CN103325701A - Installation method, installation structure and power module for power module PCB - Google Patents
Installation method, installation structure and power module for power module PCB Download PDFInfo
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- CN103325701A CN103325701A CN2013102208620A CN201310220862A CN103325701A CN 103325701 A CN103325701 A CN 103325701A CN 2013102208620 A CN2013102208620 A CN 2013102208620A CN 201310220862 A CN201310220862 A CN 201310220862A CN 103325701 A CN103325701 A CN 103325701A
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- pcb board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract
Regarding the shortcoming of finished product deficiency of a power module possibly caused by the fact that an installation method for an existing power module PCB cannot independently conduct an electric test on the PCB provided with driven elements in a welding mode, the invention provides an installation method for the PCB of the power module, the installation method comprises the following steps of S1 welding the driven elements on the PCB, and conducting the electric test on the obtained PCB; S2 conducting electric connection on the PCB which is proved to be qualified through the test in step S1 and a lead frame through a method of metal wire bonding. According to the installation method for the power module PCB, the connection of the PCB and the lead frame and the connection of the PCB and the driven elements are finished in two steps, after the driven elements are welded on the PCB and the electric test is conducted on the PCB, the next procedure is started, the PCB with electric deficiency is selected in advance, the PCB is not in electric connection with the lead frame by adopting a reflow soldering mode, and therefore the PCB cannot be damaged in the connection process, and power module deficiency caused by PCB deficiency is avoided.
Description
Technical field
The present invention relates to electric and electronic technical field, particularly relate to a kind of power model pcb board installation method, mounting structure and power model.
Background technology
Power model has a wide range of applications in motor-driven, field of power electronics such as comprising air-conditioning, washing machine and refrigerator.Power model usually by lead frame, pcb board (printed circuit board (PCB)), passive device (passive device), drive chip, power chip and will form with the moulding resin that the upper-part total incapsulation gets up, drive chip and passive device and be welded on the pcb board, pcb board is fixed on the lead frame and is electrically connected with lead frame and the power chip that is arranged on the lead frame.
In existing a kind of power model, the installation method of pcb board is as follows: apply tin cream at pcb board, the pin of passive device and lead frame is placed on the tin cream, utilize a Reflow Soldering simultaneously passive device and lead frame to be welded on the pcb board.Above-mentioned pcb board installation method, pcb board also are electrically connected when relying on tin cream and lead frame to carry out mechanical connection.Because between pcb board and the lead frame, all use tin cream bonding between passive device and the pcb board, under this technique, tin cream is curable through the Reflow Soldering rear, for fear of the tin cream secondary fusion of solidifying, the welding between passive device and the pcb board, between pcb board and the lead frame is all used with a Reflow Soldering.Owing to being in UNICOM's state between each pin of lead frame, the upper passive device of this moment welding the electric property of pcb board can't test, therefore passive device failure welding bad or passive device can not be judged by electric test, in such cases, usually can only carry out electric test to judge the bad of power model finished product to the power model finished product.Thus, bad pcb board can not be out selected before the connecting lead wire framework, and bad like this pcb board can directly cause the bad of power model finished product.
Summary of the invention
Technical problem to be solved by this invention is can not carry out separately electric test to the pcb board that is welded with passive device for existing power model pcb board installation method may cause the bad defective of power model finished product, and a kind of power model pcb board installation method is provided.
It is as follows that the present invention solves the problems of the technologies described above the technical scheme that adopts:
A kind of power model pcb board installation method is provided, comprises the steps:
S1, a plurality of passive devices are welded on the pcb board, and the pcb board that obtains is carried out electric test;
S2, pcb board and the lead frame of test passes among the step S1 is electrically connected by the mode of wire bonds or by the bonding mode of conductive silver glue.
Further, among the step S1, the detailed process that a plurality of passive devices are welded on the pcb board is as follows: apply tin cream at pcb board, a plurality of passive devices are placed on the tin cream, utilize a Reflow Soldering that a plurality of passive devices are welded on the pcb board.
Further, after the step S1, also comprise before the step S2 pcb board and lead frame are carried out mechanical connection with the step S12 of the relative position between restriction pcb board and the lead frame.
Further, also comprise and utilize non-conductive adhesive or electroconductive binder will drive the step S0 of chip adhesive on pcb board, step S0 is after pcb board welding passive device, carry out before the connecting lead wire framework; Or step S0 carries out after pcb board connecting lead wire framework.
Power model pcb board installation method provided by the invention, being connected and being divided into pcb board and being connected of passive device for two steps and finishing of pcb board and lead frame, pcb board carries out entering subsequent processing behind the electric test after having welded passive device again, electric so bad pcb board will be picked out in advance, and pcb board and lead frame are electrically connected by the mode of wire bonds or by the bonding mode of conductive silver glue, therefore in the connection procedure of pcb board and lead frame, can not damage the qualified pcb board of electric test, avoided the bad power model that causes of pcb board bad fully, effectively promote power model finished product yield, reduced production, maintenance cost.
In addition, the present invention also provides a kind of power model pcb board mounting structure, comprise pcb board and lead frame, be welded with a plurality of passive devices on the described pcb board, described pcb board and lead frame are electrically connected by the mode of wire bonds or by the bonding mode of conductive silver glue.
Further, described mounting structure comprises described pcb board and lead frame is carried out mechanical connection to limit the position limiting structure of the relative position between described pcb board and the lead frame.
Further, described position limiting structure comprises the first through hole and the second through hole that are arranged at described pcb board two ends, is arranged on the hook of first on the described lead frame and the second hook, described the first hook and the first through hole interference fit, described the second hook and the second through hole interference fit.
Further, described the first hook is provided with to the inside diastrophic two the first elastic foots at Width, and described two the first elastic foots are pushed against in described the first through hole; Described the second hook is provided with to the inside diastrophic two the second elastic foots at Width, and described two the second elastic foots are pushed against in described the second through hole.
Power model pcb board mounting structure provided by the invention, the mode of a traditional Reflow Soldering is not adopted in electrical connection between pcb board and the lead frame, but adopt the mode of wire bonds or be electrically connected by the bonding mode of conductive silver glue, therefore, pcb board can be finished in two steps with being connected with pcb board and being connected of passive device of lead frame, like this, pcb board can carry out electric test after having welded passive device, electric so bad pcb board will be picked out in advance, therefore, avoid the bad power model that causes of pcb board bad, effectively promoted power model finished product yield, reduced production, maintenance cost.
In addition, the present invention also provides a kind of power model with above-mentioned power model pcb board mounting structure.
Description of drawings
Fig. 1 is the schematic flow sheet of the power model pcb board installation method that provides of one embodiment of the invention;
Fig. 2 is the schematic flow sheet of the power model pcb board installation method that provides of another embodiment of the present invention;
Fig. 3 is the schematic flow sheet of the power model pcb board installation method that provides of another embodiment of the present invention;
Fig. 4 is the structural representation of its pcb board of power model pcb board mounting structure of providing of one embodiment of the invention;
Fig. 5 is the structural representation of its lead frame of power model pcb board mounting structure of providing of one embodiment of the invention;
Fig. 6 is the schematic diagram of the power model pcb board mounting structure that provides of one embodiment of the invention.
Wherein, 1, pcb board; 11, the first through hole; 12, the second through hole; 13, pad; 2, passive device; 3, lead frame; 31, the first hook; 310, the first elastic foot; 32, the second hook; 320, the second elastic foot; 33, pin; 4, wire; 5, drive chip.
Embodiment
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with drawings and Examples, the present invention is further described in detail.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
Please in the lump with reference to Fig. 1, Fig. 4 to Fig. 6, the schematic flow sheet of the power model pcb board installation method that Fig. 1 provides for one embodiment of the invention; Among this embodiment, described power model pcb board installation method comprises the steps:
S1, a plurality of passive devices 2 are welded on the pcb board 1, and the pcb board 1 that obtains is carried out electric test, welded the pcb board of passive device 2 as shown in Figure 4; Among the step S1, preferably, the detailed process that a plurality of passive devices 2 are welded on the pcb board 1 is as follows: apply tin cream at pcb board 1, a plurality of passive devices 2 are placed on the tin cream, utilize a Reflow Soldering that a plurality of passive devices 2 are welded on the pcb board 1.Above-mentioned electric test mainly is the failure welding for detection of the bad and passive device of passive device on the pcb board, and the pcb board qualified through electric test just can enter into subsequent processing.Herein, passive device 2 also claims passive device, such as resistance, electric capacity, inductance and transformer etc.
S2, pcb board 1 and the mode of lead frame 3 by wire bonds of test passes among the step S1 is electrically connected, the structure of lead frame 3 is please referring to Fig. 5, and the connect Please of pcb board 1 and lead frame 3 is referring to Fig. 6.Preferably, such as Fig. 5 and shown in Figure 6, extend a plurality of pins 33 at lead frame 3; Correspondingly be provided with a plurality of pads 13 on pcb board, each pad 13 passes through wire 4 bondings with the pin 33 of its correspondence position.Preferably, herein wire 4 adopts aluminum steels.
The schematic flow sheet of the power model pcb board installation method that Fig. 2 provides for another embodiment of the present invention; Be with difference embodiment illustrated in fig. 1, in the present embodiment, after step S1, before the step S2, also comprise pcb board 1 and lead frame 3 are carried out mechanical connection to limit the step S12 of the relative position between pcb board 1 and the lead frame 3.
The schematic flow sheet of the power model pcb board installation method that Fig. 3 provides for another embodiment of the present invention; Be with difference embodiment illustrated in fig. 1, in the present embodiment, as shown in Figure 4, after pcb board 1 welding passive device 2, before the connecting lead wire framework 3, comprise that also utilizing non-conductive adhesive or electroconductive binder will drive chip 5 is bonded in step S0 on the pcb board 1.Certainly, in another embodiment, step S0 carries out after pcb board 1 connecting lead wire framework 3.Above-mentioned non-conductive adhesive is such as being non-conductive elargol, epoxyn, synvaren and polyurethane adhesive etc., and electroconductive binder can be conductive silver glue.Drive chip 5 and be electrically connected with the mode of pcb board 1 by wire bonds, herein, wire is gold thread or aluminum steel, is preferably gold thread.
Certainly, in other embodiment of pcb board installation method provided by the invention, pcb board 1 also can be realized electrical connection by the bonding mode of conductive silver glue with lead frame 3 among the step S2.Concrete steps are, at first apply one deck conductive silver glue at pcb board 1 corresponding link position, a plurality of pins 33 on the lead frame 3 are pressed in the position that is coated with conductive silver glue on the pcb board, after conductive silver glue solidifies, pcb board 1 namely forms with lead frame 3 and firmly is connected, thereby realizes the electrical connection between pcb board 1 and the lead frame 3.
The power model pcb board installation method that the above embodiment of the present invention provides, being connected and being divided into pcb board and being connected of passive device for two steps and finishing of pcb board and lead frame, pcb board carries out entering subsequent processing behind the electric test after having welded passive device again, electric so bad pcb board will be picked out in advance, and pcb board and lead frame are electrically connected by the mode of wire bonds or by the bonding mode of conductive silver glue, therefore in the connection procedure of pcb board and lead frame, can not damage the qualified pcb board of electric test, avoided the bad power model that causes of pcb board bad fully, effectively promote power model finished product yield, reduced production, maintenance cost.
In addition, to shown in Figure 6, one embodiment of the invention also provides a kind of power model pcb board mounting structure, comprises pcb board 1 and lead frame 3 such as Fig. 4, be welded with a plurality of passive devices 2 on the described pcb board 1, described pcb board 1 is electrically connected with the mode of lead frame 3 by wire bonds.Herein, passive device 2 also claims passive device, such as resistance, electric capacity, inductance and transformer etc.In the present embodiment, wire 4 is preferably aluminum steel.In addition, as shown in Figure 4, in the present embodiment, power model pcb board mounting structure can also comprise power chip 5, and power chip utilizes scolding tin to be bonded on the pcb board.Drive chip 5 and be electrically connected with the mode of pcb board 1 by wire bonds, herein, wire is gold thread or aluminum steel, is preferably gold thread.
In the present embodiment, described mounting structure comprises described pcb board 1 and lead frame 3 is carried out mechanical connection to limit the position limiting structure of the relative position between described pcb board 1 and the lead frame 3.Described position limiting structure comprises the first through hole 11 and the second through hole 12 that are arranged at described pcb board 1 two ends, is arranged on the hook of first on the described lead frame 3 the 31 and second hook 32, described the first hook 31 is provided with to the inside diastrophic two the first elastic foots 310 at Width, and described two the first elastic foots 310 are pushed against in described the first through hole 11; Described the second hook 32 is provided with to the inside diastrophic two the second elastic foots 320 at Width, and described two the second elastic foots 320 are pushed against in described the second through hole 12.Like this, first the hook 31, second the hook 32 respectively with the first through hole 11, the second through hole 12 interference fit; Realized spacing between pcb board 1 and the lead frame 3.Above-mentioned position limiting structure can keep pcb board to reach in the horizontal direction the straight up position of direction well, in the transportation of producing, pcb board direction is straight down also controlled under the effect of frictional force, paste wafer at Dice bond() and Wire Bond(wire bonds) station, pcb board all has corresponding anchor clamps to fix it in the position of vertical direction in machine.In Molding(moulding resin mould envelope) station, fixedly thimble is for the vertical direction position of control PCB to be designed with three in injection mold, and after the Molding station was finished, pcb board and lead frame will be wrapped by moulding resin.That is to say, pcb board can both obtain well spacing in whole technological process, therefore, encapsulates later power model, and the position of pcb board is accurate.
Certainly, in other embodiment of pcb board mounting structure provided by the invention, pcb board 1 also can be realized electrical connection by the bonding mode of conductive silver glue with lead frame 3.
The power model pcb board mounting structure that the above embodiment of the present invention provides, the mode of a traditional Reflow Soldering is not adopted in electrical connection between pcb board and the lead frame, but adopt the mode of wire bonds or be electrically connected by the bonding mode of conductive silver glue, therefore, pcb board can be finished in two steps with being connected with pcb board and being connected of passive device of lead frame, like this, pcb board can carry out electric test after having welded passive device, electric so bad pcb board will be picked out in advance, therefore, avoided the bad power model that causes of pcb board bad, effectively promote power model finished product yield, reduced production, maintenance cost.
In addition, the present invention also provides a kind of power model with above-mentioned power model pcb board mounting structure.Above-mentioned power model pcb board mounting structure is pasted wafer through Dice bond(), Wire Bond(wire bonds) station and Molding(moulding resin mould envelope) station, namely obtain power model of the present invention.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. a power model pcb board installation method is characterized in that, comprises the steps:
S1, a plurality of passive devices are welded on the pcb board, and the pcb board that obtains is carried out electric test;
S2, pcb board and the lead frame of test passes among the step S1 is electrically connected by the mode of wire bonds or by the bonding mode of conductive silver glue.
2. power model pcb board installation method according to claim 1, it is characterized in that, among the step S1, the detailed process that a plurality of passive devices are welded on the pcb board is as follows: apply tin cream at pcb board, a plurality of passive devices are placed on the tin cream, utilize a Reflow Soldering that a plurality of passive devices are welded on the pcb board.
3. power model pcb board installation method according to claim 1 and 2, it is characterized in that, also comprise after the step S1, before the step S2 pcb board and lead frame are carried out mechanical connection with the step S12 of the relative position between restriction pcb board and the lead frame.
4. power model pcb board installation method according to claim 1 and 2, it is characterized in that, also comprise and utilize non-conductive adhesive or electroconductive binder will drive the step S0 of chip adhesive on pcb board, step S0 is after pcb board welding passive device, carry out before the connecting lead wire framework; Or step S0 carries out after pcb board connecting lead wire framework.
5. power model pcb board mounting structure, comprise pcb board and lead frame, be welded with a plurality of passive devices on the described pcb board, it is characterized in that, described pcb board and lead frame are electrically connected by the mode of wire bonds or by the bonding mode of conductive silver glue.
6. power model pcb board mounting structure according to claim 5 is characterized in that, described mounting structure comprises described pcb board and lead frame are carried out mechanical connection to limit the position limiting structure of the relative position between described pcb board and the lead frame.
7. power model pcb board mounting structure according to claim 6, it is characterized in that, described position limiting structure comprises the first through hole and the second through hole that are arranged at described pcb board two ends, is arranged on the hook of first on the described lead frame and the second hook, described the first hook and the first through hole interference fit, described the second hook and the second through hole interference fit.
8. power model pcb board mounting structure according to claim 7 is characterized in that, described the first hook is provided with to the inside diastrophic two the first elastic foots at Width, and described two the first elastic foots are pushed against in described the first through hole; Described the second hook is provided with to the inside diastrophic two the second elastic foots at Width, and described two the second elastic foots are pushed against in described the second through hole.
9. a power model is characterized in that, described power model comprises the described power model pcb board of claim 5 to 8 any one mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102208620A CN103325701A (en) | 2013-06-05 | 2013-06-05 | Installation method, installation structure and power module for power module PCB |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2013102208620A CN103325701A (en) | 2013-06-05 | 2013-06-05 | Installation method, installation structure and power module for power module PCB |
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| CN103325701A true CN103325701A (en) | 2013-09-25 |
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| CN2013102208620A Pending CN103325701A (en) | 2013-06-05 | 2013-06-05 | Installation method, installation structure and power module for power module PCB |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104900620A (en) * | 2014-03-03 | 2015-09-09 | 西安永电电气有限责任公司 | PCB fixing structure of plastic-packaging type IPM and fixing method thereof |
| CN106876287A (en) * | 2017-02-21 | 2017-06-20 | 深圳市江波龙科技有限公司 | A kind of SIP method for packing and a kind of SIP modules |
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| US20040218375A1 (en) * | 2003-05-02 | 2004-11-04 | Fronk Karl T. | Thermal interface adapter plate conversion kit and method |
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| CN106876287A (en) * | 2017-02-21 | 2017-06-20 | 深圳市江波龙科技有限公司 | A kind of SIP method for packing and a kind of SIP modules |
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Application publication date: 20130925 |