JP3019899B2 - Manufacturing method of multi-chip module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a multichip module used in a workstation, a computer, and the like.

[0002]

2. Description of the Related Art In recent years, demands for miniaturization of workstations and computers have been increasing. In order to meet these demands, in the implementation of LSIs, multi-chip modules for directly mounting the LSIs have been actively developed.

Hereinafter, an example of a conventional method for manufacturing a multichip module will be described with reference to the drawings. FIG.
, 21 is a multilayer substrate, 22 is an LSI chip connection electrode, 23 is an insulating resin, 24 is an external electrode, and 25 is LS
I chip, 26 is a bump, 28 is an external lead, and 29 is a pressure tool.

Next, a manufacturing method will be described. First, as shown in FIG. 3A, the LS at the right end of the multilayer substrate 21 is formed.
An insulating resin 23 is applied to a region where the I chip is to be mounted.
Thereafter, as shown in FIG. 3B, the bumps 26 of the LSI chip 25 and the electrodes 22 are aligned, the LSI chip 25 is set on the multilayer substrate 21, and the LSI chip 2 is
5 is pressurized. In this state, the insulating resin 23 is cured by heating or light irradiation, and the bumps 2 of the LSI chip 25 are cured.
6 and the electrode 22 are electrically connected. Hereinafter, similarly, a plurality of L
The SI chip is connected on the multilayer substrate 22. Next, FIG.
As shown in (c), the external electrode 24 and the external lead 28 are connected by soldering or the like. Thereafter, an electrical inspection of the multi-chip module is performed via the external leads 28.

[0005]

However, in the above configuration, since the external leads are connected after connecting a plurality of LSI chips to the singulated multi-layer substrate, a defect generated when connecting the external leads is caused. The discarded module includes an expensive LSI chip and is very expensive.

There is also a method of connecting external leads before mounting the LSI chip. In this case, since the external leads use a lead frame which is not electrically separated,
The electrical inspection of the module is performed by cutting the external leads after resin molding including the external leads. Even if a defective LSI chip occurs in the multi-chip module, it is impossible to replace the LSI chip. The yield is low. Further, the multi-layer substrate has low productivity because it is handled individually.

The present invention has been made in view of the above problems, and provides a low-cost multi-chip module.

[0008]

In order to solve the above problems, a method of manufacturing a multi-chip module according to the present invention comprises:
The flexible film having the circuit board insertion hole and the guide hole is electrically independent on at least one side of the flexible film , and the tip of the flexible film has the circuit hole.
Film carrier with conductor wiring protruding into the circuit board insertion hole
And it connects the external electrodes of the tip and the circuit board of the rear of the conductor wiring the circuit of the film carrier to the circuit board
A step of supporting in a substrate insertion hole, a step of inspecting a connection portion between the circuit board and the conductor wiring, and applying an insulating resin to the circuit board or the semiconductor element supported by the film carrier to form an internal electrode of the circuit board. Positioning the semiconductor element on the circuit board by aligning the projecting electrode of the semiconductor element with the projecting electrode of the semiconductor element; pressing the semiconductor element to contact the projecting electrode of the semiconductor element with the internal electrode of the circuit board; A step of connecting the plurality of semiconductor elements to the internal electrodes of the circuit board by curing the insulating resin in a state where the elements are pressurized and electrically connecting the protruding electrodes of the semiconductor element to the internal electrodes of the circuit board; A step of bringing an electrode for electrical inspection into contact with the conductor wiring of the film carrier and performing an electrical inspection of a circuit formed on the circuit board;
A step of punching the circuit board including the conductor wiring from the film carrier to obtain a multi-chip module.

[0009]

According to the present invention, with the above-described structure, a multi-layer substrate is provided with L
Before connecting the SI chip, the leads of the film carrier, which are electrically separated in advance, are connected to the external electrodes of the multilayer substrate to form the external leads. Therefore, the yield at the time of connecting the external leads does not affect the LSI chip. The cost is low. Further, since the electrical inspection of the module is performed in a state where the external leads are supported by the film carrier, the productivity is improved.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a multichip module according to one embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a cross-sectional view of a multi-chip module according to an embodiment of the present invention, which is obtained by different processes. In FIG. 1, 1 is a film carrier, 2 is an external lead,
Reference numeral 3 denotes a multilayer substrate, 4 denotes an external electrode, 5 denotes an internal electrode, 6 denotes an insulating resin, 7 denotes an LSI chip, 8 denotes a bump, 9 denotes a pressing tool, 10 denotes a probe , and 12 denotes light irradiation.

First, as shown in FIG. 1A, the external electrodes 4 of the multilayer substrate 3 are connected to the external leads 2 of the film carrier 1, and the multilayer substrate 3 is held by the film carrier 1. The multilayer substrate 3 is a multilayer substrate of a thin film based on glass, silicon, ceramic, or the like, or a multilayer substrate of glass epoxy, ceramic, or the like. The configuration of the external electrode 4 is Cr-Cu-Ni-Au in the case of a thin-film multilayer substrate.
And the like. The external leads 2 of the film carrier 1 are formed by etching a copper foil, and have a thickness of about 10 μm to 100 μm.

Au, Sn, solder, etc. are formed on the surface of the external lead 2 to facilitate bonding with the external electrode 4 of the multilayer substrate 3. The connection between the external electrode 4 and the external lead 2 is performed by thermocompression bonding using pulse heating or heating connection using a laser. When soldering with Pb-Sn solder , a high melting point solder having a Pb content of about 90% is used, and is configured to withstand the temperature when soldering to a mother printed board on which a module is mounted later. fill
External Lee projecting the circuit board insertion hole 13 of the beam carrier 1
The de 2 shows a perspective view of a state of connecting the multilayer substrate 3 in FIG.

Next, as shown in FIG. 1B, an insulating resin 6 is applied to a region on the right end of the multilayer substrate 3 where the LSI chip is to be mounted. The insulating resin 6 is a photo-curable or heat-curable resin such as acrylic, silicone, or epoxy. As a method of applying the insulating resin 6, a method such as dispensing, stamping, and printing can be used.

Next, as shown in FIG.
Of the bump 8 and the internal electrode 4 of the multilayer substrate 3,
The LSI chip 7 is mounted on the multilayer substrate 3. At this time, LS
The I chip 7 is temporarily fixed on the multilayer substrate 3 due to the viscosity of the insulating resin 6. Next, the LSI chip 7 is pressed by the pressing tool 9. At this time, the insulating resin 6 existing between the bumps 8 of the LSI chip 7 and the internal electrodes 5 of the multilayer substrate 3 is extruded to the periphery, and the bumps 8 and the internal electrodes 5 come into electrical contact. Next, the insulating resin 6 is cured while the LSI chip 7 is pressed by the pressing tool 9. The method of curing the insulating resin 6 is as follows.
The insulating resin 6 around the SI chip 7 is cured, and the insulating resin 6 in the uncured portion is cured by room temperature curing or heat curing after releasing the pressure. When the multilayer substrate 3 is transparent such as glass, it is irradiated with light from the back surface of the multilayer substrate 3 and cured. When the insulating resin 6 is a heat-curable type, a heating mechanism is provided in the pressurizing tool 9 and the pressurizing tool 9 heats and cures.

Next, as shown in FIG.
Is released, the LSI chip 7 is bonded and fixed to the multilayer substrate 3, and the internal electrodes 4 of the multilayer substrate 3 and the bumps 8 of the LSI chip 7 are electrically connected. Next, a plurality of L
The SI chip 7 is connected on the multilayer substrate 3. Next, a probe 10 for characteristic inspection is brought into contact with a portion of the film carrier 1 where the external leads 2 do not protrude, and a characteristic inspection of a multi-chip module including a plurality of LSI chips 7 is performed. At this time, since the external leads 2 of the film carrier 1 are electrically separated in advance, the characteristic inspection can be easily performed. If a defect occurs in the characteristic inspection, the defective LSI chip is replaced at this stage. The yield can be improved by replacing the LSI chip.

Next, as shown in FIG. 1 (e), the external leads 2 are cut and formed by a die to obtain a multi-chip module with leads.

[0018]

As described above, according to the present invention, the leads of the film carrier, which are electrically separated in advance before connecting the LSI chip to the multilayer substrate, are connected to the external electrodes of the multilayer substrate by the above-described structure. Therefore, the damage caused by the defect that occurs when the external leads are connected does not reach the LSI chip, and the cost is very low. Further, since the electrical inspection of the module is performed in a state where the external leads are supported by the film carrier, the productivity is improved.

[Brief description of the drawings]

FIG. 1 is a process sectional view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing one process in the embodiment.

FIG. 3 is a process sectional view showing a conventional manufacturing method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Film carrier 2 External lead 3 Multilayer substrate 4 External electrode 5 Internal electrode 6 Insulating resin 7 LSI chip 8 Bump 9 Pressure tool 10 Probe 12 Light irradiation 13 Circuit board insertion hole

Claims (3)

(57) [Claims] 1. A electrically independent on at least one surface of the flexible having a circuit board insertion hole and the guide hole film, its
Having a conductor wiring protruding into the circuit board insertion hole.
And the step of supporting said conductive wire tip and the circuit and the circuit board by connecting the external electrodes of the substrate to the circuit board insertion hole of the film carrier of the film carrier, the connecting portion of the conductor wiring and the circuit board Inspecting, connecting a plurality of electronic components to internal electrodes of the circuit board supported by the film carrier, and a circuit formed on the circuit board by contacting an electrode for electrical inspection with the conductor wiring of the film carrier A method for producing a multi-chip module, comprising the steps of: performing an electrical inspection of the above, and punching the circuit board including the conductor wiring from the film carrier to obtain a multi-chip module. 2. The circuit board according to claim 1, wherein the circuit board is made of silicon or glass, and the conductor wiring is a multilayer.
A method for manufacturing the multichip module according to the above. 3. A step of applying an insulating resin to a circuit board or a semiconductor element, aligning an internal electrode of the circuit board with a projection electrode of the semiconductor element, and placing the semiconductor element on the circuit board. Contacting the protruding electrode of the semiconductor element with the internal electrode of the circuit board, curing the insulating resin in a state where the semiconductor element is pressurized, and projecting the semiconductor element and the internal electrode of the circuit board. 3. The method according to claim 1, wherein a plurality of electronic components are connected to the internal electrodes of the circuit board by electrically connecting the electronic components.