CN208316589U - A kind of direct insertion rectifier bridge device with output protection - Google Patents
A kind of direct insertion rectifier bridge device with output protection Download PDFInfo
- Publication number
- CN208316589U CN208316589U CN201821079576.1U CN201821079576U CN208316589U CN 208316589 U CN208316589 U CN 208316589U CN 201821079576 U CN201821079576 U CN 201821079576U CN 208316589 U CN208316589 U CN 208316589U
- Authority
- CN
- China
- Prior art keywords
- frame unit
- frame
- chip
- rectifier bridge
- overvoltage protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 238000003780 insertion Methods 0.000 title claims abstract description 15
- 230000037431 insertion Effects 0.000 title claims abstract description 15
- 238000010276 construction Methods 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims description 8
- 238000000605 extraction Methods 0.000 claims description 6
- 230000003447 ipsilateral effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000001052 transient effect Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 208000025274 Lightning injury Diseases 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of direct insertion rectifier bridge device with output protection; belong to semiconductor components and devices technical field; including four rectification chips, an overvoltage protection chip, two input terminals, two output terminals and plastic-sealed body; it is characterized in that; the frame unit group for further including five film dancings and being made of the first frame unit, the second frame unit, third frame unit, the 4th frame unit; four frame units are coplanar, and the two sides up and down that four rectification chips, an overvoltage protection chip are arranged in frame unit group form laminated construction；Solve the problems, such as that overvoltage protection chip and rectification chip tiling encapsulation bring occupancy plane space are big, conducive to the miniaturization of rectifier bridge device, and production efficiency is higher, and cost is lower.
Description
Technical field
The utility model relates to semiconductor components and devices technical fields, and in particular to a kind of direct insertion rectification with output protection
Bridge device.
Background technique
With the development of society, electronic product is also that increasingly precision, requirement of the electronic product to power supply are also higher and higher.
Existing AC network can generate instantaneous interference when by factors such as lightning stroke and power equipment start and stop in power grid, this interference
Electronic equipment and circuit can be damaged.Many electronic components using direct current, institute can have been used in electronic product
To need to add AC to DC before accessing power grid and have the electronic component of rectifying and voltage-stabilizing structure, to its these electronics
Component is protected.There is existing Transient Suppression Diode the response time (nanosecond) being exceedingly fast and quite high surge to inhale
Receipts ability can protect impact of the subsequent circuit element not by high voltage transient spike.General Transient Suppression Diode installation
In power input or output module, all components being responsible in the entire circuit of protection, but TVS pipe is individually welded, not only cost
Height will also occupy no small space, be unfavorable for electronic product micromation.
In response to this problem, application No. is 201621041504.9 utility model patent, to disclose a kind of two-way TVS of band defeated
Enter the full-wave rectification bridge of filtering, it includes the frame of four diode chip for backlight unit, a two-way TVS pipe chip, four leads；Four
Diode chip for backlight unit technical indicator is identical, and top surface is p-type, and bottom surface is N-type；Two-way TVS pipe chip and first diode core
Piece is fixed on first lead frame, connects third lead frame, the second lead frame by conducting wire；Second diode chip for backlight unit
It is fixed on the 4th lead frame with the 4th diode chip for backlight unit, first lead frame, third lead is connected by conducting wire respectively
Frame；Third diode chip for backlight unit is fixed on third lead frame, connects the second lead frame by conducting wire；The first, third
Lead frame does negative, positive pole pin as exchange pin, the second, the 4th lead frame respectively.The utility model can rectify
Effective protection is provided when bridge is by reversed transient overvoltage pulse, compact layout is conducive to pcb board miniaturization.
Although it is big that above structure solves on circuit boards independent welding TVS diode occupied space to a certain extent
Problem, but there is a problem in that: bonding wire craft itself has limitation, and production efficiency is relatively low, to working condition
The phenomenon that harsher, and the lead used collapses during plastic packaging it is easy to appear bonding wire, cause product yield relatively low, together
When influence the quality of product；Used lead is generally copper wire, and in order to meet the requirement of encapsulation, copper wire fineness used is wanted
It asks high, is bound to cause the raising of product cost, and make contact and operate more troublesome, speed of making contact is slow, influences production efficiency；Separately
Outside, which uses bonding wire craft to weld together the chip of TVS diode and rectifier bridge with flush system, this topology layout
In the case where encapsulating the TVS chip of Same Efficieney size, it certainly will need to expand the size of lead frame, to cause encapsulation electricity
The plane occupied space of sub- device is larger, is unfavorable for the miniaturization of rectifier bridge, and the increase of size lead frame is also straight
The quantity for the rectifier bridge that every group of lead frame can encapsulate during resulting in its manufacturing procedure is connect, and then influences the production of product
Efficiency increases production cost.
Utility model content
Technical problem to be solved in the utility model is in view of the deficiencies of the prior art, to provide a kind of occupancy plane space
It is small, production efficiency is higher, the lower direct insertion rectifier bridge device with output protection of cost, solve overvoltage protection chip with it is whole
It flows chip tiling encapsulation bring and occupies the big problem of plane space, conducive to the miniaturization of rectifier bridge device.
The technical solution that the utility model solves above-mentioned technical problem is as follows: a kind of direct insertion rectifier bridge with output protection
Device, including four rectification chips, an overvoltage protection chip, two input terminals, two output terminals and plastic-sealed body, it is special
Sign is, further includes five film dancings and by the first frame unit, the second frame unit, third frame unit, the 4th frame unit
The frame unit group of composition, four frame units are coplanar, and four rectification chips, an overvoltage protection chip are arranged in frame
The two sides up and down of frame unit group form laminated construction, and the overvoltage protection chip can be used but be not limited to TVS chip or pressure-sensitive electricity
Hinder chip；
There are two pad, the second frame units, third frame unit upper surface for the setting of first frame unit upper surface
It is respectively arranged with a pad, the cathode of four rectification chips, which respectively corresponds, to be arranged on four pads；On first frame unit
The anode of a rectification chip be connected with the second frame unit by film dancing, another rectification chip on the first frame unit
Anode be connected with third frame unit by film dancing, the anode of the second frame unit, rectification chip on third frame unit
It is connected respectively by film dancing with the 4th frame unit；The lower surface of the first frame unit, mistake is arranged in the overvoltage protection chip
The two poles of the earth of pressure protection chip are separately connected the first frame unit, the 4th frame unit, and overvoltage protection chip passes through film dancing and the 4th
The lower surface of frame unit is connected, and in addition the lower surface of the 4th frame unit can also be arranged in overvoltage protection chip, at this time mistake
Pressure protection chip is connected by film dancing with the lower surface of the first frame unit；
Two input terminals are drawn from the second frame unit, third frame unit respectively, and two output terminals are respectively from the
One frame unit, the 4th frame unit are drawn.
Further, described the input terminal and the output terminal is from the ipsilateral extraction of plastic-sealed body.
Further, extraction location of the input terminal and the output terminal on plastic-sealed body close to connection the first frame unit and
The film dancing of third frame unit and the film dancing for connecting third frame unit and the 4th frame unit.
Further, four terminals are coplanar.
Further, second frame unit, third frame unit, set with the junction of film dancing on the 4th frame unit
It is equipped with film dancing welding position, film dancing is weldingly connected by film dancing welding position with corresponding frame unit.
The beneficial effects of the utility model are: the technical barrier on the two sides of lead frame while chip placement is overcome,
Overvoltage protection chip is placed in the lower surface of frame unit, so that it is connected to the output end of rectifier bridge, is encapsulated as with rectifier bridge
One, forms four rectification chips-frame unit group-overvoltage protection chip three-layer sandwich type laminated construction, integral layout is more
Adduction reason, flush system welds compared with prior art, reduces the plane occupied space of encasing electronic components, more conducively product is micro-
Type expands the popularity of products application；Meanwhile frame unit needed for encapsulating the overvoltage protection chip of Same Efficieney size
Size is smaller, therefore increases the quantity for the rectifier bridge that can be encapsulated with group lead frame, substantially increases the production effect of product
Rate reduces production cost；In addition, be fixed and connect using film dancing between chip and frame unit, stable structure, compared with
Existing bonding wire craft can be avoided the problem of product yield caused by bonding wire collapses during plastic packaging, be conducive to improve product product
Matter.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the backsight structural representation of the utility model；
Fig. 3 is the right side structural representation of the utility model.
In figure: 1. first frame units, 2. second frame units, 3. third frame units, 4. the 4th frame units, 5. is whole
Flow chip, 6. overvoltage protection chips, 7. input terminals, 8. output terminals, 9. film dancings, 10. plastic-sealed bodies.
Specific embodiment
The principles of the present invention and feature are described with reference to the accompanying drawing, illustrated embodiment is served only for explaining this reality
With novel, it is not intended to limit the scope of the utility model.
As shown in Figure 1-Figure 3, a kind of direct insertion rectifier bridge device with output protection of the present embodiment, including four rectifications
7, two output terminals 8 of the input terminal of overvoltage protection chip 6, two of chip 5, one and plastic-sealed body 10, the overvoltage protection
Chip can be used but be not limited to TVS chip or voltage dependent resistor chip, and the direct insertion rectifier bridge further includes five film dancings 9 and by
The frame unit group of one frame unit 1, the second frame unit 2, third frame unit 3, the 4th frame unit 4 composition, four frames
Frame unit is coplanar, and four rectification chips, 5, overvoltage protection chips 6 are arranged in the two sides shape up and down of frame unit group
At laminated construction；
First frame unit, 1 upper surface setting is there are two pad, table on the second frame unit 2, third frame unit 3
Face is respectively arranged with a pad, and the cathode of four rectification chips 5, which respectively corresponds, to be arranged on four pads；First frame unit
The anode of a rectification chip 5 on 1 is connected by film dancing 9 with the second frame unit 2, another on the first frame unit 1
The anode of rectification chip 5 is connected by film dancing 9 with third frame unit 3, whole on the second frame unit 2, third frame unit 3
The anode of stream chip 5 is connected by film dancing 9 with the 4th frame unit 4 respectively；The two poles of the earth of the overvoltage protection chip 6 are separately connected
First frame unit 1, the 4th frame unit 4, the following table of the first frame unit 1 is arranged in overvoltage protection chip 6 in the present embodiment
Face, overvoltage protection chip 6 are connected by film dancing 9 with the lower surface of the 4th frame unit 4, and in addition overvoltage protection chip 6 can be with
The lower surface of 4th frame unit 4 is set, and overvoltage protection chip 6 passes through the lower surface phase of film dancing 9 and the first frame unit 1
Even；
Two input terminals 7 are drawn from the second frame unit 2, third frame unit 3 respectively, and two output terminals 8 are distinguished
It is drawn from the first frame unit 1, the 4th frame unit 4.
Input terminal 7 and output terminal 8 described in the present embodiment are from the ipsilateral extraction of plastic-sealed body 10, and input terminal 7
With extraction location of the output terminal 8 on plastic-sealed body 10 close to the film dancing 9 of connection the first frame unit 1 and third frame unit 3
And the film dancing 9 of connection third frame unit 3 and the 4th frame unit 4, four terminals are coplanar.
Second frame unit 2, third frame unit 3 described in embodiment, the connection on the 4th frame unit 4 with film dancing 9
Place is provided with 9 welding position of film dancing, and film dancing 9 is weldingly connected by 9 welding position of film dancing with corresponding frame unit.
As shown in figure 3, being connected between terminal and associated frame members unit in Z-shaped bending structure, in frame unit group two sides
Rectification chip and overvoltage protection chip are encapsulated, the increasing of frame unit size is in turn avoided while product thickness not being caused to increase
Greatly.
The utility model overcomes the technical barrier on the two sides of lead frame while chip placement, by overvoltage protection chip
It is placed in the lower surface of frame unit, so that it is connected to the output end of rectifier bridge, is packaged as a whole with rectifier bridge, formation four is whole
Chip-frame unit group-overvoltage protection chip three-layer sandwich type laminated construction is flowed, integral layout is more reasonable, compared to existing
The welding of technology flush system, reduces the plane occupied space of encasing electronic components, the more conducively micromation of product, expands product
The popularity of application；Meanwhile frame unit size needed for encapsulating the overvoltage protection chip of Same Efficieney size is smaller, therefore increases
The quantity for having added the rectifier bridge that can be encapsulated with group lead frame, substantially increases the production efficiency of product, reduces and be produced into
This；In addition, be fixed and connect using film dancing between chip and frame unit, stable structure, compared with existing bonding wire craft
The problem of can be avoided product yield caused by bonding wire collapses during plastic packaging, is conducive to improve product quality.
In the present invention, term " first ", " second " are used for description purposes only, and are not understood to indicate or imply
Relative importance or the quantity for implicitly indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can
To explicitly or implicitly include at least one this feature.In the present invention unless specifically defined or limited otherwise, art
The terms such as language " installation ", " connected ", " connection ", " fixation " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to
It is detachably connected, or integral；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be in
Between medium be indirectly connected, can be the connection inside two elements or the interaction relationship of two elements, unless otherwise clear
Restriction.For the ordinary skill in the art, above-mentioned term can be understood in the utility model as the case may be
In concrete meaning.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
It states and is necessarily directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be with
It can be combined in any suitable manner in any one or more of the embodiments or examples.In addition, without conflicting with each other, this field
Technical staff can by the feature of different embodiments or examples described in this specification and different embodiments or examples into
Row knot
It closes and combines.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are in the scope of the utility model
Inside it can make changes, modifications, alterations, and variations to the above described embodiments.
Claims (7)
1. a kind of direct insertion rectifier bridge device with output protection, including four rectification chips (5), an overvoltage protection chip
(6), two input terminals (7), two output terminals (8) and plastic-sealed body (10), which is characterized in that further include five film dancings (9)
And the frame being made of the first frame unit (1), the second frame unit (2), third frame unit (3), the 4th frame unit (4)
Unit group, four frame units are coplanar, and four rectification chips (5), an overvoltage protection chip (6) are arranged in frame list
The two sides up and down of tuple form laminated construction；There are two pad, the second frame lists for first frame unit (1) the upper surface setting
First (2), third frame unit (3) upper surface are respectively arranged with a pad, and the cathode of four rectification chips (5), which respectively corresponds, to be set
It sets on four pads；The anode of a rectification chip (5) on first frame unit (1) passes through film dancing (9) and the second frame
Unit (2) is connected, and the anode of another rectification chip (5) on the first frame unit (1) passes through film dancing (9) and third frame list
First (3) are connected, and the anode of the rectification chip (5) on the second frame unit (2), third frame unit (3) passes through film dancing (9) respectively
It is connected with the 4th frame unit (4)；The overvoltage protection chip (6) is arranged in the first frame unit (1) or the 4th frame unit
(4) lower surface, the two poles of the earth of overvoltage protection chip (6) are separately connected the first frame unit (1), the 4th frame unit (4)；Two
Input terminal (7) is drawn from the second frame unit (2), third frame unit (3) respectively, and two output terminals (8) are respectively from the
One frame unit (1), the 4th frame unit (4) are drawn.
2. the direct insertion rectifier bridge device according to claim 1 with output protection, which is characterized in that the overvoltage protection
Chip (6) is arranged at the lower surface of the first frame unit (1), and overvoltage protection chip (6) passes through film dancing (9) and the 4th frame list
The lower surface of first (4) is connected.
3. the direct insertion rectifier bridge device according to claim 1 with output protection, which is characterized in that the overvoltage protection
Chip (6) is arranged at the lower surface of the 4th frame unit (4), and overvoltage protection chip (6) passes through film dancing (9) and the first frame list
The lower surface of first (1) is connected.
4. the direct insertion rectifier bridge device according to claim 1 with output protection, which is characterized in that second frame
Unit (2), third frame unit (3) with the junction of film dancing (9) are provided with film dancing welding position on the 4th frame unit (4), jump
Piece (9) is weldingly connected by film dancing welding position with corresponding frame unit.
5. the direct insertion rectifier bridge device according to claim 1 with output protection, which is characterized in that the input terminal
(7) and output terminal (8) is from the ipsilateral extraction of plastic-sealed body (10).
6. the direct insertion rectifier bridge device according to claim 5 with output protection, which is characterized in that input terminal (7)
With extraction location of the output terminal (8) on plastic-sealed body (10) close to connection the first frame unit (1) and third frame unit (3)
Film dancing (9) and connect third frame unit (3) and the 4th frame unit (4) film dancing (9).
7. the direct insertion rectifier bridge device according to claim 1-6 with output protection, which is characterized in that four
Terminal is coplanar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821079576.1U CN208316589U (en) | 2018-07-09 | 2018-07-09 | A kind of direct insertion rectifier bridge device with output protection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821079576.1U CN208316589U (en) | 2018-07-09 | 2018-07-09 | A kind of direct insertion rectifier bridge device with output protection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208316589U true CN208316589U (en) | 2019-01-01 |
Family
ID=64717496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821079576.1U Withdrawn - After Issue CN208316589U (en) | 2018-07-09 | 2018-07-09 | A kind of direct insertion rectifier bridge device with output protection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208316589U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108736743A (en) * | 2018-07-09 | 2018-11-02 | 山东晶导微电子股份有限公司 | A kind of direct insertion rectifier bridge device with output protection |
-
2018
- 2018-07-09 CN CN201821079576.1U patent/CN208316589U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108736743A (en) * | 2018-07-09 | 2018-11-02 | 山东晶导微电子股份有限公司 | A kind of direct insertion rectifier bridge device with output protection |
| CN108736743B (en) * | 2018-07-09 | 2024-05-24 | 山东晶导微电子股份有限公司 | Direct-insert rectifier bridge device with output protection |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205984975U (en) | Filtering transient state high -voltage pulse's ultra -thin rectifier bridge | |
| CN103107171A (en) | Semiconductor device of flip chip | |
| CN208316589U (en) | A kind of direct insertion rectifier bridge device with output protection | |
| CN208507670U (en) | A kind of direct insertion rectifier bridge device of band input protection | |
| CN108598073A (en) | A kind of direct insertion rectifier bridge device of band input protection | |
| CN108389853A (en) | A kind of full-wave rectification bridge structure of integrated form antisurge | |
| CN108736743A (en) | A kind of direct insertion rectifier bridge device with output protection | |
| CN208173578U (en) | A kind of novel power supply power module architectures with output protection | |
| CN208173579U (en) | A kind of novel power supply power module architectures of band input protection | |
| CN208127202U (en) | A kind of rectifier bridge component of band TVS Anti-surging impact | |
| CN108807306B (en) | Power module structure with input protection | |
| CN208142169U (en) | A kind of rectifier bridge component of the output end with TVS surge protection | |
| CN107731818A (en) | Transient suppression diode chip structure | |
| CN109244225A (en) | A kind of packaging method of flip-over type LED chip | |
| CN212209485U (en) | Rectifier bridge circuit module of rear TVS protection diode | |
| CN102842572A (en) | Small double-row bridge rectifier | |
| CN206180863U (en) | Take two -way TVS input filter's full wave bridge rectifier | |
| CN210805764U (en) | Packaging structure of sealed rectifier bridge and power module | |
| CN212461690U (en) | TVS suppression protection and follow current protection type rectifier bridge integrated packaging module | |
| CN108807305B (en) | Power supply power module structure with output protection | |
| CN209087828U (en) | A kind of half-bridge encapsulating structure | |
| CN218447401U (en) | Three-phase piezoresistor | |
| CN203536411U (en) | Semiconductor packaging structure | |
| CN208675599U (en) | A kind of novel mono-/multi- chip patch-type electronic device | |
| CN111710666A (en) | Rectifier bridge circuit module of rear TVS protection diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20190101 Effective date of abandoning: 20240524 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20190101 Effective date of abandoning: 20240524 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |