CN206505917U - A kind of rectification integration module - Google Patents
A kind of rectification integration module Download PDFInfo
- Publication number
- CN206505917U CN206505917U CN201720184327.8U CN201720184327U CN206505917U CN 206505917 U CN206505917 U CN 206505917U CN 201720184327 U CN201720184327 U CN 201720184327U CN 206505917 U CN206505917 U CN 206505917U
- Authority
- CN
- China
- Prior art keywords
- controllable silicon
- pins
- framework
- slide glass
- poles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000010354 integration Effects 0.000 title claims abstract description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 51
- 239000010703 silicon Substances 0.000 claims abstract description 51
- 239000011521 glass Substances 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 8
- 238000000605 extraction Methods 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 8
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000005457 optimization Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
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- Rectifiers (AREA)
Abstract
The utility model discloses a kind of rectification integration module, including framework, controllable silicon and commutation diode, the framework includes controllable silicon slide glass area, diode slide glass area and pin, No. two pins of the controllable silicon slide glass area correspondence, the controlled silicon chip bonding die is in controllable silicon slide glass area, the T1 poles of controllable silicon, T2 poles and G poles are connected respectively to No. three pins of framework, on No. two pins and a pin, four rectifier diode chips distinguish bonding die in four diode slide glass areas on framework, the both positive and negative polarity of rectifier diode chip is concatenated into bridge heap, two extraction poles of bridge heap chip connect No. five pins and No. six pins respectively, controllable silicon is connected with Qiao Dui surfaces.Controllable silicon and rectifier bridge are integrated together to the encapsulation process for reducing device, the number of times of packaging is reduced, the welding times of device and wiring board are reduced, reduce whole manufacturing cost, the volume of device is reduced, contributes to the optimization design of wiring board, the reliability of wiring board is improved.
Description
Technical field
The utility model is related to integrated circuit fields, more particularly, to a kind of rectification integration module.
Background technology
In the circuit of many controlled rectifications, all there is the design with one rectifying full bridge of a SCR control, mainly
Mentality of designing is exactly to realize that to AC rectification be direct current Electricity Functional using rectifying full bridge, and controllable silicon mainly uses its controllable
Switching characteristic, when rectification is needed, controllable silicon is opened, rectifying full bridge work, and AC rectification is direct current；Do not needing
When rectification, controllable silicon is closed, and rectifying full bridge does not work, whole circuit cut-off.
In general, a single controllable silicon and a single rectifying full bridge are needed in such circuit, with reference to
Fig. 1, an independent silicon-controlled device is in the mill, it is necessary to by controlled silicon chip bonding die on TO-220 frameworks, pass through high temperature
Sintering process so that controlled silicon chip is combined closely with framework, then using aluminium wire ultrasonic bonding technique, to controlled silicon chip
T1 and G poles are attached with the corresponding pin of framework respectively, then controlled silicon chip and exposed framework are carried out using plastic packaging material
Encapsulating, then carries out cutting golden processing to framework.One independent rectifier bridge stack is needed by four rectification chip bonding dies on framework,
Subsequent step is consistent with controllable silicon encapsulation process., it is necessary to by the artificial plug-in unit of controllable silicon to circuit in the assembling process of assist side
On plate, then welded respectively, after the completion of again by rectifying full bridge plug-in unit to wiring board, once welded.Chip
Encapsulation process is cumbersome, and the assembling process of wiring board is also very cumbersome, it is necessary to substantial amounts of manpower and materials, and adds out risk
Hidden danger.
Drawbacks described above in view of prior art is, it is necessary to a kind of new integration module.
Utility model content
The purpose of this utility model is to overcome prior art defect, designs a kind of new rectification integration module, effective drop
The packaging cost and installation cost of low device, while the space of wiring board can significantly be saved, improve the reliable operation of wiring board
Property.
To achieve these goals, the utility model provides a kind of rectification integration module, including framework, controllable silicon and rectification
Diode, the framework includes controllable silicon slide glass area, diode slide glass area and a pin to No. six pins, and the controllable silicon is carried
Section No. two pins of correspondence, the controlled silicon chip bonding die is in controllable silicon slide glass area, T1 poles, T2 poles and the G poles difference of controllable silicon
It is connected on No. three pins of framework, No. two pins and a pin, four rectifier diode chips distinguish bonding die on framework
Four diode slide glass areas, the both positive and negative polarity of four rectifier diode chips is concatenated into bridge heap, two extraction poles of bridge heap chip
No. five pins and No. six pins are connected respectively, and controllable silicon is connected with Qiao Dui surfaces.
Controllable silicon described in the utility model is connected with Qiao Dui surfaces by aluminium wire, a diameter of 300 μm of aluminium wire, can be born
High current.
Merge and be fixedly connected for sintering between controlled silicon chip and rectifier diode chip and framework described in the utility model.
The electrode of controllable silicon described in the utility model and the pin of framework are connected using welding manner.
The both positive and negative polarity of rectifier diode chip described in the utility model is concatenated using welding manner.
AC1 inputs connect No. two pins of integration module, and AC2 inputs connect No. four pins of integration module, pass through
After the rectification of integration module, No. six pins of integration module as direct current positive pole, No. five pins as direct current negative pole.
Compared with prior art, the beneficial effects of the utility model are：Rectification integration module described in the utility model, will
Controllable silicon and rectifier bridge are integrated together, and effectively reduce the encapsulation process of device, reduce the number of times of packaging, are reduced
The welding times of device and wiring board, so that whole manufacturing cost is greatly reduced, while reduce the volume of device,
Contribute to the optimization design of wiring board, improve the reliability of wiring board.
Brief description of the drawings
Fig. 1 is the existing line figure described in background technology.
Fig. 2 is the frame construction drawing of rectification integration module described in the utility model.
Fig. 3 is using the line map after rectification integration module described in the utility model.
In figure：Number pin of 1-, No. bis- pins of 2-, No. tri- pins of 3-, No. tetra- pins of 4-, No. five pins of 5-, 6- six draws
Pin, 7- frameworks, 8- controllable silicon slide glasses area, 9- diode slide glasses area.
Embodiment
Preferred embodiment of the present utility model is more fully described below with reference to accompanying drawings.
A kind of rectification integration module according to Fig. 3, including framework 7, controllable silicon and commutation diode, the framework 7
Including controllable silicon slide glass area 8, diode slide glass area 9 and a pin to No. six pins (1,2,3,4,5,6), the controllable silicon is carried
No. two pins 2 of correspondence of section 8, the controlled silicon chip bonding die is in controllable silicon slide glass area 8, T1 poles, T2 poles and the G poles point of controllable silicon
Be not connected to 1 on No. three pins 3 of framework 7, No. two pins 2 and a pin, four rectifier diode chips difference bonding dies in
Four diode slide glass areas 9 on framework 7, the both positive and negative polarity of four rectifier diode chips is concatenated into bridge heap, the two of bridge heap chip
Individual extraction pole connects No. five pins 5 and No. six pins 6 respectively, and controllable silicon is connected with Qiao Dui surfaces by aluminium wire, and aluminium wire is a diameter of
300 μm, high current can be born.
Merge and be fixedly connected for sintering between controlled silicon chip described in the present embodiment and rectifier diode chip and framework 7.
The electrode of controllable silicon described in the present embodiment is connected with the pin of framework 7 using welding manner.
The both positive and negative polarity of rectifier diode chip described in the present embodiment is concatenated using welding manner.
Rectification integration module described in the present embodiment is connected in circuit, circuit is as shown in figure 3, AC1 inputs are connected
No. two pins 2 of integration module, AC2 inputs connect No. four pins 4 of integration module, after the rectification of integration module, collection
Into module No. six pins 6 as direct current positive pole, No. five pins 5 as direct current negative pole.
Claims (6)
1. a kind of rectification integration module, including framework (7), controllable silicon and commutation diode, the framework include controllable silicon slide glass
Area (8), diode slide glass area (9) and a pin are to No. six pins (1,2,3,4,5,6), it is characterised in that the controllable silicon is carried
Section (8) No. two pins (2) of correspondence, the controlled silicon chip bonding die is in controllable silicon slide glass area (8), T1 poles, the T2 poles of controllable silicon
It is connected respectively to G poles on No. three pins (3) of framework, No. two pins (2) and a pin (1), four commutation diode cores
Piece distinguishes bonding die in four diode slide glass areas (9) on framework (7), and the both positive and negative polarity of four rectifier diode chips is concatenated into bridge
Heap, two extraction poles of bridge heap chip connect No. five pins (5) and No. six pins (6) respectively, and controllable silicon is connected with Qiao Dui surfaces.
2. rectification integration module according to claim 1, it is characterised in that the controllable silicon passes through aluminium wire with Qiao Dui surfaces
Connection.
3. rectification integration module according to claim 2, it is characterised in that described connection controllable silicon and Qiao Dui surfaces
A diameter of 300 μm of aluminium wire.
4. rectification integration module according to claim 1, it is characterised in that controlled silicon chip and the commutation diode core
Merge and be fixedly connected for sintering between piece and framework.
5. rectification integration module according to claim 1, it is characterised in that the electrode of the controllable silicon and the pin of framework
Connected by the way of welding.
6. rectification integration module according to claim 1, it is characterised in that the both positive and negative polarity of the rectifier diode chip is adopted
Concatenated with the mode of welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720184327.8U CN206505917U (en) | 2017-02-28 | 2017-02-28 | A kind of rectification integration module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720184327.8U CN206505917U (en) | 2017-02-28 | 2017-02-28 | A kind of rectification integration module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206505917U true CN206505917U (en) | 2017-09-19 |
Family
ID=59840408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720184327.8U Expired - Fee Related CN206505917U (en) | 2017-02-28 | 2017-02-28 | A kind of rectification integration module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206505917U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109494210A (en) * | 2018-12-25 | 2019-03-19 | 山东晶导微电子股份有限公司 | A kind of half-bridge encapsulating structure |
| CN110138236A (en) * | 2019-05-27 | 2019-08-16 | 扬州扬杰电子科技股份有限公司 | A kind of new-type rectifier bridge |
-
2017
- 2017-02-28 CN CN201720184327.8U patent/CN206505917U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109494210A (en) * | 2018-12-25 | 2019-03-19 | 山东晶导微电子股份有限公司 | A kind of half-bridge encapsulating structure |
| CN110138236A (en) * | 2019-05-27 | 2019-08-16 | 扬州扬杰电子科技股份有限公司 | A kind of new-type rectifier bridge |
| CN110138236B (en) * | 2019-05-27 | 2024-01-26 | 扬州扬杰电子科技股份有限公司 | Novel rectifier bridge |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170919 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |