ultrasonic welding.
【請求項4】 前記導電材は、厚さ18μm〜70μm
の銅箔であることを特徴とする請求項1〜3のいずれか
1項記載の可撓性プリント基板同士の接続方法。
4. The conductive material has a thickness of 18 μm to 70 μm.
The method for connecting flexible printed circuit boards according to any one of claims 1 to 3, wherein the copper foil is a copper foil.
JP2000332820A 2000-10-31 2000-10-31 Method for connecting flexible printed board to each other Pending JP2002141660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
JP2000332820A JP2002141660A (en) 2000-10-31 2000-10-31 Method for connecting flexible printed board to each other

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Publication Number Publication Date
JP2002141660A true JP2002141660A (en) 2002-05-17

Family

ID=18808977

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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JP2005349448A (en) * 2004-06-11 2005-12-22 Nissan Motor Co Ltd Ultrasonic joining method and ultrasonic joining device
JP2008078520A (en) * 2006-09-25 2008-04-03 Casio Comput Co Ltd Solder joint structure of wiring board
CN101553091B (en) * 2008-04-02 2012-07-04 恩斯迈电子(深圳)有限公司 Printed circuit board and process for promoting qualification rate of lead-free process
WO2021186794A1 (en) * 2020-03-19 2021-09-23 三洋電機株式会社 Voltage detection line and voltage detection line module

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