CN207602558U - A kind of grafting power module package device - Google Patents
A kind of grafting power module package device Download PDFInfo
- Publication number
- CN207602558U CN207602558U CN201721818452.6U CN201721818452U CN207602558U CN 207602558 U CN207602558 U CN 207602558U CN 201721818452 U CN201721818452 U CN 201721818452U CN 207602558 U CN207602558 U CN 207602558U
- Authority
- CN
- China
- Prior art keywords
- main terminal
- copper coin
- power module
- chip
- package device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000004033 plastic Substances 0.000 claims abstract description 22
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 6
- 238000002347 injection Methods 0.000 claims abstract description 3
- 239000007924 injection Substances 0.000 claims abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000000017 hydrogel Substances 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000011265 semifinished product Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of grafting power module package device,It is welded on copper coin including DBC plates,Main terminal lower half portion,First chip,Second chip is respectively welded at the corresponding position on the DBC plates,The surrounding of the copper coin upper surface coats the uniform silicon rubber of a layer thickness,Main terminal top half and the injection of plastic casing and nut are integrated,The main terminal top half and the main terminal lower half portion coordinate and it is pluggable together,The location hole of the copper coin both sides and the through-hole of plastic casing both sides corresponding position get up via rivet interlacement,The utility model is by reducing main terminal height,Thus the contradiction resolution between being bonded and welding,Weld job uses a kind of solder,It is disposable to complete,Main terminal is divided into two parts,A part is connect with lower part DBC,Another part and plastic housing are molded into together,Centre carries out matching connection with plug in construction,Simplify installation step and difficulty,Working efficiency is high,Reduce the complexity of integrated artistic.
Description
Technical field
The utility model belongs to module packaging system technical field more particularly to a kind of grafting power module package device.
Background technology
Traditional module packaging technology, because of main terminal (passing through the copper bar of high current) height limitation, causing must be first complete
Aluminium wire into chip surface is bonded, and then can just weld main terminal；And in order to avoid under main terminal welding process chips
The secondary fusion of solder takes the solder of two kinds of different melting points in entire technique；New designing scheme is by reducing main terminal
Highly, so as to the contradiction resolution between be bonded and weld, weld job uses a kind of solder, disposably completion, then due to
Reduce main terminal height, it is ensured that bonding operation is feasible.
In traditional module encapsulation, main terminal is typically all to be integrally formed, and size is bigger, fixed difficulty in welding process
Spend it is bigger, to auxiliary clamp and personnel operation it is more demanding, in another aspect power module package traditional method, pass through 2
~3 weld jobs could complete the connection of inside modules, inefficiency.
Therefore, a kind of grafting power module package device of utility model is very necessary.
Utility model content
For above-mentioned technical problem, the utility model provides a kind of grafting power module package device, existing to solve
Module packaging technology operates more demanding, ineffective problem to auxiliary clamp and personnel.
A kind of grafting power module package device, which is characterized in that the grafting power module package device includes main terminal
Lower half portion, DBC plates, copper coin, the first chip, the second chip, main terminal top half and plastic casing；DBC plates are welded on copper
On plate, main terminal lower half portion, the first chip, the second chip are respectively welded at the corresponding position on the DBC plates, the copper coin
The surrounding of upper surface coats the uniform silicon rubber of a layer thickness, and main terminal top half and plastic casing and nut are molded into one
Body, the main terminal top half and the main terminal lower half portion coordinate and it is pluggable together.
Preferably, the location hole of the copper coin both sides and the through-hole of plastic casing both sides corresponding position connect via rivet
It picks up and.
Preferably, Silica hydrogel is injected in the through-hole at the top of the plastic casing and heating makes it fully solidify.
Preferably, silicon is injected separately into inside the location hole of the copper coin both sides and the through-hole of the plastic casing both sides to coagulate
Glue.
Compared with prior art, the utility model has the advantages that：The utility model is simple in structure, passes through reduction
Main terminal height, thus the contradiction resolution between being bonded and welding, weld job uses a kind of solder, disposable to complete, will
Main terminal is divided into two parts, and a part is connect with lower part DBC, and another part and plastic housing are molded into together, intermediate plug-in type knot
Structure carries out matching connection, simplifies installation step and difficulty, and working efficiency is high, reduces the complexity of integrated artistic.
Description of the drawings
Fig. 1 is the utility model metal connecting piece installation diagram.
Fig. 2 is the metal connecting piece structure chart in the utility model Fig. 1.
In figure,
1- main terminals lower half portion, 2-DBC plates, 3- copper coins, the first chips of 4-, the second chips of 5-, 6- main terminals lower half
Divide, 7- plastic casings.
Specific embodiment
The utility model is described further below in conjunction with attached drawing：
Embodiment：
As shown in attached drawing 1,2, the utility model provides a kind of grafting power module package device, which is characterized in that this is inserted
It connects power module package device and includes main terminal lower half portion 1, DBC plates 2, copper coin 3, the first chip 4, the second chip 5, main terminal
Top half 6 and plastic casing 7；DBC plates 2 are welded on copper coin 3, main terminal lower half portion 1, the first chip 4, the second chip 5
The corresponding position being respectively welded on DBC plates 2, the surrounding of 3 upper surface of copper coin coat the uniform silicon rubber of a layer thickness, main terminal
Top half 6 and the injection of plastic casing 7 and nut are integrated, main terminal top half 6 and main terminal lower half portion 1 coordinate and
It is pluggable that the through-hole of the location hole and 7 both sides corresponding position of plastic casing of 3 both sides of copper coin gets up via rivet interlacement together,
Silica hydrogel is injected in the through-hole at 7 top of plastic casing and heating makes it fully solidify, the location hole and plastic casing of 3 both sides of copper coin
Silica hydrogel is injected separately into inside the through-hole of 7 both sides.
Operation principle
Main terminal lower half portion 1, DBC plates 2,3 and first chip 4 of copper coin, the second chip 5 are used weldering by the utility model
To expect (weld tabs or soldering paste), disposable assembling is welded afterwards in place, as shown in Figure 1, by the welding semi-finished product of above-mentioned completion, transfer
To aluminum wire bonding process, the first chip 4, the aluminium wire bonding operation on the second chip 5 are completed, according to traditional work method, complete
Into the semi-finished product surrounding coating silicon rubber of copper coin 3, the top half 6 of main terminal, plastic housing 7 and nut are combined by Shooting Technique
To the outline border for together, forming module, matching outline border and the corresponding position for welding main terminal top and the bottom on semi-finished product will firmly be inserted
Two parts grafting of connecting terminal is got up, and forms closely connection, in the circular hole position of outline border and copper coin, the fourth of the twelve Earthly Branches enters quilting rivet, shape
Into mechanical connection, the connection of outline border and bottom plate is fastened with auxiliary；Then by high-temperature baking, the curing of silicon rubber is realized, from outer
In through-hole above frame, a certain amount of Silica hydrogel is injected, then high-temperature baking, realize the abundant solidification of Silica hydrogel, most produce at last
Product examine survey, packaging and storage complete module packaging operation, by reducing main terminal height, thus the lance between being bonded and welding
Shield is dissolved, and weld job uses a kind of solder, disposable to complete, then due to reducing main terminal height, it is ensured that bonding operation
It is feasible, main terminal is divided into two parts, a part is connect with lower part DBC, and another part and plastic housing are molded into together, and centre, which is used, inserts
The formula structure of connecing carries out matching connection, simplifies installation step and difficulty.
Using technical solution described in the utility model or those skilled in the art in technical solutions of the utility model
Under inspiration, similar technical solution is designed, and reaches above-mentioned technique effect, is the protection model for falling into the utility model
It encloses.
Claims (4)
1. a kind of grafting power module package device, which is characterized in that the grafting power module package device is included under main terminal
Half part (1), DBC plates (2), copper coin (3), the first chip (4), the second chip (5), main terminal top half (6) and plastic housing
Body (7)；DBC plates (2) are welded on copper coin (3), and main terminal lower half portion (1), the first chip (4), the second chip (5) weld respectively
The corresponding position being connected on the DBC plates (2), the surrounding of copper coin (3) upper surface coat the uniform silicon rubber of a layer thickness,
Main terminal top half (6) and plastic casing (7) and nut injection is integrated, the main terminal top half (6) with it is described
Main terminal lower half portion (1) coordinate and it is pluggable together.
2. grafting power module package device as described in claim 1, which is characterized in that the positioning of copper coin (3) both sides
Hole and the through-hole of the plastic casing (7) both sides corresponding position get up via rivet interlacement.
3. grafting power module package device as described in claim 1, which is characterized in that at the top of the plastic casing (7)
Silica hydrogel is injected in through-hole and heating makes it fully solidify.
4. grafting power module package device as claimed in claim 1 or 2, which is characterized in that determine copper coin (3) both sides
Silica hydrogel is injected separately into inside the through-hole of position hole and the plastic casing (7) both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721818452.6U CN207602558U (en) | 2017-12-22 | 2017-12-22 | A kind of grafting power module package device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721818452.6U CN207602558U (en) | 2017-12-22 | 2017-12-22 | A kind of grafting power module package device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207602558U true CN207602558U (en) | 2018-07-10 |
Family
ID=62766838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721818452.6U Expired - Fee Related CN207602558U (en) | 2017-12-22 | 2017-12-22 | A kind of grafting power module package device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207602558U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946273A (en) * | 2017-12-22 | 2018-04-20 | 江苏宏微科技股份有限公司 | A kind of grafting power module package device |
| CN110010579A (en) * | 2019-05-06 | 2019-07-12 | 合肥中恒微半导体有限公司 | A kind of signal terminal built-in power semiconductor module and its packaging technology |
-
2017
- 2017-12-22 CN CN201721818452.6U patent/CN207602558U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946273A (en) * | 2017-12-22 | 2018-04-20 | 江苏宏微科技股份有限公司 | A kind of grafting power module package device |
| CN110010579A (en) * | 2019-05-06 | 2019-07-12 | 合肥中恒微半导体有限公司 | A kind of signal terminal built-in power semiconductor module and its packaging technology |
| CN110010579B (en) * | 2019-05-06 | 2024-03-22 | 合肥中恒微半导体有限公司 | Signal terminal embedded power semiconductor module and packaging process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180710 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |